CN1593923A - Fluid spraying apparatus - Google Patents
Fluid spraying apparatus Download PDFInfo
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- CN1593923A CN1593923A CN 03158497 CN03158497A CN1593923A CN 1593923 A CN1593923 A CN 1593923A CN 03158497 CN03158497 CN 03158497 CN 03158497 A CN03158497 A CN 03158497A CN 1593923 A CN1593923 A CN 1593923A
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- ejection apparatus
- fluid ejection
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- 239000012530 fluid Substances 0.000 title claims abstract description 44
- 238000005507 spraying Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 230000004069 differentiation Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 description 24
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- -1 boron ion Chemical class 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018594 Si-Cu Inorganic materials 0.000 description 2
- 229910008465 Si—Cu Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- VGRFVJMYCCLWPQ-UHFFFAOYSA-N germanium Chemical compound [Ge].[Ge] VGRFVJMYCCLWPQ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention relates to a kind of fluid spraying device which locates on the semiconductor base . It includes a manifold which is formed through etching in the semiconductor base and is filled with a fluid , a temperature-adjusting component which is located on the manifold to heat the semiconductor base to raise the temperature of the fluid and is roughly a ring-type . Thus we can control the temperature of the spraying ink when typing to guarantee the quality of the ink drop .
Description
The present invention be the Chinese invention patent application (application number: 01112034.7, the applying date: March 27 calendar year 2001, denomination of invention: dividing an application voltage-resistor type temp sensor).
Technical field
The present invention relates to a kind of ink jet printing device, particularly relate to a kind of fluid ejection apparatus.
Background technology
In recent years, under the drive of high-tech industry, all electronic correlation industries are all flourish, every modern product, and as computer, computer periphery, household electrical appliances and business machine etc., no matter function or outward appearance, compare all has significant progress in the past.With the printer is example, just only several years, printing technique just from striker formula, the progress of black and white laser to color jet-ink and color laser etc., be at a tremendous pace.The present general user of family is because it is few to print the chance of heap file, so when choosing printer, for taking into account the two balance of print quality and price, still be first-selection with the color inkjet printer; If budget is abundant, just buy more monochrome laser printer in addition with usefulness as file printout.
Ink-jet printer on the market adopts bubble type or piezoelectric ink-jet head to finish print job on the paper so that ink is disseminated to mostly at present.For the bubble type ink gun, its main member includes heater, ink and spray orifice (nozzle).The effect of heater is heating ink producing bubble, and makes bubble rise big gradually and push ink, and the ink that is pushed drops on and forms ink dot on the paper then via the spray orifice ejection.When printing, only need control the concentration and the drop point of ink, numerous ink dots can be combined into required literal or figure.Aspect resolution ratio, the ABC of machine of present color inkjet printer, resolution ratio is about 720 * 720dpi or 1440 * 720dpi, resolution ratio is high more, the expression ink dot is careful more, and the careful degree of ink dot is then relevant with the viscosity (Viscosity) of ink with the surface tension (Surface Tension) of ink dot.Then please refer to Fig. 1, it illustrates a kind of ink gun structure (please refer to United States Patent (USP) the 6th, 102, No. 530) of traditional ink cartridges.For now, meeting for example is to form structure sheaf 120 on the silicon base 140 earlier at the semiconductor-based end when making ink gun 100, then utilizes etching technique that silicon base 140 is carried out anisotropic etching again, to form manifold 150 and inkjet ink chamber 130; After progressively structures such as heater 160, heater 165 and spray orifice 110 being formed one by one, ink gun 100 is promptly accused and is finished.Basically, spray orifice on the ink gun 100 110 can be with array (array) form proper alignment, in order to ink 190 ejections, because the geometry of each spray orifice is all identical on practice, so only draw several spray orifices in graphic typically and be illustrated.With this figure is example, each spray orifice 110 is positioned at the top of inkjet ink chamber (chamber) 130, and each inkjet ink chamber 130 all is communicated with manifold (manifold) 150, so, ink 190 in the ink cartridges can riddle by the guiding of manifold 150 in each inkjet ink chamber 130, so that ink 190 can outwards spray by each spray orifice 110.All dispose heater around it should be noted that each spray orifice 110, for example heater 160 and heater 165 are in order to these spray orifice 110 residing inkjet ink chamber 130 heating; After heater is heated, ink temperature in the inkjet ink chamber 130 is risen and forms bubble, when bubble rise gradually big after, can force ink in spray orifice, to spray, required ink droplet so that video picture to be provided hereinafter, will be illustrated at the formation situation of ink droplet.
Please refer to Fig. 2, it illustrates the cross-section structure of the ink gun of Fig. 1.As shown in the figure, spray orifice 110 other heater 160 and the heaters 165 of being provided with, after being heated, two heaters just can form bubble 210 and bubble 215 in graphic respectively, heat heater if continue this moment, two bubbles just can rise outward with the direction of arrow P greatly, and squeezeout ink makes it from spray orifice 110 ejection, illustrates as institute in graphic; Therefore, the ink that is extruded just can spray and drop on and form ink dot on the paper along the direction of arrow F.
Briefly, make its ejection ink if will drive a certain specific spray orifice, the corresponding heater of meeting this spray orifice of first activation sprays ink so that the interior ink temperature of the inkjet ink chamber under this spray orifice raises and produces bubble.In other words, if the ink temperature in the inkjet ink chamber higher already (for example i.e. repeatedly ink-jet of this spray orifice before this) before heater is heated, this moment is if heat heater with identical power once again, certainly will will make ink be reduced its toughness, therefore the resolution ratio variation of printing by superheated; Otherwise as if the ink temperature in the inkjet ink chamber low excessively (for example this spray orifice not ink-jet for a long time before this) before heater is heated, just can't not make ink reach predetermined temperature if do not increase the power of feed-in heater this moment, causes ink normally to spray.So the ink temperature in the inkjet ink chamber must be controlled in the predetermined temperature range exactly in the printing current situation, just can possess perfect print quality; Therefore to how to detect ink temperature and also be compensated effectively, just become the difficult problem that the research staff need overcome.
Ink temperature context of detection at ink gun, at preceding case United States Patent (USP) the 5th, 696, No. 543-" Recording head which detects temperature of an element chip and correctsfor variations in that detected temperature; and cartridge and apparatus havingsuch a head; " in mention and utilize a resistor as the detector unit on the chip (Chip), and the resistance of doing an adjustment in chip exterior is to form the testing circuit of Wheatstone bridge (Wheatstone bridge), trouble when this kind practice not only detects, expensive especially on cost, be unsuitable for doing a large amount of productions really.Therefore, provide one pratical and feasible, cost is lower, and the temperature-sensitive sticker with sensitiveer sensing effect is an instant trend in fact.
Summary of the invention
The object of the present invention is to provide a kind of fluid ejection apparatus, and be provided with a kind of manifold and temperature adjustment element, improve print quality thus.
The object of the present invention is achieved like this, and a kind of fluid ejection apparatus promptly is provided, and comprising:
One manifold, this manifold are to form and be filled with a fluid by the semiconductor substrate etching; And
One temperature is adjusted element, in order to heat this semiconductor-based end so that the temperature of this fluid rise.
The present invention also provides a kind of fluid ejection apparatus, and the based semiconductor substrate comprises:
One manifold, this manifold are to form and be filled with a fluid by carry out etching on this semiconductor-based end; And
One temperature is adjusted element, is arranged on this manifold, so that the temperature of this fluid rises, wherein this temperature adjustment device is a ring-type haply in order to heat this semiconductor-based end.
The present invention also proposes a kind of voltage-resistor type temp sensor and includes sensing sheet and pressure drag component, and is arranged at the ink gun place, in order to the ink temperature in the sensing ink gun.During practical operation, heater can be set with the heating silicon base around ink gun, ink temperature in the ink gun can be remained in the scope of operating temperature, and after utilizing semi-conducting material to form the sensing region of rectangle at the ink gun place, central point at each edge of sensing region is provided with pressure drag component (for example polysilicon), thus the situation that causes the pressure drag component deformation value of having a resistance to change to bear the stress generation.When ink temperature rose, the plane at sensing region place (being the ink gun surface) can be because be heated and swell, so also deformation thereupon of sensor makes pressure drag component experience powerful stress and makes its resistance value change; If each pressure drag component is coupled mutually with electric bridge kenel (for example Wheatstone bridge), just can make the resistance change of each pressure drag component be converted into voltage signal output, so can learn the height of ink temperature according to the size of voltage signal.Moreover, can in polysilicon, mix when making pressure drag component, for example doped with boron ion or phosphonium ion to improve the tolerance factor of each pressure drag component, make the sensing signal can be stronger.Certainly the material of pressure drag component is not exceeded with polysilicon, also can utilize metal to make each pressure drag component, this each metal can be selected from aluminium, gold, copper, tungsten, titanium and Al-Si-Cu alloy, tungsten nitride, titanium nitride and constitutes in the group any, also can possess the characteristic of pressure drag component.
Description of drawings
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Fig. 1 is the ink gun structure schematic diagram of existing ink cartridges;
Fig. 2 is the cross-sectional view of ink gun among Fig. 1;
Fig. 3 A is ink gun structure schematic diagram that a preferred embodiment of the present invention provided;
Fig. 3 B is the cross-sectional view of ink gun among Fig. 3 A;
Fig. 3 C is the ink gun schematic diagram with two temperature-sensitive stickers and two heaters;
Fig. 3 D is the ink gun schematic diagram with three temperature-sensitive stickers and three heaters;
Fig. 4 is the voltage-resistor type temp sensor schematic diagram in the preferred embodiment;
Fig. 5 is that the pressure drag component of voltage-resistor type temp sensor among Fig. 4 produces the outline line schematic diagram to top offset;
Fig. 6 is the Wheatstone bridge equivalent circuit diagram of voltage-resistor type temp sensor among Fig. 4.
The specific embodiment
In order to make print quality not because of the difference of ink temperature influences to some extent, on the practice, the temperature of ink can be remained in the predetermined temperature range, for example between temperature value T1 between the temperature value T2, so just can guarantee the quality of each ink droplet ejection; Therefore, can claim temperature value T1 to the operating temperature of temperature value T2 for suitable ink ejection.When design, the research staff can be according to the characteristic of ink, preestablish the scope of operating temperature, after operating temperature is determined, during printing if the actual temperature of ink just heater can be opened when being lower than temperature value T1, and be higher than temperature value T2 or allow heater close between temperature value T1 and temperature value T2 the time at ink temperature, ink temperature is remained in the predetermined temperature range, to guarantee print quality.
How does this keep the temperature of ink so? the practice of the present invention is to adjust element around one or more temperature all around at ink gun, it for example is heater, be used for ink is heated, and utilize the temperature-sensitive sticker of being located at the manifold top to detect the temperature of ink gun, so, can determine whether according to the sensing result of temperature-sensitive sticker and heater need be opened, thereby make ink temperature can remain within the operating temperature; Certainly, if ink temperature has remained in the predetermined temperature range, heater just needn't be opened.Then please refer to Fig. 3 A, it illustrates a kind of ink gun structure that can realize above-mentioned saying.This figure is the top view of ink gun, temperature-sensitive sticker 31 can be arranged on the structure sheaf 120 of ink gun 100, is positioned at the top of manifold 150, with the ink temperature in the sensing ink gun 100.It should be noted that owing to be full of and have the thickness of ink and structure sheaf 120 very little in the manifold 150, so the temperature of structure sheaf 120 and ink temperature are quite approaching; In other words,, also can learn ink temperature indirectly, in practical operation, there is no difficulty by the temperature of structure sheaf 120 though temperature-sensitive sticker 31 does not directly contact with ink.Moreover, cross when low when ink temperature, heater 310 can be opened, allow to moment will big current fed heater 310 to heat silicon base 140, the temperature of silicon base 140 is climbed sharply immediately; After silicon base 140 is heated, the temperature of ink is raise at once, after ink temperature rises to operating temperature, heater 310 can cut out, ink temperature can be stabilized within the operating temperature.On the other hand, if Fig. 3 A is downcut along tangent line 3B-3B, formed profile then illustrates as Fig. 3 B; Because the thickness of structure sheaf 120 is extremely thin, therefore when ink temperature rises, temperature-sensitive sticker 31 residing positions can upwards be swelled because be heated, make temperature-sensitive sticker 31 produce deformation, so deformation degree according to temperature-sensitive sticker 31, can know the ink temperature in the ink gun by inference, thus the unlatching opportunity of control heater 310.
Under identical invention spirit, for asking temperature to control ink-jet more accurately the time to guarantee the ink dot quality, temperature-sensitive sticker 32 and temperature-sensitive sticker 33 can be set respectively at the manifold place, and setting and corresponding heater 320 of temperature-sensitive sticker and heater 330, illustrate as Fig. 3 C; Because Fig. 3 C adopts the ink gun structure identical with Fig. 3 A, so structures such as manifold and spray orifice are not drawn so that graphic straightforward.Under this each structure, can decide heater 320 to open or close according to the temperature that temperature-sensitive sticker 32 records, also the temperature that can utilize temperature-sensitive sticker 33 to record decides heater 330 to open or close, in other words, just the ink separated into two parts of whole manifold is controlled individually, the interior ink temperature of ink gun is distributed can be more even.Moreover, in fact also temperature- sensitive sticker 34,35 can be set, on 36 unlatching opportunitys, illustrate as Fig. 3 D, so that the control of ink temperature can be more accurate with difference control heater 340,350,360.Certainly, when the design ink gun, the number of temperature-sensitive sticker or heater is not exceeded with above-mentioned number, and the designer can decide the number or the arrangement mode of temperature-sensitive sticker and heater by actual demand, obtains best balance between temperature control effect and the production cost to be desirably in.Hereinafter, will be illustrated at the structure and the operation principle of temperature-sensitive sticker.
At list of references Smith, C.S.,-" Piezoresistive effect in germanium and silicon; " Phys.Rev., Vol.94, confirm among the pp.42-49 (1954), the piezoresistive effect of silicon (Silicon) and germanium (Germanium) (Piezoresistive effect) exceeds 100 times than plain conductor, and Mr.'s Dai Qingliang of mechanical engineering research institute of Univ Nat Taiwan thesis for the doctorate-" making the research of micro electronmechanical sensor with the integrated circuit production technique of standard; " pp.38-48 once mentioned in (1997), if want pressure drag component can produce bigger sensing signal, except pressure drag component itself will have high measurement factor (Gauge factor), on the other hand, pressure drag component must be implanted (Implant) can produce maximum stress in sensing region place exactly, be the center edge place on rectangle sensing region four limits, to improve the sensing effect.Therefore, for above-mentioned theory fully being applied on the temperature sensing of ink gun, the present invention is convenient to use semi-conducting material, and for example polysilicon forms several pressure drag components at the ink gun place and constitutes a sensing region, with the usefulness as temperature sensing; For improving the tolerance factor of pressure drag component, also can in pressure drag component, mix during practical operation, for example doped with boron ion or phosphonium ion make the sensing signal can be stronger.Certainly, the material of pressure drag component is not exceeded with polysilicon, can utilize metal material to make pressure drag component yet, can be selected from aluminium, gold, copper, tungsten, titanium and Al-Si-Cu alloy, tungsten nitride, titanium nitride and constitute in the group any on Material Selection.Then please refer to Fig. 4, voltage-resistor type temp sensor schematic diagram that provides according to a preferred embodiment of the present invention is provided for it.The geometry of the sensing region 410 of voltage-resistor type temp sensor 400 can be a rectangular shape as shown in the figure, and at the edge of sensing region 410 configuration pressure drag component 41,42,43,44, to use as temperature sensing.It should be noted that, sensing region 410 is under a uniform pressure, the distortion of its maximum occurs in the central spot of sensing region 410, and promptly the central authorities of sensing region 410 can upwards swell, therefore after ink temperature rises, pressure drag component 41,42,43,44 all can produce the profile (Profile) to the top offset situation, as shown in Figure 5, the resistance value of each pressure drag component is changed; And because maximum stress concentrates on the central spot at each edge after sensing region 410 deformation, so each pressure drag component 41,42,43,44 stress of being experienced is the most powerful, the sensing effect is also best.
In practical application, for can be with pressure drag component 41,42,43,44 variation detects, and can utilize resistance as each pressure drag component, and with each pressure drag component with an electric bridge kenel, for example Wheatstone bridge (Wheatstone bridge) kenel couples mutually, makes the resistance change of each pressure drag component can be converted into voltage signal output, so can learn the height of ink temperature according to the size of voltage signal.Then please refer to Fig. 6, it illustrates the equivalent circuit of Wheatstone bridge, and E is an input voltage, and V is an output voltage.Each resistance R 1 among Fig. 6, R2, R3, R4 respectively with Fig. 4 in each pressure drag component 41,42,43,44 equivalences, just resistance R 1 and pressure drag component 41 equivalences, resistance R 2 and pressure drag component 42 equivalences, resistance R 3 and pressure drag component 43 equivalences, resistance R 4 and pressure drag component 44 equivalences.When design, the resistance value of supposing each resistance all identical (being R1=R2=R3=R4=R) and when sensing region 410 be subjected to one upwards during moment of flexure the resistance value of each resistance all produce the variable quantity of △ R, then owing to resistance R 1 and the direction of resistance R 3 and the edge-perpendicular of sensing region 410, so its resistance value is to increase △ R; Otherwise because the direction of resistance R 2 and resistance R 4 is parallel with the edge of sensing region 410, so its resistance value is to reduce △ R, so the change amount Δ V of output voltage values can be designated as: Δ V=(△ R/R) E.
Hence one can see that, and ink temperature changes can make sensing region 410 produce deformation, causes pressure drag component 41,42,43,44 resistance value R1, R2, R3, R4 changes, and resistance value R1, R2, R3, the variation of R4 can obtain the change of output voltage V, so can utilize the change amount Δ V of output voltage values to learn the height of ink temperature, there is no technical difficulty.
By above narrating as can be known, spirit of the present invention is to utilize variation of temperature to make sensing region produce deformation, and the resistance value of pressure drag component also changes thereupon after the sensing region deformation, thus this variation can be detected, to learn variation of temperature.It should be noted that, though above be that temperature-sensitive sticker with ink gun is the example explanation, yet suitable application area of the present invention should not exceed with ink gun, also in the chamber type device applicable to other kind contained fluid, as long as it is applicable elements according to the invention that the fluid temperature variations in the type device of arbitrary chamber can cause the deformation of sensing region, and does not break away from spirit of the present invention.Certainly, the preparation method of sensing region and pressure drag component also is not limited to semiconductor fabrication process, no matter preparation method why, as long as can realize meeting the sensing region of foregoing invention spirit and the design requirement that pressure drag component can reach voltage-resistor type temp sensor, but with technology now, the practice of utilizing semiconductor fabrication process is really for taking into account with low cost and convenient effectively optimal selection.
The advantage of apparatus of the present invention is:
1. manufacture craft is to utilize the integrated circuit technology of standard made to finish fully, need not add the making step that other is extra in addition, and possessing has the mass producible ability, and the accuracy of produced sensor and yield all have certain level.
2. utilize original required back manufacture craft (Post-processing) eating thrown silicon substrate to produce the step of manifold, above manifold, finish its voltage-resistor type temp sensing element film in advance, so can promptly can be made into this sensor under the condition of cost not increasing.
3. utilize this temperature-sensitive sticker to cooperate heater to do the control of whole ink-jet environment temperature, temperature controllable is in the scope that is predetermined, to reach the good effect of print quality.
In sum; though disclosed the present invention in conjunction with an above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (19)
1. fluid ejection apparatus comprises:
One manifold, this manifold are to form and be filled with a fluid by the semiconductor substrate etching; And
One temperature is adjusted element, in order to heat this semiconductor-based end so that the temperature of this fluid rise.
2. fluid ejection apparatus as claimed in claim 1, wherein this semiconductor-based end is a silicon base.
3. fluid ejection apparatus as claimed in claim 1, wherein this fluid ejection apparatus is an ink gun.
4. fluid ejection apparatus as claimed in claim 1, wherein this fluid is an ink.
5. fluid ejection apparatus as claimed in claim 1, wherein this temperature adjustment element is a heater.
6. fluid ejection apparatus as claimed in claim 1, wherein this temperature is adjusted the edge of element around this manifold.
7. fluid ejection apparatus as claimed in claim 1, wherein this temperature is adjusted the edge of element around this semiconductor-based end.
8. fluid ejection apparatus as claimed in claim 1 also comprises a plurality of temperature-sensitive stickers, is located at the top of this manifold, is used to detect the temperature of this fluid.
9. fluid ejection apparatus as claimed in claim 8, wherein this temperature is adjusted element and is divided into a plurality of parts by differentiation, and this each part is round corresponding temperature-sensitive sticker.
10. a fluid ejection apparatus is based on the semiconductor substrate, comprising:
One manifold, this manifold are to form through carry out etching on this semiconductor-based end, and are filled with a fluid; And
One temperature is adjusted element, is arranged at the top of this manifold, and in order to heat this semiconductor-based end to adjust the temperature of this fluid, wherein this temperature adjustment device is a ring-type haply.
11. fluid ejection apparatus as claimed in claim 10, wherein this semiconductor-based end is a silicon base.
12. fluid ejection apparatus as claimed in claim 10, wherein this fluid ejection apparatus is an ink gun.
13. fluid ejection apparatus as claimed in claim 10, wherein this fluid is an ink.
14. fluid ejection apparatus as claimed in claim 10, wherein this temperature adjustment element is a heater.
15. fluid ejection apparatus as claimed in claim 10, wherein this temperature adjustment element is the edge around this manifold.
16. fluid ejection apparatus as claimed in claim 10, wherein this temperature adjustment element is the edge around this semiconductor-based end.
17. fluid ejection apparatus as claimed in claim 10 also comprises a plurality of temperature-sensitive stickers, is positioned at the top of this manifold, is used to detect the temperature of this fluid.
18. fluid ejection apparatus as claimed in claim 17, wherein this temperature is adjusted element and is separated into a plurality of parts, and this each part is round corresponding temperature-sensitive sticker.
19. fluid ejection apparatus as claimed in claim 10, wherein this temperature adjustment element is rectangle haply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031584977A CN1296211C (en) | 2001-03-27 | 2001-03-27 | Fluid spraying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031584977A CN1296211C (en) | 2001-03-27 | 2001-03-27 | Fluid spraying apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011120347A Division CN1159571C (en) | 2001-03-27 | 2001-03-27 | Voltage-resistor type temp sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1593923A true CN1593923A (en) | 2005-03-16 |
| CN1296211C CN1296211C (en) | 2007-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031584977A Expired - Fee Related CN1296211C (en) | 2001-03-27 | 2001-03-27 | Fluid spraying apparatus |
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| Country | Link |
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| CN (1) | CN1296211C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017213874A (en) * | 2016-05-30 | 2017-12-07 | キヤノン株式会社 | Recording element substrate and recording device |
| CN109070593A (en) * | 2016-05-02 | 2018-12-21 | 马姆杰特科技有限公司 | Monochrome ink jet printhead for flying print |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0479784B1 (en) * | 1988-12-14 | 1993-07-28 | Siemens Aktiengesellschaft | Arrangement for heating the ink in the write head of an ink-jet printer |
| JPH09131896A (en) * | 1995-11-10 | 1997-05-20 | Brother Ind Ltd | Ink-jet recording apparatus |
| CN1274499C (en) * | 1998-01-23 | 2006-09-13 | 明碁电通股份有限公司 | Apparatus and method for using bubble as virtual valve in microinjector to eject fluid |
-
2001
- 2001-03-27 CN CNB031584977A patent/CN1296211C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109070593A (en) * | 2016-05-02 | 2018-12-21 | 马姆杰特科技有限公司 | Monochrome ink jet printhead for flying print |
| TWI715755B (en) * | 2016-05-02 | 2021-01-11 | 愛爾蘭商滿捷特科技公司 | Monochrome inkjet printhead configured for high-speed printing |
| CN109070593B (en) * | 2016-05-02 | 2021-03-16 | 马姆杰特科技有限公司 | Monochrome ink jet printhead for high speed printing |
| JP2017213874A (en) * | 2016-05-30 | 2017-12-07 | キヤノン株式会社 | Recording element substrate and recording device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1296211C (en) | 2007-01-24 |
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