CN1592550A - Back board for through hole plugging device and assembling method - Google Patents
Back board for through hole plugging device and assembling method Download PDFInfo
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- CN1592550A CN1592550A CN 03155479 CN03155479A CN1592550A CN 1592550 A CN1592550 A CN 1592550A CN 03155479 CN03155479 CN 03155479 CN 03155479 A CN03155479 A CN 03155479A CN 1592550 A CN1592550 A CN 1592550A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000002788 crimping Methods 0.000 claims description 43
- 238000003780 insertion Methods 0.000 claims description 21
- 230000037431 insertion Effects 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
This invention disclosed a back-plate with through-hole plugging-in device. This back-plate contains PCB, crimp connection socket and through-hole plugging-in device. The PCB is connected with the crimp connection socket, and the crimp connection socket is connected with the through-hole plugging-in device. The crimp connection socket's induced plug is plugged into the cavity of the PCB hole, the coordination between them formed with stationary fit. This invention also disclosed an assembling method for through-hole plugging-in devices.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a back plate for a through hole plug-in device and an assembling method.
Background
With the rapid development of communication technology, communication equipment becomes more and more complex, and meanwhile, higher requirements are put on the reliability of the equipment by customers. The backplane is used as a carrier which is arranged at the bottom or the middle part of an inserting frame or a machine frame and is used for interconnecting signals among the single boards or the sub cards and supplying power to the single boards or the sub cards, and has a light role in the whole equipment, so that the requirements on maintainability, maintainability and reliability of the backplane are gradually improved. Due to the development of communication technology, the backplane must meet the requirement of transmitting high-rate signals, while high-rate signals often require that resistance-capacitance components are adopted for signal matching, and simultaneously, in order to meet different requirements of customers on the functions of equipment, dial switches capable of switching different functional configurations need to be assembled on the backplane.
Along with the increase of the functions of the back plate, the size of the back plate is also continuously increased, particularly the thickness of the back plate is increased, the traditional wave soldering, manual soldering or reflow soldering process technology is adopted to perform soldering assembly on the through hole plug-in mounting device on the back plate, the size (length/width/thickness) of the back plate is greatly limited, and the design of the back plate is restricted. For the backboard with a large size, new equipment needs to be added to assemble the backboard, meanwhile, the welding quality cannot be guaranteed, the cost of the product is increased invisibly, and the engineering design difficulty of the product is increased, so that the welding process technology is difficult to be applied to the backboard with the large size, particularly the backboard with the large thickness. Meanwhile, the welding process technology is adopted, and soldering flux and cleaning agent chemical reagents are needed, so that the environmental adaptability of the back plate is influenced; the back plate is heated at high temperature in the assembling process, so the selection of the thickness and the material of the back plate is strict; the welding heat also has influence on the long-term reliability of the back plate; once the welding device fails, a power failure disassembly maintenance mode is required, so that the back plate is difficult to maintain.
In order to solve the problems of the conventional welding process, a process technology has appeared at present, in which a resistance-capacitance device for signal matching is arranged on a small buckle plate or a small plug plate, and then the small buckle plate or the small plug plate is connected with a back plate through a crimping connector.
However, the connection mode of the small pinch plate or the small plug board cannot be realized for products with compact back plate layout structure and dense slot position spacing, and the small plug board or the small pinch plate cannot be fixed due to space limitation and is easy to fall off in the transportation process and the like.
Disclosure of Invention
The invention provides a backboard for a through hole plug-in device and a mounting method, and aims to solve the problems that the existing small buckle plate or small plug board technology cannot be well realized on products with compact layout and dense slot spacing and the fixing reliability is poor.
Therefore, the invention provides the following technical scheme:
a backboard for a through-hole plug-in device comprises a PCB (printed circuit board), a compression-type socket and the through-hole plug-in device; the PCB is connected with the crimping type socket, the crimping type socket is connected with the through hole plug-in device, a crimping type pin of the crimping type socket is crimped in the aperture of the PCB, and the crimping type pin and the aperture form interference fit.
The through hole plug-in device is a discrete device, a single in-line (SIP) device or a dual in-line (DIP) device.
The pins of the discrete device are right-angled with respect to the discrete device.
The invention also provides an assembling method for the through hole plug-in device, which comprises the following steps:
determining through hole plug-in devices to be assembled;
selecting and determining a corresponding crimping type socket according to the determined thickness of the pin of the through hole plug-in device to be assembled;
determining the position of the crimping type socket on the PCB according to the positions of the pins of the through hole insertion device on the PCB and the intervals among the pins;
determining the size of the aperture of the PCB according to the size of a crimping pin of the crimping type socket;
defining pin signals of the crimping type socket according to the pin signals of the through hole plug-in device;
crimping the crimp-style socket onto the PCB;
and installing the through hole insertion device on the crimping type socket.
The step of crimping the crimp-type socket onto the PCB includes the steps of:
aligning crimping pins of the crimping type socket to an aperture corresponding to the crimping type socket on the PCB;
inserting crimp pins of the crimp-style socket down into respective apertures of the PCB;
crimping the crimp pin of the crimp-style socket into the aperture and forming an interference fit.
The step of mounting the through-hole insertion device to the press-fit type socket includes the steps of:
if the through hole plug-in device is a discrete device, preforming the discrete device;
if the through hole plug-in device is SIP or DIP, special molding is not needed;
and installing the pins of the through hole insertion device into the hole diameter of the crimping type socket.
The step of pre-forming the discrete device is:
preforming pins of the discrete device into a right-angle shape according to the vertical shape of the crimping socket crimped on the PCB;
according to the invention, the compression joint type socket is additionally arranged between the through hole plug-in device and the back plate, so that the through hole plug-in device can be conveniently assembled without a welding process, no special requirements are required on the back plate PCB material, design, production, back plate processing and the like, and the engineering design difficulty and the engineering cost are very low; the technological process of the back plate can be optimized into the crimping technological process, the high-temperature impact frequency of the back plate is reduced, the reliability of the back plate is improved, and the requirement of the back plate on high reliability in a system is met; the through hole plug-in device can be conveniently maintained under the condition that the through hole plug-in device fails, the replacement of the through hole plug-in device can be completed without disassembling a back plate, and the normal service of a system is not influenced; the through hole plug-in mounting device can be placed at a place where signal matching is needed in the same way as a common layout mode, and does not affect PCB layout and wiring and transmission quality of signals.
The backboard with the through-hole plug-in device is subjected to vibration test and impact test, wherein in the vibration test (according to the standard of ETS 300-2(ii) a The impact pulse contact time in the impact test (according to the standard of ETS 300-2The number of impacts was 500 per face for a total of 6 faces. Experiments show that the through hole plug-in device on the backboard does not fall off, the signal interruption or electrical interruption time is less than 1 microsecond, and the reliability of electrical signal contact is ensured.
Drawings
The invention is further described with reference to the following figures and detailed description.
FIG. 1 is a schematic view of a backplane with through-hole mounted devices of the present invention.
Fig. 2 is a schematic view of a discrete device molding shape of the present invention.
FIG. 3 is a flow chart of the method for assembling the through hole plug-in device and the PCB of the present invention.
Fig. 4 is a schematic view of the press contact type socket of the present invention press-contacted to a PCB.
FIG. 5 is a schematic view of the through-hole insertion device of the present invention mounted to a crimp socket.
Detailed Description
In order that those skilled in the art will more clearly understand the present invention, they will now be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic view of a backplane with through-hole mounted devices of the present invention. The backplate that has the through-hole cartridge device includes: PCB100, crimp-type socket 110, and through-hole insertion device 120. In which a press-fit type socket 110 is coupled to a PCB100 and a through-hole insertion device 120 is mounted on the press-fit type socket 110. The crimp pins of the crimp socket 110 are crimped into the bore of the PCB100, with the crimp pins forming an interference fit with the bore. The through hole plug-in device can be a discrete device, such as a plug-in resistor, a capacitor, a Light Emitting Diode (LED) and the like which adopt axial packaging, and can also be a single in-line package device (SIP) or a dual in-line package Device (DIP) and the like.
Fig. 2 is a schematic view of a discrete device molding shape of the present invention. The pins 170 of the discrete device 160 are bent into a right angle perpendicular to the discrete device 160 to facilitate mounting to the crimp-type socket. (ii) a
FIG. 3 is a flow chart of the method for assembling the through hole plug-in device and the PCB of the present invention. Wherein,
in step 200, firstly, whether a through hole plug-in device to be mounted and connected on a PCB is a discrete device or an SIP or DIP is determined;
in step 210, according to the determined specific size of the pin of the through hole insertion device to be assembled, a corresponding matched crimping type socket is selected and determined. For example, if the through hole plug-in device to be assembled is a discrete device, and the pin diameter of the discrete device is 0.5mm, the technical requirement of the aperture of the crimp-type socket matched with the discrete device is phi 0.4-0.56 mm, so that the discrete device can form good electrical performance connection with the crimp-type socket.
In step 220, the position of the crimp-type socket on the PCB is determined according to the determined pin pitch of the through hole insertion device. For example, if the through-hole insertion device is determined to be a resistor with 400mil pin pitch on the PCB, the distance between two adjacent crimp-type sockets is also designed to be 400mil pitch.
In step 230, the size of the PCB aperture is determined according to the size of the press pin of the press type socket. For example, when a certain resistor is used in a soldering process, the diameter of the PCB is 36mil, and when a crimp socket is used, the diameter of the PCB is 40mil according to the size of the crimp pin of the crimp socket.
In step 240, pin signals of the crimp-type socket are defined according to the pin signals, that is, the definition of the pin signals of the crimp-type socket is consistent with the definition of the pin signals of the through hole plug-in device originally used for soldering.
In step 250, the PCB is designed according to the above steps, and the aperture of the PCB is processed according to the designed PCB, that is, the aperture is processed on the PCB according to the determined position and aperture size.
At step 260, the crimp-style receptacle is crimped onto the PCB.
To better illustrate the process of crimping a crimp-type socket onto a PCB, reference is made to fig. 4 for a detailed description.
Fig. 4 is a schematic view showing a process of crimping the crimp type socket of the present invention to a PCB. FIG. 4a is a schematic diagram of a ready to crimp socket and PCB with crimp pins 410 on crimp socket 400 aligned with apertures 430 on PCB 420; FIG. 4b is a schematic view of the crimp socket being crimped to a PCB, with the crimp pins 410 on the crimp socket 400 aligned with corresponding apertures 430 on the PCB420 and the crimp pins 410 being inserted down into the apertures 430 on the PCB 420; figure 4c is a schematic view of the crimp socket being crimped onto the PCB with the crimp pins 410 on the crimp socket 400 forming an interference fit with the corresponding apertures 430 on the PCB420 so that the crimp socket 400 forms a reliable electrical connection with the PCB 420.
Referring back to fig. 3, the method of assembling the through-hole mounted device and the PCB is described.
At step 270, the type of through-hole insertion device being installed is determined. The through hole plug-in device can be a discrete device, and can also be an SIP or DIP device.
In step 280, if the through-hole plug-in device is a discrete device, such as a plug-in resistor, a plug-in capacitor, an LED lamp, or the like, which is packaged in an axial direction, the discrete device needs to be preformed into a right-angled shape on both sides according to the vertical shape of the press-connection type socket pressed on the PCB.
In step 290, if the through hole plug-in device is a package type solder device such as SIP or DIP, the through hole plug-in device can be directly mounted on the crimp socket without special molding.
At step 300, the through-hole insertion device is mounted to the crimp-type socket.
To better illustrate the process of mounting the through-hole insertion device to the crimp-type socket, it is described in detail below with reference to fig. 5.
Fig. 5 is a schematic view of the through-hole insertion device of the present invention attached to a crimp-type socket. The pins 610 of the through-hole insertion device 600 are aligned with the insertion holes of the crimp-type socket 630 crimped onto the PCB620, and the pins 610 are inserted downward into the insertion holes of the crimp-type socket 630. And finishing the assembly of the PCB and the through hole plug-in device.
Although the present invention has been described by way of examples, a person of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the spirit of the present invention, and it is therefore intended that the appended claims encompass such modifications and changes as can be made without departing from the spirit of the present invention.
Claims (7)
1. A backboard for a through-hole plug-in device comprises a Printed Circuit Board (PCB), a compression-type socket and the through-hole plug-in device; the PCB is connected with the crimping type socket, the crimping type socket is connected with the through hole plug-in device, a crimping type pin of the crimping type socket is crimped in the aperture of the PCB, and the crimping type pin and the aperture form interference fit.
2. The backplane of claim 1, wherein the through-hole interposer device is a discrete device, a single in-line (SIP) device, or a dual in-line (DIP) device.
3. The backplane of claim 2, wherein the leads of the discrete devices are right-angled with respect to the discrete devices.
4. An assembling method for a plug-in device with a through hole comprises the following steps:
determining through hole plug-in devices to be assembled;
selecting and determining a corresponding crimping type socket according to the determined thickness of the pin of the through hole plug-in device to be assembled;
determining the position of the crimping type socket on the PCB according to the positions of the pins of the through hole insertion device on the PCB and the intervals among the pins;
determining the size of the aperture of the PCB according to the size of a crimping pin of the crimping type socket;
defining pin signals of the crimping type socket according to the pin signals of the through hole plug-in device;
crimping the crimp-style socket onto the PCB;
and installing the through hole insertion device on the crimping type socket.
5. The method of claim 4, wherein said step of crimping said crimp-type socket onto said PCB comprises the steps of:
aligning crimping pins of the crimping type socket to an aperture corresponding to the crimping type socket on the PCB;
inserting crimp pins of the crimp-style socket down into respective apertures of the PCB;
crimping the crimp pin of the crimp-style socket into the aperture and forming an interference fit.
6. The method of claim 4, wherein said step of mounting said through-hole insertion device to said crimp-type socket comprises the steps of:
if the through hole plug-in device is a discrete device, preforming the discrete device;
if the through hole plug-in device is SIP or DIP, special molding is not needed;
and installing the pins of the through hole insertion device into the hole diameter of the crimping type socket.
7. The method of claim 6, wherein the step of pre-forming the discrete device is:
preforming pins of the discrete device into a right-angle shape according to the vertical shape of the crimping socket crimped on the PCB;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031554792A CN100372446C (en) | 2003-08-30 | 2003-08-30 | Back board for through hole plugging device and assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031554792A CN100372446C (en) | 2003-08-30 | 2003-08-30 | Back board for through hole plugging device and assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1592550A true CN1592550A (en) | 2005-03-09 |
| CN100372446C CN100372446C (en) | 2008-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031554792A Expired - Fee Related CN100372446C (en) | 2003-08-30 | 2003-08-30 | Back board for through hole plugging device and assembling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100372446C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105572A (en) * | 2017-05-10 | 2017-08-29 | 华勤通讯技术有限公司 | A kind of vertical welding leg |
| CN110783104A (en) * | 2018-07-26 | 2020-02-11 | 大陆汽车系统公司 | Compliant pin structure for discrete electrical components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132250A (en) * | 1990-09-21 | 1992-05-06 | Nec Corp | Ic package for solderless mounting |
| CN2236715Y (en) * | 1995-05-11 | 1996-10-02 | 张安宁 | Electronic element with easily sold leads |
| JP2001357952A (en) * | 2000-06-12 | 2001-12-26 | Ibiden Co Ltd | Mounting module |
-
2003
- 2003-08-30 CN CNB031554792A patent/CN100372446C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105572A (en) * | 2017-05-10 | 2017-08-29 | 华勤通讯技术有限公司 | A kind of vertical welding leg |
| CN107105572B (en) * | 2017-05-10 | 2023-04-14 | 华勤技术股份有限公司 | Vertical leg structure |
| CN110783104A (en) * | 2018-07-26 | 2020-02-11 | 大陆汽车系统公司 | Compliant pin structure for discrete electrical components |
| US11509078B2 (en) | 2018-07-26 | 2022-11-22 | Vitesco Technologies USA, LLC. | Compliant pin structure for discrete electrical components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100372446C (en) | 2008-02-27 |
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| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guangzhou Kangyijian Medical Equipment Co., Ltd. Assignor: Huawei Technologies Co., Ltd. Contract fulfillment period: 2008.6.11 to 2013.6.11 contract change Contract record no.: 2009440001691 Denomination of invention: Back board for through hole plugging device and assembling method Granted publication date: 20080227 License type: Exclusive license Record date: 20091022 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.11 TO 2013.6.11; CHANGE OF CONTRACT Name of requester: GUANGZHOU CITY KANGYIJIAN MEDICAL EQUIPMENT CO., L Effective date: 20091022 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 Termination date: 20160830 |
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| CF01 | Termination of patent right due to non-payment of annual fee |