CN1587040A - Comprehensive utilizing method for by-product in organic silicon methyl monomer production process - Google Patents
Comprehensive utilizing method for by-product in organic silicon methyl monomer production process Download PDFInfo
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- CN1587040A CN1587040A CN 200410051507 CN200410051507A CN1587040A CN 1587040 A CN1587040 A CN 1587040A CN 200410051507 CN200410051507 CN 200410051507 CN 200410051507 A CN200410051507 A CN 200410051507A CN 1587040 A CN1587040 A CN 1587040A
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- 239000006227 byproduct Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000178 monomer Substances 0.000 title claims description 17
- 239000010703 silicon Substances 0.000 title description 2
- 229910052710 silicon Inorganic materials 0.000 title description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000007789 gas Substances 0.000 claims abstract description 35
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 19
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 19
- 239000001257 hydrogen Substances 0.000 claims abstract description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000000926 separation method Methods 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 238000009835 boiling Methods 0.000 claims description 24
- 229960001866 silicon dioxide Drugs 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 7
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000005543 nano-size silicon particle Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000003837 high-temperature calcination Methods 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 229910001868 water Inorganic materials 0.000 claims description 4
- 229910008045 Si-Si Inorganic materials 0.000 claims description 3
- 229910003902 SiCl 4 Inorganic materials 0.000 claims description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 claims description 3
- 229910006411 Si—Si Inorganic materials 0.000 claims description 3
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 claims description 3
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000006068 polycondensation reaction Methods 0.000 claims description 2
- 239000000047 product Substances 0.000 abstract description 13
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 230000007062 hydrolysis Effects 0.000 abstract description 2
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000005060 rubber Substances 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- 238000005345 coagulation Methods 0.000 abstract 1
- 230000015271 coagulation Effects 0.000 abstract 1
- 238000012643 polycondensation polymerization Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 12
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 6
- 239000005049 silicon tetrachloride Substances 0.000 description 6
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical compound C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000005055 methyl trichlorosilane Substances 0.000 description 2
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XLVKXZZJSTWDJY-UHFFFAOYSA-N [SiH4].[Si] Chemical compound [SiH4].[Si] XLVKXZZJSTWDJY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007233 catalytic pyrolysis Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000005826 halohydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- Silicon Compounds (AREA)
Abstract
Description
The component title | Molecular formula | Boiling point (101.3kPa)/℃ | ||
Principal product | Dimethyldichlorosilane(DMCS) | (CH 3) 2SiCl 2 | ???70.2 | |
By product | Low-boiling-point substance | METHYL TRICHLORO SILANE | CH 3SiCl 3 | ???66.1 |
Trimethylchlorosilane | (CH 3) 3SiCl | ???57.3 | ||
Dimethyl dichlorosilane (DMCS) | CH 3SiHCl 2 | ???40.4 | ||
Dimethylchlorosilane | (CH 3) 2SiHCl | ???35.4 | ||
Tetramethylsilane | (CH 3) 4Si | ???26.2 | ||
Silicon tetrachloride | SiCl 4 | ???57.6 | ||
Trichlorosilane | HSiCl 3 | ???31.8 | ||
High boiling material | Disilane etc. | ≡Si-Si≡ ≡Si-O-Si≡ ≡Si-CH 2-Si≡ | ???>70.2℃ |
Claims (7)
Priority Applications (1)
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CN 200410051507 CN1238252C (en) | 2004-09-17 | 2004-09-17 | Comprehensive utilizing method for by-product in organic silicon methyl monomer production process |
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CN 200410051507 CN1238252C (en) | 2004-09-17 | 2004-09-17 | Comprehensive utilizing method for by-product in organic silicon methyl monomer production process |
Publications (2)
Publication Number | Publication Date |
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CN1587040A true CN1587040A (en) | 2005-03-02 |
CN1238252C CN1238252C (en) | 2006-01-25 |
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CN 200410051507 Expired - Lifetime CN1238252C (en) | 2004-09-17 | 2004-09-17 | Comprehensive utilizing method for by-product in organic silicon methyl monomer production process |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100369811C (en) * | 2006-04-29 | 2008-02-20 | 广州吉必时科技实业有限公司 | Comprehensive utilization method of by-product for poycrystalline silicon production process |
CN101378991B (en) * | 2006-03-03 | 2012-11-28 | 瓦克化学有限公司 | Process for recycling high-boiling compounds within an integrated chlorosilane system |
CN107603230A (en) * | 2017-08-25 | 2018-01-19 | 山东东岳有机硅材料有限公司 | Silicon rubber prepared using organosilicon low boiling hydrolysate and preparation method thereof |
CN109880119A (en) * | 2019-01-31 | 2019-06-14 | 山东东岳有机硅材料股份有限公司 | Elimination organosilicon crude monomer hydrolysate is not stratified and sticks the method for equipment phenomenon |
CN113663464A (en) * | 2021-09-01 | 2021-11-19 | 山东东岳有机硅材料股份有限公司 | Impurity removal process and impurity removal device for HCl for industrial production of chloromethane |
CN114015049A (en) * | 2021-10-29 | 2022-02-08 | 山东东岳有机硅材料股份有限公司 | Preparation method of MQ silicon resin for synthesizing pressure-sensitive adhesive from organic silicon by-product |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102513031B (en) * | 2011-11-30 | 2014-04-16 | 广州吉必盛科技实业有限公司 | Deacidification process and equipment thereof |
-
2004
- 2004-09-17 CN CN 200410051507 patent/CN1238252C/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101378991B (en) * | 2006-03-03 | 2012-11-28 | 瓦克化学有限公司 | Process for recycling high-boiling compounds within an integrated chlorosilane system |
CN100369811C (en) * | 2006-04-29 | 2008-02-20 | 广州吉必时科技实业有限公司 | Comprehensive utilization method of by-product for poycrystalline silicon production process |
CN107603230A (en) * | 2017-08-25 | 2018-01-19 | 山东东岳有机硅材料有限公司 | Silicon rubber prepared using organosilicon low boiling hydrolysate and preparation method thereof |
CN109880119A (en) * | 2019-01-31 | 2019-06-14 | 山东东岳有机硅材料股份有限公司 | Elimination organosilicon crude monomer hydrolysate is not stratified and sticks the method for equipment phenomenon |
CN109880119B (en) * | 2019-01-31 | 2021-08-10 | 山东东岳有机硅材料股份有限公司 | Method for eliminating phenomena of no delamination and equipment adhesion of organosilicon crude monomer hydrolysate |
CN113663464A (en) * | 2021-09-01 | 2021-11-19 | 山东东岳有机硅材料股份有限公司 | Impurity removal process and impurity removal device for HCl for industrial production of chloromethane |
CN114015049A (en) * | 2021-10-29 | 2022-02-08 | 山东东岳有机硅材料股份有限公司 | Preparation method of MQ silicon resin for synthesizing pressure-sensitive adhesive from organic silicon by-product |
CN114015049B (en) * | 2021-10-29 | 2023-10-24 | 山东东岳有机硅材料股份有限公司 | Preparation method of MQ silicon resin for synthesizing pressure-sensitive adhesive from organic silicon byproducts |
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CN1238252C (en) | 2006-01-25 |
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Effective date of registration: 20200407 Address after: 443007 66-2, Lanting Avenue, Lanting District, Yichang City, Hubei Province Patentee after: YICHANG HUIFU SILICON MATERIAL Co.,Ltd. Address before: Nanxiang three road, Science City high tech Industrial Development Zone, Guangzhou city of Guangdong Province, No. 15 510663 Patentee before: GUANGZHOU GBS HIGH-TECH & INDUSTRY Co.,Ltd. |
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Address after: 66-2 No. 443007 Hubei city of Yichang province located in Xiaoting District Road Patentee after: Hubei HuiFu nano materials Co.,Ltd. Address before: 443007 66-2, Lanting Avenue, Lanting District, Yichang City, Hubei Province Patentee before: YICHANG HUIFU SILICON MATERIAL Co.,Ltd. |
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