CN1572915A - Cartridge plating device and design method - Google Patents
Cartridge plating device and design method Download PDFInfo
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- CN1572915A CN1572915A CN 200410044686 CN200410044686A CN1572915A CN 1572915 A CN1572915 A CN 1572915A CN 200410044686 CN200410044686 CN 200410044686 CN 200410044686 A CN200410044686 A CN 200410044686A CN 1572915 A CN1572915 A CN 1572915A
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- 238000007747 plating Methods 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title claims description 16
- 238000013461 design Methods 0.000 title claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 230000005611 electricity Effects 0.000 claims description 15
- 210000004508 polar body Anatomy 0.000 claims description 14
- 230000008676 import Effects 0.000 claims description 12
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 150000002910 rare earth metals Chemical class 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 238000007665 sagging Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005755 formation reaction Methods 0.000 description 16
- 238000009713 electroplating Methods 0.000 description 11
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- 230000000694 effects Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
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- 239000004020 conductor Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
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- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Abstract
The invention relates to a barrel plating device; the plated object used for barrel plating is a flat board shaped object, which is characterized in that the major axis length (a) is 5 to 60 mm; the ratio of the major length (a) and the stub axle length (b) (unit mm) is greater than 1.2; the thickness (c) (unit mm) is smaller than the stub axle length (b); a rod-like cathode instruction part is introduced into the barrel, and a horizontal part with a distance (L) is formed; the relationship of the distance and the plated object length (a) is utilized; the the distance (L/a) is less than or equal to 0.9; even if a interfered flat board shaped plated object is in barrel plating, the bias or stay of the flow state of the plated object in barrel can be reduced or prevented; a coating with uniform thickness formed on the plated object can be guaranteed, and the bad phenomenon of crack or breakage can be inhibited.
Description
Technical field
The present invention relates to cartridge plating device and method of design, especially relate to and utilizing and the electrode shape that is loaded on by the relation decision of plating object shape in the tube, reduce or prevent in the tube, can guarantee to be plated object and form the cartridge plating device and the method for design of uniform thickness plated film by the bias or the stop of plating object flow state.
Technical background
To electronic component etc. implemented plating by the plating object time device that uses a kind of cartridge plating device is arranged.This plating appts people know its form already, this plating appts at least a portion is made of the material of wire netting by electroplate liquid etc., in internal configuration the tube of cathode electrode, accommodate electronic component for example etc. by the plating object, with connect for example steel ball used by plating object and cathode electrode etc. contact medium (also claiming medium) after, tube is immersed in the electroplate liquid in the plating tank, the limit in being equipped on plating tank anode electrode and cathode electrode between switch on, the limit rotates tube in plating bath, contact with electroplate liquid with cathode electrode by utilizing the contact medium to make, to being electroplated by the surface of plating object by the plating object.
Yet, cartridge plating device in the past, adopt the method for tube rotation, though the inner object state moving that plated with contacting media streaming, but owing to play the negative electrode introduction part that imports the cathode electrode effect in the tube is slightly horizontal, so when rotation tube by plate object also be concentrated in the negative electrode introduction part near, produce the offset issue of be can not ignore sometimes by the electroplating thickness between the plating object.
In order to solve such problem, Te Kaiping 9-119000 communique (Patent Document 1) has proposed the rectification body of a configuration at two ends in tube as agitating plate, the cartridge plating device that sheet component is not separated with the electroconductibility medium and move sleekly in center side, therefore, can make the few element of plating thickness deviation with the relatively shorter time.
In addition, the spy opens 2001-279498 communique (Patent Document 2), coniform or pyramidal parts are installed at the two ends that proposed in tube, reduce or prevent to be plated the bias or the stop of object flow state in tube, guarantee the main points that formed the uniform thickness plated film on the object plating.
Yet because both formations of limiting-members are installed at two ends that are formed in the tube, so that the structure of device itself becomes is complicated, also there are the tendency of a minimizing capacity in above-mentioned Patent Document 1 and 2 motion, are unfavorable for the miniaturization of implement device.
In addition, it is this that above-mentioned Patent Document 1 and the motion of Patent Document 2 are used is film about the thick 2 μ m of little thing shape and plated film by the plating object, estimate not produce the present inventor basically and be familiar with by this problem of plating object eclipsed, in the disclosed special setting specification that does not more need to consider to improve cartridge plating device in by plating object scope in the past.
Summary of the invention
The present invention is improved invention on the basis of this actual state.Yes adopts the miniaturization of simple structure implement device for its purpose, the application's purpose provides utilization and is loaded on the interior electrode shape of tube by the relation decision of plating object shape especially with employed, reduce or prevent to be plated the skew or the stop of object flow state in tube, can guarantee to be plated the plated film that object forms uniform thickness, and can suppress to chap or cartridge plating device and its method of design of splintering problem.In addition, also provide to make the flow state of being plated object as far as possible, thereby can improve electroplating velocity, can reduce the cartridge plating device and the method for design thereof of electroplating with current value near the ideal state.
In order to solve such problem, it is 5～60mm that the present invention adopts long axis length, the value of the ratio (a/b) of long axis length a and minor axis length b (mm of unit) is more than 1.2, the writing board shape thing that thickness c (mm of unit) is littler than minor axis length b is carried out the barrel plating cartridge plating device as plating object, it is cylindrical body roughly that this cartridge plating device constitutes, rotatable, having inside accommodates by the tube of plating object, with the bar-shaped cathodic electricity polar body that in tube, imports respectively from position in the relative end faces of both sides plate side of aforementioned tube with the about concentric shafts of tube turning axle, the cathode electrode portion that aforementioned bar-shaped cathodic electricity polar body has its top to expose, with be insulated material lining until the bar-shaped negative electrode introduction part of aforementioned cathode electrode portion, aforementioned bar-shaped negative electrode introduction part, the horizontal part that distance L is arranged after in the importing tube, the relation of the long axis length a of utilization and quilt plating object, set this distance L and make L/a≤0.9.
In addition, as preferred version of the present invention, aforementioned bar-shaped negative electrode introduction part, its formation will have and import in the tube after the horizontal part of distance L, the structure that hangs down then are configured near the central authorities cathode electrode portion.
In addition, as preferred version of the present invention, it is 0.5～24 liter that its formation makes the capacity of aforementioned tube.
In addition, as preferred version of the present invention, its formation be aforementioned by the plating object be permanent magnet.
In addition, as preferred version of the present invention, its formation is that aforementioned permanent magnet is the rare earth class permanent magnet.
In addition, as preferred version of the present invention, its formation is to be the metal-plated that contains at least a kind of Ni, Cu, Zn, Sn to the aforementioned plating of being implemented by the plating object.
In addition, as preferred version of the present invention, it is more than the 5 μ m that its operation will make thick to aforementioned plated film by the enforcement of plating object.
The galvanized formation method of permanent magnet of the present invention, its formation is to use aforementioned cartridge plating device to carry out the plating of permanent magnet.
The method of design of cartridge plating device of the present invention, be that long axis length a is 5～60mm, the value of the ratio (a/b) of long axis length a and minor axis length b (mm of unit) is more than 1.2, the writing board shape thing that thickness c (mm of unit) is littler than minor axis length b is carried out the barrel plating cartridge plating device as plating object, its formation of this cartridge plating device is that slightly cylindrical body is rotatable, having inside accommodates by the tube of plating object, with the bar-shaped cathodic electricity polar body that in tube, imports respectively from position in the relative end faces of both sides plate side of aforementioned tube with the about concentric shafts of tube turning axle, the cathode electrode portion that aforementioned bar-shaped cathodic electricity polar body has its top to expose, with be insulated material lining, until the bar-shaped negative electrode introduction part of aforementioned cathode electrode portion, the horizontal part that distance L is arranged after aforementioned bar-shaped negative electrode introduction part imports in the tube, utilize the relation of plating the long axis length a of object with quilt, set this distance L and make L/a≤0.9.
Description of drawings
Fig. 1 is the figure of a kind of embodiment of pattern ground expression cartridge plating device of the present invention.
Fig. 2 is the side-view of an example of simple face shaping that expression is used for the tube of cartridge plating device.
Fig. 3 (a) is the figure of expression as the rectangular parallelepiped writing board shape thing of quilt plating object shape, and Fig. 3 (b) is the figure of expression as the writing board shape thing of the plane fan shape of being plated the object shape.
Fig. 4 is the figure that behind the pattern ground expression barrel plating quilt is plated the plated film state of object lining.
The preferred plan that carries out an invention
Below, the embodiment of cartridge plating device of the present invention is at length described.
Fig. 1 is the figure of a kind of embodiment of pattern ground expression cartridge plating device of the present invention, and Fig. 2 is the side-view that expression is used for an example of its simple face shaping of tube of cartridge plating device.
Cartridge plating device 1 of the present invention has the tube 30 of tubular.Tube 30 has the end plates 31,35 of relative (opposed) that be positioned at axle this rotation shaft side and constitutes the tube plate 38 of circumferential lateral surface.Usually, form on the tube plate 38 many communicating poress (omitting the expression on the drawing) make electroplate liquid can be by tube inside and outside.
As shown in Figure 1, utilize the end of end plates 31, the 35 sealing tubular tubes of the both ends of the surface that are disposed at tube 30. End plates 31,35 and tube plate 38 can form respectively, also can form.
The material that constitutes tube 30 is preferably used the resin material of insulativity.This molding resin material is good, in light weight, price is also cheap.
Center at the end plates 31,35 that are disposed at tube 30 both ends of the surface forms patchhole 32,36 respectively, and inserting respectively to utilize in these patchhole 32,36 does not have the fixing 2 bar-shaped cathodic electricity polar bodys 10,20 that do not rotate separately of illustrated bearing part itself.
Bar-shaped cathodic electricity polar body 10 on one side, as shown in Figure 1, the cathode electrode portion 15 that its top exposes is arranged and be insulated the material lining, until the bar-shaped negative electrode introduction part 11,12,13 of cathode electrode portion 15.Be positioned at the end with the negative electrode introduction part of electrode part 15 opposition sides, do not have illustrated negative potential to be connected with the outside of tube 30.Bar-shaped negative electrode introduction part in the present embodiment, after injecting patchhole 32 and importing in the tube roughly along the central shaft of tube protract slightly (forming introduction part 11), the symbol place once towards below descend crooked (forming introduction part 12) by the angles of about 90 degree, curve about 90 degree again at the symbol beta place again and form with the bottom surface of tube and become slightly parallel horizontal component (formation introduction part 13).
The cathodic electricity polar body 20 of the other side similarly, as shown in Figure 1, the cathode electrode portion 25 that its top exposes is arranged and be insulated the material lining, until the bar-shaped negative electrode introduction part 21,22,23 of cathode electrode portion 25.Be positioned at the end with the negative electrode introduction part of electrode part 25 opposition sides, do not have illustrated negative potential to be connected with the tube outside.Bar-shaped negative electrode introduction part in the present embodiment, after injecting patchhole 36 and importing in the tube simultaneously again roughly the central shaft along tube protract slightly (forming introduction part 21), the symbol place once towards below descend crooked (forming introduction part 22) by the angles of about 90 degree, curve about 90 degree again at the symbol beta place again and form with the bottom surface of tube and become slightly parallel horizontal component (formation introduction part 23).In addition, until the cross-sectional shape of the bar-shaped negative electrode introduction part 11,12,13 of cathode electrode portion 15 or 25 or 21,22,23 can be circular, but the polygon of diamond shape etc. can be brought into play effect.
The major portion of this cartridge plating device of the present invention is to utilize and the optimal morphology that is loaded on the bar-shaped cathodic electricity polar body in the tube by the relation decision of plating object shape.
That is, the present invention is being made by plating object 70 as the writing board shape thing of the rectangular parallelepiped of Fig. 3 (a) expression or as the writing board shape thing of plane fan-shaped (class the is trapezoidal) shape represented of Fig. 3 (b).And, long axis length a is 5～60mm (preferred 5～50mm), ratio (a/b) value of long axis length a and minor axis length b (mm of unit) is (preferred 1.5～20 scopes) more than 1.2, thickness c (mm of unit), and little (especially, the writing board shape thing of c≤0.5b) is as by the plating object than minor axis length b.As the occasion of the plane fan shape of Fig. 3 (b) expression, long axis length a makes to be approximated between the angle 71 and 72 of periphery bend that to get this length behind the straight line be a.
Of the present invention by the value of the long axis length a of plating object 70 less than 5mm and value (a/b) less than 1.2 small-sized approximate foursquare object, do not produce basically during the electroplating operations in barrel plating by the plating object each other overlapping, the phenomenon that the resistance barrier forms even plated film appears hardly.Therefore, do not need modifying device again, get final product with original device, the problem that the present invention will solve becomes other objects.That is, do not set the necessity of the bar-shaped cathode electrode optimal morphology in the cartridge plating device.
And long axis length a surpasses the large-scale this advantage of not carried out barrel plating by the plating object of 60mm.Promptly, pack into when the surpassing 60mm quantity of a container of long axis length a reduces cost up, and, the value that long axis length a surpasses 60mm, (a/b) is difficult to utilize barrel plating to generate the defective of uniform film, generation pin hole etc. less than the wide sample of 1.2 area, is perhaps caused producing be full of cracks by the plating object because of stirring.Break, be difficult to keep can anti-practicality quality.So long axis length a surpasses the large-scale by the plating object of 60mm, adopts the so-called＜plating method of painting〉handle and be only the ideal strategy.
When such the present invention is plated object and is carried out barrel plating, bar-shaped negative electrode introduction part among the present invention, the horizontal part that distance L is arranged after importing in the tube as shown in Figure 1, utilize with by the relation of the long axis length a of plating object, set this distance L and make L/a≤0.9, preferred L/a≤0.6.Distance L is to arrive the partial-length of the introduction part 11,21 of initial bend α after importing in the tube 30.And, the said what is called＜horizontal part of the present invention〉be to mean actual horizontal component, comprise ± about 20% angular error scope.For example, need to consider introduction part 11,21 causes because of deflections such as deadweights.
The value of L/a surpasses at 0.9 o'clock since with above-mentioned by the relation of plating object, plate the bias of the flow state of object in tube or stop etc. and is sharply increased, be difficult in the plated film that is plated formation uniform thickness on the object.
That drops into tabular shape thing in tube 30 of the present invention is plated object and medium, is immersed in the electroplate liquid then and electroplates.The capacity of tube 30 is 0.5～24 liter, is preferably 5～14 liters.
Be permanent magnet, specifically be rare earth class permanent magnet etc. by the plating object as concrete.More specifically, for example can enumerate the R-TM-B series permanent magnet that is processed into the tabular shape (rare earth element that R represents to contain at least Y more than a kind, TM represent that Fe is that transition element, the B of main component represents boron), Sm-Co series permanent magnet and so on and have 10
-4～10
-8The oxidesintering material of the metal sintering material of Ω m scope resistance value or ferrite and so on.Certainly, these all are to satisfy the quilt plating object shape that the invention described above is set the geomery prerequisite.
When being formed plated film, in order to assist to being imported medium by the energising of plating object outside surface by the outside surface of plating object.Medium is made of by the material that conductive material is covered conductive material or its surface of steel ball etc.
Use device of the present invention to implement galvanized occasion, at first in tube 30, drop into, this 30 is immersed in to store and has in the plating tank 40 of electroplate liquid 41 by plating object, medium.Then, the turning axle 100 with tube 30 is that the center makes tube 30 rotations.Moreover speed of rotation is 3～20r.p.m, preferred 4～9r.p.m.By being stirred, mixing with medium in the rotating cylinder of tube by the plating object.During this, to be disposed at the anode electrode 50 of tube in the outer electroplate liquid, and cathode electrode 15,25 between switch on and carry out electroplating processes.In addition, the bar-shaped negative electrode introduction part of cartridge plating device of the present invention, the horizontal part that distance L is arranged after importing in the tube, this distance L is utilized the relation with the long axis length a that is plated object, because its formation makes L/a≤0.9, so can reduce or prevent to be plated the bias or the stop of object flow state in tube, can guarantee the plated film that is formed uniform thickness on the object plating.
In addition, be preferably at the aforementioned plated film that is formed on the object by plating and contain Ni, Cu, at least a metal coating of Zn, Sn.In addition, it is more than the 5 μ m that electroplating operations makes the aforementioned plated film that is formed on the object by plating thick, is preferably 5～60 μ m.
Below, enumerate embodiment and illustrate in greater detail the present invention.
[embodiment 1]
Use the cartridge plating device of representing as Fig. 1, under following condition, plated Ni plating object.
(1) electroplanting device specification
Tube face shaping: 6 corner post shapes
Tube capacity: 12 liters
The value of the distance L of bar-shaped negative electrode introduction part: with reference to following table 1
Distance H from the tube horizontal bottom to turning axle
0: 100mm
Distance from the tube horizontal bottom to the darkest introduction part 13 and distance H from the tube horizontal bottom to turning axle
0Ratio (H
1/ H
0): 0.1
(2) electroplate preparation method
Medium: the steel ball 15kg that uses diameter 3.0mm
Plated the shape of object:
As shown in table 1; A/b=1.0,1.5,2.0 and 5.0 four types, 5 kinds of size samples of all types of a=3mm, 5mm, 20mm, 45mm, 60mm
In addition, the value of c is as shown in table 1.
Plated the material of object:
Form the magnet material (numerical value is atom % in the parantheses) that constitutes by Nd (14)-Dy (1)-B (7)-Fe (78)
By total input amount of plating object: 3kg
Ni electroplate liquid: Watts bath
(3) electroplating manipulation condition
Cathode current density during cathode current density plating Ni: 0.43A/dm
2
Electroplating time
The electroplating thickness of suitably regulating as (a/2) place-centric portion of being plated object is 15 μ m
Tube rotation number: 6r.p.m
In the concrete experiment of this barrel plating, whether Visual Confirmation is overlapped each other by the plating object in barrel plating.The results are shown in following table 1.In the table 1, with＜zero〉represent that the eclipsed occasion does not appear in certain hour, with＜* represent that the eclipsed occasion can appear in certain hour.If overlapped each other, then produce this bad phenomenon that to guarantee to form the uniform thickness plated film by the plating object.
In addition, the value (the μ m of unit) (sample number N=50) of (d2-d1)/2 when asking after the electroplating processes as shown in Figure 4 the thickness direction that is of a size of d2, (a/2) position by the long axis length a end portion thickness direction of plating object 70 to be of a size of d1 is in the parantheses () that this mean value is shown in Table 1.Symbol 77 expression plated films among Fig. 4.The plated film that the more little formation of the more little electroplating thickness of numerical value in () has good uniformity.Moreover, use milscale to carry out the mensuration of d2 and d1.In addition, this experiment result within the scope of the present invention, owing to bad phenomenon such as do not overlap, so even the identical time forms identical thickness, also can confirm to have same effect under low current value, that the reduction effect of this current value can be confirmed to economize on electricity is about 20% (if electric current identical then being equivalent to shorten for about 20% time).
Table 1
| ???a(mm) | ????a/b | ??c(mm) | ?????????????????????????????L/a | |||
| ?????0.70 | ?????0.90 | ?????1.06 | ????1.10 | |||
| ????3 | ????1.0 | ????1 | ????○(9) | ????○(10) | ????○(11) | ????○(11) |
| ????1.5 | ????1 | ????○(10) | ????○(11) | ????○(11) | ????○(12) | |
| ????2.0 | ????1 | ????○(11) | ????○(11) | ????○(12) | ????○(12) | |
| ????5 | ????1.0 | ????0.5 | ????×(12) | ????×(14) | ????×(15) | ????×(15) |
| ????1.5 | ????0.5 | ????○(12) | ????○(13) | ????×(15) | ????×(16) | |
| ????2.0 | ????0.5 | ????○(14) | ????○(15) | ????×(17) | ????×(18) | |
| ????5.0 | ????0.5 | ????○(16) | ????○(17) | ????×(19) | ????×(20) | |
| ????20 | ????1.0 | ????3 | ????×(38) | ????×(39) | ????×(41) | ????×(40) |
| ????1.5 | ????3 | ????○(28) | ????○(32) | ????×(40) | ????×(42) | |
| ????2.0 | ????3 | ????○(32) | ????○(34) | ????×(43) | ????×(44) | |
| ????45 | ????1.0 | ????4 | ????×(47) | ????×(49) | ????×(49) | ????×(51) |
| ????1.5 | ????4 | ????○(39) | ????○(42) | ????×(52) | ????×(54) | |
| ????2.0 | ????4 | ????○(42) | ????○(45) | ????×(57) | ????×(58) | |
| ????60 | ????1.0 | ????4 | ????×(50) | ????×(49) | ????×(52) | ????×(57) |
| ????1.5 | ????4 | ????○(45) | ????○(50) | ????×(59) | ????×(63) | |
| ????2.0 | ????4 | ????○(49) | ????○(53) | ????×(63) | ????×(68) | |
| ????5.0 | ????4 | ????○(60) | ????○(63) | ????×(73) | ????×(75) | |
Zero ... not overlapping in the barrel plating by the plating object
* ... overlapping in the barrel plating by the plating object
Find out effect of the present invention by above-mentioned result.Promptly, cartridge plating device of the present invention is that long axis length is that the value of the ratio (a/b) of 5～60mm, long axis length a and minor axis length b (mm of unit) is more than 1.2, the writing board shape thing that thickness c (mm of unit) is littler than minor axis length b is carried out the cartridge plating device that barrel plating is used for plating object, its formation is the horizontal part that distance L is arranged after bar-shaped negative electrode introduction part imports in the tube, and this distance L utilization becomes L/a≤0.9 with the relation of the long axis length of quilt plating object.
Therefore, even adopt barrel plating that the quilt plating object of the writing board shape of obstacle is arranged, also can reduce or prevent to be plated the bias or the stop of object flow state in tube, can guarantee to be plated object and form the plated film of uniform thickness and can suppress be full of cracks or disruptive bad phenomenon.
The possibility of utilizing on the industry
The present invention be to electronic component etc. implemented to electroplate by the plating object time cartridge plating device that uses, generally be used for the plating industry.
Claims (9)
1. cartridge plating device, it is characterized in that it being that long axis length (a) is that 5～60mm, long axis length (a) are more than 1.2 with the value of the ratio (a/b) of minor axis length (b) (mm of unit), the writing board shape thing that thickness (c) (mm of unit) is littler than minor axis length (b) is carried out the cartridge plating device that barrel plating is used for plating object
Aforementioned cartridge plating device, its formation is that roughly cylindrical body is rotatable, inside has accommodates by the tube of plating object and relative end faces of both sides plate side at aforementioned tube, and be roughly concentric position from turning axle and import a bar-shaped cathodic electricity polar body in the tube respectively with tube,
Aforementioned bar-shaped cathodic electricity polar body has the cathode electrode portion that its top exposes and is insulated the material lining and until the bar-shaped negative electrode introduction part of aforementioned cathode electrode portion.
The horizontal part that distance (L) is arranged after in the aforementioned bar-shaped negative electrode introduction part importing tube utilizes and is set this distance by the relation of the long axis length (a) of plating object to make (L/a)≤0.9.
2. the described cartridge plating device of claim 1 is characterized in that aforementioned bar-shaped negative electrode introduction part has to import in the tube after the horizontal part of distance (L) that sagging then structure is configured near the central authorities cathode electrode portion.
3. the described cartridge plating device of claim 1 is characterized in that the capacity of aforementioned tube is 0.5～24 liter.
4. the described cartridge plating device of claim 1 is characterized in that aforementioned is permanent magnet by the plating object.
5. the described cartridge plating device of claim 4 is characterized in that aforementioned permanent magnet is the rare earth class permanent magnet.
6. the described cartridge plating device of claim 1 is characterized in that in the aforementioned plating that forms on by the plating object be the Metal plating that contains at least a kind of Ni, Cu, Zn, Sn.
7. the described cartridge plating device of claim 6, it is characterized in that operating make aforementioned by the plated film that forms on the plating object thick be more than the 5 μ m.
8. the formation method of permanent magnet plating is characterized in that being to use cartridge plating device to carry out the formation method of the galvanized permanent magnet plating of permanent magnet,
Aforementioned permanent magnet is that long axis length (a) is that 5～60mm, long axis length (a) are more than 1.2 with the value of the ratio (a/b) of minor axis length (b) (mm of unit), and the writing board shape thing that thickness (c) (mm of unit) is littler than minor axis length (b) is plated object,
Aforementioned cartridge plating device, its formation is that roughly cylindrical body is rotatable, there is the tube of accommodating by the plating object inside, with relative end faces of both sides plate side at aforementioned tube, be roughly concentric position from turning axle and import the interior bar-shaped cathodic electricity polar body of tube respectively with tube, the cathode electrode portion that aforementioned bar-shaped cathodic electricity polar body has its top to expose, with being insulated material lining until the bar-shaped negative electrode introduction part of cathode electrode portion, the horizontal part that distance L is arranged after aforementioned bar-shaped negative electrode introduction part imports in the tube, utilize the relation of plating the long axis length (a) of object with quilt, set this distance and make (L/a)≤0.9.
9. the method for design of cartridge plating device, it is characterized in that it being that long axis length (a) is that 5～60mm, long axis length (a) are more than 1.2 with the value of the ratio (a/b) of minor axis length (b) (mm of unit), thickness (c) (mm of unit) is than the method for design of the little writing board shape thing of minor axis length (b) for the cartridge plating device that carried out barrel plating by the plating object and use
As the cartridge plating device of this design object, its formation be roughly rotatable, the inside of cylindrical body have accommodate by the tube of plating object,
Be roughly concentric position in the relative both ends of the surface side of aforementioned tube, from turning axle and import bar-shaped cathodic electricity polar body in the tube respectively with tube,
Aforementioned bar-shaped cathodic electricity polar body, the cathode electrode portion that top ends exposes is arranged and is insulated the material lining and until the bar-shaped negative electrode introduction part of cathode electrode portion,
The horizontal part that distance (L) is arranged after aforementioned bar-shaped negative electrode introduction part imports in the tube, utilize with by the relation of the long axis length (a) of plating object, set this distance and make (L/a)≤0.9.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP141528/03 | 2003-05-20 | ||
| JP141528/2003 | 2003-05-20 | ||
| JP2003141528 | 2003-05-20 | ||
| JP130846/2004 | 2004-04-27 | ||
| JP130846/04 | 2004-04-27 | ||
| JP2004130846A JP3589298B1 (en) | 2003-05-20 | 2004-04-27 | Barrel plating apparatus and design method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1572915A true CN1572915A (en) | 2005-02-02 |
| CN1308497C CN1308497C (en) | 2007-04-04 |
Family
ID=33513343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100446860A Expired - Lifetime CN1308497C (en) | 2003-05-20 | 2004-05-20 | Cartridge plating device and design method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3589298B1 (en) |
| CN (1) | CN1308497C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586852A (en) * | 2011-01-12 | 2012-07-18 | 上海运青制版有限公司 | Plating solution automatic electrolytic system |
| CN104988572A (en) * | 2015-07-29 | 2015-10-21 | 俞雄飞 | Electroplating line steel ball recovery system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445993A (en) * | 1981-10-29 | 1984-05-01 | Stutz Company | Laser perforated plating barrel and method of constructing the same |
| JPH0510471U (en) * | 1991-07-26 | 1993-02-09 | 辰澤興業有限公司 | Rotating barrel in the metal electrolytic cell |
| US5817220A (en) * | 1994-07-29 | 1998-10-06 | General Semiconductor, Inc. | Electroplating apparatus |
-
2004
- 2004-04-27 JP JP2004130846A patent/JP3589298B1/en not_active Expired - Lifetime
- 2004-05-20 CN CNB2004100446860A patent/CN1308497C/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586852A (en) * | 2011-01-12 | 2012-07-18 | 上海运青制版有限公司 | Plating solution automatic electrolytic system |
| CN104988572A (en) * | 2015-07-29 | 2015-10-21 | 俞雄飞 | Electroplating line steel ball recovery system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005002467A (en) | 2005-01-06 |
| CN1308497C (en) | 2007-04-04 |
| JP3589298B1 (en) | 2004-11-17 |
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