CN1571598A - Organic luminescent display and manufacturing method thereof - Google Patents

Organic luminescent display and manufacturing method thereof Download PDF

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Publication number
CN1571598A
CN1571598A CN 200410042240 CN200410042240A CN1571598A CN 1571598 A CN1571598 A CN 1571598A CN 200410042240 CN200410042240 CN 200410042240 CN 200410042240 A CN200410042240 A CN 200410042240A CN 1571598 A CN1571598 A CN 1571598A
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CN
China
Prior art keywords
adhesive layer
substrate
organic light
light emitting
breach
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CN 200410042240
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Chinese (zh)
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CN100369291C (en
Inventor
施国辉
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AU Optronics Corp
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AU Optronics Corp
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Priority to CNB2004100422404A priority Critical patent/CN100369291C/en
Publication of CN1571598A publication Critical patent/CN1571598A/en
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Publication of CN100369291C publication Critical patent/CN100369291C/en
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Abstract

The invention discloses a organic light display, it includes: a basal plate, a glue layer, which is formed on the frame of the basal plate, there is at least one corner of the frame has a gap. The invention also includes the producing method of the organic light display.

Description

Organic light emitting display and manufacture method thereof
Technical field
The present invention relates to a kind of electrooptical device, particularly relate to a kind of organic light emitting display and manufacture method thereof.
Background technology
In general, organic light emitting display is through using for a long time, aqueous vapor in the environment is easy to infiltrate in the display via the interface of its back of the body lid with the base plate bonding place, because element electrode adopts active higher metal as material usually, satisfy and to react with the aqueous vapor of infiltrating in the display, and the structural arrangement of metal level itself is looser, aqueous vapor will be by the light-emitting component of this path effects lower floor, cause and comprise and peeling off between metal electrode and the organic luminous layer or the phenomenon of material cracking, cause dim spot (dark spot) to produce, significantly reduce the luminous intensity and the uniformity of organic light emitting display, reduce component life.
For prolonging the useful life of organic light emitting display, the display package fabrication process is improved, it is an epochmaking technical development, more shape is tight can to make display device structure, really reach and block the effect that aqueous vapor enters, the pattern that covers of adhesive layer or adhesive layer the keeping of its width after the substrate pressing wherein, the more whether successful key of this encapsulation technology.
Existing as United States Patent (USP) the 5th, 882,761 disclose a kind of structure of organic light emitting display, as shown in Figure 1a, an organic light emitting display comprises a glass substrate 10, one adhesive layers 9, constituted and coated the frame place of glass substrate 10 by ultraviolet ray (UV) sclerosis glue, and the back of the body cover plate 7 of a groove pattern, engage with the surperficial frame place of glass substrate 10 by the adherence of adhesive layer 9, and then form a confined space 11.
The existing pattern that covers adhesive layer is included on the path 13 that adhesive layer covers (non-angle position) and reserves a breach 12, discharge in order to internal gas, but the starting point 12a of this breach and terminal point 12b is all to the extension of the outside of element, shown in Fig. 1 b.When the substrate pressing, shown in Fig. 1 c because internal gas pressure increases, be easy to cause adhesive layer in the junction point 14 width excessive, cause the excessive situation of sealing.
Perhaps (non-angle position) reserves the broad breach that its Origin And Destination can not extend to the outside on the path that covers adhesive layer, discharge gas, though help the discharge of gas, but because the influence that the adhesive layer the evolving path still is subjected to disengaging gas, cause the optimum width control of breach to be difficult for, and produce the too wide or too narrow problem of jagged reservation, if the breach of reserving is too wide, the junction point width of adhesive layer may be not enough, even the situation that can't engage appears, and if the breach of reserving is too small, because of internal pressure increases suddenly, the situation that also causes adhesive layer to be broken through usually.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of organic light emitting display, the phase sees through the breach of reserving in the frame corner, improves the effect of upper and lower substrate pressing, avoids aqueous vapor to infiltrate.
In order to reach above-mentioned purpose, the invention provides a kind of organic illuminated display structure, comprising: a substrate; One adhesive layer is formed at the frame place of this substrate, and is formed with a breach at least one angle position at this frame place.
Because the present invention can grasp the suitable distance of this breach, the situation that the adhesive layer width narrows down when upper and lower substrate pressing can not take place then, and this breach distance is existing to be enlarged, and has increased the efficient of overflowing of internal gas, makes that adhesive layer is more difficult to be broken through because of internal pressure is excessive.
The present invention provides a kind of manufacture method of organic light emitting display in addition, comprising: one first substrate is provided; One light-emitting component is set on the inner surface of this first substrate; Form the inner surface frame place of an adhesive layer, and form a breach at least one angle position at this frame place in this first substrate; And one second substrate is provided, this adhesive layer of mat engages with the inner surface frame place of this first substrate, to constitute the enclosure space of this light-emitting component of placement.
The present invention is if cover adhesive layer with coating method because the breach position of reserving on the corner, so only must be careful the position of coating terminal point, this with existing must measure before and after each breach several original positions by comparison, have advantage easily and fast in fact.
For above and other objects of the present invention, feature and advantage can be become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs. elaborates.
Description of drawings
Fig. 1 a is according to United States Patent (USP) the 5th, 882, No. 761, and the generalized section of an organic light emitting display.
Fig. 1 b is the coating path of existing adhesive layer.
Fig. 1 c is the enlarged drawing of existing pressing effect.
Fig. 2 is according to embodiments of the invention, the generalized section of organic light emitting display manufacturing process.
Fig. 3 is according to embodiments of the invention, the top view in adhesive layer coating path.
Fig. 4 to Fig. 5 is according to embodiments of the invention, the enlarged drawing of Fig. 3 angle position.
The simple symbol explanation
Existing part (Fig. 1 a~1c)
1~organic light emitting display;
3~anode conductive layer;
4~luminous organic material layer;
5~cathodic metal layer;
6~laminate;
7~back of the body cover plate;
8~drying layer;
9~adhesive layer;
10~glass substrate;
11~inner space.
Embodiment of the invention part (Fig. 2~Fig. 5)
20~organic light emitting display;
22~substrate;
24~adhesive layer;
25~the first electrodes;
26~back of the body cover plate;
27~organic luminous layer;
29~the second electrodes;
30~angle position;
32~drying layer;
34~breach
34 '~breach center;
38~tie point.
Embodiment
Embodiment
See also Fig. 2, embodiments of the invention are described, the making of organic light emitting display.At first, as shown in Figure 2, provide a substrate 22.Substrate 22 is glass, macromolecule, pottery or the plastic base of a printing opacity, and wherein this plastic base is made of polyethylene terephthaldehyde ester (polyethyleneterephthalate), polyester (polyester), Merlon (polycarbonates), policapram (polyimide), Arton, polyacrylate (polyacrylates) or polystyrene (polystyrene) material.
Then, form one first electrode 25 on substrate 22.First electrode 25 is a transparency electrode for example, or is called anode conductive layer, and this transparency electrode is indium tin oxide (ITO), indium-zinc oxide (IZO), Zinc-aluminium (AZO) or zinc oxide (ZnO).
The continuous organic light-emitting structure layer that forms is on first electrode 25, this organic light-emitting structure layer from bottom to top includes an electron transfer layer (not icon), an organic luminous layer 27 and a hole transport layer (not shown) in regular turn, wherein organic luminous layer 27 is made of the luminous organic material of single or multiple lift, and its material comprises micromolecule or high molecular fluorescence (fluorescence) or phosphorescence (phosphorescence) luminescent material.The above-mentioned micromolecule luminous organic material that is covered on first electrode 25 for example forms in the vacuum evaporation mode, and high molecular luminous organic material then forms with rotary coating, ink-jet or screen painting mode.
Afterwards, form one second electrode 29 on organic luminous layer 27, second electrode is the metal electrode of an individual layer or multiple layer, or being called the cathodic metal layer, the material of metal electrode is selected the alloy of forming from the group that lithium, magnesium, calcium, aluminium, silver, indium, gold, nickel and platinum are formed or above-mentioned two or more element.
Then, cover an adhesive layer 24 on substrate 22, adhesive layer 24 can be formed at the frame place of substrate 22 by screen painting or optics rubbing method, as shown in Figure 3.Adhesive layer 24 is made of ultraviolet ray (UV) sclerosis glue, and its width is preferably 8 millimeters substantially between 5~10 millimeters.In addition, that the shape that adhesive layer 24 surrounds in the frame place comprises is square, rectangle or polygon, and it is according to the profile variation of inner member, and gives suitable correspondence combination.
See also Fig. 3, covering the process of adhesive layer 24, can reserve a breach 34 at least one angle position 30, with as the pressing substrate time, the point of release of internal pressure.The number that breach 34 is formed on the substrate 22 increases and decreases with inner member area occupied size, when if area occupied is big, need the more breach of number 34, to discharge the bigger internal pressure of relative generation, and if area occupied is less, the demand number of breach 34 also can and then reduce, to meet the manufacturing process present situation.In addition, if the breach number increases, its spacing is from must be reduced simultaneously, and vice versa, to reach the optimized state of breach number and its distance.Wherein the distance of the central point 34 ' of breach and adhesive layer 24 is substantially between 3~7 millimeters, and preferred distance is 5 millimeters.
The present invention is reserved in breach 34 angle position 30 of frame, because the geometrical configuration that this place is special, make adhesive layer in upper and lower substrate pressing moment, it is subjected to the chance that internal gas pressure directly collides, upsets and die-offs, and is accurately estimated the evolving path and the speed of adhesive layer 24.Satisfy in the present invention, when covering adhesive layer 24, can obtain a suitable breach distance smoothly, the distance cardinal principle of the central point of breach 34 and adhesive layer 24 is preferably 5 millimeters between 3~7 millimeters as mentioned above.
Because the distance of breach 34 is selected suitably, exempted existing middle breach if too little, can be broken through because of internal pressure is excessive, or if breach is too big, the not enough problem of junction point width meeting of adhesive layer 24 after upper and lower plate pressing, improve the joint effect of adhesive layer 24 greatly, the width of adhesive layer 24 is kept all avoid in the lump the danger of being broken through by gas.
In addition, because adhesive layer 24 is fast than other position in the diffusion velocity of angle position 30, then can reserve existing more roomy breach distance, and this expansion width, just provide gas bigger, discharge pipeline faster, significantly increase it and overflow efficient and reach more than 50%,, make adhesive layer 24 be difficult for more being broken through then because this moment, internal pressure reduced relatively.
If the present invention is to cover adhesive layer 24 as above-mentioned optics coating method, because 34 of breach of reserving on the corner, then only must be careful the position of coating terminal point, this with existing must measure before and after each breach several original positions by comparison, have advantage easily and fast in fact.
At last, see also Fig. 2, a back of the body cover plate 26 is provided, engage with the surperficial frame place of substrate 22, and then involution becomes a closed container that is placed with first electrode 25, organic luminous layer 27 and second electrode 29 by the adherence of adhesive layer 24.Back of the body cover plate 26 is a plane or fluted body substrate, and its material can be selected glass, macromolecule, pottery or metal etc. for use.
In the process of back of the body cover plate 26, as shown in Figure 4, can observe out adhesive layer 24 and advance, and reach a splendid joint effect at last, as shown in Figure 5 with the evolving path of a plurality of directions with substrate 22 pressings.
In the enclosure space that is constituted by substrate 22, back of the body cover plate 26 and adhesive layer 24, also comprise a drying layer 32 being set on back of the body cover plate 26 inner surfaces.The material of drying layer 32 can be selected metal oxide (for example alkali metal group oxide or alkaline earth oxide), metal sulfide, metal halide, metal perchlorate or high activity metal material (for example alkali metal group or alkaline earth) etc. for use, and its thickness is less than 10 microns.So far promptly finish the making of an organic light emitting display 20.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can make and changing and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.

Claims (9)

1, a kind of organic light emitting display comprises:
One substrate;
One adhesive layer is formed at the frame place of this substrate, and wherein at least one angle position in this frame place is formed with a breach.
2, organic light emitting display as claimed in claim 1, wherein the width of this adhesive layer is substantially between 5~20 millimeters.
3, that organic light emitting display as claimed in claim 1, the shape that this adhesive layer encloses that wherein is formed at this substrate frame place comprise is square, rectangle or polygon.
4, organic light emitting display as claimed in claim 1, wherein the distance of the central point of this breach and adhesive layer is substantially between 3~7 millimeters.
5, a kind of manufacture method of organic light emitting display comprises:
One first substrate is provided;
One light-emitting component is set on the inner surface of this first substrate;
Inner surface frame place at this first substrate forms an adhesive layer, and forms a breach at least one angle position at this frame place; And
One second substrate is provided, engages with the inner surface frame place of this first substrate, constitute the enclosure space of this light-emitting component of placement by this adhesive layer.
6, the manufacture method of organic light emitting display as claimed in claim 5, wherein this light-emitting component comprises an anode conductive layer, an organic luminous layer and a cathodic metal layer at least.
7, the manufacture method of organic light emitting display as claimed in claim 5, wherein the width of this adhesive layer is substantially between 5~20 millimeters.
8, that the manufacture method of organic light emitting display as claimed in claim 5, the shape that this adhesive layer encloses that wherein is formed at this first substrate inner surface frame place comprise is square, rectangle or polygon.
9, the manufacture method of organic light emitting display as claimed in claim 5, wherein the distance of the central point of this breach and adhesive layer is substantially between 3~7 millimeters.
CNB2004100422404A 2004-05-09 2004-05-09 Organic luminescent display and manufacturing method thereof Expired - Lifetime CN100369291C (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103500755A (en) * 2013-10-16 2014-01-08 京东方科技集团股份有限公司 OLED (organic light-emitting diode) display screen, manufacturing method for same and display device
CN104518128A (en) * 2013-09-06 2015-04-15 株式会社半导体能源研究所 Light-emitting device and method for manufacturing light-emitting device
CN110703481A (en) * 2019-09-27 2020-01-17 上海天马微电子有限公司 Display device
CN113093441A (en) * 2021-03-31 2021-07-09 重庆烯宇新材料科技有限公司 Novel liquid optical cement full-lamination box dam technology

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4640583A (en) * 1983-07-22 1987-02-03 Kabushiki Kaisha Seiko Epson Display panel having an inner and an outer seal and process for the production thereof
JPH09148066A (en) * 1995-11-24 1997-06-06 Pioneer Electron Corp Organic electroluminescent element
JP2002025764A (en) * 2000-07-05 2002-01-25 Toyota Motor Corp Sealing method for organic el element
JP2003017259A (en) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd Manufacturing method of electroluminescent display panel

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104518128A (en) * 2013-09-06 2015-04-15 株式会社半导体能源研究所 Light-emitting device and method for manufacturing light-emitting device
US10686157B2 (en) 2013-09-06 2020-06-16 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing light-emitting device
US11355729B2 (en) 2013-09-06 2022-06-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing light-emitting device
CN103500755A (en) * 2013-10-16 2014-01-08 京东方科技集团股份有限公司 OLED (organic light-emitting diode) display screen, manufacturing method for same and display device
US9768406B2 (en) 2013-10-16 2017-09-19 Boe Technology Group Co., Ltd. OLED display panel and manufacturing method thereof, display device and filling method of filling adhesive
CN110703481A (en) * 2019-09-27 2020-01-17 上海天马微电子有限公司 Display device
CN113093441A (en) * 2021-03-31 2021-07-09 重庆烯宇新材料科技有限公司 Novel liquid optical cement full-lamination box dam technology

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