CN1556926A - Tester and testing method - Google Patents
Tester and testing method Download PDFInfo
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- CN1556926A CN1556926A CNA028184769A CN02818476A CN1556926A CN 1556926 A CN1556926 A CN 1556926A CN A028184769 A CNA028184769 A CN A028184769A CN 02818476 A CN02818476 A CN 02818476A CN 1556926 A CN1556926 A CN 1556926A
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- wiring
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
Abstract
Disclosed is an inspection apparatus and method for inspecting a circuit wiring on a circuit board. An inspection signal is supplied to the circuit wiring on the circuit board (S 141), and potential variation generated in a specific region of the circuit wiring in response to the inspection signal is detected using a plurality of sensor elements (S 142) to create image data representing the shape of the circuit wiring (S 151 and subsequent Steps). The shape of the circuit wiring is compared with a corresponding pre-registered standard shape (S 167) to check the state of the circuit wiring (S 168, S 169). The inspection apparatus and method of the present invention can reliably inspect the state of a circuit wiring with a high degree of accuracy.
Description
Technical field
Even the present invention relates to a kind of testing fixture and wiring inspection method of the wiring that also can check reliably the wiring of complexity.
Background technology
In the manufacturing of circuit substrate, after configuration circuit wiring on the circuit substrate, need to check whether break or short circuit.
In recent years, densification along with wiring, when carrying out the inspection of each wiring, generation can't be at the two ends while of each wiring configuration inspection pin, and guarantee the situation at the abundant interval of its leading section contact, therefore, but in order not use the state of inspection with pin also check circuit wiring, it is that a kind of contact circuit wiring both ends of avoiding also can receive contactless inspection method (spy opens flat 9-264919 communique) from the electric signal of wiring that motion is arranged.
This contactless inspection method, as shown in figure 22, its method is: make end one side of inspection with one side of the wiring of pin contact conduct inspection object, and at the other end of wiring one side sensors configured conductor non-contactly, electrostatic coupling state between the other end of formation and wiring, supply with the inspection signal from checking with pin, check that by whether detecting signal checks the broken string of Butut by the static joint portion, if detect the inspection signal, then check the test mode of the short circuit between adjacent wiring at adjacent wiring place.
Yet, described existing contactless test mode, wiring, can be for example linearity, but wiring is branched off into situation more than two from branch midway and its front end under, though in the wiring of the part of branch broken string is arranged, if other wiring is continuously, also can detect the inspection signal, then can not detect the wiring bad.
Summary of the invention
The present invention makes invention for solving described problem, and for solving described problem, the object of the invention is to provide a kind of whether good wiring testing fixture and the inspection method that can grasp the state of wiring reliably and judge state.A kind of device as reaching this purpose for example has following structure.
That is, its a kind of testing fixture that is used for the wiring on the check circuit substrate is characterized in that having: feed mechanism, nearby locate to supply with the inspection signal by the end of described wiring; Testing agency disposes a plurality of sensor elements of its width less than described wiring width, is used to detect the potential change of supplying with on the wiring that described inspection signal is arranged; Shape extracts mechanism, according to the positional information that detects the described sensor element of potential change in the described testing agency, extract the shape of supplying with the wiring that described inspection signal is arranged, but extract the state of the shape judging circuit wiring of the wiring that mechanism extracted by described shape.
And it is characterized in that: for example described testing agency, the variation that detects dielectric (flux) densities by a plurality of sensor elements comes the potential change of testing circuit wiring.
In addition, it is characterized in that: for example described a plurality of sensor elements are configured to rectangular, and in addition, described a plurality of sensor elements are configured to honeycomb, and in addition, described a plurality of sensor elements are configured to the alternate matrix trellis.
Have again, it is characterized in that: also have mechanism for identifying, to extract the shape of the wiring that mechanism extracted and the wiring shape in the design compare by described shape, again according to comparative result differentiate with described shape extract wiring that mechanism was extracted whether very.
In addition, it is characterized in that: described shape extracts mechanism, in described a plurality of sensor elements, the sensor element that selectively drives the regulation zone is with the potential change in the testing circuit wiring, and when will selecting signal to be supplied to the sensor element row of horizontal direction strip simultaneously, the potential change of the wiring of detection and described sensor element row subtend.
In addition, a kind of inspection method, it is useful in the testing fixture, this device has testing agency, dispose a plurality of sensor elements, be used for the potential change in the testing circuit wiring, it is characterized in that: form described a plurality of sensor element less than the width of described wiring at least with its width, nearby locate to supply with the inspection signal by the end of described wiring, detect the positional information of the described sensor element of potential change according to the supply of the corresponding described inspection signal of the sensor element of described testing agency, extract the shape of supplying with the wiring that described inspection signal is arranged, so that come the state of judging circuit wiring according to the described shape that extracts.
And, it is characterized in that: for example described a plurality of sensor elements, by detecting the variation of dielectric (flux) density, with the potential change of testing circuit wiring.
Have again, it is characterized in that: for example, the wiring shape in the shape of the described wiring that has extracted and the design is compared, according to comparative result differentiate the described wiring that has extracted whether very.In addition, it is characterized in that: the shape that extracts described wiring, in described a plurality of sensor elements, optionally drive the sensor element in regulation zone, with the potential change in the testing circuit wiring, and when will selecting signal to be supplied to simultaneously on the sensor element row of horizontal direction strip, the potential change of the wiring of detection and described sensor element row subtend.
Description of drawings
Fig. 1 is the synoptic diagram of the check system of an embodiment example of invention in the present invention relates to.
Fig. 2 is the calcspar of hardware structure of computer that is used to illustrate the check system of present embodiment example.
Fig. 3 is the calcspar of connection of electricity of the sensor chip 1 of expression present embodiment example.
Fig. 4 is the figure that is used to illustrate the sensor element structure of present embodiment example.
Fig. 5 is used for illustrating that the potential change of the sensor element corresponding circuits wiring of present embodiment example produces the module map of the principle of electric current.
Fig. 6 is used for illustrating that the potential change of the sensor element corresponding circuits wiring of present embodiment example produces the module map of the principle of electric current.
Fig. 7 is the sequential chart that is used to illustrate the input and output sequential example when using MOSFET as the sensor chip of present embodiment example.
Fig. 8 be used for illustrating according to the check system of present embodiment example for wiring 1.～figure that the sensor element with 6 * 6 that 3. carried out is checked.
Fig. 9 is that expression applies the sequential of voltage and the sequential chart of data output timing for wiring shown in Figure 8.
Figure 10 is used for illustrating when there is a plurality of wiring in a circuit substrate of the check system of present embodiment, for the figure of wiring driving sensor order.
Figure 11 is the sequential chart that voltage applies the sequential example in the sensor drive shown in Figure 10 control in the check system of expression present embodiment.
Figure 12 is in the check system that relates to of the expression first embodiment example, applies the figure of the tabulation of order in order to try to achieve the voltage that applies for a plurality of wirings.
Figure 13 is in the check system of expression present embodiment example, in order to try to achieve the figure of tabulation that applies the order of voltage for a plurality of wirings.
Figure 14 is the process flow diagram that is used for illustrating by the processing of extracting objects data in the desirable sample of the check system of present embodiment example.
Figure 15 is the process flow diagram that is used for illustrating the inspection control of present embodiment example.
Figure 16 is the setting example of the specified point during the inspection of expression present embodiment example is controlled.
Figure 17 is used for illustrating when there is a plurality of wiring in a circuit substrate of the second embodiment example that the present invention relates to, applies the figure of order for wiring voltage.
Figure 18 is the sequential chart that the voltage of the expression second embodiment example applies the sequential example.
Figure 19 is the output image example of voltage when applying carried out in expression with sequential shown in Figure 180 figure.
Figure 20 is the figure of the sensor element assortment of the 3rd embodiment example that the present invention relates to of expression.
Figure 21 is the figure of the sensor element assortment of the 4th embodiment example that the present invention relates to of expression.
Figure 22 is the figure of the existing circuit board inspection apparatus of explanation.
Embodiment
Below, the working of an invention mode example that present invention will be described in detail with reference to the accompanying relates to.As the relative configuration of structure, constituent components, numerical value etc., purport of the present invention is not that invention scope is defined in the scope of following explanation in the following describes.
The following description is to be that example is illustrated with a kind of device that wiring Butut on the circuit substrate that integrated circuit (IC) chip is installed is checked.
The first embodiment example
As the first embodiment example that the present invention relates to, just use MOSFET to describe as the check system 20 of sensor element.Fig. 1 is the schematic configuration diagram of the Butut check system 20 of a working of an invention mode example the present invention relates to.
The structure of＜check system 〉
The check system 20 of present embodiment example, have a plurality of sensor elements that form with the size below the width of described at least wiring sensor chip 1, computing machine 21, be used for checking that signal is supplied to probe 22 on the wiring 101, switches and be used for probe 22 is supplied with the formations such as selector switch 23 of selecting signals.Selector switch 23 for example can be by multiplexer, demodulator formations such as (デ プ レ Network サ).
Both all can inspection signal voltage pulse that is applied or AC signal.Because the working voltage pulse can limit the polarity of signal, therefore can make the direction of current of sensor element be limited to the single direction design circuit, and circuit design get fairly simple.
In addition, computing machine 21 receives detection signal from the sensor chip 1 that flow to wiring corresponding to detection signal, and generating with circulation has the pairing view data of wiring Butut of checking signal, and the image that generates is shown in display 21a.
Thus, can search specific wiring shape, with the view data that generates view data based on the wiring in the expression design, the testing circuit undesirable conditions such as 101 broken string, short circuit, shortcoming that connect up.
In addition, selector switch 23 about not applying the wiring of checking signal, makes it be connected to earthing potential (GND) or as on the low-impedance lines such as power supply.Because avoid test signal to overlap because of crosstalking in non-test circuit wiring, so that do not make sensor receive rub-out signal.
The sensor chip 1 of present embodiment example, be configured in non-contactly on the position with wiring 101 subtends of circuit substrate 100, the inspection input of being supplied with by probe 22 goes out the potential change that produces on the wiring 101, is re-used as detection signal to computing machine 21 inputs.
Promptly, receive from applying the electric field pulse of the wiring radiation of checking signal with sensor element, for example read the information receiving state that the sensor element with horizontal delegation receives, just which sensor element receives the electric field pulse that wiring radiated of checking signal by applying in the row based on reading, and can grasp the wiring state.
In addition, in the circuit substrate 100 of Fig. 1, though hypothesis only is provided with wiring 101 on single face example is shown, but the present embodiment example is not limited in the above example, certainly also can check the two-sided circuit substrate that is provided with wiring 101, in this case, sensor chip 1 is to use two circuit substrate is clipped in the middle to dispose like that checks up and down.
Next, the detailed structure of computing machine 21 is described with reference to Fig. 2.Fig. 2 is the calcspar of hardware configuration of the computing machine 21 of expression present embodiment example.
In Fig. 2,211 is control computer 21 integral body and the CPU that can be used for s operation control, 212 for storing the ROM of performed program of CPU211 or fixed value etc., 213 for handling the numerical data of importing and generating view data, the image processing part of the view data of processes and displays on display 21a, 214 is temporary transient storage RAM, comprises among the RAM214 to store to load from the program loading zone of the program of HD215 etc. and storage by the memory block of the digital signal that sensor chip 1 detected etc.By the digital signal that computing machine 21 receives, be stored in each group with the pairing sensor element of each wiring shape from sensor chip 1.
215 is the hard disk as external memory, and 216 is the removably CD-ROM CD-ROM drive of the reading device of medium of conduct.217 is IO interface, carries out the IO interface control of 23 of keyboard 218, mouse 219, sensor chip 1, selector switchs as input media by IO interface 217.
In HD215, store sensor chip control program, selector switch control program, image processing program etc., when carrying out each program, they are carried in the program loading zone of RAM214 and carry out.
In addition, expression is by the view data of the shape of the wiring of sensor chip 1 inspection, and the view data of the wiring shape in the expression design all is stored in the HD215.By the view data of sensor chip 1 input, with the sensor key element group of the shape subtend of each wiring as judging the unit storage, or with a frame of whole sensor elements as judging the unit storage.
The view data of the wiring shape in sensor chip control program, selector switch control program, image processing program and the expression design, can be recorded in and read this CD-ROM recorded information with the CD-ROM CD-ROM drive in the CD-ROM and install, or read again after being recorded in other medium such as FD or DVD, or all can by network download.
Secondly, the connection of electricity of the sensor chip 1 of present embodiment example is described with reference to Fig. 3.Fig. 3 is the calcspar of connection of electricity of the sensor chip 1 of expression present embodiment example.
A/D converter 17, the inspection signal of each sensor element 12a that will be sent with analog form by signal processing part 16 converts for example 8 digital signal output to.Power circuit part 18 generates the benchmark clamping voltage of signal processing part etc.
In addition, though in sensor chip 1, be built-in with A/D converter 17, also can directly export the simulating signal after carrying out simulation process through signal processing part to computing machine 21.
Secondly, the concrete structure example with regard to the employed sensor chip 1 of present embodiment example is illustrated.Fig. 4 is the figure that is used to illustrate the sensor element that the mos semiconductor assembly (MOSFET) by the present embodiment example constitutes.
By vertical selection portion 14, select sensor element 12a by sequential generating unit 15, just signal is sent to grid from vertical selection portion 14, sensor element 12a is ON (the exportable state of detection signal).
At this moment, apply voltage as detection signal by probe 22, promptly current potential changes on wiring 101, follows therewith, can make electric current flow to drain electrode by source electrode.Thus as detection signal by horizontal selection portion 13, send to signal processing part 16.In addition, if when not having wiring 101, just do not produce electric current in the position of sensor element 12a subtend.
Therefore, if position analyze to occur as the sensor element 12a of the electric current output of detection signal, just learn exist in circuit substrate 100 which position with probe 22 that contact with the continuous wiring 101 of electrode.
At this, flow to the principle of drain electrode with regard to electric current by source electrode, be illustrated in more detail.Fig. 5 and Fig. 6 are and are used for the module map of the principle of work of the sensor element of understanding ground explanation present embodiment example easily, Fig. 5 is the figure that is used to illustrate the state that does not apply voltage on wiring, and Fig. 6 is then for being used to illustrate the figure that has applied the state of voltage on wiring.
As shown in Figure 5, if do not apply voltage on wiring, the unnecessary electric charge of diffusion layer is just overflowed by the also low discharge electromotive force barrier of electric potential difference barrier of electric potential difference than the grid below that is in the OFF state.At this moment, the current potential of source electrode depends on the discharge electric potential difference.
Then, as shown in Figure 6, if apply voltage V to wiring, wiring band+electricity (becoming current potential V) then.At this, because wiring and source-side diffusion layer slight distance at interval only, so the source-side diffusion layer of subtend is subjected to the influence of the potential change of wiring, current potential becomes V and flows into electric charge.That is, wiring and source-side diffusion layer electrostatic capacitance coupling ground work, the electric potential difference step-down of source-side diffusion layer flows into electronics, from source electrode to the drain electrode streaming current.
If wiring is connected to ground once more, then the electromotive force of source-side diffusion layer returns at first, and unnecessary electronics spues lentamente and overflows from the electromotive force barrier.
The input and output of the signal of＜sensor chip regularly 〉
Fig. 7 is used to illustrate utilize MOSFET as the regularly routine time diagram of the input and output under the situation of the sensor chip of present embodiment shown in Figure 4.
4 top segment tables show that Vsync, Hsync, Dclk reach the output data (output Data) from sensor chip 1, and 6 following segment tables show Hsync one by one and have the input and output of which kind of signal therebetween in sensor element.
As shown in Figure 7, under the situation of timing generating unit 15 input Vsync, Hsync and Dclk, from the data of sensor chip 1 output shown in Data.
If describe in detail, regularly generating unit 15 is counted Dclk quantity since the negative edge of n Hsycn, controls vertical selection portion 14 with predetermined timing A, selects signal to send to n the capable 12b of sensor element.Then, count Dclk again, send and select signal, until predetermined timing B.
On the other hand, computing machine 21 is counted Dclk since the negative edge of n Hsync, and with at timing A and the timing C between the B regularly, control selector switch 23 is so that apply voltage (apply and check signal) to the wiring of checking object.
In addition, timing generating unit 15 is with the horizontal selection portion 15 of the timing controlled identical with timing C, so that keep from n the detection signal that sensor element is capable.Being made as and the regularly identical timing of C, is because utilizing under the situation of MOSFET shown in Figure 4, is represented as the electric current of reduction differentiated waveform, exponential function of the potential pulse that is applied to wiring from the output of sensor element.
Below, the voltage that specifies 3 wirings with Fig. 8 and Fig. 9 applies regularly and the output signal under this situation.Fig. 8 be the wiring of explanation in the present embodiment 1.～3., just describe for simplified illustration based on the example that 6 * 6 sensor elements are checked, still, the sensor element of basic any one assortment of control is all identical.
Fig. 8 is the figure of explanation of the inspection of wiring 6 * 6 sensor elements 1.～3. in the present embodiment example, Fig. 9 is the action timing diagram of present embodiment example, the following description, data with indication circuit wiring shape 1., the data of indication circuit wiring shape 2., the situation that the data of indication circuit wiring shape are 3. exported successively is that example is carried out.
As corresponding circuits wiring sensor element 1., exist be positioned at coordinate (X2, Y1), (X3, Y1), (X4, Y1), (X2, Y2), (X3, Y2), (X4, Y2), (X5, Y2), (X6, Y2), (X5, Y3), (X6, Y3) 10 sensor elements on.
In addition, as corresponding circuits wiring sensor element 2., exist to be positioned at coordinate (X1, Y1), (X2, Y1), (X1, Y2), (X2, Y2), (X3, Y2), (X2, Y3), (X3, Y3), (X4, Y3), (X5, Y3), (X6, Y3), (X3, Y4), (X4, Y4), (X5, Y4), (X6, Y4) 14 sensor elements on.
In addition, as corresponding circuits wiring sensor element 3., exist be positioned at coordinate (X1, Y4), (X2, Y4), (X1, Y5), (X2, Y5), (X3, Y5), (X1, Y6), (X2, Y6), (X3, Y6), (X4, Y6) 9 sensor elements on.
Wherein, in the drawings, with black represent (X2, Y1), (X2, Y2), (X3, Y2), (X5, Y3), (X6,5 sensor elements Y3) be used for wiring 1. with 2. two sides' inspection of wiring.Therefore, in the driving of primary transducer parts, can not check this two wirings.In addition, because 3. 2. wiring reach wiring, all utilize the sensor element of the Y4 sensor element on capable to check, so under the situation of utilizing the capable method of driving simultaneously of the sensor element that makes horizontal delegation shown in above-mentioned simultaneously, this two wirings are checked in the driving of sensor element that can not be by once.On the other hand, wiring 1. and wiring do not produce this problem between 3..
Therefore, during making once that all sensor element drives (1 frame), the check circuit wiring 1. with wiring 3. both, in frame then, 2. check circuit connects up.
Shown in the time diagram of Fig. 9, order is exported the data of indication circuit wiring shape 1., the data of indication circuit wiring shape 3., the data of indication circuit wiring shape 2. thus.
＜to the voltage application method of a plurality of wirings 〉
Below, illustrate that with reference to Figure 10 and Figure 11 a plurality of wirings to present embodiment carry out the method that effective voltage applies.Figure 10 be have in the circuit substrate of explanation in the check system of present embodiment under the situation of a plurality of wirings, to the figure of the sensor drive order (voltage applies order) of wiring, Figure 11 is that the voltage in the sensor drive control shown in Figure 10 in the check system of expression present embodiment applies the regularly time diagram of example.
In example shown in Figure 10, for the purpose of simplifying the description, represent as the wiring of checking object with zero mark.In addition, wiring is modularized to and is arranged in rectangular that m is capable, n is listed as.
In the receiving area of sensor, exist under the situation of a plurality of wirings, basically apply to 1 wiring voltage during, other wiring need keep reference potential (GND).This be because, if apply under the voltage condition to two wirings at the same time, even being examined wiring is cut off midway, simultaneously with the situation of other wiring short circuit that applies voltage under, therefrom apply voltage to the end that is examined wiring, it is qualified that mistake is judged as, and misses the discovery open circuit fault.
Driving 1 sensor element between the departure date, because apply voltage 1 time, so, also only can apply voltage to 1 wiring wherein even the corresponding identical sensor element of a plurality of wiring is capable to wiring.
Therefore, as shown in the figure, in the 1st frame, along on the longitudinal direction among the figure, the wiring that will gather into first row from the top successively from the 1st row, the 2nd row ..., to the capable voltage that applies of m.In the 2nd frame, also along longitudinal direction among the figure, from the top down successively to and be listed in the 2nd row wiring apply voltage.From, in the n frame, apply voltage to all wirings.
Concrete voltage applies regularly, as shown in figure 11,1Hsync to the 7Hsync of corresponding the 1st frame (between 1Vsync to the 2Vsync), the wiring (1,1) that is listed as to the 1st row the 1st applies voltage.
Then, corresponding to 8Hsync to the 14Hsync, the wiring (2,1) that is listed as to the 2nd row the 1st applies voltage.And then wiring (3,1), (4,1) after applying voltage to wiring (m, 1), move to the 2nd frame, apply voltage to wiring (1,2)～(m, 2).Thus, up to the inspection end of all wirings, promptly up to the n frame, more repeatedly, the driving sensor parts.
The modularization of＜wiring 〉
Secondly, use Figure 12 and Figure 13, the rectangular modular method of wiring of present embodiment example is illustrated.In the present embodiment example, as above-mentioned, be not only to detect at the place, end of wiring whether the inspection signal is arranged, can discern concrete wiring shape.
Therefore, can be with each concrete inspection object reliable and at length grasp in fact circulation the wiring Butut of checking signal is arranged, even for example midway under the situation of difference branch, also can discern and check which part signal specifically is applied at wiring.
Therefore, can also easily discern broken string, the short circuit of direct wiring.Consider that above characteristics just carry out the modularization of wiring in the present embodiment example, and adopt a kind of inspection method, its for the shape of modular preferred circuit wiring and shape of checking the wiring of object individually and particularly compare research with the decision circuitry wiring whether very.
At first, the shape data (for example cad data) from wiring design, cut out the rectangular wiring zone checked wanted, form table shown in Figure 12.To each wiring append serial numbers, make the coordinate correspondence of the sensor element of the most upper left coordinate of the rectangular region that comprises this wiring and bottom right among Figure 12, be illustrated in the form.In addition, frame all is made as the 1st.
Below, little from upper left Y coordinate figure, the wiring of beginning order replacement circuit.Among Figure 11, the 1st be the Y coordinate be Y1 wiring 1. with wiring 2..In addition, the 2nd be the Y coordinate be Y4 wiring 3..
Then, relatively the upper left Y of each wiring sits the Y coordinate of the bottom right of target value wiring previous with it, and the upper left Y coordinate figure of this wiring than the little situation of the Y coordinate of the bottom right of previous wiring under, capable as the sensor element that reads these wirings is repetition, move to different frames.
Under the situation of Figure 12, at first 1. wiring is fixed as the wiring that applies voltage at first.In addition, comparator circuit wiring upper left Y coordinate and wiring bottom right Y coordinate 1. 2..At this moment, because 1. wiring is Y3,2. wiring is Y1, and Y3＞Y1 is so wiring moves to frame 2.Because frame 2 is checked then at frame 1, so move to the hurdle that descends most of form.
This moment, wiring previous wiring 3. be wiring 1..Therefore, follow comparator circuit wiring upper left Y coordinate Y4 and wiring bottom right Y coordinate Y3 1. 3., because Y4＞Y3, so 3. wiring is stayed in the frame 1.Repetitive operation simultaneously, 4. beginning all wiring decisions from wiring is frame 1 or frame 2.From, can distinguish the group of frame 1 and frame 2.
In the group of frame 2, operate equally below.At this moment, the more upper left Y coordinate figure whether bottom right Y coordinate figure than the previous wiring that applies voltage is big, and little wiring moves to frame 3, and big wiring is stayed in the frame 2.
Therefore, can form the group of frame 1,2,3.Carrying out frame no longer increases, and finishes when not increasing.
The result of this processing generates form shown in Figure 13.The row sequence number of the corresponding Figure 10 of frame number, the voltage in the expression same number of frames applies the sequence number corresponding row sequence number of order.
Form by reference Figure 13, the the 1st～the 3rd the Hsync (with reference to the Y coordinate) of at first corresponding 1Vsync, 1. apply potential pulse to wiring, corresponding the 4th～the 6Hsync, 3. apply potential pulse to wiring, then, 2. corresponding the 2nd Vsync the 1st～the 4Hsync then apply potential pulse to wiring.
At this, because the shape data in the design of hypothesis wiring is corresponding fully with the coordinate of sensor element, so merely the profile coordinate of wiring is made as the coordinate of sensor element.But, in fact, because sensor and wiring mechanical anastomosis, so produce dislocation.Therefore, the Y coordinate that determines above-mentioned inspection area also can be obtained slightly larger except that this magnitude of misalignment.
＜image processing method 〉
Below, the extraction that enters capable target data of the actual inspection control beginning in the check system of present embodiment is described with reference to Figure 14.Figure 14 is the process flow diagram that is used for illustrating the processing of extracting objects data from the gold sampling of the check system of present embodiment.
The extraction processing that enters capable target data of controlling beginning in the inspection of present embodiment is described with reference to Figure 14.At first, in step S101, check the wiring of 1 frame sign of golden circuit substrate of sampling.That is, drive all sensors parts together, but take out the numerical data that the expression module changes into the shape of the vertical one a plurality of wirings that are listed as.
Then carrying out horizontal noise in step S102 removes.At this,, from the value of original all images data, deduct this and be worth and carry out by 10 points of along continuous straight runs equalization left end.
In step S103, judge whether reading of 10 frames finishes.If not reading of 10 frames finishes, then return step S101, carry out the inspection of same circuits wiring once more.
On the other hand, if in step S103, the inspection of 10 frames finishes, and then enters into step S104, the view data of 10 frames of equalization.Then, in step S105, the view data after the equalization is passed through medial filter.Thus, remove local noise.
Then, in step S106, degree of comparing correction.Then, in next step S107, will carry out outline data after the Flame Image Process, be stored among the RAM214 of computing machine 21 as target data.
Then, in step S108, judge whether the whole wirings in the gold sampling are taken out numerical data.Whole wirings not being taken out numerical data, also have under the situation of unchecked wiring, enter into step S109.
In step S109, in order to carry out that the data of unchecked wiring are taken out, control, to carry out the inspection of next frame, enter into step S101 then.Carry out processing later on from step S101 to step S107.
If repeat above processing from step S101 to step S107, then the taking-up to the view data of whole wirings finishes.At this moment, in step S108, whole wirings are taken out numerical data, enter into step S110, form form.This form is answered wiring and its scope and gray scale subtend.If form form, then target data extracts the processing end.
Below, the check system of present embodiment is described with reference to Figure 15.Figure 15 is the process flow diagram that is used to illustrate the inspection control of present embodiment.
At first, in the step S140 of Figure 15, sensor chip 1 is positioned on the initial inspection position of checking object substrate, simultaneously, will be used to supply with probe 22 location of checking signal and be connected to the wiring 101 that to check at first.
Then, in step S141, through probe 22 to the capable power supply of the cloth that should check at first, for example with the capable earth level that controls to of peripheral cloth.So in step S142, utilize sensor chip, only detect the potential change (electricity bundle variable density) at position of the prior specified point of the wiring comprise power supply.This detection is treated in the processing of step S151 described later～S156 the only detection of regulation sensor element and handles.
In advance specific point is that electricity bundle variable density by detecting this position is near the position end of the wiring of probe 22 power supplies, if output power arrives this position, then do not open circuit in the capable pattern of cloth in the way, in addition, be made as and connect the check point that does not also become earth level behind the capable pattern of other cloth.
The setting example of this specified point shown in Figure 16.Figure 16 is the figure that the specified point during the inspection of expression present embodiment example is controlled is set example.
Among Figure 16, the circuit pattern that is expressed as check pattern is the circuit pattern that probe 22 is connected to the base portion power supply.The pattern that both sides are represented with GND is the wiring that the probe 22 that will be controlled to earth level is connected to base portion.
By check pattern with the input/output terminal of other circuit pattern shown in A, B, the C (leading section) for example near setting specific point, if in the electricity bundle variable density of this position probing to expectation, it is normal then to be judged as this check pattern, under the situation (situation of this specified point of output power no show) of the electricity bundle variable density that does not have expectation, can be judged as fault.
Therefore, in step S143, within the limits prescribed whether the testing result of determining step S142, the variation of electric Shu Midu.Under situation within the specific limits, it is normal to be judged as the capable pattern of this cloth, enters into step S144.Judge whether subtend location circuit wiring to the full frame of sensor chip 1 inspection that is all over.Whether the inspection of the wiring pattern of the subtend position of whole frames of investigation sensor chip 1 finishes.Under the unclosed situation of inspection of the wiring pattern of the subtend position of whole frames of sensor chip 1, return step S141, carry out power supply control and earth level control to next wiring, carry out the detection of the specified point of next wiring and handle.
On the other hand, in step S145, under the situation that the inspection of the wiring pattern of the subtend position of whole frames of sensor chip 1 finishes, enter into step S145, whether investigation finishes the inspection of whole wirings of checking object.Under the situation that the inspection to whole wirings finishes, finish this inspection and handle.
On the other hand, in step S145,, enter into step S146, sensor chip 1 is moved, navigate on for example adjacent wiring position under the unclosed situation of the inspection of whole wirings.Then, return step S140, begin the new locational inspection of sensor chip.
In addition, the electricity bundle variable density of specified point is not under the situation in specialized range in step S143, think that this wiring does not match in certain position existence, handles so move to the following wiring evaluation of step S151, and moves to the state judgment processing of wiring integral body.
At first, in step S151, anticipation covers the integral body of wiring pattern, and 1 sensor element that then drives the sensor element in the default sensor chip 1 is capable.Then, in step S152, the numerical data that obtains is sent to the image processing part 213 of computing machine 21 by every row.
In step S153, judge whether this row is the final row that covers the frame of this wiring.In addition, capable as if this is not the final row that covers the frame of this wiring, then enters into step S154, enters the processing of next line.
On the other hand, in step S153, this row is to cover under the situation of final row of frame of this wiring, enters into step S155, and whether the processing in the investigation computing machine finishes.Under the unclosed situation of processing in computing machine, wait for that Computer Processing finishes.This is because final receive data and what handle is computing machine.
In step S155, under the situation that Computer Processing finishes, enter into step S144, carry out the processing of the capable pattern of next cloth.
In the present embodiment, in image processing part,, then shown in step S157, the big or small numerical data of 1 row is input to computing machine 21, in step S156, removes horizontal noise if sensor chip portion 1 carries out the transmission of the line data shown in the step S152.
The method of utilizing among the step S102 of this method and Figure 14 is the same.But, at this, do not carry out the average treatment of 10 frames among step S103 or the step S104, after removal, the medial filter shown in the execution in step S159 is handled, and behind medial filter, carries out medial filter and handles.
Then, in step S160, deal with data is transmitted and is stored among the RAM214 of computing machine 21.
Then, in step S161, judge whether whole row of whole frames are stored among the RAM214.If the transmission of the row of correspondence proving object wiring (necessary row) does not finish, then return step S157, repeat the processing of above-mentioned steps S157-step S161.
On the other hand, if in step S161, the processing of the row of correspondence proving object wiring (necessary row) finishes, then because the release of image processing part 213, so enter into step S155.
On the other hand, if the data that computing machine 211 receives from the image processing part of handling shown in the corresponding step S160 213 transmit, then, carry out patterning, but so that Visual Confirmation is checked the potential change of object wiring pattern by the following processing of execution in step S162.
That is, data after the processing of input pattern handling part 213 in step S162 at first, and be stored among the RAM214.Then, in step S163, judge the data of whether storing 1 frame among the RAM214.Do not store in RAM214 under the data conditions of 1 frame sign, the data input that continues among the step S162 is handled.
On the other hand, in step S163, under the situation of the view data of storage 1 frame sign, enter into step S164, the view data of storage is whole by behind the medial filter, carry out medial filter and handle.
Then, in step S165, compare correction.In addition, in step S166, after carrying out 2 system processing, carry out profile and follow the tracks of.
Then, enter into step S167, and the target data obtained by processing shown in Figure 14 between, compare with least square method.Then, enter into step S168, obtain its correlation.
Then, in step S169, comparative result is presented among the display 21a, so that know and the different part of terminal objective data relatively.Thus, the direct state of the wiring of this frame of Visual Confirmation of operator.
Then, in step S170, whether investigation finishes whole processing of necessary frame.Under the unclosed situation of whole processing to necessary frame, return step S162, repeat above-mentioned processing, carry out showing with the result that relatively reaches of the target data of whole frames of relationship object wiring, show up to the result who carries out whole frames of necessity.
On the other hand, in step S170, under the situation that the whole processing to necessary frame finish, enter into step S144.At this moment, can be to be presented at state in the display frame with being preset as problematic wiring pattern, operator directly Visual Confirmation thinks problematic pattern state.
As mentioned above, according to present embodiment, because following the tracks of, the following profile of the step S151 of Figure 15 needs the time, so do not follow the tracks of by at first from step S140 to step S146, not carrying out profile, the electricity bundle variable density of investigation specified point, only under problematic situation, just carry out profile and follow the tracks of, so when can carrying out the high speed inspection, can carry out the necessary inspection of misfitting really.And, needn't under the whole circumstances, all carry out the affirmation of the capable pattern of cloth, as long as only check default problematic part, can check efficiently.
In the present embodiment, because only decide wiring whether suitable by view data in the case of necessary, so can there be excessive burden ground not carry out correct whether suitable judgement.In addition,, the shape of wiring can be intuitively held, also rejected region can be detected easily by display image.In addition, though can supply with a kind ofly be present under the situation on the circuit substrate at a plurality of wirings, the limit is suppressed to complex image processing necessary Min., only confirms the good check system that gets final product in the case of necessary in addition.
In addition, consistent with the shape of circuit substrate 100 in sensor chip 1, plane earth disposes each sensor element 12a, but but also stereoscopic configurations.
The shape of each sensor element 12a is expected all unified shapes as shown in Figure 3.This is because each sensor element 12a does not have and carries out to the supply of the inspection signal of wiring unevenly and appear at the reception of the signal of wiring.
In addition in the present embodiment, each sensor element 12a as shown in Figure 3, expectation constitutes and follows rectangular that direction and column direction uniformly-spaced arrange respectively.Therefore, can reduce towards the quantity inequality of the sensor element 12a of the per unit area of wiring, simultaneously, the subtend position relation between each sensor element 12a becomes clear, the shape that can come particular electrical circuit to connect up based on detection signal easily.But, but also the shape of the wiring of correspondence proving etc. only disposes 1 row size simply.
In sensor chip 1, sensor element 12a is the arrangement of 480 row 640 row, but this determines for convenient in the present embodiment, in the reality, for example also can dispose 200,000 to 2,000,000 sensor elements in 5 to 50 microns square.Expectation according to the size of like this setting sensor parts 12a, purpose at interval is, setting should realize the size of line width more accurate inspection, the corresponding circuits wiring, at interval.
At this, though N-channel MOS FET is made as sensor element, the invention is not restricted to this, also available P channel mosfet, also available TFT.Though passive device is made as n type diffusion layer, be not limited thereto, so long as the higher material of conductance also can be the amorphous semiconductor.In addition, also can make the current-carrying plate Ohmic contact, on source-side diffusion layer as passive device, improve the conductivity on passive device surface thus, that is, can make signal charge concentrate on the passive device near surface, can improve signal charge density, so can further strengthen the electrostatic capacitance coupling.At this moment, current-carrying plate can be a metallic film, also can be poly semiconductor.
As sensor element, can utilize semiconductor diffusion layer is made as charge voltage change-over circuit from the signal receiving element of wiring, the voltage form that can amplify is taken out detection signal, clearly discerns detection signal, so can carry out the inspection of more accurate circuit substrate.As sensor element, can utilize bipolar transistor, can be at a high speed and output detection signal correctly.As sensor element, also can utilize thin film transistor (TFT)s such as TFT, can improve the throughput rate of sensor element, in addition, can further increase the area of sensor array.
In addition, sensor element also can utilize the charge transfer element.The charge transfer element is CCD for example.At this moment, utilize electric charge to read the MOSFET of usefulness as transistor, passive device is connected with diffusion layer as source electrode, to the grid input select signal, be formed at current potential barrier under the grid from reduction, the signal charge that will be positioned at source side as the detection signal charge transfer to drain side, by the charge transfer element transmission detection signal that is connected in drain side.
In addition, before the potential change of corresponding circuits wiring is supplied with the potential change end of electric charge and wiring to passive device, the electric charge of supplying with during adverse current, can not carry out stable charge transfer if the diffusion layer that makes the electric charge that forms potential barrier supply with the drain electrode of MOSFET and passive device is connected to form.In addition, if utilize the charge transfer element, then laterally selection portion needn't be utilized on-off circuits such as multiplexer.
Sensor element is formed on idioelectric substrates such as glass, pottery, glass epoxy resin, plastics, receives the electromagnetic wave that radiates from the wiring that applies the inspection signal by metallic film, poly semiconductor, amorphous semiconductor, the higher material of conductance.
In addition, in the present embodiment, establish the potential change of testing circuit wiring, but also can detect electromagnetic amount and the radiation shape that radiates from wiring.And,, then be judged as wiring and normally connect if can detect the electromagnetic amount and the shape of regulation.And, under detecting, be judged as and be interrupted in the wiring way or lose than the regulation amount and difform situation lacked.
In addition, in the present embodiment, make the end of probe contact circuit wiring, but also can utilize the noncontact terminal to come the input checking signal from the starting point of wiring.Sensor chip also can be the capable type sensor that sensor element is arranged in row.At this moment, sensor chip is moved in the vertical direction, check the wiring in regulation zone.In addition, as area type sensor, under the big situation of the arrangement area of the wiring ratio sensor parts of the circuit substrate of checking, make the sensor mechanical shift.
Under the big situation in the receiving area of the shape ratio sensor of wiring, keeping respectively receives data, and is synthetic then.
In the present embodiment, make 1 capable driving of sensor element simultaneously, but be not limited thereto, can make the capable driving of a plurality of sensor elements simultaneously, in addition, a plurality of sensor elements in zone of the area shape of non-capable shape are driven simultaneously.At this moment, under the situation of a plurality of sensor element groups of the wiring shape that subtend is checked and the part repetition of the sensor element group of other wiring shape of subtend, with during being applied to timing on other wiring and being made as the selection of different frames.
As mentioned above, according to present embodiment, after at first detecting the electricity bundle variable density of specified point, whether the decision circuitry wiring is normal, with this judged result as a reference, the Butut that carries out wiring shows be used for whether judging normally of wiring, so high speed processing is adopted on the limit more simply, reliable wiring inspection is realized on the limit where necessary.
＜the second embodiment example 〉
Next uses Figure 17, Figure 18, Figure 19, and the check system of the second embodiment example that just the present invention relates to is illustrated.The check system of the second embodiment example is checked the two adjacent wirings of going simultaneously in an interframe, this point, and the described first embodiment example does not coexist.As for other parts, all identical with the first embodiment example, therefore, in this description will be omitted, and represent for the equal additional phase jack per line of identical constituent components in the drawings.
Figure 17 is used for illustrating when there is a plurality of wiring in a slice circuit substrate of the second embodiment example that the present invention relates to, apply the figure of order for wiring voltage, Figure 18 is that expression applies the sequential chart of sequential example for wiring voltage shown in Figure 17, and to be expression carry out the figure of the output image example of voltage when applying with sequential shown in Figure 180 to Figure 19.
In Figure 17, be simplified illustration as Figure 10, it is rectangular to check that with zero symbolic representation the circuit of object, wiring are configured to that m is capable, n is capable.
In the second embodiment example, as shown in figure 17, in first frame, for coming first and second wiring that lists longitudinal direction and apply voltage by last first row in regular turn, second row in the figure, voltage is applied to the m behavior to be ended.In second frame, also for coming the 3rd and the 4th wiring that lists longitudinal direction and by the last voltage that applies in regular turn in the figure.So, just apply voltage with the n/2 frame for all wirings.
Figure 18 is the sequential example of sequential chart expression applies to(for) the voltage that wiring applied shown in Figure 17.
As shown in figure 18, in first frame (between a Vsync to the two Vsync), and corresponding to the first, the 3rd, the 5th, the 7th Hsync, apply voltage on the wiring (1,1) for first row, first row, corresponding to the second, the 4th, the 6th, the 8th Hsync, apply voltage for first wiring (1,2) capable, secondary series.Next, corresponding to the 9th, the 11 ... Hsync, apply voltage for the wiring of first row, corresponding to the tenth, the 12 ... Hsync, apply voltage for the wiring (1,2) of secondary series.
Also identical later on as for second frame, corresponding to the Hsync of odd number, apply voltage for the wiring of odd column, corresponding to the Hsync of even number, apply voltage for the wiring of even column.
Promptly, control select signal input timing, supply with sequential etc. from the detection sequential of the potential change of sensor element row and for the inspection signal of wiring, so that drive the sensor element row of odd number, be used to detect the wiring of first row, and drive the sensor element row of even number, be used to detect the wiring of secondary series.
In other words, apply the sequential of voltage for a wiring, carry out every a sensor element row, view data will be existing at each bar line.
Thus, the wiring of odd column, display image (Figure 19 (a)) on odd lines only, the wiring of even number, only display image (Figure 19 (b)) on even lines.
So,, in same frame, alternately apply voltage, just make the supervision time be shortened to 1/2 for the wiring of odd-numbered line and the wiring of even number line.In addition,, and compensate the line of being missed, can obtain the profile of wiring integral body by image data processing.
In addition, also can in same frame, carry out inspection according to the resolution of sensor for the wiring of a plurality of row.For example, when 5 row were arranged, the same wiring of every 5Hsync electricity applied voltage and gets final product.
(the 3rd embodiment example)
In the present embodiment, as shown in Figure 3, be illustrated though just the sensor element 12 of sensor chip 1 is configured to example rectangular and that carry out the detection of wiring shape.But the present invention be not limit at above embodiment, its seniority among brothers and sisters method is unqualified, also can for example sensor element be configured to staggered array trellis.
With reference to Figure 20, the 3rd just relevant with the present invention who sensor element is configured to staggered array trellis embodiment example is illustrated.Figure 20 is the figure of a certain example of the sensor element of the 3rd embodiment example that the present invention relates to of expression.
As shown in figure 20,, can improve the resolution of column direction especially, therefore be arranged under the situation of column direction, can realize also SHAPE DETECTION accurately as wiring by sensor element being configured to staggered array trellis.In addition, when reading control, as long as will can read a line direction sensor element of horizontal-drive signal (Hsync), be configured to staggered array trellis, add to be connected with in every line and share read level synchronizing signal (Hsync) control line, just can realize to reduce the wiring potential change detection of the influence of adjacent sensors element.
(the 4th embodiment example)
In the 3rd as above illustrated embodiment example, as shown in figure 20, just the sensor element 12 of sensor chip 1 is configured to the embodiment that staggered array trellis carries out the detection of wiring shape and is illustrated.But the present invention be not limit at described embodiment, for example sensor element is configured to (cellular) honeycomb, to realize the higher SHAPE DETECTION of resolution.
With reference to Figure 21, the 4th just relevant with sensor element being configured to honey comb like the present invention embodiment example is illustrated.Figure 21 is the figure of an example of the sensor element of the 4th embodiment example that the present invention relates to of expression.
As shown in figure 21,, compare, can improve the density of the constituent parts area of sensor element, make and realize the higher wiring SHAPE DETECTION of resolution with the 3rd embodiment example by sensor element is configured to honeycomb.
In addition, as for reading control, can adopt and the identical control mode of the 3rd embodiment example.
According to the present invention, for the wiring of Any shape, the reliably also wiring inspection of correct execution.
Claims (16)
1. the testing fixture of the wiring on the check circuit substrate is characterized in that having: feed mechanism, and nearby locate to supply with by the end of described wiring and check signal; Testing agency disposes a plurality of sensor elements of its width less than described wiring width, is used to detect the potential change of supplying with on the wiring that described inspection signal is arranged; Shape extracts mechanism, according to the positional information that detects the described sensor element of potential change in the described testing agency, extract the shape of supplying with the wiring that described inspection signal is arranged, but extract the state of the shape judging circuit wiring of the wiring that mechanism extracted by described shape.
2. testing fixture according to claim 1 is characterized in that: for example described testing agency, the variation that detects dielectric (flux) densities by a plurality of sensor elements comes the potential change of testing circuit wiring.
3. testing fixture according to claim 1 and 2 is characterized in that, described a plurality of sensor elements are configured to rectangular.
4. testing fixture according to claim 1 and 2 is characterized in that, described a plurality of sensor elements are configured to honeycomb.
5. testing fixture according to claim 1 and 2 is characterized in that, described a plurality of sensor elements are configured to the alternate matrix trellis.
6. according to arbitrary described testing fixture in the claim 1 to 5, it is characterized in that: also have mechanism for identifying, to extract the shape of the wiring that mechanism extracted and the wiring shape in the design compare by described shape, again according to comparative result differentiate with described shape extract wiring that mechanism was extracted whether very.
7. according to arbitrary described testing fixture in the claim 1 to 6, it is characterized in that: described shape extracts mechanism, in described a plurality of sensor elements, the sensor element that selectively drives the regulation zone is with the potential change in the testing circuit wiring, and when will selecting signal to be supplied to the sensor element row of horizontal direction strip simultaneously, the potential change of the wiring of detection and described sensor element row subtend.
8. inspection method, it is useful in the testing fixture, this device has testing agency, dispose a plurality of sensor elements, be used for the potential change in the testing circuit wiring, it is characterized in that: form described a plurality of sensor element less than the width of described wiring at least with its width, nearby locate to supply with the inspection signal by the end of described wiring, detect the positional information of the described sensor element of potential change according to the supply of the corresponding described inspection signal of the sensor element of described testing agency, extract the shape of supplying with the wiring that described inspection signal is arranged, so that come the state of judging circuit wiring according to the described shape that extracts.
9. inspection method according to claim 8 is characterized in that, described a plurality of sensor elements are by detecting the variation of dielectric (flux) density, with the potential change of testing circuit wiring.
10. according to Claim 8 or 9 described inspection methods, it is characterized in that described a plurality of sensor elements are configured to rectangular.
11. according to Claim 8 or 9 described inspection methods, it is characterized in that described a plurality of sensor elements are configured to honeycomb.
12. according to Claim 8 or 9 described inspection methods, it is characterized in that described a plurality of sensor elements are configured to the alternate matrix trellis.
13. arbitrary described inspection method in 12 according to Claim 8, it is characterized in that, in addition, for comparing with the wiring shape in the shape of the described wiring that has extracted and the design, again according to comparative result differentiate the described wiring that has extracted whether very.
14. arbitrary described inspection method in 13 is characterized in that according to Claim 8, extracts the shape of described wiring, for in described a plurality of sensor elements, optionally drive the sensor element in regulation zone, with the potential change in the testing circuit wiring
And when will selecting signal to be supplied to simultaneously on the sensor element row of horizontal direction strip, the potential change of the wiring of detection and described sensor element row subtend.
15. a computer-readable goes out recording medium, it is characterized in that:
Can store computer program, this program is used for and can be implemented in claim the 8 to 14 each described inspection methods with computer control.
16. a computer program string is used for and can be implemented in claim scope the 8th to 14 each described inspection method with computer control.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP287638/2001 | 2001-09-20 | ||
| JP2001287638A JP2003098213A (en) | 2001-09-20 | 2001-09-20 | Inspection device and inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1556926A true CN1556926A (en) | 2004-12-22 |
Family
ID=19110416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA028184769A Pending CN1556926A (en) | 2001-09-20 | 2002-09-18 | Tester and testing method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040240724A1 (en) |
| JP (1) | JP2003098213A (en) |
| KR (1) | KR20040031098A (en) |
| CN (1) | CN1556926A (en) |
| WO (1) | WO2003027687A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884906A (en) * | 2012-12-20 | 2015-09-02 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Method for testing a sensor circuit |
| TWI621863B (en) * | 2016-03-14 | 2018-04-21 | 山葉汎提克股份有限公司 | Substrate inspection apparatus and substrate inspection method |
| CN112595955A (en) * | 2020-11-26 | 2021-04-02 | 中国计量大学 | Quantum chip detection tool and detection system |
| CN112611950A (en) * | 2020-11-26 | 2021-04-06 | 中国计量大学 | Quantum chip detection tool and detection system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7305645B1 (en) * | 2004-09-07 | 2007-12-04 | Advanced Micro Technologies, Inc. | Method for manufacturing place & route based on 2-D forbidden patterns |
| JP2008134114A (en) * | 2006-11-28 | 2008-06-12 | Hioki Ee Corp | Inspection device and inspection method |
| US9933469B1 (en) | 2012-11-19 | 2018-04-03 | Samuel Alden Ridenour | Non-contact, capacitive, portable presence sensing |
| JP7415444B2 (en) * | 2019-10-30 | 2024-01-17 | セイコーエプソン株式会社 | Vibration devices, electronic equipment and moving objects |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3868508A (en) * | 1973-10-30 | 1975-02-25 | Westinghouse Electric Corp | Contactless infrared diagnostic test system |
| JP3080595B2 (en) * | 1997-02-28 | 2000-08-28 | 日本電産リード株式会社 | Substrate inspection device and substrate inspection method |
| JPH11153638A (en) * | 1997-11-25 | 1999-06-08 | Nihon Densan Riido Kk | Method and device for inspecting substrate |
| JP2968785B1 (en) * | 1998-07-07 | 1999-11-02 | 日本電気移動通信株式会社 | Foldable mobile phone, answering machine service and drive mode setting method |
| JP2001221824A (en) * | 2000-02-10 | 2001-08-17 | Oht Inc | Inspection instrument, method and unit |
| JP2001235501A (en) * | 2000-02-22 | 2001-08-31 | Oht Inc | Inspection device and sensor |
| JP2001272430A (en) * | 2000-03-24 | 2001-10-05 | Oht Inc | Apparatus and method for inspection |
| JP2002022789A (en) * | 2000-07-05 | 2002-01-23 | Oht Inc | Inspection device and method |
-
2001
- 2001-09-20 JP JP2001287638A patent/JP2003098213A/en not_active Withdrawn
-
2002
- 2002-09-18 KR KR10-2004-7004029A patent/KR20040031098A/en not_active Application Discontinuation
- 2002-09-18 US US10/490,289 patent/US20040240724A1/en not_active Abandoned
- 2002-09-18 CN CNA028184769A patent/CN1556926A/en active Pending
- 2002-09-18 WO PCT/JP2002/009544 patent/WO2003027687A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884906A (en) * | 2012-12-20 | 2015-09-02 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Method for testing a sensor circuit |
| CN104884906B (en) * | 2012-12-20 | 2017-03-15 | 大陆-特韦斯贸易合伙股份公司及两合公司 | For the method checked by sensor circuit |
| TWI621863B (en) * | 2016-03-14 | 2018-04-21 | 山葉汎提克股份有限公司 | Substrate inspection apparatus and substrate inspection method |
| CN112595955A (en) * | 2020-11-26 | 2021-04-02 | 中国计量大学 | Quantum chip detection tool and detection system |
| CN112611950A (en) * | 2020-11-26 | 2021-04-06 | 中国计量大学 | Quantum chip detection tool and detection system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003098213A (en) | 2003-04-03 |
| WO2003027687A1 (en) | 2003-04-03 |
| KR20040031098A (en) | 2004-04-09 |
| US20040240724A1 (en) | 2004-12-02 |
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