CN1556841A - Thermoconductive composition - Google Patents
Thermoconductive composition Download PDFInfo
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- CN1556841A CN1556841A CNA028183886A CN02818388A CN1556841A CN 1556841 A CN1556841 A CN 1556841A CN A028183886 A CNA028183886 A CN A028183886A CN 02818388 A CN02818388 A CN 02818388A CN 1556841 A CN1556841 A CN 1556841A
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- thermally conductive
- wax
- conductive composition
- boron nitride
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
In a thermoconductive composition containing wax, a substantially spherical boron nitride is added as a filler. The average particle size of the substantially spherical boron nitride is preferably from 20 to 100 mu m and the filling ratio is preferably from 10 to 30 % by volume.
Description
Detailed description of the invention
Technical field
The present invention relates to thermally conductive composition, more specifically, the present invention relates to be used for and the heat-generating electronic elements CPU thermally conductive composition that closely contact and dispel the heat for example to the external world.
Background technology
Recent years, remove the major issue that heat has become every field from heating unit.Especially remove heat-generating electronic elements (for example IC chip) and other various device such as heat on electron device and the PC that carries element (being called " Heating element " later on) has become a major issue.This is because along with the temperature rising of various Heating elements, the possibility that this element breaks down will be exponential growth.And, for the size that reduces Heating element and improve processing speed, the requirement of Heating element is also become more strict.
At present, in order to disperse to produce and the cumulative heat in the Heating element, scatterer for example radiator element, radiator fan or metal suspension ring (slinger) are installed on Heating element usually.In addition, also can use various thermally conductive materials or conducting strip, thereby play the effect of heat catalysis as the heat transfer dividing plate between Heating element and the scatterer.
For example, the common heat conductive filler that contains lubricating grease that uses is as thermally conductive material, because lubricating grease has extremely low thermal resistance.Lubricating grease itself has excellent thermal conductivity, yet lubricating grease is liquid, and the time that needs when therefore placing it between Heating element and the scatterer is long, labor capacity is big.Therefore, the problem of lubricating grease is that handlability is poor, and in addition, also there is contaminate environment in it or is difficult to all measure the problem of coating.
In order to overcome these problems, propose that the shape of thermally conductive material being made sheet material obtains thermally-conductive sheet.Traditional thermally-conductive sheet, its thermal conductivity are to improve by highly-filled filler with high thermal conductivity.For example, European patent disclose 0322165 and the open No.11-26661 of Japanese unexamined patent a kind of thermally-conductive sheet has been described, this sheet material uses the boron nitride with volume particle size as filler, its filling ratio is up to 30 to 60 volume %.Yet because packed height fills, and binding agent is thermosetting resin or elastomerics, this sheet material on being assembled into equipment the time compression resilience bigger.And because the restriction of mechanical strength, the original depth of sheet material can not be less than 300 to 500 μ m, and because compression resilience is big, its thickness of sheet material that is installed in the equipment can not be less than 200 to 300 μ m.Accordingly, compare with lubricating grease, the thermotolerance of this sheet material is high especially, and lubricating grease combines back thickness with equipment can be reduced to tens of microns.
On the other hand, using paraffin is a kind of thermally-conductive sheet with workability of high-heating radiation and excellence as the phase transformation type thermally-conductive sheet of binding agent, because the wax heat fused also changes mutually, the thickness of sheet material reduces, and it is the same with lubricating grease low that final thermal resistance value becomes.For example, the open No.2000-509209 of Japanese unexamined international monopoly has illustrated and has a kind ofly contained paraffin and mean particle size is the thermally-conductive sheet of the sheet boron nitride of 7 to 10 μ m.In this thermally-conductive sheet, filler is a sheet, and binding agent has flowability, and the thickness that therefore changes the back sheet material mutually is decreased to 50 to 100 μ m, and it is the same with lubricating grease low that final thermal resistance becomes.Yet, sheet plate-like boron nitride is anisotropic, the thermal conductivity of in-plane is higher approximately 20 times than the thermal conductivity of thickness direction, after this sheet boron nitride is made sheet material, the sheet liquid crystal is in the in-plane orientation of sheet material, therefore, the thermal conductivity of sheet thickness direction is lower, and the initial thermal resistance before changing mutually is high especially.As a result, charge for the first time when being used for that test set starts and carrying out bolt down procedure at energy source, the Heating element that contains this sheet material has superheating phenomenon, and the waiting facilities refrigerative time will increase like this.
The problem to be solved in the present invention
The objective of the invention is to overcome these problems and provide a kind of and can reduce the thermally conductive composition of the initial thermal resistance value when especially reducing device start.
The method of dealing with problems
According to the present invention, the target of above-mentioned explanation can be by containing paraffin and basic thermally conductive composition acquisition for the spheric boron nitride.By mix basic for the spheric boron nitride as heat conductive filler, thermally-conductive sheet is more much higher than the situation of using the sheet boron nitride particle in the thermal conductivity of thickness direction, also can reduce the initial thermal resistance value before changing mutually simultaneously.
Implement mode of the present invention
Thermally conductive composition of the present invention contains paraffin and is that the spheric boron nitride is as necessary component substantially.Wax is not particularly limited, can uses natural wax, synthetic wax or blended wax.The example of natural wax comprises vegetable wax, gama wax for example, carnauba wax, rice wax, haze tallow and jojoba wax; Animal wax such as beeswax, lanolin wax and spermaceti; Mineral wax has montanin wax, ceresine and ceresin; Petroleum wax has paraffin, Microcrystalline Wax and petrolatum wax.The example of synthetic wax comprises synthetic hydrocarbon, for example Fischer-Tropsch wax and polyethylene wax; Sex change paraffin is montanin wax derivative, paraffin derivative and microcrystallite wax derivative for example; Hydrogenation wax such as hydrogenated castor oil and hydrogenated castor oil derivative; Lipid acid, acid acylamide (acid amide) fat, ketone and other is as 1,2-hydroxystearic acid, stearic amide, the mite of anhydrous phthalic imidine and hydrochloric ether.Preferred 30 to 150 ℃ of the fusing point of this wax, better then is 40 to 80 ℃.
Basic for the spheric boron nitride is to pulverize or other method makes the primary crystal granulating of boron nitride by adopting, then the particle sintering that will obtain or produce molded of a kind of sintering again with molded again pulverizing obtain.This boron nitride is a spheric on substantially, and particle used herein comprises that length-to-diameter ratio is 1 to 5 particle, also comprises oval particle.For boron nitride is sheet, and the made sheet material of the thermally conductive composition that contains this boron nitride is placed on the Heating element of above-mentioned explanation and this situation between the scatterer, because boron nitride is in the in-plane of sheet material orientation, can not obtain sufficiently high thermal conductivity at the thickness direction of this sheet material.On the other hand, when boron nitride can be thought sphere, the thermal conductivity of sheet thickness direction can increase, and especially, can reduce the initial thermal resistance value before changing mutually.
Thisly be preferably 20 to 100 μ m for its mean particle size of spheric boron nitride substantially, better then is that 30 to 60 μ m are better.If the boron nitride particle mean particle size of using is less than 20 μ m, the thermal conductivity of thickness direction will reduce, and if the particulate mean particle size surpasses 100 μ m, the thickness after thermally-conductive sheet changes mutually almost can not reduce, and has higher final thermal resistance value sometimes.In whole thermally conductive composition, be preferably 10 to 30 volume % for the filling ratio of spheric boron nitride substantially.If filling ratio just can't obtain sufficiently high thermal conductivity less than 10 volume %, and surpass 30 volume % as fruit volume, the thickness after thermally-conductive sheet changes mutually almost can not reduce, and has higher final thermal resistance value sometimes.
Thermally conductive composition of the present invention can also contain the compound of being represented by following molecular formula except the wax that comprises above-mentioned explanation and substantially for the spheric boron nitride:
(R wherein
1And R
2Representative independently of one another contains the alkyl of 1 to 3 carbon atom, and the value of n is 100 to 100,000).In the compound by molecular formula (I) expression, R
1And R
2Both equal preferable methyl.Promptly the compound by molecular formula (I) expression better is a polyisobutene.Number of repeat unit n is 100 to 100,000, and molecular weight is better 1,000 to 1,000,000, is more preferably 30,000 to 60,000.Molecular formula is to add 10 to 1,000 parts in per 100 parts of waxes, better 20 to 100 parts of these compounds for the combined amount of the compound of (I).
The compound of molecular formula (I) is a kind of liquid polymers, and its pour point temperature (by JIS K2269 regulation) is a room temperature or higher.Contain molecular formula and do not contain elastic component for the thermally conductive composition of the compound of (I), when fusion, has excellent flowability, embody excellent thermorodiative property, can not cause excessively and be clamminess, the sheet material that obtains has improved degradation property and has had higher intensity again simultaneously, and can guarantee good workability.
Thermally conductive composition of the present invention can also contain tenderizer except comprising molecular formula for the compound of (I).Can improve the flowability of thermally conductive composition by adding tenderizer, improve tight contact the between Heating element and the scatterer, can also further improve thermal conductivity.The example of spendable tenderizer comprises plant type tenderizer, mineral type tenderizer and synthetic softening agent, and these tenderizers all hold with wax phase separately.Operable plant type tenderizer example comprises oleum gossypii seminis, Toenol 1140 and rape seed oil.Operable mineral type tenderizer example comprises paraffin oil, naphthenic oil and perfume oil.The example of operable synthetic softening agent comprises dioctyl phthalate (DOP), dibutyl phthalate, Octyl adipate, diisodecyl adipate, dioctyl sebacate and Uniflex DBS.Preferred naphthenic oil and paraffin oil.The amount of the tenderizer of sneaking in the paraffin of per 100 weight parts is 1,000 part or still less, preferred 10 parts or still less.
Except the component of above-mentioned explanation, can add additive commonly used in the various polymer chemistries in the thermally conductive composition of the present invention.For example, can add the viscosity that tackifier, softening agent and similar substance are adjusted the sheet material of formation, can add fire retardant and antioxidant improves thermotolerance.Other example of additive comprises properties-correcting agent, thermo-stabilizer and tinting material.Simultaneously, above-mentioned explanation basic can be used surface treatment agent such as silane coupling agent for the spheric boron nitride and handled in advance.
Thermally conductive composition of the present invention can be mixed with by each component with predetermined amount.Can use this area method commonly used that thermally conductive composition is made sheet material or film.For example, with wax, in hot mixing tank, mediate for the required compound of (I), tenderizer etc. for spheric boron nitride, molecular formula substantially, apply by hot melt and will mediate coated materials and become to be similar to liner thereby formation sheet material.Perhaps, the component of above-mentioned explanation is diluted with suitable solvent, be coated in mixture on the wadding thereby the formation sheet material by solvent casting method with suitable solvent.
Sheet material can be made all thickness according to its end-use or applying portion, yet as a rule, because thickness is as far as possible little, so thickness is preferably 0.02 to 2mm, and better is 0.1 to 0.5mm.If thickness is less than 0.02mm, just can not obtain sufficiently high cohesive strength between Heating element and the scatterer, resulting heat dispersion is also not fully up to expectations, if yet thickness surpasses 2.0mm, FX between heat conducting element and the scatterer extrude increase, and caused the unnecessary bonding of periphery.
The sheet material of Xing Chenging can directly use as the heat transfer instrument thus.Yet, if necessary, sheet material can be used in combination with suitable substrates.The example of suitable substrate comprises plastics film, Woven fabric, supatex fabric and tinsel.The example of Woven fabric and supatex fabric comprises by weaving or non-woven fabric that glass fibre, polyester, polyolefine, nylon, carbon, pottery etc. are formed, or the fiber of applied metal coating.Base material can be used as the middle layer of upper layer or sheet material.
Sheet material at room temperature is a solid, so sheet material can be compared the workability with excellence with the situation of using liquid grease by being placed between Heating element and the scatterer in use.Heating element when work, changed mutually and fill space between Heating element and the scatterer by softening the causing of the heat of Heating element thereby insert sheet material.And, because spatial thickness reduces much between Heating element and the scatterer, thereby can reduce thermal resistance value greatly.Accordingly, contain preferred 30 to 150 ℃ of its softening temperature of thermally conductive composition of this sheet material, better then is 40 to 100 ℃.Can freely select softening temperature according to the type and the content of moiety.
In addition, the molecular formula that contains predetermined amount is compared with the traditional sheet material that uses wax for the sheet material of the compound of (I), has excellent sheet strength such as tensile strength and flexural strength, can not take place such as tearing or splintering problem when using simultaneously.
Embodiment
Embodiment 1
With the fusing point that contains 75 weight parts of 85 volume % is that 54 ℃ the paraffin and the molecular weight of 25 weight parts are 40, the mean particle size of the binding agent of 000 polyisobutene and 15 volume % is that the basic of 50 μ m gathered materials (being produced by Mizushima Gokin Tetsu Sha) 80 ℃ of evenly kneadings for the spheric boron nitride, boron nitride is used as filler, the material of mediating is placed between upper strata and the lower floor's wadding and 80 ℃ of calenderings obtain the thermally-conductive sheet that thickness is 0.25mm.
Embodiment 2
Prepare thermally-conductive sheet according to the mode identical with embodiment 1, different is, use mean particle size be 20 μ m basic for spheric boron nitride base-material as filler (PT620 is by Advanced Ceramics production).
Embodiment 3
Prepare thermally-conductive sheet according to the mode identical with embodiment 1, different is, use mean particle size be 100 μ m basic for spheric boron nitride base-material as filler (obtaining) by PT620 gradation with Advanced Ceramics production.
Embodiment 4
Prepared thermally-conductive sheet according to the method identical with embodiment 1, different is, changes the filling ratio of filler into 25 volume %.
The comparative example 1
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, use mean particle size be 200 to 300 μ m basic for spheric boron nitride base-material as filler (PT670 is by Advanced Ceramics production).The thickness of resulting sheet is 0.35mm.
The comparative example 2
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, using mean particle size is that the sheet boron nitride (HP-1 is produced by Mizushima Gokin Tetsu Sha) of 10 μ m is as filler.
The comparative example 3
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, using mean particle size is that the sheet boron nitride (PT110 is produced by Advanced Ceramics) of 45 μ m is as filler.
The comparative example 4
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, use mean particle size be 40 μ m basic for spheric aluminum oxide (CBA40 is by Showa Denko K.K production) as filler.
The comparative example 5
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, changes the filling ratio of filler into 5 volume %.
The comparative example 6
Prepared thermally-conductive sheet according to the mode identical with embodiment 1, different is, changes the filling ratio of filler into 35 volume %.
The comparative example 7
Prepared thermally-conductive sheet according to the mode identical with comparative example 2, different is to change the filler filling ratio into 25 volume %.
The Performance Evaluation of thermally-conductive sheet
The thermally-conductive sheet of preparation is according to the method described above cut into the size of 10mm * 11mm and peels off from wadding.This sheet material is inserted between heat generating resistor and the cooling aluminium dish, then heat generating resistor is applied the 20W power supply.Apply power supply after 30 seconds and 30 minutes, test heating resistor actuator temperature (T1) and aluminium dish temperature (T2), thermal resistance value is calculated according to following formula.Thermal resistance value after 30 seconds is as initial thermal resistance value, and the thermal resistance value after 30 minutes is thermal resistance value the most finally.
Thermal resistance value (℃ cm
2/ W)=(T1-T2) (℃) * surface area of sample (cm
2)/power supply (W)
The gained result is as shown in table 1 below.For reference example, thermal resistance value employing thermal conductivity is that the heat conduction lubricating grease (SE4490CV is produced by Dow Corning Toray Silicone Co.) of 1.6W/mK replaces thermally-conductive sheet to test with similarity method.
Table 1
| Initial thermal resistance value (℃ cm 2/W) | Final thermal resistance value (℃ cm 2/W) | |
| Embodiment 1 | ????2.2 | ????1.3 |
| Embodiment 2 | ????2.4 | ????1.3 |
| Embodiment 3 | ????2.2 | ????1.7 |
| Embodiment 4 | ????2.0 | ????1.5 |
| The comparative example 1 | ????2.6 | ????3.0 |
| The comparative example 2 | ????3.2 | ????1.7 |
| The comparative example 3 | ????3.1 | ????1.4 |
| The comparative example 4 | ????3.5 | ????3.2 |
| The comparative example 5 | ????4.5 | ????2.9 |
| The comparative example 6 | ????2.1 | ????2.9 |
| The comparative example 7 | ????2.8 | ????2.2 |
| Reference example | ????1.1 | ????1.3 |
Can it is evident that from The above results the thermally-conductive sheet of using composition of the present invention to make can reduce initial and final thermal resistance value, especially, compare that this thermally-conductive sheet can also reduce initial thermal resistance value with the situation of using laminal filler.
Effect of the present invention
By using the basic filler of spherical boron nitride as thermally conductive composition that be, can improve the thermal conductivity of the thermally-conductive sheet of being made by this composition, especially can greatly reduce the initial thermal resistance value before changing mutually.
Claims (9)
1. thermally conductive composition comprises wax and spherical boron nitride.
2. thermally conductive composition as claimed in claim 1 is characterized in that, in the amount of whole composition, the content of described spherical boron nitride is 10 to 30 volume %.
3. thermally conductive composition as claimed in claim 1 or 2 is characterized in that, the mean particle size of described spherical boron nitride is 20 to 100 μ m.
4. as each described thermally conductive composition in the claim 1 to 3, it is characterized in that, is 100 weight parts in wax, and described thermally conductive composition also contains the compound by following molecular formula (I) expression of 10 to 1,000 weight parts:
Wherein, R
1And R
2Independently represent the alkyl that contains 1 to 3 carbon atom separately, the value of n is 100 to 100,000.
5. thermally conductive composition as claimed in claim 4 is characterized in that, the described compound of being represented by molecular formula (I) is a polyisobutene.
6. will make film or sheet material as each described thermally conductive composition in the claim 1 to 5.
7. thermally conductive composition as claimed in claim 6 is characterized in that, the thickness of described film or sheet material is 0.02mm to 2.0mm.
8. thermally conductive composition as claimed in claim 1 is characterized in that, described wax is selected from natural wax, synthetic wax and their mixture.
9. thermally conductive composition as claimed in claim 1 is characterized in that described wax is paraffin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP289591/2001 | 2001-09-21 | ||
| JP2001289591A JP2003113313A (en) | 2001-09-21 | 2001-09-21 | Heat-conductive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1556841A true CN1556841A (en) | 2004-12-22 |
Family
ID=19112059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA028183886A Pending CN1556841A (en) | 2001-09-21 | 2002-07-29 | Thermoconductive composition |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1427792A1 (en) |
| JP (1) | JP2003113313A (en) |
| KR (1) | KR20040039379A (en) |
| CN (1) | CN1556841A (en) |
| WO (1) | WO2003027207A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103958400A (en) * | 2011-11-29 | 2014-07-30 | 三菱化学株式会社 | Aggregated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6713088B2 (en) | 1999-08-31 | 2004-03-30 | General Electric Company | Low viscosity filler composition of boron nitride particles of spherical geometry and process |
| US7976941B2 (en) | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
| JP4511858B2 (en) * | 2004-03-26 | 2010-07-28 | ポリマテック株式会社 | Phase change heat conductive molding |
| KR101261064B1 (en) * | 2004-08-23 | 2013-05-06 | 제너럴 일렉트릭 캄파니 | Thermally conductive composition and method for preparing the same |
| KR100587402B1 (en) * | 2005-10-11 | 2006-06-08 | 일동화학 주식회사 | Silver organo-sol ink for conductive pattern |
| JP5184543B2 (en) | 2007-09-26 | 2013-04-17 | 三菱電機株式会社 | Thermally conductive sheet and power module |
| US20110262728A1 (en) * | 2010-01-29 | 2011-10-27 | Nitto Denko Corporation | Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet |
| CN102250588B (en) * | 2011-05-18 | 2013-09-25 | 杨福河 | High-performance phase-change heat conduction material and preparation method thereof |
| KR102318231B1 (en) | 2015-01-29 | 2021-10-27 | 엘지이노텍 주식회사 | Inorganic filler, resin composition comprising the same and heat radiation board using the same |
| CN105441034A (en) * | 2015-12-03 | 2016-03-30 | 深圳德邦界面材料有限公司 | Rubber modified phase change heat conduction interface material and preparation method |
| JP7211923B2 (en) * | 2019-10-08 | 2023-01-24 | アイシン化工株式会社 | Composition for heat-dissipating moldings |
| CN113150565B (en) * | 2021-04-25 | 2022-09-27 | 华南理工大学 | Flexible heat-conducting insulating viscous phase-change heat radiating fin, preparation method thereof and battery heat management system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6197859B1 (en) * | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
| AU723258B2 (en) * | 1996-04-29 | 2000-08-24 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
| US5950066A (en) * | 1996-06-14 | 1999-09-07 | The Bergquist Company | Semisolid thermal interface with low flow resistance |
| US6391442B1 (en) * | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
| JP2001118973A (en) * | 1999-10-20 | 2001-04-27 | Fuji Kobunshi Kogyo Kk | Forming method of heat conductive film |
-
2001
- 2001-09-21 JP JP2001289591A patent/JP2003113313A/en active Pending
-
2002
- 2002-07-29 WO PCT/US2002/023960 patent/WO2003027207A1/en not_active Application Discontinuation
- 2002-07-29 CN CNA028183886A patent/CN1556841A/en active Pending
- 2002-07-29 EP EP02756746A patent/EP1427792A1/en not_active Withdrawn
- 2002-07-29 KR KR10-2004-7004058A patent/KR20040039379A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103958400A (en) * | 2011-11-29 | 2014-07-30 | 三菱化学株式会社 | Aggregated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition |
| US9822294B2 (en) | 2011-11-29 | 2017-11-21 | Mitsubishi Chemical Corporation | Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition |
| US10400151B2 (en) | 2011-11-29 | 2019-09-03 | Mitsubishi Chemical Corporation | Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003113313A (en) | 2003-04-18 |
| WO2003027207A1 (en) | 2003-04-03 |
| KR20040039379A (en) | 2004-05-10 |
| EP1427792A1 (en) | 2004-06-16 |
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