CN1546317A - Application type positive property thermal sensitive computer direct board and process for making same - Google Patents
Application type positive property thermal sensitive computer direct board and process for making same Download PDFInfo
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- CN1546317A CN1546317A CNA2003101173870A CN200310117387A CN1546317A CN 1546317 A CN1546317 A CN 1546317A CN A2003101173870 A CNA2003101173870 A CN A2003101173870A CN 200310117387 A CN200310117387 A CN 200310117387A CN 1546317 A CN1546317 A CN 1546317A
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- 238000000034 method Methods 0.000 title claims abstract description 4
- 230000008092 positive effect Effects 0.000 title 1
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 24
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims abstract description 21
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000000990 laser dye Substances 0.000 claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 241001597008 Nomeidae Species 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- 229920001519 homopolymer Polymers 0.000 claims abstract description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-dimethylformamide Substances CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 39
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 24
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims description 23
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 21
- 239000005011 phenolic resin Substances 0.000 claims description 21
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 15
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 15
- 239000004305 biphenyl Substances 0.000 claims description 14
- 235000010290 biphenyl Nutrition 0.000 claims description 14
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 14
- UXFQFBNBSPQBJW-UHFFFAOYSA-N 2-amino-2-methylpropane-1,3-diol Chemical compound OCC(N)(C)CO UXFQFBNBSPQBJW-UHFFFAOYSA-N 0.000 claims description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- 125000006267 biphenyl group Chemical group 0.000 claims description 9
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920003987 resole Polymers 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000000975 dye Substances 0.000 claims description 7
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical class NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 claims description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 5
- 241001330002 Bambuseae Species 0.000 claims description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 5
- 239000011425 bamboo Substances 0.000 claims description 5
- 235000006408 oxalic acid Nutrition 0.000 claims description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001450 anions Chemical class 0.000 claims description 4
- 235000015165 citric acid Nutrition 0.000 claims description 4
- 230000001186 cumulative effect Effects 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- 239000012046 mixed solvent Substances 0.000 claims description 4
- 125000001624 naphthyl group Chemical group 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 150000003921 pyrrolotriazines Chemical class 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 8
- -1 carboxy, carboxy methyl Chemical group 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 239000004971 Cross linker Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical group COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 8
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical group COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000005217 methyl ethers Chemical class 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- BSUNTQCMCCQSQH-UHFFFAOYSA-N triazine Chemical class C1=CN=NN=C1.C1=CN=NN=C1 BSUNTQCMCCQSQH-UHFFFAOYSA-N 0.000 description 1
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- Materials For Photolithography (AREA)
Abstract
The invention discloses a kind of coating positive thermal sensitive CTP version and the manufacturing method. The thermal layer of the CTP version is: the coating liquid is created by dissolving filming material with weight of 100, infrared laser dye, heat acid generating agent, cross linker into organic solvent with weight of 300-600, which is coated on the base piece and dried under temperature of 90oC-120 oC for 1-5 minutes and forms a thin film with thickness of 1-2mum. The filming material is one or more of carboxy, carboxy methyl or sulfonic group derivant formed by homopolymer and polymer of phenol formaldehyde resin, paramethyl phenol formaldehyde resin, methylol or multi-methylol phenol formaldehyde resin, vinylphenol. The invention will form cross linker structure in the preheated process.
Description
Technical field:
The invention belongs to the plate making technical field, be specifically related to a kind of application type thermosensitive type computer direct plate (thermosensitive type CTP version) and preparation method thereof.
Background technology:
Printing and plate-making technology have very big development and variation closely during the last ten years, and traditional offset printing and pre-coating photosensitive offset plate (PS version) are just promptly replaced by CTP (abbreviation of Computer To Plate) version.To the beginning of this century, just no matter is CTP platemaking equipment or plate recent years, all commercializations, and reach a certain scale.The CTP technology is the combination of laser and computer, than traditional printing technology, equipment is more advanced, it is faster to make a plate, also saved lithographic film preparation and from the film reproduction to operations such as PS versions, saved raw material and shortened the plate-making process.
The plate that is applied to the CTP technology claims CTP version, is sensitization or sensible heat according to plate printing surface impression layer, can be divided into two kinds: photosensitive CTP version and heat-sensitive CTP plate.
Heat-sensitive CTP plate also claims the thermosensitive type computer direct plate.It is a kind of can be by the plate of the direct scanning imagery of computer-controlled infrared laser.Common heat-sensitive CTP plate is coated with heat sensitive heat sensing layer, and when infrared laser scanned, the laser dye in the heat sensing layer absorbed infrared energy and changes heat into, and under the effect of heat, the hot acidoid in the heat sensing layer produces proton (H
+), at H
+Effect under film forming matter in the heat sensing layer take place crosslinked or decompose.Part without infrared laser scanning does not have this variation, thereby the back of developing forms the image of being made up of film forming matter, and it is ink-receptive.
According to the variation of heat sensing layer after the laser scanning, heat-sensitive CTP plate can be divided into positivity version and negativity version two classes again: in general, it be negative thermo-sensitive CTP version that heat sensing layer in the part of laser scanning crosslinked version takes place, and the crosslink part that develops afterwards is insoluble and stay image.The version that the heat sensing layer of laser scanning part takes place to decompose is the positivity heat-sensitive CTP plate, and the image that stays after developing is the part without laser scanning.
Chinese patent CN1380180A discloses a kind of coating type negative thermo-sensitive CTP version, and this negative thermo-sensitive CTP version needs to carry out The pre-heat treatment before scanning, brings loaded down with trivial details on the increase of cost and the program to the user.The present invention carries out the change of component by the film forming matter to heat sensing layer in the disclosed negative thermo-sensitive CTP of the Chinese patent CN1380180A version, thereby obtains the heat-sensitive CTP plate of positivity.
Summary of the invention:
The purpose of this invention is to provide a kind of application type positivity heat-sensitive CTP plate.
Another purpose of the present invention provides the preparation method of described application type positivity heat-sensitive CTP plate.
Technical scheme of the present invention is as follows:
A kind of application type positivity heat-sensitive CTP plate, comprise sheet base and heat sensing layer, the sheet base is the sheet base that is generally used for positive PS printing plate, heat sensing layer is: be 100 film forming matter, infrared laser dye, hot acid agent and crosslinking agent by weight, in weight is lysigenous coating fluid in 300～600 the organic solvent, is coated on the sheet base and dries under 90～120 ℃ of temperature that to form thickness in 1～5 minute be 1～2 micron film.Below describe the component and the content of heat sensing layer in detail:
(1) film forming matter: one or more among the following B, perhaps, one or more among one or more among the A and the B are 1 according to weight ratio: the composition that (0.3～0.8) is formed, weight is 70～85:
A: the homopolymers or the copolymer of phenolic resins, paracresol urea formaldehyde, methylol or many resol resins, vinylphenol;
The carboxy derivatives of material, carboxymethyl derivant, sulfonic group derivative among the B:A.
An exemplary of film forming matter is the composition of phenolic resins (or paracresol urea formaldehyde) and its carboxylic acid derivates, and said composition weight is 70～85, because of forming different variation to some extent.When adopting the composition of paracresol urea formaldehyde and its carboxylic acid derivates, paracresol urea formaldehyde and carboxyl (or carboxymethyl) are 1 to the weight ratio of sylvan urea formaldehyde in the composition: (0.3～0.8), preferred version are 1: (0.4～0.6).Carboxymethylated structural representation formula to the sylvan urea formaldehyde can be expressed as:
(2) infrared laser dye is a kind of material that can absorb near the infrared light 830nm, and commonly used have mountain valley with clumps of trees and bamboo dyestuff and a phthalein cyanogen dyestuff, and typical infrared laser dye is the mountain valley with clumps of trees and bamboo dyestuff of a kind of two ends band naphthyl, and the weight of dyestuff is 5～15, and preferred version is 8～12; Its effect is to absorb near the infrared light of 830nm and be converted into heat; Its structural formula is as follows:
(3) hot acid agent adopts diphenyl iodnium or triazine (triazine) derivative, and weight is 0.1～1.5, and preferred version is 0.5～1.0, can produce H under infrared laser or heat effect
+Typical hot acid agent is to be the diphenyl iodnium of anion with the hexafluoro-phosphate radical, and it is heated or during the 830nm laser action, generates hexafluorophosphoric acid in the presence of hydrogeneous organic compound (normally solvent).Hexafluorophosphoric acid is a kind of strong protonic acid, can discharge H
+
(4) crosslinking agent is many methylated methylol melamines, and weight is 9～20, and preferred version is 12～18.Crosslinking agent plays a part crosslinked in heat sensing layer.For example, when adopting paracresol urea formaldehyde carboxylic acid derivates to be film forming matter, at appropriate heating and H
+Effect down, what it can make carboxylated forms " crosslinked " structure to the sylvan urea formaldehyde.Typical crosslinking agent is a hexamethoxymethyl melamine, and its structural formula is as follows:
Selecting the solvent of making coating fluid for use is ethanol, ethylene glycol mono-ether, bis ether, 1, ammediol monoether, bis ether, dimethyl formamide (DMF) or their mixture.Preferred version is 1, the ammediol bis ether, and it and DMF form mixed solvent, and the percentage that DMF accounts for the solvent cumulative volume is 10-35%, and preferred version is 15-25%.
Above-mentioned application type positivity heat-sensitive CTP plate can also increase in the described coating fluid and is selected from oxalic acid, malic acid, citric acid or tartaric organic acid, and weight is 0.5～1.5, and preferred version is 0.8～1.2.
Positivity heat-sensitive CTP plate of the present invention can develop with the developer solution that the Kodak heat-sensitive CTP plate is used, and also can develop with the developer solution of positive-type PS version, and they all are the alkaline-based developers of water-based.Be developed in room temperature (about 20 ℃) and carry out, 1～5 minute time, preferred version is 2～3 minutes.
The preparation method of positivity heat-sensitive CTP plate of the present invention is as follows:
(1) with weight be 100 following be that 300～600 solvent is prepared into homogeneous phase solution 1. to the material of 4. described component and content and weight, solvent is selected from ethanol, ethylene glycol mono-ether, ethylene glycol bis ether, 1, ammediol monoether, 1, the mixture of one or more among ammediol bis ether, the DMF:
1. film forming matter: one or more among the following B, perhaps, one or more among one or more among the A and the B are 1 according to weight ratio: the composition that (0.3～0.8) is formed, weight is 70～85:
A: the homopolymers of phenolic resins, paracresol urea formaldehyde, resol resin, many resol resins, vinylphenol, the copolymer of vinylphenol;
The carboxy derivatives of material, carboxymethyl derivant, sulfonic group derivative among the B:A;
2. the mountain valley with clumps of trees and bamboo dyestuff of two ends band naphthyl, weight is 5～15, preferred version is 8～12;
3. diphenyl iodnium or pyrrolotriazine derivatives, weight is 0.1～1.5, and preferred version is 0.5～1.0, and typical diphenyl iodnium is to be anion with the hexafluoro-phosphate radical;
4. many methylated methylol melamines, weight are 9～20, and preferred version is 12～18, and typical example is a hexamethoxymethyl melamine;
(2) with above-mentioned solution coat on the sheet base, coating weight by amount of solid be calculated as 1～2 the gram/square metre, being equivalent to coating layer thickness is 1～2 micron, after the coating the version under 90～120 ℃ of temperature, dried 1～5 minute, promptly get the positivity thermo-sensitive computer direct plate.The purpose of oven dry is to remove to desolvate on the one hand, is to make the solid layer of coating take place crosslinked in advance on the other hand.Typical sheet base is that thickness is 0.1～0.3 millimeter through electrolysis and anodised aluminium flake base.
Among the above-mentioned preparation method, be preferably 1 as the organic solvent that forms homogeneous phase solution, ammediol bis ether and DMF composition mixed solvent, wherein to account for the percentage of solvent cumulative volume be 10～35% to DMF.
Among the above-mentioned preparation method, also can be added with in the described homogeneous phase solution and be selected from oxalic acid, malic acid, citric acid or tartaric organic acid, weight is 0.5～1.5, and preferred version is 0.8～1.2.
Positivity heat-sensitive CTP plate of the present invention, the film forming matter of its heat sensing layer, a kind of component is a phenolic resins, the paracresol urea formaldehyde, methylol (or many methylols) phenolic resins, the formed carboxyl of the homopolymerization of vinylphenol or copolymer, a kind of in carboxymethyl or the sulfonic group derivative or several, another kind of component is a phenolic resins, the paracresol urea formaldehyde, methylol (or many methylols) phenolic resins, the homopolymerization of vinylphenol or copolymer (a kind of or several) and their formed carboxyls, the composition that carboxymethyl or sulfonic group derivative (a kind of or several) are formed.Carboxyl or carboxymethyl, sulfonic introducing, increased heat sensing layer crosslinked sensitivity and with the firmness that combines of aluminium flake base.The derivative that has added a kind of melamine in the heat sensing layer of the present invention---many methylated methylol melamines are made crosslinking agent, and it plays a part crosslinked in heat sensing layer.The methoxyl methyl that an example of cross-linking reaction is a crosslinking agent is at H
+Catalysis is descended and sulfonic group, carboxyl or carboxymethyl are sloughed methoxyl group formation cross-linked structure.As being example with the hexamethoxymethyl melamine, the component of it and film forming matter band acidic-group forms cross-linked structure when being heated, and cross-linking reaction is that example can be expressed as follows with carboxymethyl paracresol urea formaldehyde:
R in the formula represents the ring of melamine.
The cross-bond of above-mentioned cross-linked structure is disconnected when infrared laser scans, and is solvable thereby scanning place becomes, and forms positive images.
Advantage of the present invention and good effect:
Film forming matter on the positivity heat-sensitive CTP plate of the present invention in the heat sensing layer prescription, stable in properties, cost is more cheap, prepare also fairly simple, highly beneficial to industrialization; Many methylated methylol melamines crosslinking agent in the heat sensing layer prescription and an amount of diphenyl iodnium, increased heat cross-linking sensitivity, make CTP version of the present invention just form cross-linked structure, got rid of the operation that preheats when using, thereby made the user very convenient in use in the heating process in advance of coating.Positivity heat-sensitive CTP plate of the present invention, the developer solution of employing and development conditions and general positive-type PS version are basic identical, adopt the alkaline-based developer of water-based, have both helped environmental protection, also provide users with the convenient.
Positivity heat-sensitive CTP plate of the present invention, what be different from other positivity heat-sensitive CTP plate is: its heat sensing layer had carried out temporary " crosslinked " before laser scanning, make whole heat sensing layer be not dissolved in developer solution.This temporary cross-linked structure is untied when infrared laser scans, thereby laser scanning partly becomes in the developer solution solubilized.The part of not untiing cross-linked structure is still insoluble developer solution.After infrared laser scanning, sweep test is developed to be removed like this, and sweep test does not stay, and forms ink-receptive positive images.
The specific embodiment:
Embodiment 1:
Get phenolic resins and paracresol urea formaldehyde (weight ratio: 1: 1) 1.2g, carboxymethyl phenolic resins 0.55g, infrared Absorption agent (830 laser dye) 0.2g, hexafluorophosphoric acid diphenyl iodnium 0.02g, hexamethoxymethyl melamine 0.34g, be added in the dicyandiamide solution of forming by glycol monoethyl ether 5ml, ethanol 5ml, dimethyl formamide 1ml, form coating fluid.With the coating method that coating fluid adopts according to common positive-type PS version, being coated on through electrolysis and anodised thickness is on the aluminium plate of 0.3mm, handles through 110 ℃ and dries in 2 minutes, promptly makes computer direct plate of the present invention.
The computer direct plate that makes is gone up scanning in thermosensitive CTP platemaking machine (the 830nm semiconductor laser being housed, Beijing Hua Tong company), and condition is: 830nm semiconductor laser light intensity 220mW, picture point diameter 10 μ m, time for exposure 1 μ s (500 rev/mins).Developer solution is a Kodak company heat-sensitive CTP plate with developer solution or with positive-type PS plate developing liquid, for example solution of 10% sodium sulfite and 1% NaOH.Be developed in 20 ℃ and carry out, 3 minutes time, obtain ink-receptive clearly image, in conjunction with firm, site 1%-99% reproduces image on the version base.
Embodiment 2:
Get phenolic resins and paracresol urea formaldehyde (weight ratio: 1: 1) 1.2g, carboxymethyl phenolic resins 0.55g, infrared Absorption agent (830 laser dye) 0.2g, hexafluorophosphoric acid diphenyl iodnium 0.02g, hexamethoxymethyl melamine 0.34g, glycol monoethyl ether 5ml, ethanol 5ml, dimethyl formamide 1ml mixes to form and forms coating fluid, being coated on coating fluid through electrolysis and anodised thickness is on the aluminium plate of 0.3mm, obtains computer direct plate after 110 ℃ of processing oven dry in 2 minutes.Scanning is with embodiment 1, and just the time for exposure is 2 μ s (250 rev/mins), develops with embodiment 1, obtains picture rich in detail.Image on the version base in conjunction with firmly, firmly wipe 100 times back and forth with rubber after, use microscopic examination, image does not fall a little.
Embodiment 3:
Paracresol urea formaldehyde (or phenolic resins) 1.2g, carboxymethyl paracresol urea formaldehyde 0.55g, infrared Absorption agent (830 laser dye) 0.2g, hexafluorophosphoric acid diphenyl iodnium 0.02g, hexamethoxymethyl melamine 0.34g, propylene glycol monomethyl ether (or the two methyl ethers of propane diols) 5ml, ethanol 5ml, dimethyl formamide 1ml, other adds the 3ml ether and forms coating fluid.Scanning, development conditions obtain picture rich in detail with embodiment 1.Image in conjunction with firmly, is wiped 100 times with rubber on the version base back and forth, uses microscopic examination, and image does not fall a little.
Embodiment 4:
Resol resin 1.2g, the paracresol urea formaldehyde of carboxymethyl (or carboxymethyl phenolic resins) 0.55g, infrared Absorption agent (830 laser dye) 0.2g, hexafluorophosphoric acid diphenyl iodnium 0.02g, hexamethoxymethyl melamine 0.34g, glycol monoethyl ether 5ml, ethanol 5ml, dimethyl formamide 1ml forms coating fluid.Scanning, development conditions obtain picture rich in detail with embodiment 1.Image in conjunction with firm especially, is wiped 100 times with rubber on the version base back and forth, uses microscopic examination, and image does not fall a little.
Embodiment 5:
Many resol resins 1.2g, carboxymethyl paracresol urea formaldehyde (or carboxymethyl phenolic resins) 0.55g, infrared Absorption agent (830 laser dye) 0.2g, hexafluorophosphoric acid diphenyl iodnium 0.02g, hexamethoxymethyl melamine 0.34g, glycol monoethyl ether 5ml, ethanol 5ml, dimethyl formamide 1ml.Scanning, development conditions obtain picture rich in detail with embodiment 1.Image in conjunction with firm especially, is wiped 100 times with rubber on the version base back and forth, uses microscopic examination, and image does not fall a little.
Embodiment 6:
With phenolic resins and paracresol urea formaldehyde among the styrene-ethylene base phenol copolymer replacement embodiment 1, other condition is with embodiment 1.Obtain picture rich in detail.
Embodiment 7:
With the phenolic resins among Sulfonated phenolic resins (or sulfonated paracresol urea formaldehyde) the replacement embodiment 1 with to the sylvan urea formaldehyde, other condition is with embodiment 1.Obtain picture rich in detail.
Embodiment 8:
With embodiment 1, just in original formulation, increase 0.01g oxalic acid (or citric acid), the dosage of 830 laser dyes is reduced to 0.15g, and other condition is constant, obtains picture rich in detail after laser scanning, the development.
Claims (10)
1. application type positivity thermo-sensitive computer direct plate, comprise sheet base and heat sensing layer, it is characterized in that heat sensing layer is: be 100 film forming matter, infrared laser dye, hot acid agent, crosslinking agent by weight, in weight is lysigenous coating fluid in 300～600 the organic solvent, being coated on the sheet base and drying the thickness that formed in 1～5 minute under 90～120 ℃ of temperature is 1～2 micron film, wherein:
(1) film forming matter is one or more among the following B, and perhaps, one or more among one or more among the A and the B are 1 according to weight ratio: the composition that (0.3～0.8) is formed, and weight is 70～85:
A: the homopolymers of phenolic resins, paracresol urea formaldehyde, resol resin, many resol resins, vinylphenol, the copolymer of vinylphenol;
The carboxy derivatives of material, carboxymethyl derivant, sulfonic group derivative among the B:A;
(2) infrared laser dye is the mountain valley with clumps of trees and bamboo dyestuff of a kind of two ends band naphthyl, and weight is 5～15, and structural formula is as follows:
(3) hot acid agent is diphenyl iodnium or pyrrolotriazine derivatives, and weight is 0.1～1.5;
(4) crosslinking agent is many methylated methylol melamines, and weight is 9～20;
Be selected from ethanol, ethylene glycol mono-ether, ethylene glycol bis ether, 1, ammediol monoether, 1, the mixture of one or more among ammediol bis ether, the DMF as the organic solvent that forms coating fluid.
2. application type positivity thermo-sensitive computer direct plate as claimed in claim 1 is characterized in that described film forming matter is: the composition of phenolic resins or paracresol urea formaldehyde and their carboxyl or carboxymethyl derivant.
3. application type positivity thermo-sensitive computer direct plate as claimed in claim 1 is characterized in that, described hot acid agent is to be the diphenyl iodnium of anion with the hexafluoro-phosphate radical.
4. application type positivity thermo-sensitive computer direct plate as claimed in claim 1 is characterized in that, described is 1 as the organic solvent that forms coating fluid, ammediol bis ether and DMF composition mixed solvent, and wherein to account for the percentage of solvent cumulative volume be 10～35% to DMF.
5. application type positivity thermo-sensitive computer direct plate as claimed in claim 1 is characterized in that, also increases in the described coating fluid to be selected from oxalic acid, malic acid, citric acid or tartaric organic acid, and weight is 0.5～1.5.
6. the method for preparing application type positivity thermo-sensitive computer direct plate as claimed in claim 1 is as follows:
(1) with weight be 100 following be that 300～600 solvent is prepared into homogeneous phase solution 1. to the material of 4. described component and content and weight, solvent is selected from ethanol, ethylene glycol mono-ether, ethylene glycol bis ether, 1, ammediol monoether, 1, the mixture of one or more among ammediol bis ether, the DMF:
1. film forming matter: one or more among the following B, perhaps, one or more among one or more among the A and the B are 1 according to weight ratio: the composition that (0.3～0.8) is formed, weight is 70～85:
A: the homopolymers of phenolic resins, paracresol urea formaldehyde, resol resin, many resol resins, vinylphenol, the copolymer of vinylphenol;
The carboxy derivatives of material, carboxymethyl derivant, sulfonic group derivative among the B:A;
2. the mountain valley with clumps of trees and bamboo dyestuff of two ends band naphthyl, weight is 5～15;
3. diphenyl iodnium or pyrrolotriazine derivatives, weight is 0.1～1.5;
4. many methylated methylol melamines, weight are 9～20;
(2) with above-mentioned solution coat on the sheet base, coating layer thickness is 1～2 micron, the version after the coating is dried under 90～120 ℃ of temperature and was promptly got described computer direct plate in 1～5 minute.
7. preparation method as claimed in claim 6 is characterized in that, described film forming matter is: the composition of phenolic resins or paracresol urea formaldehyde and their carboxyl or carboxymethyl derivant.
8. preparation method as claimed in claim 6 is characterized in that, described hot acid agent is to be the diphenyl iodnium of anion with the hexafluoro-phosphate radical.
9. preparation method as claimed in claim 6 is characterized in that, described is 1 as the organic solvent that forms coating fluid, ammediol bis ether and DMF composition mixed solvent, and wherein to account for the percentage of solvent cumulative volume be 10～35% to DMF.
10. preparation method as claimed in claim 6 is characterized in that, also increases in the described coating fluid to be selected from oxalic acid, malic acid, citric acid or tartaric organic acid, and weight is 0.5～1.5.
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| CN 200310117387 CN1259189C (en) | 2003-12-12 | 2003-12-12 | Application type positive property thermal sensitive computer direct board and process for making same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101122745A (en) * | 2006-08-11 | 2008-02-13 | 成都科瑞聚数码科技有限公司 | Positive printing heat-sensitive lithographic printing planography and its preparation method |
| CN102109764A (en) * | 2010-12-31 | 2011-06-29 | 浙江康尔达新材料股份有限公司 | Positive-type thermosensitive computer to plate (CPT) plate |
| CN101439610B (en) * | 2007-11-22 | 2012-07-04 | 乐凯集团第二胶片厂 | Negative type infrared light responsive composition, negative type printing plate and method of use thereof |
| CN101734034B (en) * | 2009-12-14 | 2012-09-19 | 泰兴市东方实业公司 | High sensitivity positive thermosensitive CTP plate and preparation method thereof |
| CN102841502A (en) * | 2012-09-21 | 2012-12-26 | 成都星科印刷器材有限公司 | Imaging liquid for thermosensitive CTP (cytidine triphosphate) plate |
| CN101734036B (en) * | 2009-12-14 | 2013-06-19 | 泰兴市东方实业公司 | Positive thermosensitive CTP plate adopting active etherate in condensation resin of pyrogallol and divinylbenzene and preparation method thereof |
| CN105301903A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition |
| CN113084353A (en) * | 2021-02-20 | 2021-07-09 | 清华大学 | Laser-induced thermal patterning method of nano-crystal based on ligand chemistry and patterned nano-crystal film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101122745A (en) * | 2006-08-11 | 2008-02-13 | 成都科瑞聚数码科技有限公司 | Positive printing heat-sensitive lithographic printing planography and its preparation method |
| CN101439610B (en) * | 2007-11-22 | 2012-07-04 | 乐凯集团第二胶片厂 | Negative type infrared light responsive composition, negative type printing plate and method of use thereof |
| CN101734034B (en) * | 2009-12-14 | 2012-09-19 | 泰兴市东方实业公司 | High sensitivity positive thermosensitive CTP plate and preparation method thereof |
| CN101734036B (en) * | 2009-12-14 | 2013-06-19 | 泰兴市东方实业公司 | Positive thermosensitive CTP plate adopting active etherate in condensation resin of pyrogallol and divinylbenzene and preparation method thereof |
| CN102109764A (en) * | 2010-12-31 | 2011-06-29 | 浙江康尔达新材料股份有限公司 | Positive-type thermosensitive computer to plate (CPT) plate |
| CN102109764B (en) * | 2010-12-31 | 2012-11-21 | 浙江康尔达新材料股份有限公司 | Positive-type thermosensitive computer to plate (CPT) plate |
| CN102841502A (en) * | 2012-09-21 | 2012-12-26 | 成都星科印刷器材有限公司 | Imaging liquid for thermosensitive CTP (cytidine triphosphate) plate |
| CN102841502B (en) * | 2012-09-21 | 2014-06-04 | 成都星科印刷器材有限公司 | Imaging liquid for thermosensitive CTP (cytidine triphosphate) plate |
| CN105301903A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition |
| CN113084353A (en) * | 2021-02-20 | 2021-07-09 | 清华大学 | Laser-induced thermal patterning method of nano-crystal based on ligand chemistry and patterned nano-crystal film |
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