CN1539256A - Welded leadframe - Google Patents
Welded leadframe Download PDFInfo
- Publication number
- CN1539256A CN1539256A CNA028153472A CN02815347A CN1539256A CN 1539256 A CN1539256 A CN 1539256A CN A028153472 A CNA028153472 A CN A028153472A CN 02815347 A CN02815347 A CN 02815347A CN 1539256 A CN1539256 A CN 1539256A
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- hole
- contact pad
- localized heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
In joining a lead of a leadframe (3) or component to a contact pad (9) of a substrate (1), the lead and contact pad are locally welded to be electrically connected. For reducing the power used in the welding operation the lead has at least one hole and preferably two holes (11), the material of the lead thereby melting, in the welding step, at the edges of holes to be joined with the heated material of the pad. Thereby a relatively low power can be used in the welding, the local heating used in the welding melting preferably or primarily material in the walls of said at least one hole.
Description
Related application
The application requires to enjoy in priority and the rights and interests of the Swedish patent application No.0102668-1 that submits to August 7 calendar year 2001, and the full content of this application is incorporated herein by reference.
Technical field
The present invention relates to a kind ofly for example in manufacturing is installed on than the assembly on the large circuit board, lead-in wire is connected to suprabasil method.
Background
In the process of the Reflow Soldering of electronic building brick, exist with solder when the assembly of some type of weldering and can produce relevant problem of remelting and potential inefficacy, used here assembly comprises carrier with conductive pattern, is installed in various components and parts and lead frame on the carrier.If this assembly has carrier such as the ceramic bases that is in the lead frame below, the weight of carrier and components and parts will make this assembly cave in and substrate is dropped so.This situation is shown among Fig. 1.
When being connected to lead frame on the assembly, exist may lose efficacy relevant with the cure cycle of secondary back or adhesive, this inefficacy is caused by the temperature stress on the components and parts that are installed on the assembly.
When being connected to thermally sensitive components and parts on substrate or the printed circuit board, normal reflux or the circulation that is used for cure adhesive can cause components and parts to lose efficacy.
The traditional solution of these problems comprises following:
-solder reflow during adopting conventional solder and accepting reflux technique.
-adopt the high temperature solder to avoid the solder reflow during the reflux technique.
-employing braze material.
The adhesive that-employing is conductive polymers based.
Here used solder is meant that fusing point is lower than 450 ℃ alloy, and it is used under the temperature of the fusing point that is lower than two parts these two parts being linked to each other.Brazing metal is meant and is used for identical purpose but fusing point is higher than 450 ℃ alloy.
The shortcoming of above-mentioned solution comprises:
The remelting of-conventional solder in secondary back technology, thermally sensitive components and parts may damage during refluxing.
-be in that known solder in the temperature required scope has such as fragility, cost is higher or contain the undesirable feature of harmful substance.And many components and parts can't bear high temperature required when using the high temperature solder.
-components and parts can't bear the required high temperature of reflux technique of brazing metal.
-having high efficiency energy source use aspect for requiring, the electrical property of known conductive adhesive material has not high enough conductance.
As substituting of said method, can adopt melting welding.Yet it is higher and carry out the bigger shortcoming of the required energy of melting welding that welding process has temperature.
Summary
An object of the present invention is to provide a kind of will be for example lead-in wire in lead frame or the components and parts be connected to method on the substrate pad, its needs carry out localized heating with medium energy.
Another object of the present invention provides a kind of lead-in wire in the lead frame being connected on the substrate pad so that the sub-assembly of lead frame and substrate can bear higher temperature, used method of temperature in the high temperature solder for example.
In general, in the method on the substrate pad in lead frame being connected to assembly for example, in the lead-in wire of framework, make the hole, then with wire bonds to pad.These holes have reduced welds required energy.These Kongzuis cover easily heated about 50% area in welding procedure.
In lead-in wire, adopt the hole to allow to produce not have lead-in wire, in fact to the insensitive machinery of heat be electrically connected, and can will be connected on substrate or the printed circuit board heat sensitive components and parts.Can produce the subsystem of mounted on surface, and such as use solder or curing conductive adhesive the time, avoid carrying out the integral body heating with no lead type connection.This technology allows to adopt lower input welding energy that thick lead-in wire is installed.In addition, it allows to install lead-in wire/components and parts and thermally sensitive components and parts is installed on thermally sensitive device.
Other purpose of the present invention and advantage will be set forth in following introduction, partly can understand from following introduction, perhaps can recognize in the embodiment of this invention.These purposes of the present invention and advantage can be by in claims, pointing out method, technology, instrument and its make up and realize and reach.
Brief description
Though in claims, set forth novel feature of the present invention particularly, yet by with reference to the accompanying drawings and from following detailed introduction to non-limiting example, can obtain of the present invention about its tissue and content and the above-mentioned and complete understanding further feature aspect, and can understand the present invention better, in the drawings:
Fig. 1 be the lead frame that links to each other with substrate cutaway view and
Fig. 2 is the partial plan view of the lead-in wire that links to each other with contact pad.
Introduce in detail
In the schematic cross sectional views of Fig. 1, assembly is shown as and for example is included in the ceramic bases 1 that link position 5 places link to each other with lead frame 3.In these positions, the connection lead-in wire of lead frame or pin 7 are made for the pad 9 of substrate and are electrically connected, and this is found in the partial plan view among Fig. 2.Lead-in wire 7 has the thickness more much bigger than thin contact pad 9.For example can adopt as shown in the reference numeral 10 laser beam, plasma welding, microflame (microflame) at the link position place with wire bonds to pad.
Pine in adding of welding procedure, pad will be than easier being heated of lead-in wire, and this is because exist by the caused heat capacity difference of different thickness.Yet, in order to reduce lead-in wire 7 thermal capacity, can on lead-in wire 7, be provided with at least one, best two holes 11, it has covered heated for example about 50% area in welding.These holes can have Any shape, circle for example shown in the figure.Then in heating process, the wall in hole 11 material interior or that lead-in wire is gone up in the fringe region of locating in the hole can produce fusing, and the material of fusing flows downward and links to each other with the material with below pad 9.Meanwhile, the zone that is in around the hole on the lead frame is heated, and substrate is that the pad 9 of substrate also is heated by hole 11.
When adopting high-power laser beam to heat,, therefore can form the plasma that can absorb laser apace because hole 11 can form cavity effectively when placing lead frame in the substrate.This plasma can strengthen the coupling of laser energy to the material to be welded to each other significantly.
As a rule, hole 11 is formed in the blaster fuse frame material, and its diameter is in about 0.1-0.8 millimeter scope, and the thickness of blaster fuse frame material is in the scope of 0.1-1 millimeter.Has direction with the bigger surperficial approximate vertical of components and parts to be welded to each other by the input heat energy of arrow 10 expression.
In welding procedure, lead frame is clamped by relative substrate of unshowned anchor clamps and pad and is directed, so that make it be in the desired position.
Though by the agency of and described specific embodiment of the present invention here, yet should be appreciated that those skilled in the art will readily recognize that many additional advantages, modifications and changes.Therefore, the present invention is not limited to detail, representative device and example shown shown and that introduce in a broad sense here.Therefore, under the prerequisite that does not break away from by the spirit or scope of claims and the globality inventive concept that equivalent limited thereof, can carry out multiple modification.Therefore it should be understood that claims are intended to cover all this modifications and changes that belong in marrow of the present invention and the scope.
Claims (3)
1. a lead-in wire that is used for lead frame or components and parts is connected to the method on the contact pad of substrate, comprise described lead-in wire and contact pad are carried out localized heating so that it is linked to each other, it is characterized in that, described localized heating is carried out as welding sequence, its melt in described lead-in wire and the contact pad at least one to the small part material, so that this or these materials link to each other described lead-in wire with described contact pad, and before carrying out described localized heating, in described lead-in wire, make at least one hole, thereby allow to use in described localized heating relatively low energy, described localized heating preferably or mainly melts the material in the fringe region at material in the wall in described at least one hole or described at least one place, hole on the described lead-in wire.
2. method according to claim 1 is characterized in that, makes two holes in described lead-in wire.
3. method according to claim 1 is characterized in that, described at least one hole is made for roughly 50% the area that has covered the described lead-in wire that is locally heated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0102668A SE521528C3 (en) | 2001-08-07 | 2001-08-07 | Welded leg frame |
| SE01026681 | 2001-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1539256A true CN1539256A (en) | 2004-10-20 |
| CN1270376C CN1270376C (en) | 2006-08-16 |
Family
ID=20284987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028153472A Expired - Fee Related CN1270376C (en) | 2001-08-07 | 2002-08-07 | Welded leadframe |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1415519A1 (en) |
| JP (1) | JP2004538656A (en) |
| CN (1) | CN1270376C (en) |
| SE (1) | SE521528C3 (en) |
| TW (1) | TW531462B (en) |
| WO (1) | WO2003015485A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054658B (en) * | 2009-10-30 | 2013-03-27 | 日月光封装测试(上海)有限公司 | Heating fixture of packaging lineup process and method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4842118B2 (en) | 2006-01-24 | 2011-12-21 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4889275A (en) * | 1988-11-02 | 1989-12-26 | Motorola, Inc. | Method for effecting solder interconnects |
| US4972989A (en) * | 1989-10-30 | 1990-11-27 | Motorola, Inc. | Through the lead soldering |
| DE19840306A1 (en) * | 1998-09-04 | 2000-03-09 | Bosch Gmbh Robert | Locating strip for positioning conductors with respect to the contact pins of an electronics housing, has fixed conductors aligning with contact pins protruding from through bores |
-
2001
- 2001-08-07 SE SE0102668A patent/SE521528C3/en not_active IP Right Cessation
- 2001-08-29 TW TW090121349A patent/TW531462B/en not_active IP Right Cessation
-
2002
- 2002-08-07 CN CNB028153472A patent/CN1270376C/en not_active Expired - Fee Related
- 2002-08-07 WO PCT/SE2002/001434 patent/WO2003015485A1/en active Application Filing
- 2002-08-07 JP JP2003520257A patent/JP2004538656A/en active Pending
- 2002-08-07 EP EP02756051A patent/EP1415519A1/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054658B (en) * | 2009-10-30 | 2013-03-27 | 日月光封装测试(上海)有限公司 | Heating fixture of packaging lineup process and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1270376C (en) | 2006-08-16 |
| TW531462B (en) | 2003-05-11 |
| WO2003015485A1 (en) | 2003-02-20 |
| SE521528C2 (en) | 2003-11-11 |
| SE0102668D0 (en) | 2001-08-07 |
| EP1415519A1 (en) | 2004-05-06 |
| SE0102668L (en) | 2003-02-08 |
| JP2004538656A (en) | 2004-12-24 |
| SE521528C3 (en) | 2003-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060816 Termination date: 20100807 |