CN1526169A - Method of producing a lamp - Google Patents

Method of producing a lamp Download PDF

Info

Publication number
CN1526169A
CN1526169A CNA02812023XA CN02812023A CN1526169A CN 1526169 A CN1526169 A CN 1526169A CN A02812023X A CNA02812023X A CN A02812023XA CN 02812023 A CN02812023 A CN 02812023A CN 1526169 A CN1526169 A CN 1526169A
Authority
CN
China
Prior art keywords
conductor
knot
method described
lamp
depression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA02812023XA
Other languages
Chinese (zh)
Inventor
��·��Ү���ɵ�
巴路·耶甘纳丹
A
约翰·A·蒙塔纳特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lednium Technology Pty Ltd
Original Assignee
Lednium Technology Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lednium Technology Pty Ltd filed Critical Lednium Technology Pty Ltd
Publication of CN1526169A publication Critical patent/CN1526169A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

A method of producing a lamp, including mounting light emitting junctions on a support structure (52) such that the junctions adopt a three-dimensional array. The support structure may be a curved lead frame, which is also claimed. The conductors may be in a part spherical configuration. The light emitting junctions may be mounted in recesses (57) in the curved conductors, the recesses acting as an optical guide controlling the direction of light output from the junction.

Description

Produce the method for lamp
The field of the invention
The present invention relates to produce lamp, particularly LED lamp and for the method for the lead frame that uses in the lamp.
General introduction of the present invention
According to the present invention, a kind of method of producing lamp is provided, be included on the supporting construction light-emitting junction is installed, make knot adopt cubical array.
This method preferably also is included in each depression that forms in the supporting construction and makes the knot location, and the function of this depression is as light guide, is used to control the direction of light from relevant knot output.
This supporting construction preferably includes a plurality of conductors, and this method also is included in the warp architecture and forms conductor, and this crooked structure the pick of is a spherical structure.
Conductor is preferably installed with the form of lead frame.
This method comprises also that preferably making lead frame moves with respect to forming platform, and makes drift and punch die from the engagement of lead frame opposition side, to form depression.These depressions can be in independent on formation, or can sequentially form in addition, makes each be recessed to form that drift and punch die move with respect to lead frame after the action, make for order be recessed to form the action drift and punch die is suitably located.
Framework preferably is supported on the carriage, and this method comprises movable support bracket, makes to be installed to each depression of conductor place towards erecting bed at knot.Carriage preferably can be around the first and second orthogonal axle rotations, so that making each depression aims at erecting bed, and by knot and associated conductor are advanced toward each other along the 3rd, knot is installed in each depression, and the 3rd preferably orthogonal to first and second.
Each knot preferably is electrically connected to two conductors by middle conductor.Middle conductor can be connected, so that cross the electric current that each ties connected associated conductor by control flows, allows the independent control of at least two knots.Knot also can be electrically connected to the conductor that can separately control in groups.
This method preferably includes at least and apply shared phosphorus on two adjacent bonds, and is more preferably sealing supporting construction and knot in spherical part.
In another way, the lead frame that is included in a plurality of conductors that form in the crooked configuration is provided, be used for light-emitting junction is supported on cubical array.Lead frame preferably includes the depression of holding a knot respectively.
In another way, provide the lamp that forms according to the above method.
In another way, provide and handled the above with a kind of method of conductor with the lamp that is connected electrically in light-emitting junction formation therebetween, comprise the electric current of control, so that the independent light of exporting from connected knot of controlling by each conductor.
Brief description of drawings
More describe the present invention with reference to the accompanying drawings in detail, wherein:
Fig. 1 is the end view of a LED lamp;
Fig. 2 is the plan view of the lamp of Fig. 1;
Fig. 3 is the plan view for the lamp of Fig. 1 and 2;
Fig. 4 is the schematic sectional view of second LED lamp;
Fig. 5 is the circuit diagram of the lamp of Fig. 4;
Fig. 6 is the cutaway view of the lamp of Fig. 4;
Fig. 7 is the plan view of the lamp of Fig. 4;
Fig. 8 is the expression of the lamp light illumination mode of Fig. 4 to 7;
Fig. 9 is the plan view of the 3rd lamp;
Figure 10 is the circuit diagram of the lamp of Fig. 9;
Figure 11 is the front view of the lamp of Fig. 9;
Figure 12 is the end view of the lamp of Fig. 9;
Figure 13 is the end view that fits in the lens on the lamp of Fig. 9;
Figure 14 is the cutaway view of being got along the X-X of line shown in Figure 11;
Figure 15 is the cutaway view of being got along the Y-Y of line shown in Figure 12;
Figure 16 be the light illumination mode that produces by the lamp of Fig. 9 to 12 expression;
Figure 17 is the flow chart that expression is used to produce the step of lamp;
Figure 18 is a perspective illustration of operating the lead frame of arranging for being recessed to form;
Figure 19 is the perspective view of lead frame on the carriage;
Figure 20 is the cutaway view of lead frame;
Figure 21 is with the plan view of knot with the lead frame of middle conductor a);
Figure 21 b) be along a) cutaway view of the lead frame got of the timberline A-A of institute of Figure 21;
Figure 22 is with the plan view of another lead frame of knot;
Figure 23 is the plan view that another kind of lead frame constitutes;
Figure 24 is the perspective view from the lamp of Figure 23 lead frame formation; And
Figure 25 is the perspective view of another lamp.
DETAILED DESCRIPTION OF THE PREFERRED
As shown in Figure 1, lamp 1 comprises spherical part 2, has cylindrical base 3 and parabola shaped end 4, is configured to improve the brightness in the axial output of lamp.Lamp also comprises first and second terminals, and it is preferably the form that is embedded into the conductor 5,6 in the spherical part 2.Terminal 5 has support platform 7, and integrated circuit (IC) wafer 8 is installed on it.In the example that provides, wafer comprises two adjacent basically each other knots of arranging, and makes such as the phosphorus layer, to be applied in the fluorescent material shared layer and to tie.9 to 12 knots of middle conductor are electrically connected to respectively holds 5,6, makes as pointed in the circuit diagram 3, and LED ties 14,15 and arranges with opposite polarity.A resistive element 16 is installed between another conductor 13 (connecting middle conductor 11 and 12) and the terminal 5.
Conductor 5,6, middle conductor 9 to 13 reaches wafer 8 and all is embedded in spherical part 2, makes lamp be rendered as a firm overall structure.The opposite polarity of knot allows lamp to be connected to power supply, compares with traditional LED structure and needn't consider polarity.Use common single phosphorus layer to simplify manufacturing for each knot, and aesthetic advantage is provided, promptly from being from single light source in one of any light perception of two knots.
In a kind of preferred form of LED lamp, use following standard:
Nominal size-9.5mm diameter
Photochromic-white
Spherical color-water is clear
Light intensity-superbright typical light output>500Cd@20mA
Guarantee life-span-30,000 hour
15 ° of typ. of focusing-half-angle
Pedestal type-interchangeable with the wedge shape type lamp
Outside lead-in wire size-6mm nom. pedestal wedge shape
Supply power voltage-12 volt nom.{>11.5<14 volts AC or DC}
Forward current-20+8/-3mA@12 volt
Forward voltage-3.6nim (typ) 4.0max.@20mA
Reverse voltage-5 volt nim.
Power dissipation-LED ties 120Mw
Resistance 170mW
Reverse current-50 * 10 -3MA max.@5V
Internal resistance-430ohms nom
Yet the configuration and the running parameter that should be appreciated that any part dimension of lamp can change on demand, and the number of LED knot also can increase to be fit to the illumination needs.
Referring now to second lamp 20 of Fig. 4 to 8 explanation.With regard to installing first and second terminals 21 and 22 scopes, together to embed the form of the conductor 23,24 of spherical part 25 with extra conductor 26,27, lamp 20 structurally is similar to Fig. 1 to 3.Each conductor 23,26 and 27 has depression 28 separately, and provide the structural support is used to hold by label 29,30, the relevant knot of 31 indications.Knot is covered by phosphorus 35 shared layers, and is connected between each each conductor 23,26,27 that they are installed in and the adjacent conductor by middle conductor 32,33,34.In an example shown, represent that knot is connected as the circuit diagram of Fig. 5.
Institute's conductor 23,24,26,27 to some extent is preferably formed as two-dimentional lead frame structure 40 into as shown in Figure 6, so that before inside applies phosphorus layer 35 and apply before the spherical part 25, allows directly be easy to manufacturing and reliability in the location knot 29,30,31.As from Fig. 6 and 7 liang figure as seen, knot 29,30,31 is arranged in the array that is generally straight line, and conductor 23,27 projectioies make that the whole brightness by the knot generation will axially be reinforced in a way, shown in Fig. 8 curve A on conductor 26.
Lamp 20 also can be installed lens 41, and these lens fit in spherical part 25, and is configured as the light that modification is produced by lamp, so that for example produce the luminance patterns of being represented by the curve B among Fig. 8, thereby the brightness of output is distributed to a certain degree more equably.Referring now to Fig. 9 to 16,, indicates one the 3rd lamp 50.Be embedded in whole spherical part 55 with regard to a plurality of conductors 51,52,53 and 54, and have the scope that is installed in the light-emitting junction 56 that respectively caves in 57 and covered by shared fluorescent material layer, lamp 50 generally is similar to the structure with headlight.Each knot also is electrically connected to each conductor of its installation and adjacent conductor by middle conductor 58, so that form circuit shown in Figure 10.Yet in this example, each of conductor 51 to 54 has three knots 56.
Conductor 51 to 54 is crooked in spherical part 55, so as knot be supported on dotted line such as on the spherical curve face, and by this way, the illumination that is produced by lamp 50 will be well as if little is generally that the spherical point light source sends from one.The installing of lens 60 is also in order to revise the output of knot, and to produce such as by more uniform distribution pattern shown in Figure 16 curve C, this pattern is to export from the brightness that a plane graph of lamp 50 is observed, promptly when lamp is equidirectional finding observed from Fig. 9.
Except using lens 60 to revise the output of light, can also be with any required assignment of configuration conductor, and 57 the structure of caving in also can be used to help to control the orientation output from the light of respectively binding up one's hair out.Specifically, the configuration of each depression for example can be like this, i.e. the effect of recessed side walls is as direction and/or the angle of light guide control from each light scattering of binding up one's hair out.
More particularly, the shape of each depression is described in more detail and to the effect from the light of knot output now with reference to Figure 14 and 15, these two figure illustrate the cutaway view of the associated conductor of being got along Figure 11 and 12 center line X-X and Y-Y respectively.
The depression 57 that comprises the LED knot is at conductor 51,52, location and shaping in 53, make the light beam that sends from depression to be combined with predictable pattern at the free space outside the lamp 50, this pattern is by extending the distance that intersects-be labeled as ' r ' to be tied depression side dotted line by the radius of dotted portion sphere ' R ' LED from depression, and the center line 61 of lamp 50 is with definite by the angle ' A ' between the center line of tying perpendicular to any other LED 62.
The radius of dotted line sphere ' R ' is the distance of tying to the LED in the depression from the crosspoint of those center lines.Angle between the depression side has been determined the value of ' r '.
Be equal to or greater than at ' r ' under the situation of ' R ' restriction,, will be configured as Uncrossed light beam by depression from the light of each LED knot no matter the value of angle ' A ' how.Can make the coincident of light beam of tying from each LED and the light beam of tying from adjacent LED for ' r ' all values less than ' R '.Accurate in locating will be determined by the value of ratio R/r and angle ' A ' in this example.
Can see that above-mentioned lamp allows suitable scope to use junction diode to obtain light source, has one of various predetermined output luminance patterns, keeps general simple structure simultaneously.A special advantage is, each knot size is little, and can be configured to and produce naked eyes and can feel the light output of sending from a single point light source.
A kind of method referring now to Figure 17 to 24 explanation production lamp.This method comprises three Main Stage: the stage 100 forms suitable lead frame; Stage 101 is that knot is appended to lead frame; Stage 102 is final encapsulated phases.
Stage 100 is included in step 103 a flat lead frame is provided, and forms spherical calotte at the conductor of step 104 lead frame, and forms depression in step 105 in conductor, does the surface in step 106 subsequently and handles.
Figure 18 is illustrated in the lead frame 110 between step 104 and 105.Lead frame 110 is installed in the band 111 of general elongation, and this band is divided into and finally is separated and forms the part 112 of each lamp.Each part 112 comprises a plurality of conductors 113,114,115 that form the curved configuration that is preferably the part sphere.Conductor can form with such configuration by any suitable process such as by band 111 is inserted forcing press etc.
In order to form depression, the part spherical part of lead frame fits on the instrument 116 of the correspondingly-shaped that forms the platform place, wherein the drift (not shown) is from opposition side and the conductor 113 of lead frame to the punch die side, 114,115 engagements, effect by drift is deformed into the relevant punch die 117 that provides in the instrument 116 to conductor, so that form depression in conductor.Depression can sequentially form, and for this reason, and instrument preferably moves with respect to lead frame is rotatable, makes punch die can be turned any desired position at the place that requires to cave in.Like this, coordinated single drift that turns and punch die 117 can be used to form all depressions in any required array.In addition, instrument 116 can have the punch die 117 of a suitable configuration of being scheduled to and the array of drift, makes all be recessed in the on formation of single.Because as above at Fig. 9 to 16 discussion, the effect of depression is as light guide, can select cave in specific location and configuration, so that optimize output on demand, exports so that regulation is directed, Ao Xian number will be determined maximum output intensity simultaneously.
In any case, as shown in figure 19, can be installed on the carriage 119 for stages 101 lead frame 110, wherein light-emitting junction is installed in the depression 120.Carriage 119 itself can rotate around rotating shaft 121, is pivotable to center on the x-axle, and 122 rotates around the shaft, to be pivotable around the y-axle.Like this, lead frame can be in place at erecting bed (not shown) place, and center on x with respect to erecting bed, and the y axle rotates, so that each depression 120 order presents to receive relevant knot.Figure 20 illustrates the section of one of platform 112, and the part ball formation of conductor 114 particularly.The possible path of sphere conversion of curve 123 expression conductors 114, this conductor can be by obtaining around axle 121,122 rotating lead frames 110.Line 124 representational tools 116 leave the rotation of z-axle equivalence, this rotation 120 work angles that can be formed within it 125 of having stipulated again to cave in.
When each depression when suitably being presented on erecting bed, relevant light-emitting device or punch die as shown in Figure 21 in order simply to be called knot 130, is inserted into depression along being preferably in axial the 3rd of z-, and according to the processing stage 101 step 107 bonding in place.At this moment, or subsequently, can be in the additional middle conductor 131 of step 108, so that knot is electrically connected to adjacent conductor.Knot shown in Figure 21 is with the assignment of configuration of electric parallel, yet the location of knot can be any required configuration with being connected, shown in Figure 22, wherein each knot is connected to a shared center conductor 114 and reaches the conductor 132 of radially separately arranging, and can be separated control so that allow by the electric energy that independent control offers conductor from the light intensity of each knot.The another kind of possible configuration of depression 120 shown in Figure 23.In any configuration, various knots can be electrically connected in groups, and making can be by independent control from the light intensity of each group.
In case LED ties installation in position and connected middle conductor, then the treatment step 109 in the stage 101 applies phosphorus to knot.At least two adjacent LED knots of the best paint of phosphorus.
Lead frame 110 is transferred to the terminal stage 102 of processing then, so that form lamp shown in Figure 24 140.Stage 102 comprises separate section 112, removes unnecessary lead frame material, and or at step 135 pressing mold, or in step 136 around the conductor molded spherical parts 137 of 112,114,115 epoxies (referring to Figure 24).The free end of conductor can be bent into terminal or pin 138 then, is inserted into general printed circuit board (PCB) associated through-holes such as (PCB).Test the lamp 140 of gained then in step 139, and pack if desired.
Another lamp of finishing is shown in Figure 25, and additional molding 151 forms under spherical part 137.In this example, for the conductor of simplifying in the spherical part does not illustrate, yet conductor can have and similar configuration shown in Figure 22, though more knot and relevant depression are provided.Specifically, provide the knot of 18 lines that separate, had 18 relevant pins 138 and also have pin 152, so that the common conductor in spherical part 137 provides electric current.Like this, in lamp 150, form 18 different circuit, and can be by pin 138 addressing and control these circuit respectively, they are fitted to PCB etc. again.
Then just as is understood, the invention provides a kind of method of producing the LED lamp, this method is optimized the output that LED ties by making knot with the cubical array location and be used for the depression of optics guiding.And then this structure allows the different output of the group of each knot or knot by independent control, to change radiative intensity.At last, mention once more that the configuration of the conductor of the cubical array of knot and bending itself allows more to manifest from a single point or pellet shapes light emitted from the light of lamp, this can think to surpass the light emitter junction device of traditional discrete knot.
Just the mode with non-limitative example has illustrated above method and LED lamp, and is not deviating under the above the spirit and scope of the present invention, can make many remodeling and distortion to it.

Claims (20)

1. produce a kind of method of lamp, be included on the supporting construction light-emitting junction is installed, make knot adopt cubical array.
2. the method described in claim 1, wherein supporting construction comprises a plurality of conductors, and this method also is included in the warp architecture and forms conductor.
3. the method described in claim 2, wherein conductor forms with the part ball formation.
4. the method described in claim 1 comprises also making to tie being positioned in each depression that forms in the supporting construction that the function of this depression is as light guide, is used to control the direction of light of exporting from relevant knot.
5. the method described in claim 4, wherein the supporting construction conductor is with the form installing of lead frame, to comprise a plurality of conductors.
6. the method described in claim 5, wherein conductor forms with the part ball formation.
7. the method described in claim 5 or 6 also comprises making drift and punch die and lead frame engagement, to form depression.
8. the method described in claim 5 wherein is recessed in independent on formation.
9. the method described in claim 5, wherein depression sequentially forms, and drift and punch die move with respect to lead frame after each is recessed to form action, make for order be recessed to form the action drift and punch die is suitably located.
10. the method described in one of any as claim 7 to 9 also comprises frame supported on a carriage, and movable support bracket, makes each depression appear at erecting bed, is installed on the conductor at this erecting bed knot.
11. the method described in claim 10, wherein carriage can be around the first and second orthogonal axle rotations so that each depression is aimed at erecting bed, and by make knot and associated conductor along the 3rd relative each advance, tie to be installed in and respectively cave in.
12. the method described in one of any as claim 5 to 11, wherein each knot is electrically connected to two conductors by middle conductor.
13. the method described in claim 12, wherein middle conductor can be connected, so that cross the electric current that each ties connected associated conductor by control flows, allows the independent control of at least two knots.
14. the method described in claim 13, wherein knot also can be electrically connected to the conductor that can separately control in groups.
15. the method described in one of any also comprises at least applying shared phosphorus on two adjacent bonds as claim 1 to 14.
16. the method described in one of any also is included in sealing supporting construction and knot in the spherical part as claim 1 to 15.
17. a lead frame comprises with a plurality of conductors of the configuration formation of bending, is used for light-emitting junction is supported on cubical array.
18. the lead frame described in claim 17 also comprises the depression of holding a knot respectively.
19. the lamp that forms according to one of any method of claim 1 to 16.
20. handle a kind of method of the lamp described in claim 19, described lamp forms with conductor and the light-emitting junction that is connected electrically in therebetween, this method comprises the electric current of control by each conductor, so that independent control from the light of connected knot output.
CNA02812023XA 2001-06-15 2002-06-14 Method of producing a lamp Pending CN1526169A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR5705 2001-06-15
AUPR5705A AUPR570501A0 (en) 2001-06-15 2001-06-15 Led lamp

Publications (1)

Publication Number Publication Date
CN1526169A true CN1526169A (en) 2004-09-01

Family

ID=3829678

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA02812023XA Pending CN1526169A (en) 2001-06-15 2002-06-14 Method of producing a lamp

Country Status (10)

Country Link
EP (1) EP1396023A4 (en)
JP (1) JP2004532532A (en)
KR (1) KR20040019015A (en)
CN (1) CN1526169A (en)
AU (1) AUPR570501A0 (en)
CA (1) CA2450156A1 (en)
NZ (1) NZ530066A (en)
TW (1) TW567617B (en)
WO (1) WO2002103794A1 (en)
ZA (1) ZA200309547B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102754228A (en) * 2010-01-29 2012-10-24 日本航空电子工业株式会社 Led device, manufacturing method thereof, and light-emitting device
CN102027596B (en) * 2008-05-13 2012-12-05 西门子公司 LED arrangement

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003107423A1 (en) 2002-06-14 2003-12-24 Lednium Pty. Ltd. A lamp and method of producing a lamp
US20080102726A2 (en) * 2003-03-12 2008-05-01 Balu Jeganathan Lamp and a process for producing a lamp
TWI401788B (en) 2008-12-24 2013-07-11 Ind Tech Res Inst Led packaging module and method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974687A (en) * 1982-10-21 1984-04-27 Idec Izumi Corp Light emitting diode lamp
JPS6132483A (en) * 1984-07-24 1986-02-15 Kimura Denki Kk Spherical luminous body using led
DE3438154C2 (en) 1984-10-18 1994-09-15 Teves Gmbh Alfred Rear lights for motor vehicles
DE4107526C2 (en) * 1990-03-26 1996-04-11 Siemens Ag Luminescent diode device with protective device for limiting the forward current when AC voltage is present
FR2680859B1 (en) * 1991-09-02 1993-10-29 Valeo Vision OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT.
FR2707222B1 (en) * 1993-07-07 1995-09-29 Valeo Vision Improved signaling light with light-emitting diodes.
JP3033883B2 (en) * 1994-11-30 2000-04-17 ローム株式会社 Light emitting display
GB9605314D0 (en) * 1996-03-13 1996-05-15 Toher C H Non-filament lights
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
JP3618534B2 (en) * 1997-11-28 2005-02-09 同和鉱業株式会社 Optical communication lamp device and manufacturing method thereof
DE19922176C2 (en) * 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Surface-mounted LED multiple arrangement and its use in a lighting device
US6504301B1 (en) * 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
GB2390149B (en) * 1999-11-03 2004-05-26 Page Aerospace Ltd A semiconductor light source
DE19963806C2 (en) * 1999-12-30 2002-02-07 Osram Opto Semiconductors Gmbh Process for producing a light-emitting diode white light source, use of a plastic molding compound for producing a light-emitting diode white light source and surface-mountable light-emitting diode white light source
DE20110289U1 (en) * 2001-06-21 2001-08-23 Buechner Thomas Lighting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102027596B (en) * 2008-05-13 2012-12-05 西门子公司 LED arrangement
CN102754228A (en) * 2010-01-29 2012-10-24 日本航空电子工业株式会社 Led device, manufacturing method thereof, and light-emitting device
US9425372B2 (en) 2010-01-29 2016-08-23 Japan Aviation Electronics Industry, Limited LED device, method of manufacturing the same, and light-emitting apparatus
CN102754228B (en) * 2010-01-29 2017-10-13 日本航空电子工业株式会社 LED component, its manufacture method and light-emitting device
CN107275467A (en) * 2010-01-29 2017-10-20 日本航空电子工业株式会社 LED component and its manufacture method
CN107275467B (en) * 2010-01-29 2019-06-14 日本航空电子工业株式会社 LED component and its manufacturing method

Also Published As

Publication number Publication date
NZ530066A (en) 2006-10-27
WO2002103794A1 (en) 2002-12-27
AUPR570501A0 (en) 2001-07-12
TW567617B (en) 2003-12-21
KR20040019015A (en) 2004-03-04
CA2450156A1 (en) 2002-12-27
EP1396023A1 (en) 2004-03-10
EP1396023A4 (en) 2007-03-21
JP2004532532A (en) 2004-10-21
ZA200309547B (en) 2004-07-28

Similar Documents

Publication Publication Date Title
CN102171503B (en) Illumination apparatus and manufacture method thereof
CN1251001C (en) Method for producing surface illuminating back light apparatus and surface illuminating back light apparatus
CN1663044A (en) Lamp and method of producing a lamp
US20130015472A1 (en) Method for packaging light emitting diodes and light emitting module having led packages formed by the method
CN101051665A (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
US20180358525A1 (en) Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture
US11221109B2 (en) Filament structure and bulb having the filament structure
CN102620154A (en) Led lamp
CN1460294A (en) LED lamp
CN1574402A (en) Light emitting diode for light source of a vehicle headlamp
US20140111992A1 (en) Leadframe-based surface mount technology segmented display design and method of manufacture
CN101042226A (en) High power LED lighting lamp model set
JP2009004443A (en) Led light-emitting device, led display device, and manufacturing method of led light-emitting device
CN104798118A (en) Signal column
CN1526169A (en) Method of producing a lamp
US20090246897A1 (en) LED chip package structure and method for manufacturing the same
CN1873314A (en) Light-emitting diode arrangement
EP3805628A1 (en) Novel led filament
US7320632B2 (en) Method of producing a lamp
CN2612075Y (en) Package structure for LED
US20140254181A1 (en) Light emitting package and led bulb
CN101029711A (en) Large-power LED cup light
CN108826041A (en) A kind of manufacturing method of filamentray structure
US11940107B2 (en) Lighting device and a method of manufacturing a lighting device
AU2002302196B2 (en) A method of producing a lamp

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned