CN1521813A - 化学机械研磨垫 - Google Patents
化学机械研磨垫 Download PDFInfo
- Publication number
- CN1521813A CN1521813A CNA031153992A CN03115399A CN1521813A CN 1521813 A CN1521813 A CN 1521813A CN A031153992 A CNA031153992 A CN A031153992A CN 03115399 A CN03115399 A CN 03115399A CN 1521813 A CN1521813 A CN 1521813A
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- Prior art keywords
- island
- protrusions
- substrate
- grinding
- grinding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000126 substance Substances 0.000 title claims description 16
- 238000005498 polishing Methods 0.000 title 1
- 238000000227 grinding Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000012530 fluid Substances 0.000 claims abstract description 21
- 238000005299 abrasion Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000003701 mechanical milling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Images
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031153992A CN1270356C (zh) | 2003-02-14 | 2003-02-14 | 化学机械研磨垫 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031153992A CN1270356C (zh) | 2003-02-14 | 2003-02-14 | 化学机械研磨垫 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1521813A true CN1521813A (zh) | 2004-08-18 |
CN1270356C CN1270356C (zh) | 2006-08-16 |
Family
ID=34284275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031153992A Expired - Lifetime CN1270356C (zh) | 2003-02-14 | 2003-02-14 | 化学机械研磨垫 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1270356C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102922413A (zh) * | 2011-08-12 | 2013-02-13 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
CN103648718A (zh) * | 2011-07-15 | 2014-03-19 | 东丽株式会社 | 研磨垫 |
CN108127550A (zh) * | 2017-12-12 | 2018-06-08 | 湖北鼎汇微电子材料有限公司 | 一种聚氨酯研磨垫及其制造方法 |
CN108972319A (zh) * | 2018-09-18 | 2018-12-11 | 长鑫存储技术有限公司 | 化学机械研磨垫及其制备方法 |
-
2003
- 2003-02-14 CN CNB031153992A patent/CN1270356C/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103648718A (zh) * | 2011-07-15 | 2014-03-19 | 东丽株式会社 | 研磨垫 |
CN102922413A (zh) * | 2011-08-12 | 2013-02-13 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
CN108127550A (zh) * | 2017-12-12 | 2018-06-08 | 湖北鼎汇微电子材料有限公司 | 一种聚氨酯研磨垫及其制造方法 |
CN108127550B (zh) * | 2017-12-12 | 2019-07-19 | 湖北鼎汇微电子材料有限公司 | 一种聚氨酯研磨垫及其制造方法 |
CN108972319A (zh) * | 2018-09-18 | 2018-12-11 | 长鑫存储技术有限公司 | 化学机械研磨垫及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1270356C (zh) | 2006-08-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Semiconductor Manufacturing International (Beijing) Corp. Assignor: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Contract fulfillment period: 2009.4.29 to 2014.4.29 Contract record no.: 2009990000626 Denomination of invention: Chemical mechanical polishing pad Granted publication date: 20060816 License type: Exclusive license Record date: 20090605 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.4.29 TO 2014.4.29; CHANGE OF CONTRACT Name of requester: SEMICONDUCTOR MANUFACTURING INTERNATIONAL ( BEIJIN Effective date: 20090605 |
|
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111129 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111129 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corp. Patentee after: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20180531 Address after: No. 18 Zhangjiang Road, Pudong New Area, Shanghai Co-patentee after: NINGBO SEMICONDUCTOR INTERNATIONAL Corp. Patentee after: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Address before: 201203 Zhangjiang Road, Shanghai, No. 18 Co-patentee before: Semiconductor Manufacturing International (Beijing) Corp. Patentee before: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. |
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TR01 | Transfer of patent right | ||
CX01 | Expiry of patent term |
Granted publication date: 20060816 |
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CX01 | Expiry of patent term |