CN1517426A - Thermal interface material - Google Patents
Thermal interface material Download PDFInfo
- Publication number
- CN1517426A CN1517426A CNA031136249A CN03113624A CN1517426A CN 1517426 A CN1517426 A CN 1517426A CN A031136249 A CNA031136249 A CN A031136249A CN 03113624 A CN03113624 A CN 03113624A CN 1517426 A CN1517426 A CN 1517426A
- Authority
- CN
- China
- Prior art keywords
- heat
- interfacial material
- heat interfacial
- nano carbon
- carbon balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A thermal interface material used between heat source and radiator is based on the heat conductivity of carbon nanoballs is composed of basic polymer body and carbon nano balls dispersed in said basic polymer body. Its advantage is high thermal conductivity.
Description
[technical field]
The invention relates to a kind of heat interfacial material, refer to a kind of heat interfacial material that includes Nano carbon balls especially.
[background technology]
In recent years, fast development along with the semiconducter device integrated technique, the integrated degree of semiconducter device is more and more higher, and only, it is more and more littler that device volume but becomes, requirement to heat radiation is more and more higher, so heat radiation becomes a very important problem, for satisfying these needs, various radiating modes are extensively used, as utilize modes such as fan heat radiation, water-cooled auxiliary heat dissipation and heat pipe heat radiation, and obtain certain radiating effect.But unfairness because of the surface in contact of scatterer and semiconductor integrated device, an ideal contact interface is not arranged, generally be in contact with one another only less than 2% area, fundamentally influenced semiconducter device greatly and carried out heat passage effect to scatterer, so the exposure level that increase by one thermal conductivity higher heat interfacial material increases the interface between the contact interface of scatterer and semiconducter device just seems very necessary.
The traditional hot boundary material is that the particles dispersed that some thermal conductivitys are higher forms matrix material in polymeric matrix, as graphite, boron nitride, silicon oxide, aluminum oxide, silver or other metal etc., the heat conductivility of this kind material depends on the character of polymer support to a great extent.Be that the matrix material of carrier can be with the thermal source surface infiltration so thermal contact resistance be less as liquid state when using because of it wherein, and be that the matrix material thermal contact resistance of carrier is just bigger with silica gel and rubber with grease, phase change material.A common defects of such material is that whole material thermal conductivity is less, representative value is at 1W/mK, more and more can not adapt to the demand of the raising of semiconductor integrated degree to radiating effect, and the content of heat conduction particle makes the thermal conductivity that particle and particle are in contact with one another as far as possible can increase whole matrix material in the increase polymer support, therefore can reach 4-8W/mK as some special heat interfacial material, but when the content of heat conduction particle in the polymer support is increased to a certain degree, can make polymkeric substance lose performance originally, as grease meeting hardening, thereby effect of impregnation may variation, it is harder that rubber also can become, lose due snappiness, this all can make the heat interfacial material performance reduce greatly.In addition, the size of heat conduction particle is bigger, influences the reduction of this heat interfacial material thickness.
Therefore, provide the heat interfacial material of the good thermal conduction effect of a kind of tool, thin thickness real for necessary.
[summary of the invention]
The problem to be solved in the present invention provides that a kind of heat-conducting effect is good, the heat interfacial material of thin thickness.
For addressing the above problem, a kind of heat interfacial material that the present invention discloses, this heat interfacial material are by polymeric matrix and be distributed in that heat conductor constitutes in the polymeric matrix, and this heat conductor is a Nano carbon balls.
Compared with prior art, the Nano carbon balls particle diameter that the present invention is based in the heat interfacial material of Nano carbon balls heat conduction is little, specific surface area is big, has high coefficient of thermal conductivity, formed heat interfacial material has the following advantages: one, and the heat interfacial material that utilizes nano carbon microsphere to make, Yin Naimi carbon ball particle diameter is little, distribution uniform in polymer materials, can make thickness as thin as a wafer, heat interfacial material that heat-conducting effect is good; Its two, because of the heat conduction particle of being filled in the polymeric matrix is a Nano carbon balls, take place so the increase of the Nano carbon balls content of being filled in the polymeric matrix can not be directed at the situation that polymkeric substance sclerosis etc. reduces the heat interfacial material heat-conducting effect.
[description of drawings]
First figure is a thermal interface material applications synoptic diagram of the present invention.
[embodiment]
The Nano carbon balls that the present invention selects for use forms the polyhedron carbon formed bunch by multilayer graphite with ball in the ball, and it can be hollow carbon nanometer ball or filler metal carbon ball.Shape can be sphere, elliposoidal or capsule structure, and the diameter of Nano carbon balls is 5～50 nanometers, and mean diameter is 30 nanometers.
Heat interfacial material provided by the present invention is that Nano carbon balls is distributed in the polymeric matrix, the process of this Nano carbon balls distribution polymer can liquefy polymkeric substance earlier, directly add a certain amount of Nano carbon balls uniform mixing then, with polymer cure, mold pressing, form the heat interfacial material of thinner thickness again.The Nano carbon balls particle can be stable in wherein after this polymer cure.
The Nano carbon balls weight ratio of present embodiment heat interfacial material is 60%, its mean diameter of used Nano carbon balls is between 30～40 nanometers, structure is mainly sphere, heat-conduction coefficient is approximately the twice of copper, reach 770～780W/mK, the concrete heat-conduction coefficient of Nano carbon balls is relevant with its size, structure (which floor structure ball has in the ball) and shape.Above-mentioned only is one of embodiment of the present invention, and mode is that Nano carbon balls is evenly distributed in this polymeric matrix preferably, and has contact with each other between the Nano carbon balls, forms a passage of heat, and the heat of thermal source is passed to heat sink radiates through this passage of heat.
The used polymkeric substance of heat interfacial material of the present invention is that polyalcohol polyether and isocyanate ester compound reaction form, wherein the molecular weight ranges of polyalcohol polyether is 500～5000, functionality is 3～9, the molecular weight ranges of isocyanic ester is 200～800, functionality is 2～6, its building block structure can be an aliphatics, also can be aromatic series, by regulating polyalcohol polyether and the molecular weight of isocyanic ester and the ratio of functionality, can change the strength and toughness of polymkeric substance 32, the used polymkeric substance of the present invention also can be other material, and need possess following characteristic and get final product: (1) has resiliency compressible; (2) has high coefficient of thermal conductivity; (3) macromolecular chain of this polymkeric substance can press on the Nano carbon balls.
Another embodiment system of heat interfacial material of the present invention Nano carbon balls of polymeric matrix fixing high coefficient of thermal conductivity metallic cover, this coating can be by gasified metal oxide compound and Nano carbon balls reaction, generate metal Nano carbon balls and carbon dioxide, can increase the volume of Nano carbon balls through the Nano carbon balls of metallic cover, thereby increase the contact area of thermally conductive material, so that this metal Nano carbon balls tool high coefficient of thermal conductivity, improve heat passage effect, the material of this carbon coated nanometer ball can be the oxide compound of indium and copper.In addition, also can in polymeric matrix, adopt the metallic particles of high heat conduction to fill Nano carbon balls, so that be easier to contact between the Nano carbon balls, improve heat-conducting effect, this is filled high heat conductive metal and can choose from following material, and as metallic copper, argent etc., wherein copper can be selected blue or green phosphor-copper for use.The component of used blue or green phosphor-copper is: copper (Cu) 96.5%, tin (Sn) 3.5～4.5%, phosphorus (P) 0.03～0.35%, plumbous (Pb)＜0.5%, iron (Fe)＜0.1%, zinc (Zn)＜0.5%.
Please one consult first figure, the electronic installation of the application of heat interfacial material of the present invention and description taken in conjunction accompanying drawing thereof is described in the lump, this device comprises semiconductor chip 30, this semi-conductor chip 30 is the high-density thermal source, be fixed on the mainboard 10 by solder sphere 25 through connector 20, heat interfacial material 40 places between semi-conductor chip 30 and the scatterer 50.The first surface 41 of heat interfacial material 40 and second surface 42 contact with the upper surface 31 and the scatterer lower surface 52 of semi-conductor chip 30 respectively, provide the upper surface of semi-conductor chip 30 better to contact with the lower surface 52 1 of scatterer 50, the heat that semi-conductor chip 30 produces is effective, be passed to scatterer 50 rapidly and distribute.An embodiment of only using for the present invention shown in right first figure, thermal interface material applications of the present invention is not subject to this.
Because of the hard physical construction characteristic of Nano carbon balls tool, and it is distributed in the polymeric matrix of tool resiliency compressible, in application process, effect through certain pressure, polymeric matrix produces a certain amount of deformation through this compression, Nano carbon balls is directly contacted with the surface of thermal source and scatterer, or how the contact between the rice ball is tightr to make carbon in the polymkeric substance, thereby effectively thermo-contact between thermal source and the scatterer can be provided.
The preferable elasticity of heat interfacial material tool provided by the invention; under the more coarse or uneven situation of the surface in contact of thermal source and scatterer; preferable contacting between thermal source and the scatterer still is provided; and heat interfacial material of the present invention therefore preferable elasticity can be used as an isolated body; when being impacted or vibrate, whole electronic installation shields; prevent that therefore device from impacting or vibrating impaired; in addition; heat interfacial material of the present invention is light than the heat interfacial material that other metallic substance makes, and helps reducing the weight of entire device.
Claims (9)
1. heat interfacial material, this heat interfacial material are by polymeric matrix and be distributed in that heat conductor constitutes in this polymeric matrix, it is characterized in that this heat conductor is a Nano carbon balls.
2. heat interfacial material as claimed in claim 1, wherein this polymeric matrix is formed by polyalcohol polyether and isocyanate ester compound reaction.
3. heat interfacial material as claimed in claim 2, wherein this polyalcohol polyether molecular weight is 500～5000, functionality is 3～9.
4. heat interfacial material as claimed in claim 2, wherein this isocyanate ester compound molecular weight is 200～800, functionality is 2～6.
5. heat interfacial material as claimed in claim 1, wherein this Nano carbon balls diameter is 5～50 nanometers.
6. as claim 1 or 5 described heat interfacial materials, wherein this Nano carbon balls also is coated with thermally conductive material.
7. heat interfacial material as claimed in claim 6, wherein the thermally conductive material of this carbon coated nanometer ball comprises the oxide compound of indium or copper.
8. heat interfacial material as claimed in claim 1, wherein this heat interfacial material also is filled with thermal conductive metallic material.
9. heat interfacial material as claimed in claim 8, wherein this thermal conductive metallic material comprises silver, copper, blue or green phosphor-copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03113624 CN1266246C (en) | 2003-01-18 | 2003-01-18 | Thermal interface material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03113624 CN1266246C (en) | 2003-01-18 | 2003-01-18 | Thermal interface material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1517426A true CN1517426A (en) | 2004-08-04 |
| CN1266246C CN1266246C (en) | 2006-07-26 |
Family
ID=34283755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03113624 Expired - Fee Related CN1266246C (en) | 2003-01-18 | 2003-01-18 | Thermal interface material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1266246C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7535715B2 (en) | 2003-07-09 | 2009-05-19 | Deborah D. L. Chung | Conformable interface materials for improving thermal contacts |
| CN100517889C (en) * | 2005-12-02 | 2009-07-22 | 鸿富锦精密工业（深圳）有限公司 | Radiating device and laser diode device |
| CN103311195A (en) * | 2012-03-15 | 2013-09-18 | 南亚科技股份有限公司 | Heat radiation structure |
| CN114414472A (en) * | 2022-03-29 | 2022-04-29 | 合烯电子科技(江苏)有限公司 | Detection apparatus for thermal interface material |
| WO2022230970A1 (en) * | 2021-04-28 | 2022-11-03 | パナソニックＩｐマネジメント株式会社 | Thermally conductive composition and thermally conductive material |
-
2003
- 2003-01-18 CN CN 03113624 patent/CN1266246C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7535715B2 (en) | 2003-07-09 | 2009-05-19 | Deborah D. L. Chung | Conformable interface materials for improving thermal contacts |
| CN100517889C (en) * | 2005-12-02 | 2009-07-22 | 鸿富锦精密工业（深圳）有限公司 | Radiating device and laser diode device |
| CN103311195A (en) * | 2012-03-15 | 2013-09-18 | 南亚科技股份有限公司 | Heat radiation structure |
| WO2022230970A1 (en) * | 2021-04-28 | 2022-11-03 | パナソニックＩｐマネジメント株式会社 | Thermally conductive composition and thermally conductive material |
| CN114414472A (en) * | 2022-03-29 | 2022-04-29 | 合烯电子科技(江苏)有限公司 | Detection apparatus for thermal interface material |
| CN114414472B (en) * | 2022-03-29 | 2022-07-08 | 合烯电子科技(江苏)有限公司 | Detection apparatus for thermal interface material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1266246C (en) | 2006-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100338690C (en) | Interface materials and methods of production and use thereof | |
| CN101989583B (en) | Radiating structure and radiating system employing same | |
| EP1291913B1 (en) | Morphing fillers and thermal interface materials | |
| USRE39992E1 (en) | Morphing fillers and thermal interface materials | |
| CN1927988A (en) | Heat interfacial material and method for making the same | |
| JP3290127B2 (en) | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition | |
| TW200411038A (en) | Thermal interface material | |
| CN101760035B (en) | The using method of thermal interfacial material and this thermal interfacial material | |
| CN1290963C (en) | Phase change thermal interface composition having induced bonding property | |
| CN1927989A (en) | Compliant and crosslinkable thermal interface materials | |
| CN1610725A (en) | Chain extension for thermal materials | |
| CN101405859A (en) | Thermal interconnect and interface systems, methods of production and uses thereof | |
| CN1185859A (en) | Semiconductor device having a semiconductor chip electrically connected to a wiring substrate | |
| CN1638952A (en) | Thermal interface materials | |
| CN101035876A (en) | Thermally conductive composition and method for preparing the same | |
| CN1768420A (en) | Semiconductor substrate having copper/diamond composite material and method of making same | |
| CN1799107A (en) | Thermal interconnect and interface systems, methods of production and uses thereof | |
| US6940722B2 (en) | Heat-dissipating member, manufacturing method and installation method | |
| WO2023024570A1 (en) | Diamond-based thermally conductive filler and preparation method, composite thermally conductive material and electronic device | |
| CN113789159B (en) | Liquid metal silicon-free thermal interface material and preparation method thereof | |
| CN1580116A (en) | Radiating interface material composition | |
| CN1267268C (en) | Interface materials and methods of production and use thereof | |
| CN1266246C (en) | Thermal interface material | |
| CN1982404A (en) | Thermal-interface material and its production | |
| CN1868736A (en) | Interface materials and methods of production and use thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060726 Termination date: 20180118 |