CN1501089A - Method and apparatus for testing electronic components - Google Patents
Method and apparatus for testing electronic components Download PDFInfo
- Publication number
- CN1501089A CN1501089A CNA200310114262A CN200310114262A CN1501089A CN 1501089 A CN1501089 A CN 1501089A CN A200310114262 A CNA200310114262 A CN A200310114262A CN 200310114262 A CN200310114262 A CN 200310114262A CN 1501089 A CN1501089 A CN 1501089A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- support member
- described electronic
- testing
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention provides a device for automatically testing electronic components, comprising a testing desk (7) for testing electronic components (8), and at least a support member (2) for fixing the electronic components (8). The support member fixes the electronic components by a lower side face and two opposite side surface of the electronic components, such that the upper side face and the two side faces can close to each other when fixing the electronic components (8) on the support member. All these side faces can close to each other to improve possibility of contacting with contact (80) on these side faces of the electronic components (8) being tested, and testing at the same time is allowed, such as Kelvin electrical testing and optical testing of small size LBD.
Description
Technical field
The present invention relates to a kind of apparatus and method of testing electronic element, particularly, relate to a kind of apparatus and method of testing the electronic component on the automatic assembly line.
Background technology
Electronic component is in manufacture process, before testing or being assembled into integrated circuit, usually to carry out many operations, as be fully automatically to carry out electrical testing and adjust operation etc. on the production line, but production line mainly is made up of to the travelling belt of different continuous processing stations transmitting element.
Travelling belt moves and the transmission electronic element by the element clamper that generally comprises suction inlet, and suction inlet utilizes the upper side mobile electron element of element and fixes element by vacuumizing.So can pass through machine table near the component lead that be usually located at element side or downside, mainly be the test board that carries out electrical testing, contact element contact.
Because the miniaturization that brings of semiconductor element art progress, the size of emerging electronic component constantly reduces, and therefore makes contact element and the element electric contact of automatic testing stand, and as lead-in wire, contact is difficult more.When on the same side of very little element a plurality of contact being arranged, in the time of perhaps must carrying out the measurement of Kelvin (kelvin) method to element, this measurement requirement contacts each contact point by two contact elements of test board, and the difficulty that runs into is especially big.
Small-sized electronic component is often less than the suction inlet of fixed electronic element, from top be impossible near electronic component, because from the side near will preventing that contact element from not running into suction inlet, thus very high precision required, so from the side near also being very difficult.Especially, the lead-in wire or other contact points that are positioned at the element side generally can only touch from below, depend on the size of contact point, and it is difficult contacting simultaneously at two diverse locations, or even impossible.
The system of the fixed electronic element of prior art, when some special element of test, as top view type light emitting diode (LED), promptly its luminous component is positioned at upper side, also existing problems.In fact, testing such element requirement can be near upper side, as measuring luminous intensity signal.If diode fixedly is to fix its upper side by suction inlet, can not measure.One type of prior art syringe attempts addressing this problem, and it is by in the very small container that diode is set to opening and makes progress, and the side of container is outstanding so element can be remained on the appropriate location.The contact point that is placed on the diode in such container is to be difficult to touch too.Can only carry out from above near element, for above-mentioned reasons, make that these elements are carried out the measurement of Kelvin's method to be difficult to carry out, or even can not carry out.
Summary of the invention
Therefore, an object of the present invention is to provide the device of testing electronic element, its can be easily near the contact point of testing element.
Another object of the present invention is to propose a kind of proving installation and method, allows synchronously testing element to be carried out optics and electrical testing.
The realization of these purposes can realize by the apparatus and method with feature that corresponding independent claims are introduced, and has further provided preferred embodiment in appended claims.
Particularly, the realization of these purposes can be by a kind of device of automatic testing electronic element, and this device comprises the test board of testing electronic element, the support member of at least one fixed electronic element.The downside of support member clamping electronic component and two opposite flanks, when electronic component is fixed to support member, can be comprehensively near upper side and at least two sides of electronic component.These sides are come-at-able fully, have improved the possibility that contacts the contact point of the electronic component on these sides that are positioned at the electronic component of testing, and allow synchronously to carry out the Kelvin's method electrical testing and the optic test of very little light emitting diode.
Description of drawings
The introduction of the preferred embodiment that is undertaken by 1-4 with reference to the accompanying drawings can have a better understanding to the present invention, wherein:
Fig. 1 is the top view of apparatus of the present invention that has schematically shown the endless belt conveyer of binding member production line;
Fig. 2 has shown the shape of the supporting device that is in the close position of apparatus of the present invention, and support member has opening mechanism;
Fig. 3 is the top view of the support member of Fig. 2 when being shown in an open position;
Fig. 4 has shown the contact principle of testing electronic element.
Embodiment
In a preferred embodiment, device of the present invention can combine with main electronic element production line, and electronic element production line can comprise endless belt conveyer 9, be distributed with a plurality of machine table 900 around travelling belt, wherein two schematically show in Fig. 1, for example test, sorting or debugger.But therefore the mobile preferably calibration location of travelling belt 9 in the position of its periphery formation quantification, is provided with machine table 900 on each position.Element clamper 90 is preferably suction inlet, is distributed in the periphery of travelling belt 9 regularly.Thereby make electronic component to be delivered to another from a machine table 900.
The inventive system comprises endless conveyor belt 1, center on the machine table that travelling belt 1 is provided with some, particularly, a test board 7 is set at least.The mobile preferably calibration of travelling belt is located, and therefore can form the position of quantification at its periphery, has installed machine table at everybody.Support member 2 is distributed on travelling belt 1 periphery regularly, therefore can make electronic component from a location transmission to another position.As shown in Figure 1, preferably the rotation direction with the travelling belt 9 of main line is consistent for the rotation direction of the travelling belt 1 of device.
Travelling belt 1 and 9 has suitable size and position, and the position 91,92nd that forms on periphery separately overlaps.In first common location 91, the travelling belt 9 electrons transmitted elements of main line are placed on along counter-clockwise direction by suction inlet 90 and transmit on the support member 2 of electronic component, and electronic component is placed on the machine table that is provided with around device continuously, only shown test board 7 among the figure.When electronic component arrived two travelling belts 9 and the 1 shared second place 92, suction inlet 90 was removed it from support member 2, reappose on the main line.
As shown in Figure 1, device of the present invention has the form identical with other machine table 900, can combine with the production line 1 of prior art, and it comprises the element clamper 90 of standard.Therefore, must carry out the electronic component of some operation and can process easily, such processing be there is no need to carry out any adjusting by the production line 1 and the machine table 900 of prior art.During processing, electronic component is transferred to device of the present invention very soon and carries out at least a electrical testing, if electronic component still is fixed on the main line travelling belt 1, to the test of electronic component be very difficulty or even impossible; Test can be because support member 2 of the present invention has the feature that the back will be introduced.
The mechanism of support member 2 is by referring to figs. 2 and 3 being understood better.Fig. 2 has shown the shape of the support member 2 that is in the close position.Fig. 3 has shown the top view that same support member is shown in an open position.
Each support member 2 comprises the fixing base 20 that is fixed to travelling belt 1 by plate 21, and the electronic component 8 that transmits is arranged on the travelling belt.Electronic component 8 is clamped between the locating surface 33 of retainer 22 on the fixing base 20 and moving member 3, and moving member can slide along fixing base 20.Moving member 3 is fixed to the movable plate 30 that is parallel to plate 21.Movable plate 30 can pass through elastic component, as spring 32, moves away plate 21.Under the effect of spring force, the direction that moving member 3 is subjected to promoting along fixing base 20 far-ends moves, and moving member 3 arrives the appropriate location with the effect of clamp mode with element 8 resilient clamp.
Moving of movable plate 30 preferably guides by pin 31, and pin 31 passes plate 21 and inserts the guiding piece (not shown) that forms on the travelling belt 1.
When element 8 is placed into support member 2 or when support member is removed, movable plate 30 is to the direction of plate 21 and overcome spring 32 power and slide, and therefore opens the clamping that is formed by retainer 22 and locating surface 33.Preferably form moving of cam 5 and moving synchronously of travelling belt 1 and suction inlet 90 at interval by cam 5.According to a preferred embodiment of the invention, cam 5 preferably is made of the arm 50 that an end is rotatably fixed to axle 52, and axle 52 is fixed to support member 55, and support member 55 is fixed to the travelling belt 1 of device.The other end of arm 50 preferably is provided with roller 51, when arm can overcome the acting force of spring 32 when movable plate 30 positions, does not have frictionally to lean against on the movable plate 30.This device is provided with similar cam 5 on each position that forms around travelling belt 1, electronic component can be placed in these positions on the device or from device and remove.Especially two common location 91 and 92 in two travelling belts 1 and 9 are provided with cam 5.
Therefore electronic component 8 is clamped on the support member 2 by its three sides, i.e. downside face and two relative sides, and these two sides preferably do not have the contact.Therefore the position at the relative travelling belt of surface level 1 center of electronic component 8 is determined by the fixed position and the locating surface 33 of retainer 22.Retainer and locating surface are fixed to electronic component therebetween in the clamp mode by two opposite flanks.The position of electronic component 8 on vertical axial is by the height decision of the fixing base 20 of clamping downside.
On the one hand because the level altitude of fixed head 20, on the other hand because the fixed position of retainer 22 and element is fixed to the effect of the spring 32 on the retainer 22, the position of electronic component 8 can be accurately with can repeatedly determine.The size and dimension of fixing base 20, the size and dimension of size and dimension of especially its width, and moving member 3 and element 8 adapts, and can not enter in the boundary of two free side of element.Be provided with contact point 80 on these two sides, test board 7 will contact these contact points when carrying out electrical testing.Therefore, these two sides and position contact point 80 thereon can touch fully, can be approaching from each some straight line of relative half space.Because the space around element 8 that fixing base 20 and moving member 3 requires reduces to minimum, according to contact point as going between 80 structure, even some point of the back, plane that can form from the side that has contact point of element 8 with linear fashion near lead-in wire.By same mode, preferably less than the height of electronic component, the upper side of element 8 also can be approaching fully like this for the height of the height of retainer 22 and locating surface 33.
When electronic component was set to support member 2 by suction inlet 90, as taking place in first common location 91, cam 5 rotated the clamp that fixing base 20 and moving member 3 are formed and removes, and therefore opens support member 2.At this moment suction inlet descends general who has surrendered's electronic component 8 to be placed into fixing base 20, cam 5 is rotated away along other direction then, under the effect of spring 32, and support member 2 closures.Electronic component carries out clamping by support member 2 in the clamp mode, and the absorption of 90 pairs of electronic components of suction inlet stops, and suction inlet 90 rises.Suction inlet 90 can spray very short air-flow and throws off to guarantee electronic component before suction inlet rises.Each travelling belt 1 and 9 takes a step forward.The operation that next electronic component is repeated to introduce above then, the next suction inlet 90 of travelling belt 9 is placed into same position with electronic component, will place electronic component to the next support member 2 of travelling belt 1.All these operations are preferably controlled and are synchronized them by the automatic control system (not shown).
By same way as, when electronic component 8 when support member 2 is removed, as in second common location 92, be positioned at the suction inlet 90 that will remove on the element 8 and at first descend, the upper side of contact element, simultaneously air-breathing.Support member 2 is opened by cam 5 then, and element is held fixing by suction inlet 90.Suction inlet 90 rises then, and cam 5 turns to the original position, support member 2 closures.Each travelling belt 1 and 9 takes a step forward then.All these operations are preferably controlled and are synchronized them by automatic control system.
Occur in diverse location 91 and 92 owing to be provided with and remove electronic component,, different elements 8 is carried out these operations synchronously in each step of travelling belt 1 and 9.As for the test that the electronic component 8 on the support member 2 of travelling belt transmission carries out, on certain locational at least one test board that limits between two common location 91 and 92, carry out.
An example of the application of device of the present invention is that the type light emitting diode is watched at the test top, and promptly its luminous component is positioned at upper side.The test request of these elements is measured its electricity and optical characteristics.Therefore contact lead-wire must be able to electrically contact, and will measure the light that upper side sends simultaneously.The electrical characteristics value that these elements are measured is very little, therefore it is important to limit as far as possible measuring error, all the more so when carrying out the measurement of Kelvin's method, wherein each contact point is by two different contact elements contacts, and contact element is electrically connected to surveying instrument with independent mode.
Because the support member 2 of apparatus of the present invention can make electronic component 8 obtain clamping, so can be from each side near having contact point, as contact lead-wire 80, the side, as contact element 72 that can tested 7 simultaneously from top and below touch, therefore allow each lead-in wire 80 that two measurement points are arranged.
According to a preferred embodiment of the invention, the contact element of test board 7 is the flexible sheets 72 of can the clamp mode actuating in pairs, can clamp electronic component 8, as light emitting diode, lead-in wire 80.In a single day the test of element 8 is finished, and sheet 72 moves away enough big distance, allows the electronic component 8 on the support member to pass through betwixt, and Zhuan Zhi travelling belt 1 takes a step forward simultaneously.
Under the situation of test light emitting diode, test board 7 also comprises the optical gauge 71 that is arranged on the element 8, can measure at the light that test period sends element 8.Test board 7 is adjusted the electronic component 8 with the test any kind of easily, and optical gauge 71 can must be replaced near the measurement or the proving installation of element 8 upper sides by other, as element quality being carried out the camera of vision control.
The those skilled in the art is readily appreciated that device of the present invention also can be used for testing any Small electronic component, its lead-in wire or contact point generally are inaccessible, even when element by suction inlet fixedly the time, suction inlet is usually greater than element, overslaugh touches element from above.
In a preferred embodiment, the inventive system comprises endless belt conveyer.Device of the present invention can transmit by linear certainly and bring enforcement, for example, also can implement by another kind of electronic component automatic assembly line.
Similarly, device of the present invention can be attached to the main line that comprises endless belt conveyer, as above introduced, but also can combine with the production line of other types, or be attached to the transmission parts of removing element from container or production line, it is such as can element being sent to the exact position of the travelling belt of device by the suction inlet that moves forward and backward.
Claims (16)
1. the device of an automatic testing electronic element comprises the test board (7) of testing electronic element (8) and the support member (2) of at least one fixing described electronic component (8); Described at least one support member (2) is by downside and two fixing described electronic components (8) in opposite flank of described electronic component (8), when described electronic component (8) is fixed on described at least one support member (2), can touch the upper side of described electronic component (8) and the contact point (80) of at least two opposite flanks fully.
2. device according to claim 1 is characterized in that, described device also comprises travelling belt (1), and described at least one support member (2) is fixed on the described travelling belt.
3. device according to claim 1 is characterized in that, described at least one support member (2) is by the fixing described electronic component (8) of the mode of clamp (22,23).
4. device according to claim 3 is characterized in that, described at least one support member (2) utilizes the fixing described electronic component (8) of the power of at least one elastic component (32).
5. device according to claim 4, it is characterized in that, described at least one support member (2) comprises fixing base (20) and is connected to the retainer (22) of described fixing base (20), described fixing base (20) and described retainer (22) but shape and size be designed to one of the downside of the described electronic component of clamping (8) and two opposite flanks, described support member (2) also comprises the moving member (3) that can go up slide at described fixing base (20), but in described two opposite flanks of clamping another.
6. device according to claim 1 is characterized in that, described device comprises main line and supplement production line.
7. device according to claim 6 is characterized in that, described electronic component (8) is fixed to described main line in the mode that is different from described supplement production line.
8. device according to claim 7 is characterized in that, described main line is set to described at least one support member (2) by suction inlet with described electronic component (8) and/or takes off from described support member (2).
9. device according to claim 4 is characterized in that described device comprises at least one cam, is used to control opening and/or closure of described at least one support member (2).
10. device according to claim 1 is characterized in that, described test board (7) comprises at least two contact elements (72), and each described contact element (72) can be near the contact point (80) on described electronic component (8) same side.
11. device according to claim 10 is characterized in that, each described contact element (72) can be from both direction near the contact point (80) on the same side of described electronic component (8).
12. device according to claim 1 is characterized in that, described test board (7) comprises at least 4 contact elements (72), can be near the contact point (80) on (8) two opposite flanks of described electronic component.
13. device according to claim 12 is characterized in that, described test board (7) comprises the optic test element (71) of aiming at described electronic component (8) upper side.
14. the method for a testing electronic element comprises the following steps:
Electronic component (8) is fixed on the support member (2), can be fully near upper side and two opposite flanks of described electronic component (8);
By at least two contact elements (72) of described test board (7), contact in described two sides of described electronic component (8) at least one contact point (80) at least one;
The optical characteristics of testing described electronic component (8) by the optical element (71) of described test board (7).
15. method according to claim 14 is characterized in that, described method also comprises the electrical characteristics of the described electronic component of test (8).
16. method according to claim 14 is characterized in that, described method also comprises by travelling belt (1) described electronic component (8) is set to step on described at least one support member (2).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1868/2002 | 2002-11-07 | ||
| CH1868/02 | 2002-11-07 | ||
| CH01868/02A CH695871A5 (en) | 2002-11-07 | 2002-11-07 | Apparatus and method for testing electronic components. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1501089A true CN1501089A (en) | 2004-06-02 |
| CN100459086C CN100459086C (en) | 2009-02-04 |
Family
ID=34230853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101142622A Expired - Fee Related CN100459086C (en) | 2002-11-07 | 2003-11-06 | Method and apparatus for testing electronic components |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN100459086C (en) |
| CH (1) | CH695871A5 (en) |
| MY (1) | MY149802A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100445709C (en) * | 2005-03-07 | 2008-12-24 | 大赢数控设备(深圳)有限公司 | Automatic device of LED testing table |
| CN100445708C (en) * | 2005-02-17 | 2008-12-24 | 大赢数控设备(深圳)有限公司 | Automation device for LED test table |
| CN101952734A (en) * | 2008-01-16 | 2011-01-19 | 伊斯梅卡半导体控股公司 | Arrangement and method for handling electronic components |
| CN104160288A (en) * | 2012-02-10 | 2014-11-19 | 伊斯梅卡半导体控股公司 | Nest for testing electrical components |
| CN111474903A (en) * | 2020-03-31 | 2020-07-31 | 深圳精匠云创科技有限公司 | Production data collection method, production apparatus, and computer-readable storage medium |
| CN113366936A (en) * | 2019-01-25 | 2021-09-07 | 迈康尼股份公司 | Electrical verification of electronic components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10973161B2 (en) * | 2017-01-13 | 2021-04-06 | Raytheon Company | Electronic component removal device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4721907A (en) * | 1985-01-23 | 1988-01-26 | Universal Instruments Corporation | Apparatus for automated testing of surface mounted components |
| US4763405A (en) * | 1986-08-21 | 1988-08-16 | Matsushita Electric Industrial Co., Ltd. | Chip-placement machine with test function |
| JP3012853B2 (en) * | 1990-09-14 | 2000-02-28 | 株式会社富士通宮城エレクトロニクス | Semiconductor test equipment handler |
| JP2855177B2 (en) * | 1992-03-11 | 1999-02-10 | コマツ電子金属株式会社 | Control device for wafer removal device |
| JPH08334546A (en) * | 1995-06-06 | 1996-12-17 | Hitachi Ltd | Testing apparatus for semiconductor device |
| US6019564A (en) * | 1995-10-27 | 2000-02-01 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
| KR100486412B1 (en) * | 2000-10-18 | 2005-05-03 | (주)테크윙 | Insert of test tray for test handler |
| CN1168129C (en) * | 2000-11-23 | 2004-09-22 | 崇越科技股份有限公司 | Carrier for testing chip |
| CN2512112Y (en) * | 2001-11-08 | 2002-09-18 | 致茂电子股份有限公司 | Test device for electronic components |
| CN2518217Y (en) * | 2001-11-14 | 2002-10-23 | 廖木山 | Testing & positioning appts. for electronic component |
-
2002
- 2002-11-07 CH CH01868/02A patent/CH695871A5/en not_active IP Right Cessation
-
2003
- 2003-10-16 MY MYPI20033937 patent/MY149802A/en unknown
- 2003-11-06 CN CNB2003101142622A patent/CN100459086C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100445708C (en) * | 2005-02-17 | 2008-12-24 | 大赢数控设备(深圳)有限公司 | Automation device for LED test table |
| CN100445709C (en) * | 2005-03-07 | 2008-12-24 | 大赢数控设备(深圳)有限公司 | Automatic device of LED testing table |
| CN101952734A (en) * | 2008-01-16 | 2011-01-19 | 伊斯梅卡半导体控股公司 | Arrangement and method for handling electronic components |
| CN105899065A (en) * | 2008-01-16 | 2016-08-24 | 伊斯梅卡半导体控股公司 | Arrangement And Method For Handling Electronic Components |
| CN105899065B (en) * | 2008-01-16 | 2020-05-12 | 伊斯梅卡半导体控股公司 | Device and method for handling electronic components |
| CN104160288A (en) * | 2012-02-10 | 2014-11-19 | 伊斯梅卡半导体控股公司 | Nest for testing electrical components |
| CN113366936A (en) * | 2019-01-25 | 2021-09-07 | 迈康尼股份公司 | Electrical verification of electronic components |
| CN111474903A (en) * | 2020-03-31 | 2020-07-31 | 深圳精匠云创科技有限公司 | Production data collection method, production apparatus, and computer-readable storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| MY149802A (en) | 2013-10-14 |
| CN100459086C (en) | 2009-02-04 |
| CH695871A5 (en) | 2006-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100673138B1 (en) | Testing system for solar cells | |
| KR100538796B1 (en) | Apparatus for testing lcd | |
| US8523161B2 (en) | Clamping mechanism automatically adaptable to change of thickness of printed circuit board | |
| CN2746401Y (en) | Electrical parameter test equipment | |
| CN104678222A (en) | Automatic test instrument for FPC(Flexible Printed Circuit) | |
| CN210401582U (en) | Printed circuit board on-line measuring equipment | |
| CN1501089A (en) | Method and apparatus for testing electronic components | |
| CN113049596A (en) | Appearance inspection apparatus | |
| CN113552468A (en) | Quality detection and use method of PCB | |
| US20020071601A1 (en) | Apparatus for detecting lead coplanarity, apparatus for detecting condition of electronic component, and system for mounting electronic component | |
| KR20140101066A (en) | Apparatus for Auto Testing Trace of Pannel | |
| CN1580787A (en) | Probe device for flatboard display detection | |
| CN107731142B (en) | Component for lighting test | |
| JPH1114957A (en) | Inspection device for liquid crystal panel | |
| JP4999502B2 (en) | Component transfer device and surface mounter | |
| US6972586B2 (en) | Panel inspection apparatus | |
| JP2916447B2 (en) | IC package lead pin inspection method and apparatus | |
| CN208906166U (en) | A kind of optical detection apparatus | |
| KR100278130B1 (en) | Inspection stage for liquid crystal panel | |
| CN109030511A (en) | A kind of panel compression bonding apparatus | |
| KR100486768B1 (en) | Measuring apparatus and measuring method for ic-chip shield | |
| CN212748754U (en) | Optical detection device | |
| CN219542956U (en) | Fixing clamp for light guide panel with large thickness | |
| CN217542889U (en) | LED lamp panel detection equipment | |
| CN219737328U (en) | Variable-focus image acquisition device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090204 Termination date: 20151106 |
|
| EXPY | Termination of patent right or utility model |