CN1500897A - Novel copper formed by combining copper and carbon fiber modified by plasma - Google Patents

Novel copper formed by combining copper and carbon fiber modified by plasma Download PDF

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Publication number
CN1500897A
CN1500897A CNA02151951XA CN02151951A CN1500897A CN 1500897 A CN1500897 A CN 1500897A CN A02151951X A CNA02151951X A CN A02151951XA CN 02151951 A CN02151951 A CN 02151951A CN 1500897 A CN1500897 A CN 1500897A
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China
Prior art keywords
carbon fiber
copper
plasma
environment
ordinary copper
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Pending
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CNA02151951XA
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Chinese (zh)
Inventor
黄金富
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Individual
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Individual
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Priority to CNA02151951XA priority Critical patent/CN1500897A/en
Publication of CN1500897A publication Critical patent/CN1500897A/en
Pending legal-status Critical Current

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  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

One new kind of copper material is formed with common copper material through combining with carbon fiber denatured in plasma environment. The plasma environment for processing carbon fiber is formed via ionizing gas and may be combined with applied electric field and/or magnetic field. Plasma is made to shift or rotate and carbon fiber is denatured via preset process. The carbon fiber denatured in plasma environment is then made to combine with common copper material to make the copper material with excellent quality.

Description

Copper combines the new copper of formation with the carbon fiber behind the plasma modification
Invention field
The present invention relates to copper, particularly combine the new copper that the back forms with ordinary copper with the carbon fiber after plasma environmental modified.
Background of invention
Copper is used in a plurality of fields widely, the copper of improved seeds is that industry and life are required, because the diversity and the complicacy of various demands and requirement, the new copper of making new better kind is the ten minutes needs, and adopt present ordinary method to be not easy to obtain the new copper of particular requirement, targeted is poor, and spended time is long.
Summary of the invention
Purpose of the present invention is to provide a kind of new-type copper, makes this kind new copper can have some fine quality, as snappiness preferably, good sound absorbing capabilities, have capability of electromagnetic shielding or the like.
The object of the present invention is achieved like this, and a kind of new copper is characterized in that, to be ordinary copper (1) combine and form with carbon fiber (3) after plasma body (2) is environmental modified described new copper.Can to be gas form through ionization plasma body (2) environment of Treatment of Carbon (3), and plasma environment can be by applied field and magnetic field institute separately or combined action, plasma generation is moved and rotates, and by preset program carbon fiber carried out modification and handle.Because the carbon fiber after plasma environmental modified can combine with ordinary copper, thereby can produce the new copper of fine quality.The organism such as carbon fiber and an inorganics such as the copper bonded difficult problem that never solve before the invention solves.
Description of drawings
Fig. 1 is carbon fiber is disposed modification in plasma environment a explanatory view;
Fig. 2 be carbon fiber a device produce disposed in the plasma environment modification and with ordinary copper bonded explanatory view.
Embodiment
Consult Fig. 1, be clearly shown that the situation of carbon fiber (3) quilt disposal modification in plasma body (2) environment among Fig. 1, the environment of plasma body wherein (2) can be a normality, relatively stable attitude, also can be the alternation attitude, also can carry out condition and change by preset program.Because carbon fiber (3) can easily combine with ordinary copper (1), thereby can produce the new copper of fine quality after plasma body (2) is environmental modified.
Consult Fig. 2, carbon fiber shown in Fig. 2 (3) one produce disposed in the plasma environment that plasma device (4) produced modification and with ordinary copper (1) bonded explanatory view.Plasma state is that a large amount of molecular atoms lose that electronics becomes positive ion and trapped electron becomes the formed state of negative ion, usually can under rough vacuum, be formed by gas by electrion, its state can utilize the Mike's Si dimension equation in the electromagnetism roughly to determine, shown in the figure, plasma body (2) is in the inner casing (43) that is limited in plasma device (4), the fan door is set to put into and to take out ordinary copper (1) and carbon fiber (3) on the inner casing (43), the fan door can make inner casing (43) sealing when closed, place seat (44) in the inner casing (43), seat (44) is gone up and is placed ordinary copper (1) and carbon fiber (3), seat (44) can be the dolly of fixed or band wheel, side at inner casing (43) inwall is provided with one to several electrion pins (41), electrion pin (41) can be coupled with the high-voltage of thousands of volts to tens thousand of volts, thereby make electrion pin (41) produce point discharge, make ionization of gas, produce plasma body.Inner casing (43) inwall electrion pin (41) other be provided with one to several inlet pipe (42) to inner casing (43) in, to inflate, can fill respectively with rare gas element helium neon and so on for example, or nitrogen, and easily ionizable gas such as hydrogen etc.That adopts is ionized gas multiple choices can be arranged, can select as required, also can utilize the gas of organism and petrochemicals to be charged into to form required plasma environment, opposite side at inner casing (43) inwall is provided with one to several plate shape electrodes (46), match with electrion pin (41), produce required electric field.Appropriate location is provided with vacuum-pumping tube (48) on inner casing (43) inwall, and it links to each other with the vacuum pump that the outside vacuumizes, so that required vacuum tightness is pumped in the space in the inner casing (43).In inner casing (43) inboard or arranged outside produce the coil bag (45) in magnetic field, make the plasma environment in the inner casing (43) be subjected to the action of a magnetic field of coil bag (45), for example, coil bag (45) produces magnetic field of thousands of Gausses and so on, like this, plasma environment in the inner casing (43) can be by the independent or combined action of applied field and magnetic field institute, plasma generation is moved and rotate, by preset program carbon fiber (3) being carried out modification handles, treatment time can be determined as required, can be a few hours, tens of hours, so that hundreds of hours.
Because carbon fiber (3) can easily combine with ordinary copper (1), thereby can produce the new copper of fine quality after plasma body (2) is environmental modified.

Claims (5)

1, a kind of new copper is characterized in that, to be ordinary copper (1) combine the back with carbon fiber (3) after plasma body (2) is environmental modified to described new copper and form;
2, ordinary copper as claimed in claim 1 (1) and carbon fiber (3) is characterized in that, plasma body (2) environment of handling ordinary copper (1) and carbon fiber (3) can be that gas forms through ionization;
3, ordinary copper as claimed in claim 1 (1) and carbon fiber (3) is characterized in that, plasma body (2) environment of handling ordinary copper (1) and carbon fiber (3) can be subjected to electric field action;
4, ordinary copper as claimed in claim 1 (1) and carbon fiber (3) is characterized in that, plasma body (2) environment of handling ordinary copper (1) and carbon fiber (3) can be subjected to the action of a magnetic field;
5, ordinary copper as claimed in claim 1 (1) and carbon fiber (3) is characterized in that, ordinary copper (1) and carbon fiber (3) the processed time in plasma body (2) environment can be a few hours, tens of hours, so that hundreds of hours.
CNA02151951XA 2002-11-14 2002-11-14 Novel copper formed by combining copper and carbon fiber modified by plasma Pending CN1500897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA02151951XA CN1500897A (en) 2002-11-14 2002-11-14 Novel copper formed by combining copper and carbon fiber modified by plasma

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA02151951XA CN1500897A (en) 2002-11-14 2002-11-14 Novel copper formed by combining copper and carbon fiber modified by plasma

Publications (1)

Publication Number Publication Date
CN1500897A true CN1500897A (en) 2004-06-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA02151951XA Pending CN1500897A (en) 2002-11-14 2002-11-14 Novel copper formed by combining copper and carbon fiber modified by plasma

Country Status (1)

Country Link
CN (1) CN1500897A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102051534A (en) * 2011-01-14 2011-05-11 南京信息工程大学 Damping wear-resistant copper alloy material and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102051534A (en) * 2011-01-14 2011-05-11 南京信息工程大学 Damping wear-resistant copper alloy material and preparation method thereof

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