CN1498159A - Method and apparatus for removing molecular orientation of resin molding - Google Patents
Method and apparatus for removing molecular orientation of resin molding Download PDFInfo
- Publication number
- CN1498159A CN1498159A CNA028066987A CN02806698A CN1498159A CN 1498159 A CN1498159 A CN 1498159A CN A028066987 A CNA028066987 A CN A028066987A CN 02806698 A CN02806698 A CN 02806698A CN 1498159 A CN1498159 A CN 1498159A
- Authority
- CN
- China
- Prior art keywords
- moulding article
- infrared radiation
- infra
- irradiation
- metal pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/0072—After-treatment of articles without altering their shape; Apparatus therefor for changing orientation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
A method and an apparatus for removing residual molecular orientation of a resin molding caused by heating in a short time in order to enhance surface planarity of a product with a high processing efficiency. At least one infrared ray transmission window is made at a part of a molding die and a resin molding is inserted into the transmission window such that the surface of the resin molding faces the transmission window and then the attitude thereof is fixed. At least one infrared ray irradiation source is disposed to direct the transmission window and the surface of the molding is irradiated with infrared rays from the irradiation source through the transmission window.
Description
Technical field
The present invention relates to be used for the method and apparatus that molded resin is eliminated molecularly oriented, relate more specifically to be used for the improvement that molded resin is eliminated the heating process of molecularly oriented, this molded resin is used for for example precision element of electronic installation, optical element and micro-mechanical component.
Background technology
For example be used for the electronic installation of the direct substrate contacted shell of the CPU of computer and be used for the molded resin of opto-electrical transmitting device, need very high dimensional accuracy.Usually utilize the injection moulding of plastic resin to make this resinoid moulding article.
In process of injection molding, under high pressure be expelled to the molten resin of high temperature and high viscosity in the metal pattern and cooling sharp after injection.In this course, thus having produced molecularly oriented has inevitably formed the surface solidification layer that is brought in the final products.The appearance of this molecularly oriented in the final products has caused residual deformation, birefringence and crooked generation, and these have seriously reduced the quality that needs the above-mentioned type of high dimensional accuracy product.
Because the pressurized of contact stud inserts this bending that has enlarged the electronic installation product after the mold pressing.In CPU installs, moulding article is up to about 210 ℃ heating process and has thisly added heat abstraction again and cause the crooked residual stress that enlarges for the welding purpose.
Therefore, for the manufacturing of high dimensional accuracy moulding article, need to correct near the adverse effect of the survival orientation molded article surface zone before in being installed to electronic installation.
Usually, before being used to correct the final heating process of this adverse effect, moulding article being enclosed in the heater that utilization is combined in the metal pattern in the metal pattern heating.Just, the bending that will produce by the plastication of heating is corrected to a certain degree.Specifically, moulding article is enclosed in utilizes heater to heat in the metal pattern, fixed mould and after cooling, from mould, take out moulding article.
Yet the heating process of this traditional heater class is very disadvantageous, because the processing time that continuous heating and cooling need be grown in same metal pattern.From the transfer process that is heated to cooling, in a single day heat energy be input to just need discharge it in the mould so that the thermograde reversing (inverse the thermalgradient) between metal pattern and moulding article from mould.Thereby greatly reduce working (machining) efficiency the process time of this process need length.
Summary of the invention
Main purpose of the present invention is to realize the elimination of survival orientation in molded resin in the short time, so that increase the surface smoothness of moulding article, removes residual deformation simultaneously in the process time that reduces.
According to basic sides of the present invention, at least one infra-red transmitting window is formed in the metal pattern partly, molded resin is placed in the metal pattern regularly arranges face-to-face with infra-red transmitting window, at least one source of infrared radiation is installed in the position of aiming at infra-red transmitting window, and infrared radiation is applied to the target surface of moulding article through infra-red transmitting window.
Description of drawings
Fig. 1 is the schematic diagram of an embodiment of apparatus of the present invention of single face infrared radiation;
Fig. 2 is the schematic diagram of an embodiment of apparatus of the present invention of double-sided red external irradiation;
Fig. 3 is the schematic diagram of the interior heat gradient of moulding article in the heating process of the present invention;
Fig. 4 represents according to infrared radiation heating principle of the present invention;
Fig. 5 is the transmission spectrum of moulding article that is used for the assessment of the present invention processing;
Fig. 6 is the detailed side view of device shown in Figure 1;
Fig. 7 is the detailed side view of device shown in Figure 2;
Fig. 8 is before for the backflow of the moulding article that does not carry out infrared radiation heating and the figure as a result of flexural measurement afterwards;
Fig. 9 is the temperature function figure in time that single face irradiation moulding article is carried out in expression;
Figure 10 is the measurement point that is illustrated under the measurement situation of Fig. 9;
Figure 11 is the bending change figure that the moulding article of single face irradiated heat to 250 ℃ is carried out in expression;
Figure 12 is the bending change figure that the moulding article of single face irradiated heat to 300 ℃ is carried out in expression;
Figure 13 is the bending change figure that the moulding article of single face irradiated heat to 330 ℃ is carried out in expression;
Figure 14 is the temperature function figure in time that the moulding article of two-sided irradiation is carried out in expression;
Figure 15 is the bending change figure that the moulding article of two-sided irradiated heat to 250 ℃ is carried out in expression;
Figure 16 is the bending change figure that the moulding article of two-sided irradiated heat to 300 ℃ is carried out in expression;
Figure 17 is the bending change figure that the moulding article of two-sided irradiated heat to 330 ℃ is carried out in expression.
The specific embodiment
Fig. 3 has described because the Temperature Distribution in the moulding article that heating produces.Example of the present invention is represented with solid line.In the drawings, left part is an infra-red transmitting window and the right side part is a moulding article.As shown in the figure, in zone (solidification layer), observe the rising that utilizes the infrared radiation temperature near the molecularly oriented appearance just of surperficial zone.
In Fig. 3, conventional heater type heating heat gradient dots, and in the drawings, left part is to have the metallic plate of heater and the right side part is a moulding article.As shown in the figure, the temperature in the moulding article descends to core from its surface always, and is different with the present invention, observing the rising that does not have temperature near the surface.
Basic principle of the present invention represents that in Fig. 4 wherein the irradiation bomb by the outside carries out the infrared radiation heating to the moulding article that is enclosed in the metal pattern with infra-red transmitting window.Carry out irradiated heat in two ways, a kind of is single face irradiation and another kind is two-sided irradiation.
An embodiment of single face irradiation of the present invention as shown in Figure 1, wherein molded resin P is placed in the fixing metal pattern 1 in position, its target surface for example electronic installation of moulding article is installed the surface, is placed on and infra-red transmitting window 3 tight position contacting.In this case, shown in arrow among the figure, apply infrared radiation to infra-red transmitting window 3 by a unshowned outside irradiation bomb.Continue to carry out infrared radiation and reach predetermined temperature up to the center of target surface.In Fig. 6, illustrate in greater detail this layout.
An embodiment of two-sided irradiation of the present invention as shown in Figure 2, wherein molded resin P is placed in the fixing metal pattern 1 in position, its target surface for example electronic installation of moulding article is installed the surface, is placed on and infra-red transmitting window 3 tight position contacting.In this case, apply infrared radiation as shown by arrows to infra-red transmitting window 3 by unshowned outside irradiation bomb.Compare with above-mentioned single face irradiation, the advantage of two-sided irradiation is do not have difference on temperature between two target surfaces of moulding article, and the rising of moulding article temperature is faster simultaneously.In Fig. 7, illustrate in greater detail this arrangement.
In above-mentioned embodiment, moulding article and infrared ray below using.Moulding article is made and is utilized its optical characteristics of spectrophotometer measurement by liquid crystal polymer.The transmission spectrum that obtains is shown in Figure 5.Be clear that from figure observing does not almost have infrared transmission under the situation of this moulding article experience from the far infrared to the near infrared band.In other words, observe the good absorption of infrared energy.Therefore, various irradiation bombs all are operable.As concrete example, because its low-cost and high power output is used infrared lamp, promptly a kind of near infrared irradiation source is useful.
Because its infrared transmission in the near infrared band excellence uses PYREX glass as the irradiation transmission window valuably.The radiation spectrum that obtains is shown in Figure 5.
Circulation with flexural measurement, radiation heating, flexural measurement, reflow process and flexural measurement is tested.In order to measure the bending under the initial conditions, 20 moulding articles of picked at random and with the mean value of measurement result as initial value.Under about 220 ℃, reflux.
In flexural measurement, moulding article is fixed on the test desk, and on the surface of the thick part of moulding article with a pair of diagonal X of 9 point selection and the Y at the interval of 5mm.On each point, moulding article and test desk are slided measure crooked Z.Then be placed on moulding article in the metal pattern and apply infrared radiation and reach predetermined value up to maximum surface temperature.Selecting three maximum surface temperatures to be 250,300 and 330 ℃ is used for measuring.The load of screw selection 1.5,11 and 40kgf is tightened in utilization.Under the situation of single face irradiation, increase the load of 80kgf.
Before reflow process and afterwards the flexural measurement result that the moulding article that does not stand the infrared radiation heating is carried out as shown in Figure 8.Abscissa represents that with " mm " be cornerwise position of unit and ordinate represents with " μ m " to be the crooked Z of unit.From figure, can clearly draw, bending increased more than three times by reflow process.Can be sure of that this is owing to reduced the internal residual stress that is produced by reflow process utilization heating in process of injection molding.
At first consider the situation of single face irradiation.It is applied under the situation of maximum infrared radiation intensity in the position of distance moulding article 9cm, the increase of the temperature time function of moulding article as shown in Figure 9.To the measurement result of difference irradiation on the moulding article as shown in figure 10.
When the temperature at the center on the surface that is used to lay CPU on the moulding article reached 250,300 and 330 ℃, crooked situation was illustrated by Figure 11,12 and 13 respectively.
Result shown in the figure shows, reduced in the bending of 250 ℃ of infra-red radiation post moulding goods, but be increased to crooked identical level with the moulding article that does not have infrared radiation again after reflow process.Can be sure of that this is that bending returns to initial value because do not remove residual stress at 250 ℃ by infrared radiation.
In contrast to this, 300 ℃ infrared radiation has reduced the recovery of bending after the reflow process.When the infrared radiation temperature was increased to 330 ℃, bending had reduced.Can be sure of that because irradiation temperature is near being used for the fusion point temperature of the resin of moulding article, the residual stress in the moulding article is removed.Just, under this irradiation temperature, strengthened the effect of infrared radiation.
In addition, infrared radiation being applied to CPU installs the surface and installs on the surperficial pad.Infrared lamp is placed on apart from the position of moulding article 12cm on the position of distance moulding article 1.5cm, places Halogen lamp LED simultaneously.Under peak power output, carry out irradiation.The variation of the temperature time function of moulding article as shown in figure 14.To the situation of single face irradiation, on 4 points, measure and simultaneously carry out mould and fix with 10kgf.
Under the situation of two-sided irradiation, the irradiation difference of different surfaces can be reduced to minimum by suitable adjusting irradiation distance, make the temperature difference between different surfaces reduce to minimum like this, simultaneously to accelerate the rising of temperature than single face irradiation faster speed.
The situation of double-sided red external irradiation bending is respectively shown in Figure 15,16 and 17 when the surperficial central temperature of electronic installation installation of moulding article is 250,300 and 330 ℃.
Under each situation, the amount of bending much at one behind the irradiation.Can be sure of that the deformation temperature of moulding article is lower than 250 ℃.Yet under the situation of low temperature irradiation, recovery crooked behind the irradiation increases.Along with surface temperature is elevated to 300 and 330 ℃, near being used for the melt temperature of the resin of moulding article, can find to have eliminated well residual stress, moulding article still can keep its shape behind the irradiation or even after the reflow process simultaneously.
When concern concentrates on directions X, under various radiation parameters, observe not significantly difference on amount of bow.Can be sure of that this is that the result is not even distortion occurs yet after reflow process because opposite curvature is joined in the predose initial bending.
Usually, plastic material is that infrared radiation is impenetrable and absorb irradiation energy well, therefore can promote irradiated heat.Because metal pattern itself can not produce heat, the heat gradient between moulding article and metal pattern is the trend cooling of tilting.As a result, in traditional heater heating process, no longer need spended time to be used for thermoreversion (thermalinversion).Saved process time so significantly.
Claims (5)
1. be used for eliminating the method for molecularly oriented, may further comprise the steps at molded resin:
Prepare a metal pattern that is equipped with at least one infra-red transmitting window;
Shown in fixed placement molded resin in the metal pattern, make its target surface and described one or more infra-red transmitting window face-to-face;
By described one or more infra-red transmitting windows described one or more target surfaces are applied infrared radiation.
2. method according to claim 1, wherein said infrared radiation are applied to a surface of described moulding article.
3. method according to claim 1, wherein said infrared radiation are applied to two surfaces of described moulding article.
4. according to the arbitrary described method of claim 1 to 3, the central temperature of wherein carrying out the infrared radiation moulding article surpasses its deformation temperature.
5. be used for eliminating the device of molecularly oriented, comprise at molded resin:
The metal pattern that at least one infra-red transmitting window is installed, this window are arranged in the surperficial corresponding position with the moulding article that inserts mould; With
The outside irradiation bomb relative with described infra-red transmitting window.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001076181A JP4549562B2 (en) | 2001-03-16 | 2001-03-16 | Method and apparatus for removing molecular orientation of resin molded product |
| JP76181/2001 | 2001-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1498159A true CN1498159A (en) | 2004-05-19 |
Family
ID=18933159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA028066987A Pending CN1498159A (en) | 2001-03-16 | 2002-03-14 | Method and apparatus for removing molecular orientation of resin molding |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4549562B2 (en) |
| CN (1) | CN1498159A (en) |
| WO (1) | WO2002074521A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4252586B2 (en) * | 2006-07-10 | 2009-04-08 | テクノポリマー株式会社 | Resin molding equipment |
| WO2007058184A1 (en) * | 2005-11-15 | 2007-05-24 | Techno Polymer Co., Ltd. | Resin molding process and resin molding apparatus |
| JP4234143B2 (en) * | 2006-02-15 | 2009-03-04 | テクノポリマー株式会社 | Resin molding method and resin molding apparatus |
| JP4234130B2 (en) * | 2005-11-15 | 2009-03-04 | テクノポリマー株式会社 | Resin molding method and resin molding apparatus |
| JP4234142B2 (en) * | 2006-02-15 | 2009-03-04 | テクノポリマー株式会社 | Resin molding method and resin molding apparatus |
| JP2008188953A (en) * | 2007-02-07 | 2008-08-21 | Univ Of Electro-Communications | Manufacturing method of plastic-made stamper, plastic-made stamper and manufacturing method of plastic-made substrate |
| JP6129592B2 (en) * | 2013-03-11 | 2017-05-17 | 本田技研工業株式会社 | Heating method and heating apparatus for fiber-containing resin body |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814297B2 (en) * | 1980-04-15 | 1983-03-18 | 松下電工株式会社 | Mold filling confirmation device |
| JPS5770608A (en) * | 1980-10-22 | 1982-05-01 | Ricoh Co Ltd | Compression molding method of plastic |
| DE3336244A1 (en) * | 1983-10-05 | 1985-04-25 | Bayer Ag, 5090 Leverkusen | METHOD FOR TEMPERING THERMOPLASTICALLY MOLDED PLASTIC PARTS |
| JPS63193937A (en) * | 1987-02-05 | 1988-08-11 | Kyowa Gas Chem Ind Co Ltd | Annealing of molded resin article |
| JP3169786B2 (en) * | 1995-02-10 | 2001-05-28 | 晏夫 黒崎 | Polymer injection molding equipment |
-
2001
- 2001-03-16 JP JP2001076181A patent/JP4549562B2/en not_active Expired - Fee Related
-
2002
- 2002-03-14 WO PCT/JP2002/002435 patent/WO2002074521A1/en active Application Filing
- 2002-03-14 CN CNA028066987A patent/CN1498159A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002273764A (en) | 2002-09-25 |
| WO2002074521A1 (en) | 2002-09-26 |
| JP4549562B2 (en) | 2010-09-22 |
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