CN1493635A - Sticking processing method for heat-resisting sheet and sticking band - Google Patents
Sticking processing method for heat-resisting sheet and sticking band Download PDFInfo
- Publication number
- CN1493635A CN1493635A CNA031594867A CN03159486A CN1493635A CN 1493635 A CN1493635 A CN 1493635A CN A031594867 A CNA031594867 A CN A031594867A CN 03159486 A CN03159486 A CN 03159486A CN 1493635 A CN1493635 A CN 1493635A
- Authority
- CN
- China
- Prior art keywords
- bonding
- splicing tape
- adhesive
- sheet material
- inorganic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The character is to coat at least one surface of a heat-resistant sheet with an adhesion treating solution composed of an adhesion treating agent and a solvent, then rapidly evaporate the solvent in the adhesion treating solution, form holes or/and cracks in a continuous cell state in a solid component and heat the adhesion treating agent at a temperature for causing molding thereof. When the adhesion treating surface is coated with the pressure-sensitive adhesive, the gel fraction of the pressure-sensitive adhesive is preferably 20-60%.
Description
Technical field
The present invention relates to splicing tapes, are the bonding processing method about the heat resistance sheet material for the bonding inorganic agent for being related to being applied between adhesive and substrate, and the splicing tape using substrate made of the method in more detail.
The prior art
Splicing tape, since its is easy to use, oneself is applied in many fields in recent years, and develops various products and use in multiple use.Wherein, depending on the application, the adhesive tape temporarily pasted is removed, and also had much the case where pasting new band in the release surface.In this case, splicing tape is not required nothing more than there was only so-called paste functionality, and, it is desirable that in band removing, adhesive (paste) does not end up at the function in sticky surface.About the splicing tape with this function, several schemes are had been presented for before this, moreover, some is practical.For example, can be improved by forming adhesive after applying priming coat on substrate with the adhesiveness between substrate and adhesive phase, i.e., anchor between substrate and adhesive phase closes property, paste remained on clung body few splicing tape oneself it has been proposed that (for example, Patent Document 1 etc.).In addition, other resin layers are arranged, as supporter (substrate) and adhesive phase and its middle layer, and the anchor resultant force of supporter, middle layer and each interlayer of adhesive phase is excellent, therefore, the adhesive tape of noresidue is pasted after removing also it has been proposed that (for example, Patent Document 2 etc.).
[Patent Document 1] special open 2000-191989 bulletin
[Patent Document 2] special open 2000-63774 bulletin
Subject to be solved by the invention
However, this prior art, it is that specific substrate and adhesive and middle layer are combined the splicing tape realized, it and is that can play very good function on the way in several use, it and is the splicing tape for sufficiently meeting above-mentioned requirements, but then, this function may not necessarily be generated sometimes as the adhesive tape of a variety of purposes.In addition, having carried out various discussions to bonding inorganic agent in the splicing tape that the bonding inorganic agent that manufacture is applied by adhesive and substrate and therebetween is constituted, however, actual conditions are, the completely not remaining method of paste is not found also.In particular, paste is remaining more, therefore requires to be improved the use of temperature being more than 200 DEG C on the way.
Therefore, the purpose of the present invention is to solve above-mentioned various problems, a kind of bonding processing method that anchor resultant force is improved is provided, simultaneously, it provides a kind of on using bonding process face made of the method, coating improves the adhesive of cohesiveness, or after applying silane coupling agent according to occasion, applies adhesive and paste is made, remaining splicing tape does not occur.
Means for solving the problems
The present inventor to the method for meeting the requirement careful studied as a result, it has been found that, by being bonded processing method as defined in imposing to heat resistance sheet material, excellent anchor resultant force can be obtained, then complete the present invention.
I.e., bonding processing method as heat resistance sheet material, it is characterized in that, the bonding processing solution that coating bonding inorganic agent and solvent are constituted at least one face of heat resistance sheet material, then, make the rapid solvent evaporation being bonded in processing solution, the emptying aperture of the company's of generation blister state and/or cracking in solid component, also, bonding inorganic agent is heated to forming temperature.By the way that the adhesive phase with adhesive effect, further the means such as foaming, cracking, form bumps on surface, be wrapped on the male and fomale(M&F) by adhesive, the purpose that anchor conjunction property improves can achieve.
In addition, it is taken as applying the splicing tape that adhesive is constituted on substrate made of the method (hereinafter, referred to intermediate), it is characterised in that, it is formed in the state that there is the even emptying aperture of blister state and/or cracking bonding inorganic agent, in the solid component in it.Coating improves the adhesive of cohesiveness on the intermediate with above-mentioned effect of casting anchor, and applies adhesive after applying silane coupling agent according to occasion, whereby, is likely to be obtained after removing without the remaining splicing tape of paste.
In addition, above-mentioned bonding processing solution, is to be made of silicon dioxide granule, fluororesin, surfactant and water, solid component is preferably 5~80%.It using the combination of this material or forms as condition, carry out adhesion process that can be stable can provide the splicing tape with homogeneous quality.
As above-mentioned splicing tape substrate, it is preferable to use polyimide film, polyamide sheet material, fluororesin film, on glass cloth impregnate fluororesin impregnated cloth.For such substrate, on the one hand to ensure the characteristic of the splicing tapes such as certain heat resistance, intensity, on the other hand there should be the adaptability be bonded inorganic agent and adhesive, so as to be suitable for diversified purposes.
In addition, it is preferred that the percent gel of adhesive, which is 20~60%, when toward coating adhesive in bonding process face.It has been confirmed that in the range such as percent gel, the cohesiveness of adhesive can be improved, so as to obtain the release band after applied at elevated temperature, remaining splicing tape does not occur yet for paste.
In addition, above-mentioned adhesive, preferably organic silicon-type adhesive.Whereby, not only can ensure that the characteristic to splicing tapes such as the tolerances, intensity, flexibility of high temperature, but can have with the adaptability of be bonded inorganic agent, so as to be suitable for diversified purposes.
The embodiment of invention
Embodiment of the present invention is illustrated below.
The bonding processing method of adhesive sheet of the invention, it is characterized in that, on at least one face of heat resistance sheet material, the bonding processing solution that coating bonding inorganic agent and solvent are constituted, then, make the rapid solvent evaporation being bonded in processing solution, make the emptying aperture of the company's of generation blister state and/or cracking in solid component, also, bonding inorganic agent is heated to forming temperature.It the means such as further foamed, be cracked by making the priming coat with adhesive effect, form bumps on surface, and be wrapped on the male and fomale(M&F) by adhesive, can achieve anchor and close the purpose that property improves.
In addition, coating adhesive can be used as splicing tape use using intermediate made of this method.I.e., it is formed in the state that there is the even emptying aperture of blister state and/or cracking in the solid component being bonded in inorganic agent, the splicing tape as feature can then be manufactured, coating improves the adhesive of cohesiveness on the intermediate that anchor closes excellent effect, or according to occasion, adhesive is applied after coating silane coupling agent, whereby, without the remaining splicing tape of paste after available removing.
In addition, being bonded processing solution used in the present invention, it is made of bonding inorganic agent and solvent, crosslinking agent, curing agent, organic or inorganic filler can be added as needed.
It, can be from the composition that selection is combined to band in fluororesin such as polyester resin, melamine resin, acrylic resin, organic siliconresin, PFA, FEP, PTFE etc. as bonding inorganic agent.Coating amount under drying regime is 0.5~20g/m2, preferably 1~10g/m2, cured occasion must be being carried out, it can be using peroxide such as curing agent or benzoyl peroxide such as isocyanates system, amine systems.It is lower than 0.5g/m in coating amount2When, even if heating, it is bonded the also not emptying aperture of the company's of generation blister state and/or cracking in inorganic agent, when coating amount is greater than 20g/m2When, even if coating, the effect that cannot also match with coating amount.
It, can be using toluene, dimethylbenzene, methyl ethyl ketone, ethyl acetate, butanol, water etc. and their mixture as solvent.
It, can be using inorganic powders such as organic resins powder or magnesia, aluminium oxide, silica such as melamine resin, epoxy resin, acrylic resins as filler.It is the 5~80% of bonding inorganic agent total weight, preferably in the range of 10~60% as additive amount.
As heating temperature, 20 temperature (DEG C) or more is added for solvent for use boiling point, as long as moreover, bonding inorganic agent can form, and in fact material does not deteriorate, and is preferably handled at high temperature.When for mixed solvent, above content based on the solvent of maximum boiling point, to determine heating temperature.
In addition, above-mentioned bonding processing solution is made of silicon dioxide granule, fluororesin, surfactant and water, solid component is preferably 5~80%, more preferably 10~50%.When being lower than 5%, even if heating, it is bonded the also not emptying aperture of the company's of generation blister state and/or cracking in inorganic agent, when being greater than 80%, since the viscosity of bonding processing solution increases, so applicator surface is roughening, unstable quality.Make it possible stable bonding processing as condition using the combination of such material or form.
As above-mentioned splicing tape substrate, it is preferable to use polyimide film, polyamide sheet material, fluororesin film, on glass cloth impregnate fluororesin impregnated cloth.To such substrate, while excellent heat resistance, moreover it is possible to ensure the characteristic of the splicing tapes such as intensity, processability, but also be and the adaptability of the adhesive by Nian Jie processing also excellent material.In addition, as substrate used in the present invention than that described above, stationery, polyester film, metal foil etc. can also be enumerated.
In addition, the percent gel of adhesive is preferably 20~60% when toward coating adhesive in bonding process face.As the use level of crosslinking agent, when the percent gel of adhesive is lower than 20%, when removing splicing tape after use, the cohesion that adhesive occurs is destroyed, and the so-called problem remained on clung body occurs for adhesive.When percent gel is greater than 60%, due to adhesive is hardened and bonding force declines, the problem of described splicing tape removing is likely occurred in use.Within the above range such as percent gel, the cohesiveness of bonding agent can be improved, even and if rear release band is used under available high temperature, and paste also not remaining splicing tape.
In addition, above-mentioned adhesive, preferably organic silicon-type adhesive.Not only with the tolerance to high temperature but also there are the characteristics such as the intensity, the flexibility that require splicing tape, but also with and the adaptability of Nian Jie inorganic agent.It in addition, rubber series, acrylic acid series etc. also can be used in addition to organic silicon-type adhesive, can be selected depending on the application, as crosslinking agent, sulphur, melamine resin, isocyanates system resin, peroxide etc. can be used.
In addition, the thickness as adhesive, generally 4~70 μm.When less than 4 μm, bonding force is low, and removing is likely to occur in use.Even if being greater than 70 μm, special effect is also had no, when being used as following heat seal, the thickness direction thermal conductivity of splicing tape declines instead so being undesirable.
In the present invention, by using the bonding processing method of above sheet, the improvement of anchor resultant force can be sought, meanwhile the adhesive of cohesiveness is improved by applying, or according to occasion, adhesive is applied after coating silane coupling agent, then does not paste remaining splicing tape after removing can be provided.When the splicing tape is used as Masking strip, heat seal band, even if when the band is repeated stickup removing and uses, paste residual does not occur still for band, can efficiently use the present invention excellent anchor resultant force and cohesiveness, and can be used as the splicing tape for meeting various uses functionality required to the maximum extent.
Embodiment
In the following, the composition and effect of the invention by embodiment specific description.Assessment item in each embodiment is for example following.In addition, the present invention is not by the limitation of these embodiments.
Evaluation method
(1) bonding force
Using the sample of 19mm × 200mm, it is measured by JIS C 2107.
(2) paste residual
With reciprocal 1 movement of 2kg roller, sample (19mm × 200mm) is pasted on stainless steel plate (SUS304BA plate), in being placed at room temperature for 30 minutes, after predetermined temperature placement 240 hours, in being placed at room temperature for 30 minutes.Then, it is removed with the speed of 30mm/min and 300mm/min in 180 ° of directions using Tan Xilun (テ Application シ ロ Application) type universal tensile testing machine in room temperature, investigates the adhesive residue state on the surface SUS.Herein, so-called predetermined temperature, when acrylic adhesive, mean 80 DEG C, and when silicone adhesive means 200 DEG C.
(3) percent gel
It is found out according to the method recorded below.
1) prepare 19mm × about 250mm sample.
2) sample (Ag) is weighed.
3) sample is impregnated 48 hours in about 300ml toluene.
4) after air-drying 30 minutes, in 120 DEG C, through 2 hours removing toluene.
5) it removes and places at room temperature 30 minutes.
6) sample (Bg) is weighed.
7) adhesive of sample, only substrate are removed.
8) substrate (Cg) is weighed.
9) percent gel (%) is found out with following formula (1):
Percent gel (%)=(B-C)/(A-C) × 100 formula 1
(4) anchor resultant force
On the paste face of sample (19mm × 200mm), the paste face of capron (カ プ ト Application) splicing tape (day east electrician system, No.360,1 mil sample) is pasted with roller is pulled.After being placed at room temperature for 24 hours, the sample for carrying out carrying out test as tensile peel between sample substrate and adhesive is made, it is used into テ Application シ ロ Application type universal tensile testing machine, tensile peel is carried out with 300mm/min speed in 180 ° of directions, finds out anchor resultant force.
Embodiment 1
Toward polyimide film (eastern レ デ ユ Port society manufacture, trade name power プ ト Application film 100H) a face on apply acrylic resin (レ イ ヨ Application society, Mitsubishi system, trade name ア Network リ ペ Star ト VH) 10% toluene solution, so that the coating amount under dry state is reached 4g/m2, heated 5 minutes in 170 DEG C immediately.Then, following toluene solution is applied in the bonding process face, the applied thickness under drying regime is set to reach 35 μm, the toluene solution be acrylic adhesive (2- ethylhexyl acrylate/acrylic acid=100/1, molecular weight 70 ten thousand) add in 100 parts by weight after 5 parts by weight of isocyanates system curing agent made of 30% toluene solution.By it in being placed at room temperature for after ten minutes, is heated 5 minutes in 130 DEG C, make its solidification, obtain splicing tape.
Embodiment 2
PTFE resin 90g/m is coated in the two sides of glass cloth (Zhong Fang society system, trade name KS 1090)2Impregnated cloth a face on, coating is relative to PFA resin (ダ イ キ Application industry society system, trade name: ネ オ Off ロ Application PFA AD-2CR) 100 parts by weight, silica (Nissan Chemical society system, trade name: ス ノ ` テ Star Network ス N) 60 parts by weight, surfactant (the first industrial pharmaceutical society system, Shang Mingming: ノ イ ゲ Application EA-137) bonding that constitutes of 2 parts by weight and 300 parts by weight of water handles agent solution, and so that the coating amount under drying regime is reached 1.5g/m2, heat in 200 DEG C 1 minute, then, heated 30 seconds in 370 DEG C immediately.Coating is relative to 100 parts by weight of silicone adhesive in the bonding inorganic agent applicator surface, 35% xylene solution of 2.5 parts by weight of benzoyl peroxide heats 3 minutes after so that the applied thickness under drying regime is reached 45 μm like that in 80 DEG C, it is heated 5 minutes then at 200 DEG C, obtains splicing tape.
Comparative example 1
Other than the heating temperature after the coating of the acrylic resin of embodiment 1 is become 80 DEG C of heating 10 minutes, remaining same operation obtains splicing tape.
Comparative example 2
In addition to the acrylic resin coating amount of embodiment 1 is become 0.2g/m2In addition, remaining same operation, obtains splicing tape.
Comparative example 3
Other than the isocyanate curing agent of embodiment 1 is become 1 parts by weight, remaining same operation obtains splicing tape.
Comparative example 4
Other than the heating temperature after the bonding processing agent solution coating embodiment 2 becomes 100 DEG C of heating 10 minutes, remaining is equally operated, and obtains splicing tape.
Comparative example 5
In addition to the coating amount under the drying regime of the bonding processing agent solution of embodiment 2 is become 0.1g/m2In addition, remaining same operation, obtains splicing tape.
Comparative example 6
Other than the benzoyl peroxide of the bonding processing agent solution of embodiment 2 is become 0.5 parts by weight, remaining same operation obtains splicing tape.
Test result
About above-mentioned 4 assessment items, the test result of each example is shown in table 1.
Table 1
| Project | Embodiment 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Comparative example 6 |
| Bonding force (N/19mm) | 820 | 970 | 790 | 840 | 1050 | 950 | 920 | 1120 |
| Paste residual | Nothing | Nothing | There is (anchor, which closes, to be destroyed) | There is (anchor, which closes, to be destroyed) | There is (cohesion destroys) | There is (anchor, which closes, to be destroyed) | There is (anchor, which closes, to be destroyed) | There is (cohesion destroys) |
| Percent gel (%) | 36 | 48 | 37 | 36 | 16 | 48 | 47 | 10 |
| Anchor resultant force (g/19mm) | 1260 | 1180 | 540 | 480 | 1350 | 590 | 480 | 1260 |
As shown in 1 result of table, embodiment 1 and 2, no paste residual, anchor resultant force is also high, and each assessment item obtains good result.On the other hand, comparative example 1~6, which all occurs paste residual, obtains bad result.In particular, Comparative Examples 1 and 2,4,5, anchor resultant force is very low, observes that so-called anchor closes and destroys, comparative example 3 and 6, though the high percent gel of anchor resultant force is very low, since cohesiveness declines, it can be observed that the generation that so-called cohesion destroys.
The effect of invention
As described above, making the bonding processing oxidant layer with adhesive effect in the bonding processing method of heat resistance sheet material of the invention, again with means such as foaming, crackings, surface is set to form bumps, whereby, adhesive or silane coupling agent wind on the male and fomale(M&F) and greatly improve anchor and close effect.
Therefore, the high adhesive of coating cohesiveness on manufactured intermediate in this way, or according to occasion, the splicing tape that coating adhesive is constituted after coating silane coupling agent, anchor resultant force, cohesiveness become very good, and in removing, remaining effect does not occur for available paste.Whereby, even the occasion pasted once again, clung body need not be cleaned, especially in the occasion of applied at elevated temperature, it is not necessary to because cleaning is cooled to room temperature, it is thus eliminated that undesirable situation, additionally, it is not necessary to can using organic solvent and also obtain good effect for cleaning.That is, the former, the time shortens, productivity is improved, and the latter, is improved at safe and healthy aspect, the available more improved effect of technology.
In addition, above-mentioned bonding processing solution is defined in specific material, reach its solid component in a certain range, make it possible that more stable bonding is handled, a kind of anchor resultant force height, the splicing tape with homogeneous quality can be provided.
Equally, as the substrate of splicing tape, when selecting polyimide film etc., the splicing tapes characteristic such as more excellent heat resistance, intensity had not only been can ensure that, but also because have with the adaptability of Nian Jie inorganic agent and adhesive and suitable for diversified purposes.
In addition, when applying adhesive on being bonded process face, when the percent gel of adhesive is in fixed range, the available cohesiveness for improving adhesive, and even if remaining splicing tape does not occur yet for paste after applied at elevated temperature when release band.
In addition, above-mentioned adhesive, when being organic silicon-type adhesive, not only can ensure that the characteristic to splicing tapes such as the tolerances, intensity, flexibility of high temperature, but also because have with the adaptability of Nian Jie inorganic agent may be adapted to diversified purposes.
Claims (7)
1. a kind of bonding processing method of heat resistance sheet material, it is characterized in that, the bonding processing method of the heat resistance sheet material, it is at least one face of the heat resistance sheet material, the bonding processing solution being made of bonding inorganic agent and solvent is applied, then, makes the rapid solvent evaporation being bonded in processing solution, it is allowed to the emptying aperture of the company's of generation blister state or/and cracking in solid component, and is heated to bonding inorganic agent and carries out molding temperature.
2. according to the bonding processing method of the heat resistance sheet material described in claim 1, which is characterized in that the bonding processing solution is to be made of silicon dioxide granule, fluororesin, surfactant and water, and its solid component is 5~80%.
3. a kind of splicing tape, which is characterized in that it is the splicing tape at least one face of heat resistance sheet material with bonding process face, in the state of having the even emptying aperture of blister state or/and cracking in the solid component being bonded in inorganic agent, makes to be bonded inorganic agent molding.
4. according to the splicing tape described in claim 3, which is characterized in that the bonding processing solution being made of above-mentioned bonding inorganic agent and solvent is to be made of silicon dioxide granule, fluororesin, surfactant and water, and its solid component is 5~80%.
5. according to splicing tape described in claim 3 or 4, which is characterized in that as splicing tape substrate using the impregnated cloth for impregnating fluororesin in polyimide film, polyamide sheet material, fluororesin film, glass cloth.
6. according to splicing tape described in any one of claim 3~5, which is characterized in that apply the splicing tape that adhesive is constituted in above-mentioned bonding process face, wherein the percent gel of adhesive is 20~60%.
7. according to splicing tape described in any one of claim 3~6, which is characterized in that above-mentioned bonding agent is silicon-type bonding agent.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP285455/2002 | 2002-09-30 | ||
| JP285455/02 | 2002-09-30 | ||
| JP2002285455A JP4204835B2 (en) | 2002-09-30 | 2002-09-30 | Adhesive tape and method of using adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1493635A true CN1493635A (en) | 2004-05-05 |
| CN1271160C CN1271160C (en) | 2006-08-23 |
Family
ID=32278755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03159486 Expired - Lifetime CN1271160C (en) | 2002-09-30 | 2003-09-27 | Sticking processing method for heat-resisting sheet and sticking band |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4204835B2 (en) |
| CN (1) | CN1271160C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960443A (en) * | 2014-02-13 | 2016-09-21 | 日东电工株式会社 | Silicone pressure sensitive adhesive composition, pressure sensitive adhesive tape, and method for manufacturing pressure sensitive adhesive tape |
| CN108368413A (en) * | 2015-12-10 | 2018-08-03 | 株式会社寺冈制作所 | Adhesion agent composition and adhesive tape |
| CN113166590A (en) * | 2018-11-07 | 2021-07-23 | 伊士曼性能薄膜有限责任公司 | Tackifying solutions and their use in applying films to substrates |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4647301B2 (en) * | 2004-12-16 | 2011-03-09 | 日東電工株式会社 | Adhesive tape |
| JP4708134B2 (en) * | 2005-09-14 | 2011-06-22 | 日東電工株式会社 | Sound-permeable membrane, electronic component with sound-permeable membrane, and method for manufacturing circuit board mounted with the electronic component |
| JP4608422B2 (en) * | 2005-12-05 | 2011-01-12 | 共同技研化学株式会社 | Adhesive film |
| JP2012149181A (en) * | 2011-01-19 | 2012-08-09 | Nitto Denko Corp | Double-sided adhesive tape or sheet, and method for processing adherend |
| JP2013231110A (en) * | 2012-04-27 | 2013-11-14 | Nitto Denko Corp | Adhesive tape base material, adhesive tape, and method for producing these |
| CN115232572B (en) * | 2021-06-11 | 2024-01-23 | 中国石油大学(北京) | Adhesive tape and preparation method and application thereof |
-
2002
- 2002-09-30 JP JP2002285455A patent/JP4204835B2/en not_active Expired - Lifetime
-
2003
- 2003-09-27 CN CN 03159486 patent/CN1271160C/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960443A (en) * | 2014-02-13 | 2016-09-21 | 日东电工株式会社 | Silicone pressure sensitive adhesive composition, pressure sensitive adhesive tape, and method for manufacturing pressure sensitive adhesive tape |
| CN105960443B (en) * | 2014-02-13 | 2019-04-02 | 日东电工株式会社 | The manufacturing method of polyorganosiloxane adhesive composite, adhesive tape and adhesive tape |
| CN108368413A (en) * | 2015-12-10 | 2018-08-03 | 株式会社寺冈制作所 | Adhesion agent composition and adhesive tape |
| CN108368413B (en) * | 2015-12-10 | 2021-02-02 | 株式会社寺冈制作所 | Adhesive composition and adhesive tape |
| CN113166590A (en) * | 2018-11-07 | 2021-07-23 | 伊士曼性能薄膜有限责任公司 | Tackifying solutions and their use in applying films to substrates |
| US11840649B2 (en) | 2018-11-07 | 2023-12-12 | Eastman Performance Films, Llc | Tack solutions and their use in applying films to substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004123769A (en) | 2004-04-22 |
| JP4204835B2 (en) | 2009-01-07 |
| CN1271160C (en) | 2006-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5423455B2 (en) | HEAT CONDUCTIVE SHEET, ITS MANUFACTURING METHOD, AND HEAT DISCHARGE DEVICE USING HEAT CONDUCTIVE SHEET | |
| CN1271160C (en) | Sticking processing method for heat-resisting sheet and sticking band | |
| US7718256B1 (en) | Thermal interface material for electronic assemblies | |
| EP3315573B1 (en) | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same | |
| JP5660443B2 (en) | Adhesive sheet and bonding method using the same | |
| KR102454630B1 (en) | Adhesive composition sheet, manufacturing method thereof, and semiconductor device | |
| CN107078102A (en) | Semiconductor back surface film | |
| CN1754933A (en) | Acrylic adhesive composition and acrylic adhesive sheet | |
| KR100903137B1 (en) | A Thermosetting Adhesive Film, and an Adhesive Structure Based on the Use Thereof | |
| CN106103530B (en) | Resin combination, adhesive film and semiconductor device | |
| JP2023011555A (en) | Release layer, compact having release layer, and release agent | |
| US20110079352A1 (en) | Flow Controllable B-Stageable Composition | |
| JP2010028087A (en) | Bonding film, dicing-diebonding tape, and method of manufacturing semiconductor device | |
| CN106797706A (en) | The manufacture method of supporter, adhesive sheet, laminate structure, semiconductor device and printed wiring board | |
| KR101591409B1 (en) | Release film | |
| WO2017199463A1 (en) | Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape | |
| JP2000017240A (en) | Adhesive sheet and semiconductor device using same | |
| CN1653610A (en) | Thermosetting adhesive sheet with electroconductive and thermoconductive properties | |
| JP7028264B2 (en) | Film-shaped adhesive and its manufacturing method, and semiconductor device and its manufacturing method | |
| JPWO2020075663A1 (en) | Resin composition, resin cured product and composite molded product | |
| JP5881540B2 (en) | Method for producing thermally conductive insulating sheet | |
| JP6623092B2 (en) | Thermosetting adhesive sheet and method for producing the same | |
| JP2004207263A (en) | Wafer bonding sheet, wafer laminated body, and semiconductor device | |
| JP2017025314A (en) | Adhesive sheet | |
| JP2005002335A (en) | Adhesive film and semiconductor device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20060823 |