CN1484349A - Multi-layer reflection film for micro-resonant carity of luminous component and its mfg process - Google Patents
Multi-layer reflection film for micro-resonant carity of luminous component and its mfg process Download PDFInfo
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- CN1484349A CN1484349A CNA021429251A CN02142925A CN1484349A CN 1484349 A CN1484349 A CN 1484349A CN A021429251 A CNA021429251 A CN A021429251A CN 02142925 A CN02142925 A CN 02142925A CN 1484349 A CN1484349 A CN 1484349A
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Abstract
This invention relates to a multi-layer mirror of a luminous microcavity including: 1. adding a macromolecular compound inorganic film of high penetration on a transparent base plate of a luminous element by coating or sputter to make up of at least one interface buffer layer 2. adding mulit-layer film in different refraction rates on the buffer layer in a way of filming to form a multi-layer mirror, on which surface a transparent conductive layer, a luminous layer and a top conductive layer are set up orderly so as to make up of a luminous element or organic luminous diode.
Description
Technical field
The present invention is laminated reflective film (multi-layermirror) structure and the processing procedure thereof of the microresonator of relevant a kind of light-emitting component, refers to the reflection multilayer membrane structure and the processing procedure thereof of the microresonator in the structure of organic electric exciting light-emitting diode (OLED) especially.
Background technology
The technology of organic electric exciting light-emitting diode (Organic Light Emitting Diode OLED) is according to the difference of its employed organic film material, be broadly divided into two classes, the one, be the micromolecule element system of material with the color development organic compound, another kind of then be to be the macromolecule element system of material with the conjugacy macromolecule.Owing to have and light-emitting diode (light-emitting diode, LED) similar characteristic, so the Organic Light Emitting Diode of micromolecule kenel is called as SMOLED, and polymer LED is called as Polymer OLED.
Basically the running of OLED element is similar to conventional semiconductors LED, under an applying bias, makes electric hole and electronics respectively since the both positive and negative polarity injection, and electric hole and electronics move in opposite directions under effect of electric field, and both are because of combination is luminous again.And the luminous color of element depends mainly on the organic material that has fluorescent property in the element, and OLED can sneak into the luminous efficiency that improves element in the host emitter with a spot of guest emitter in addition, and can make luminous color across whole visible region.
" light " is a kind of form of energy waves.Human optic nerve only reacts responsive especially to red, green, basket three coloured light.Other color then is that the light by these three kinds of colors mixes; In other words, other colors that we see usually be cone cell on the retina the result of external red, green, blue signal combination, they are not the color of " physical presence ".The wavelength of ruddiness is about 6000 dusts (Angstrom), and green wavelength is on the 5500 Izod right sides, and the basket light wavelength is then on the 4650 Izod right sides.In the middle of these visible lights, scattering is less so that the wavelength of ruddiness is big, and the basket light wavelength is relatively short and the phenomenon of scattering is bigger.Because short light wave has the shortcoming of easy scattering, the luminous efficiency of OLED element produces the phenomenon of luminous efficiency deficiency just because of the different wavelength characteristic of light at present, has to be overcome.
For solving the anisotropy problem of light-emitting component light source, many companies carry out different designs at the structure of element.To promote luminous efficiency is purpose, develops the comparatively effectively structural design of coming out, and for example " microresonator (micro-cavity) " of known structure light wave bootable and the enhancing specific wavelength resonates, towards the surface direction radiation of light-emitting component.Known microresonator structure has one " laminated reflective film (multi-layer mirror) " between substrate and conductive layer, the light wave that can make particular color is by phase shift and the enhancing of resonating.
In the procedure for producing of reality, constantly have many in the undiscovered technical problem of laboratory R﹠D process.For example, often not good when producing the reflection multilayer membrane structure of above-mentioned microresonator because of tack between baseplate material and the coating, cause when carrying out depositing conducting layer or luminous organic material layer, multilayer film takes place to be peeled off or deteriorated result from substrate.
Summary of the invention
The main technical problem to be solved in the present invention is at the laminated reflective film tack of the microresonator of light-emitting component not good, and what solve it regular meeting takes place when depositing conducting layer and luminous organic material layer peels off or the problem of deterioration.
In order to achieve the above object, the invention provides a kind of processing procedure of laminated reflective film of microresonator of light-emitting component, may further comprise the steps:
(1), with the coating or the method for sputter, on the transparency carrier of a light-emitting component, add a kind of macromolecular compound of high penetration, or the inorganic thin film of high penetration, make it to constitute at least an interface resilient coating (buffer layer);
(2), then, on this interface resilient coating, add the film that multilayer has different refractivity, make it to constitute the laminated reflective film of a light-emitting component with the method for sputter.
On above-mentioned laminated reflective film top layer, a transparent electrode layer (transparent conductive layer), a luminescent layer (luminous layer) and a top electrode layer (metal mirror) be can further set up in regular turn, a light-emitting component or organic light emitting diode constituted whereby.
In the such scheme, the step of the laminated reflective film of described this light-emitting component of sputter also can be included in sputter one deck zinc sulphide-silica material (ZnS-SiO on this interface resilient coating
2) or/and layer of aluminum titanium nitrogen material (AlTiN).
In order to achieve the above object, the present invention also provides a kind of reflection multilayer membrane structure of microresonator of light-emitting component, between substrate and laminated reflective film, add one deck in order to increase the film of attached outstanding power, here be called interface resilient coating (buffer layer), this layer is the macromolecular compound of tool high penetration, or the inorganic thin film of high penetration is formed.
In the such scheme, described laminated reflective film can contain one deck zinc sulphide-silica at least or/and layer of aluminum titanium nitrogen.
As from the foregoing, structure of the present invention and processing procedure thereof are to add a bed boundary resilient coating in order to increase the film of adhesive force between substrate and laminated reflective film, the adding of resilient coating whereby, can improve adhesive force, make processing procedure stable easily, thereby prevent that the problem that presents deterioration in the element processing procedure from taking place.
Description of drawings
Fig. 1 is known OLED element basic structure;
Fig. 2 is the light emitting element structure of implementing according to the present invention.
Embodiment
In order to allow above-mentioned and other purposes of the present invention, feature and advantage become apparent more, some preferred embodiments cited below particularly, and cooperate appended diagram to describe in detail.
Shown in Figure 1, be the basic structure of a known OLED element, comprising: a transparency carrier 10 and a microresonator 20.Wherein microresonator 20 is to add a laminated reflective film 22, a transparent electrode layer 23, a luminous material layer 24 and a top electrode layer 25 (being a metallic reflector, metal mirror) on transparency carrier 10 in regular turn.
Add a bias voltage between transparent electrode layer 23 and top electrode layer 25, each injects since both positive and negative polarity to make electric hole in the luminous material layer 24 and electronics, and under electric field action, makes electric hole and electronics mobile in opposite directions; When electric hole and electronics meet when combining at luminous material layer 24, because of the generation light wave that gives off energy.The luminous color of element depends mainly on the organic material that has fluorescent property in the element, and OLED can sneak into the luminous efficiency that improves element in the host emitter with a spot of guest emitter in addition, and can make luminous color across whole visible region.
Laminated reflective film 22 is located between transparency carrier 10 and the transparent electrode layer 23, the direct evaporation of method that can chemical vapor deposition is on transparency carrier 10, the generation multilayer has the film of different refractivity (refractive index) and makes, by the collocation of thickness and refractive index, the light that makes specific wavelength by the time because of the overlapping resonance of phase-shifted (phase sfift).Utilize the principle of this resonance, the three primary colors light intensities such as red, green and indigo plant of color OLED screen are increased.
In theory, the rete of laminated reflective film 22 reinforced effects at most is good, but finds at the knowhow of reality: rete the more then production difficulty is higher, and laminated reflective film 22 is easier to be peeled off from transparency carrier 10; Simultaneously known evaporation coating method productive rate is slow, and equipment is expensive, unfavorable expansion production.Yet if change, can reduce equipment cost, and improve the equipment productive rate with sputter process.
Shown in Figure 2, be foundation preferred embodiment of the present invention.The difference of present embodiment and at present known OLED structure maximum is: increase by one interface resilient coating 21 between laminated reflective film 22 and the transparency carrier 10.According to the present invention, the manufacturing step of this structure comprises:
(1), with the coating or the method for sputter, add a kind of macromolecular compound on a transparency carrier 10 surfaces, or the inorganic thin film of high penetration with high penetration, make it to constitute at least an interface resilient coating 21;
(2), then, on this interface resilient coating 21, add the film that multilayer has different refractivity with the method for sputter again, make it to constitute the laminated reflective film 22 of a light-emitting component.
On above-mentioned laminated reflective film 22 top layers, set up a transparent electrode layer 23, a luminous material layer 24 and a top electrode layer 25 in regular turn, can form the main-body structure of a light-emitting component or Organic Light Emitting Diode.About the material and the processing procedure of laminated reflective film 22, though related to the present invention, be not purpose of the present invention and emphasis, the reader can know clearly and join United States Patent (USP) the 5th, 405, No. 710,5,814, No. 416 or invention such as 6,278, No. 236 grades.In disclosed each patent case, for the existing quite detailed introduction of the stock of each rete, but for the problem of reaching or being disclosed of main purpose of the present invention, special introduction is not but all arranged or provide the teaching of usefulness.
The material of transparency carrier 10 can be selected the nature of glass or perspex manufacturing for use.If adopt the good polycarbonate (Polycarbonate) of light transmission as baseplate material, in order to reach purpose of the present invention, can be at its surperficial spin coating or sputter one interface resilient coating 21.Interface resilient coating 21 can be selected the macromolecular material of high transparent for use, or the inorganic material of high transparent; Model SD-101 or the SD-715 macromolecule glue (lacquer) produced of spin coating one deck Japan DIC company for example confirmed the effect of resilient coating (buffer layer) among the present invention in production test.
Constitute after resilient coating 21 films of interface, continue to replace repeatedly again the material of evaporation or sputter differing refraction indices (Refractive Index) on the surface as laminated reflective film 22.For example: wherein odd-level (A) is Si
xN
yFilm, even level (B) is SiO
2Film; Or to make odd-level (A) wherein be SiO
2Film, even level (B) is Si
xN
yFilm also can.The thickness of sputter should be kept: about λ/4n; Wherein:
λ: light wavelength
N: the refractive index of material (Refractive Index)
The processing procedure after resilient coating 21 films of relevant interface or the discovery of material are not emphasis of the present invention, and the reader can consider United States Patent (USP) the 5th, 405 voluntarily in light of actual conditions, and No. 710,5,814, No. 416 or 6,278, the technology of invention such as No. 236 is implemented.
According to the present invention, between transparency carrier 10 and laminated reflective film 22, increase by an interface resilient coating 21 and can increase adhesive force, make processing procedure stable.Below utilize two groups of specimen contrasts, by 40 ounces/inch of adhesion strengths
2(oz/inch
2) adhesive tape after the laminated reflective film on two groups of specimen 22 pastes jails, draw back, carry out the adhesive force test, obtain following comparing result:
Annotate: above " A " representative: Si
xN
yFilm, " B " representative: SiO
2Film.
| The number of plies | The rete structure | The laminated reflective film of no interface resilient coating | The laminated reflective film that the interface resilient coating is arranged |
| One deck | A | 100% passes through | 100% passes through |
| Two layers | A/B | 100% passes through | 100% passes through |
| Three layers | A/B/A | 100% passes through | 100% passes through |
| Four layers | A/B/A/B | 50% passes through | 100% passes through |
| Five layers | A/B/A/B/A | 50% passes through | 100% passes through |
| Six layers | A/B/A/B/A/B | 50% passes through | 100% passes through |
| Seven layers | A/B/A/B/A/B/A | 50% passes through | 100% passes through |
The sputter thickness maintains: thickness is about λ/4n
Via above-mentioned test, prove the interface resilient coating that the present invention increases between transparency carrier and laminated reflective film, can increase adhesive force, make processing procedure stable.
The present invention with preferred embodiment openly as above; right its purpose is not in order to limit the present invention; anyly have the knack of this invention operator, without departing from the spirit and scope of the present invention, equivalence design and the retouching done must be included in the scope of patent protection of the present invention.
Claims (16)
1, a kind of laminated reflective film processing procedure of microresonator of light-emitting component is characterized in that may further comprise the steps at least:
(a) on the transparency carrier of a light-emitting component, add an interface resilient coating; And
(b) on this interface resilient coating, add the film that multilayer has different refractivity with the method for sputter, make it to constitute the laminated reflective film of this light-emitting component.
2, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1, it is characterized in that described interface resilient coating is to be added on this transparency carrier with the coating or the method for sputter, increases the adhesive force of this laminated reflective film to this transparency carrier by this interface resilient coating.
3, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1, it is characterized in that the described interface resilient coating that is added on this transparency carrier, be meant the macromolecular compound that adds a kind of high penetration, increase the adhesive force of this laminated reflective film this transparency carrier by this interface resilient coating.
4, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1, it is characterized in that the described interface resilient coating that is added on this transparency carrier, be meant the inorganic thin film that adds a kind of high penetration, increase the adhesive force of this laminated reflective film this transparency carrier by this interface resilient coating.
5, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1 is characterized in that the step of the laminated reflective film of described this light-emitting component of sputter being included in sputter one deck zinc sulphide-silica material on this interface resilient coating.
6, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1 is characterized in that the laminated reflective film of described this light-emitting component of sputter being included in sputter layer of aluminum titanium nitrogen material on this interface resilient coating.
7, the laminated reflective film processing procedure of the microresonator of light-emitting component according to claim 1 is characterized in that described light-emitting component is meant an organic electric exciting light-emitting diode.
8, a kind of reflection multilayer membrane structure of microresonator of light-emitting component is formed at the surface of a transparency carrier, it is characterized in that comprising at least:
One interface resilient coating; And
One laminated reflective film increases the adhesive force of this laminated reflective film to this transparency carrier by this interface resilient coating.
9, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described interface resilient coating is the macromolecular compound of one deck high penetration.
10, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described interface resilient coating is the inorganic thin film of one deck high penetration.
11, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that what described laminated reflective film was made up of the material of two kinds of differing refraction indices.
12, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described laminated reflective film contains one deck zinc sulphide-silica at least.
13,, it is characterized in that describedly containing layer of aluminum titanium nitrogen at least at this laminated reflective film as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8.
14, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described transparency carrier is meant a nature of glass substrate.
15, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described transparency carrier is meant a polycarbonate substrate.
16, as the reflection multilayer membrane structure of the microresonator of light-emitting component as described in the claim 8, it is characterized in that described light-emitting component is meant an organic electric exciting light-emitting diode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021429251A CN1484349A (en) | 2002-09-16 | 2002-09-16 | Multi-layer reflection film for micro-resonant carity of luminous component and its mfg process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021429251A CN1484349A (en) | 2002-09-16 | 2002-09-16 | Multi-layer reflection film for micro-resonant carity of luminous component and its mfg process |
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|---|---|
| CN1484349A true CN1484349A (en) | 2004-03-24 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7692379B2 (en) | 2005-02-07 | 2010-04-06 | Samsung Electronics Co., Ltd. | Display device with reflective structure for improved light emission |
| CN103928634A (en) * | 2014-03-24 | 2014-07-16 | 京东方科技集团股份有限公司 | Organic electroluminescence device, and manufacturing method and display device thereof |
| CN113167934A (en) * | 2018-11-30 | 2021-07-23 | 索尼集团公司 | Display device |
-
2002
- 2002-09-16 CN CNA021429251A patent/CN1484349A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7692379B2 (en) | 2005-02-07 | 2010-04-06 | Samsung Electronics Co., Ltd. | Display device with reflective structure for improved light emission |
| CN103928634A (en) * | 2014-03-24 | 2014-07-16 | 京东方科技集团股份有限公司 | Organic electroluminescence device, and manufacturing method and display device thereof |
| CN103928634B (en) * | 2014-03-24 | 2016-05-25 | 京东方科技集团股份有限公司 | Organic electroluminescence device and preparation method thereof, display unit |
| CN113167934A (en) * | 2018-11-30 | 2021-07-23 | 索尼集团公司 | Display device |
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