CN1481007A - Tool for testing repeatability and reproducibility of measuring shearing force of stay, ball and wafer - Google Patents

Tool for testing repeatability and reproducibility of measuring shearing force of stay, ball and wafer Download PDF

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Publication number
CN1481007A
CN1481007A CNA021368465A CN02136846A CN1481007A CN 1481007 A CN1481007 A CN 1481007A CN A021368465 A CNA021368465 A CN A021368465A CN 02136846 A CN02136846 A CN 02136846A CN 1481007 A CN1481007 A CN 1481007A
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China
Prior art keywords
arm
testing apparatus
magnetic force
shearing
stress
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CNA021368465A
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CN1225775C (en
Inventor
简维廷
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Shanghai Corp
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Priority to CN 02136846 priority Critical patent/CN1225775C/en
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Publication of CN1225775C publication Critical patent/CN1225775C/en
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Measuring is carried out by the provided testing tool, which includes a base, an arm, a scale, and a magnetic force generation unit. The base possesses a support bar, and the arm is rotatable fixed on the support bar. The scale is formed on the arm for the tool to apply force. The magnetic force generation unit installed in the base generates adjustable magnetic force in order to provide a pulling force to pull one end of the arm. Thus, the tool applies a proper force making the arm release up from the magnetic force generation unit.

Description

The repeatability of backguy, ball shearing and wafer shearing force measurement and reproducibility testing tool
Technical field
The present invention refers to repeatability and reproducibility testing apparatus that a kind of backguy, ball shearing and wafer shearing etc. are measured especially about a kind of testing apparatus.
Background technology
Except chip package (FC, flip-chip) outside, most other encapsulation, for example little stack package (SOP, small outline package), ultra-thin stack package (TSOP, thin small outline package), four limit pin package (QFP, quad flat package) and plasticity ball lock array package (PBGA) etc. all need to be applied to routing (wire-bonding) operation.For confirming the quality and the reliability (reliability) of packaging body, (WP wire-pull) tests the step that necessitates with wafer shearing (DS, die shear) in backguy.In addition, for ball attached type encapsulation, for example plasticity ball lock array package (PBGA) and chip package (FC), ball shearing (BS, ball shear) test also is the testing procedure that institute must use in the processing procedure for all encapsulation dealers.Below will (WP wire-pull) does a representational simple narration with ball shearing test (BS, ball shear) etc. to the applied backguy of present industry test.
See also Fig. 1, it is known backguy test (WP) schematic diagram.Backguy test (WP) is the index that a measurement engages (bond) quality, and it mainly is in order to test the bond strength (strength of thebond) in vertical direction or to calculate bond strength distribution (bond strength distributions).Backguy test (WP) can be applied to by scolding tin (soldering), hot compression (thermocompression), ultrasonic waves (ultrasonic) or line that other correlation techniques engaged to wafer engage (wire-to-die bond), substrate is engaged (wire-to-substrate) with line or line engages the lead welding in the microelectronic device package body, it also can be in the joint test of microelectronic device package external body, and for example terminal is to substrate (terminals-to-substrate) ... etc.As shown in Figure 1, backguy test (WP) provides a suitable and specific vertical stress in engaging (bond), spongy lead (lead wire) or terminal places such as (terminals) by a clamp hook device 11, with the measurement bond strength, and then can recognize quality and the reliability that encapsulates finished product.
See also Fig. 2, it is known ball shearing (BS) test schematic diagram.Ball shearing (BS) test also is the index that a measurement engages (bond) quality, it is in order to the bond strength between measurement ball bond (ball bond) or contract type joint (wedge bond) and a wafer composition surface (die bonding surface), that is the bond strength of horizontal direction.The bond strength of ball shearing (BS) test gained can represent that metal bond whether perfect and aluminium routing (aluminum wire bonds) to wafer or encapsulate the joint quality of composition surface.As shown in Figure 2, ball shearing (BS) test is clamped on sample to be tested on the same product fixing device earlier, provide a proper level direction shearing to locate to make it to break away from weld pad (bond pad) by a shearing generator 21 again in ball bond (ball bond), to measure the bond strength between ball bond and weld pad, can further recognize the quality and the reliability of encapsulation finished product by this.
Yet above-mentioned test all has destructiveness to tested sample, so will make repeatability (Repeatability) research more difficult.Repeatability and reproducibility (R﹠amp; R) be to be an index, represent a testing apparatus under absolute identical test condition with the result difference degree after identical part or the sample retest.Whether the purpose of repetitive research is to stablize in a tolerance interval or in a short time in variation within this measuring equipment for determining.
Repetitive research must be in a very short time with same sample test repeatedly, yet above-mentioned test all has destructiveness to tested sample, thereby make repetitive research become more difficult.After each correction, repeatability and reproducibility (R﹠amp; R) research is to be used for determining to proofread and correct errorless necessity report.At present, all encapsulation dealers very briefly to the not collinear repetitive research of doing backguy test (WP), so will cause deviation because be not each bar line all be identical, and nobody can prove that such variation is an acceptable.Therefore, such simulation is wrong, and if during line and line widely different, may have bigger error and produce.
Summary of the invention
Main purpose of the present invention is for providing a kind of simple testing tool design to overcome the shortcoming of aforementioned wrong simulation.
A further object of the present invention is for providing a kind of testing tool of novelty, the repeatability and the reproducibility research of backguy, ball shearing and wafer shearing force measurement can be undertaken by testing tool of the present invention, and be replaced in and carry out the damage type test on the true routing (wirebond), therefore can save many costs (for example Ce Shi sample) and time (for example making the time of sample).
Repeatability and the reproducibility testing tool design of another object of the present invention for a kind of backguy, ball shearing and wafer shearing force measurement are provided, can be by selecting suitable specification and magnetic field size, and make the repeatability of tests such as backguy and reproducibility research are applied to wider correcting range.
Another purpose of the present invention is for providing a kind of testing apparatus, and it is applied in the repeatability and reproducibility test of backguy, ball shearing and wafer shearing force measurement, and wherein this backguy, ball shearing and wafer shearing force measurement are undertaken by a stress generator.This testing apparatus comprises: a base, and it has a support bar; One arm, it is fixed on this support bar axle turnablely; And a magnetic force generation device, it is arranged at this base, in order to produce the magnetic force that can modulate, so that an end of this arm of pulling force drawing to be provided.Use, this stress generator must provide the ad-hoc location of a stress in this arm, makes this end of this arm break away from this magnetic force generation device.
According to conception of the present invention, wherein this testing apparatus also comprises a flexible member, it is arranged on the position of this base with respect to this magnetic force generation device, with when this arm breaks away from the pulling force of this magnetic force generation device, provides an elastic restoring force to cushion the impact of this arm.
According to conception of the present invention, wherein this testing apparatus also comprises a connector, in order to connect this arm and this support bar, in order to do making this arm be able to be pivoted at this support bar in X and Y direction.
According to conception of the present invention, wherein this magnetic force generation device is the magnetic force of variation to provide this to modulate by its electric current.
According to conception of the present invention, wherein this testing apparatus also comprises a plurality of scales, and it is formed on this arm, in order to different correcting ranges to be provided.
According to conception of the present invention, wherein this ad-hoc location for these a plurality of scales one of them.
According to conception of the present invention, wherein each this scale has a hollow hump.
According to conception of the present invention, wherein each this scale has a depression scale in its bottom.
Repeatability and the reproducibility testing apparatus of another purpose of the present invention for a kind of backguy, ball shearing and wafer shearing force measurement are provided, wherein this backguy, ball shearing and wafer shearing force measurement are undertaken by a stress generator.This testing apparatus comprises: a base, and it has a support bar; One arm, it is fixed on this support bar axle turnablely; At least one scale, it is formed on this arm, uses for this stress generator and executes a stress; And a magnetic force generation device, it is arranged at this base, in order to produce the magnetic force that can modulate, so that an end of this arm of pulling force drawing to be provided.Use, when this answers power apparatus to execute this stress, make this end of this arm break away from this magnetic force generation device.
Another purpose of the present invention is for providing a kind of repeatability and reproducibility testing apparatus, and it is applied in backguy, ball shearing and the wafer shearing force measurement.This repeatability and reproducibility testing apparatus comprise: a stress generator, in order to the stress of backguy test to be provided; One base, it has a support bar; One arm, it is to be fixed on this support bar axle turnablely; And at least one scale, it is formed on this arm, uses for this stress generator and executes a stress; And a magnetic force generation device, it is arranged at this base, in order to produce the magnetic force that can modulate, so that an end of this arm of pulling force drawing to be provided.So, when this answers power apparatus to execute this stress, make this end of this arm break away from this magnetic force generation device.
According to conception of the present invention, wherein this stress generator is a clamp hook device or a shearing generator.
Description of drawings
The present invention can get a more deep understanding by following graphic and detailed description:
Fig. 1: it is known backguy test schematic diagram.
Fig. 2: it is known ball shearing test schematic diagram.
Fig. 3: it is the repeatability and the reproducibility testing apparatus structural representation of the backguy of preferred embodiment of the present invention, ball shearing and wafer shearing force measurement.
Fig. 4 (a): it is applied to the structural representation of backguy test for the repeatability of preferred embodiment of the present invention and reproducibility testing apparatus.
Fig. 4 (b): it is applied to the structural representation of ball shearing test for the repeatability of preferred embodiment of the present invention and reproducibility testing apparatus.
Embodiment
See also Fig. 3, it is the repeatability and the reproducibility testing apparatus structural representation of the backguy of preferred embodiment of the present invention, ball shearing and wafer shearing force measurement.As shown in Figure 3, testing apparatus of the present invention is made up of with a plurality of scale 34 base 31, a magnetic force generation device 32, an arm 33.As shown in Figure 3, this arm 33 is arranged on the support bar 35 of this base 31, and can be pivoted at this support bar 35 by a connector 36 on X and Y direction.Connector 36 can bear the strength from X and Y direction.This magnetic force generation device 32 can produce a magnetic field, in order to provide a magnetic force in this arm 33.The visual actual needs in the magnetic field of this magnetic force generation device 32 and adjusting, so this magnetic force also can change with the need.Scale 34 is arranged on this arm 33, and each this scale 34 has a hollow hump and also or in this whenever has a depression scale (not shown) according to the bottom of scale.Be provided with a spring 37 on this base 31 in addition, it is with respect to this magnetic force generation device 32.When this spring 37 overcomes magnetic force generation device 32 pulling force when this arm because of outside shearing or pulling force, can provide an elastic force to reduce arm 33 impacts changeed of axle suddenly.
In embodiments of the invention,, use less magnetic field to get final product for the backguy test; Yet, need to use bigger magnetic field to ball shearing and the test of wafer shearing.
See also Fig. 4 (a), it is applied to the structural representation of backguy test for the repeatability of preferred embodiment of the present invention and reproducibility testing apparatus.Shown in Fig. 4 (a), when repeatability of carrying out the backguy measurement and reproducibility research, earlier backguy is tested hollow hump that employed clamp hook device 41 passes the specific scale on the arm 33 also or contact the depression scale of this specific scale bottom surface, and magnetic force generation device 32 can provide carry out of a fixing and suitable downward pulling force in order to the backguy test.When clamp hook device 41 strength of drawing of executing makes this arm 33 break away from the pulling force in this magnetic field, can obtain a corresponding bond strength value.After repeating repeatedly, can obtain one group of test number, and then finish repeatability and reproducibility research that backguy is measured, so can avoid sample is produced repeatability and the reproducibility research difficulty that destruction is caused in identical condition.
Different scale 34 designs are to proofread and correct required range for providing.Suppose, the fixing magnetic field that produced of magnetic force generation device 32, but then when desire the p-wire bond strength between F/Lb and F/Lh the time scale of chosen position B to the H of position to proofread and correct the backguy measurement system (wherein, F is the vertical direction magnetic force that magnetic force generation device 32 is produced, and Lb and Lh are respectively position B to the distance of position H from connector 36).By the repeatability definition as can be known, when carrying out repetitive research, must in the very short time, finish.Therefore can ignore the variation of magnetic field size.
See also Fig. 4 (b), it is applied to the structural representation of ball shearing test for the repeatability of preferred embodiment of the present invention and reproducibility testing apparatus.Shown in Fig. 4 (b), when repeatability of carrying out the spheric stress measurement and reproducibility research, can test employed shearing generator 42 by the ball shearing the specific scale of a shearing on arm 33 is provided, and the carrying out that magnetic force generation device 32 can provide a fixing and suitable inside pulling force to test in order to the ball shearing.When the shearing of being executed when shearing generator 42 makes this arm 33 break away from the inside pulling force in these magnetic fields, can obtain a corresponding bond strength value.After repeating repeatedly, can obtain one group of test number, and then finish repeatability and reproducibility research that backguy is measured, so also can avoid sample is produced repeatability and the reproducibility research difficulty that destruction is caused in identical condition.
In sum, the present invention includes a simple design to overcome the shortcoming of known error simulation, and repeatability and reproducibility research can be undertaken by testing apparatus of the present invention, be replaced in and carry out the damage type test on the true routing (wire bond), therefore can save many costs (for example, the sample of test) and time (for example making the time of sample).Design of the present invention can be by selecting suitable specification and magnetic field size, and make the repeatability of tests such as backguy and reproducibility research are applied to wider correcting range.
In addition, the present invention also has following novelty and progressive various advantages:
Therefore 1. the magnetic force generation device can be adjusted magnetic field by the variation of its electric current, by testing apparatus of the present invention, can provide different and suitable stress in backguy, ball shearing and wafer shearing force measurement simultaneously.Because the required stress of backguy test is tested less than ball shearing and wafer shearing usually.
2. testing apparatus of the present invention can get the best simulation of backguy, ball shearing and wafer shearing force measurement.
3. testing apparatus of the present invention can provide the repeatability and the reproducibility report of backguy, ball shearing and wafer shearing force measurement simultaneously.
The present invention can appoint and executes that the craftsman thinks and be to modify as all by being familiar with present technique field person, does not take off as attached claim scope.

Claims (11)

1, a kind of testing apparatus, it is applied in the repeatability and reproducibility test of backguy, ball shearing and wafer shearing force measurement, and wherein this backguy, ball shearing and wafer shearing force measurement are undertaken by a stress generator, and this testing apparatus comprises:
One base, it has a support bar;
One arm, it is fixed on this support bar axle turnablely; And
One magnetic force generation device, it is arranged at this base, in order to producing the magnetic force that can modulate, so that an end of this arm of pulling force drawing to be provided,
So, when this stress generator provides the ad-hoc location of a stress in this arm, make this end of this arm be broken away from this magnetic force generation device.
2, testing apparatus as claimed in claim 1, it is characterized in that, this testing apparatus also comprises a flexible member, it is arranged on the position of this base with respect to this magnetic force generation device, with when this arm breaks away from the pulling force of this magnetic force generation device, provide an elastic restoring force to cushion the impact of this arm.
3, testing apparatus as claimed in claim 1 is characterized in that, this testing apparatus also comprises a connector, to connect this arm and this support bar, so that this arm is able to be pivoted at this support bar in X and Y direction.
4, testing apparatus as claimed in claim 1 is characterized in that, this magnetic force generation device is by the magnetic force of variation to provide this to modulate of its electric current.
5, testing apparatus as claimed in claim 1 is characterized in that, this testing apparatus also comprises a plurality of scales, and it is formed on this arm, in order to different correcting ranges to be provided.
6, testing apparatus as claimed in claim 5 is characterized in that, this ad-hoc location for these a plurality of scales one of them.
7, testing apparatus as claimed in claim 5 is characterized in that, each this scale has a hollow hump.
8, testing apparatus as claimed in claim 5 is characterized in that, each this scale has a depression scale in its bottom.
The repeatability of 9, a kind of backguy, ball shearing and wafer shearing force measurement and reproducibility testing apparatus, wherein this backguy, ball shearing and wafer shearing force measurement are undertaken by a stress generator, and this testing apparatus comprises:
One base, it has a support bar;
One arm, it is fixed on this support bar axle turnablely;
At least one scale, it is formed on this arm, uses for this stress generator and executes a stress; And
One magnetic force generation device, it is arranged at this base, in order to producing the magnetic force that can modulate, in order to do so that an end of this arm of pulling force drawing to be provided,
So, when this answers power apparatus to execute this stress, make this end of this arm break away from this magnetic force generation device.
10, a kind of renaturation and reproducibility testing apparatus, it is applied in backguy, ball shearing and the wafer shearing force measurement, and repeatability comprises with the reproducibility testing apparatus:
One stress generator is in order to provide the stress of backguy test;
One base, it has a support bar;
One arm, it is fixed on this support bar axle turnablely;
At least one scale, it is formed on this arm, uses for this stress generator and executes a stress; And
One magnetic force generation device, it is arranged at this base, in order to producing the magnetic force that can modulate, so that an end of this arm of pulling force drawing to be provided,
So, when this answers power apparatus to execute this stress, make this end of this arm break away from this magnetic force generation device.
11. repeatability as claimed in claim 10 and reproducibility testing apparatus is characterized in that, this stress generator is a clamp hook device or a shearing generator.
CN 02136846 2002-09-06 2002-09-06 Tool for testing repeatability and reproducibility of measuring shearing force of stay, ball and wafer Expired - Fee Related CN1225775C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02136846 CN1225775C (en) 2002-09-06 2002-09-06 Tool for testing repeatability and reproducibility of measuring shearing force of stay, ball and wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02136846 CN1225775C (en) 2002-09-06 2002-09-06 Tool for testing repeatability and reproducibility of measuring shearing force of stay, ball and wafer

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CN1481007A true CN1481007A (en) 2004-03-10
CN1225775C CN1225775C (en) 2005-11-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102265229A (en) * 2008-10-22 2011-11-30 意法半导体(格勒诺布尔)有限公司 Method for an improved checking of repeatability and reproducibility of a measuring chain, in particular for the quality control by means of the semiconductor device testing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102265229A (en) * 2008-10-22 2011-11-30 意法半导体(格勒诺布尔)有限公司 Method for an improved checking of repeatability and reproducibility of a measuring chain, in particular for the quality control by means of the semiconductor device testing
CN102265229B (en) * 2008-10-22 2015-01-28 意法半导体(格勒诺布尔)有限公司 Method for an improved checking of repeatability and reproducibility of a measuring chain in a measuring system

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CN1225775C (en) 2005-11-02

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Address after: 201203 No. 18 Zhangjiang Road, Shanghai

Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation

Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation

Address before: 201203 No. 18 Zhangjiang Road, Shanghai

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Granted publication date: 20051102

Termination date: 20180906