CN1479327A - High impedance large current piece type magnetic pearl and its manufacturing method - Google Patents
High impedance large current piece type magnetic pearl and its manufacturing method Download PDFInfo
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- CN1479327A CN1479327A CNA031397298A CN03139729A CN1479327A CN 1479327 A CN1479327 A CN 1479327A CN A031397298 A CNA031397298 A CN A031397298A CN 03139729 A CN03139729 A CN 03139729A CN 1479327 A CN1479327 A CN 1479327A
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Abstract
The invented bead includes electrode, ferrite basis material and several wires not staggered each other. Two ends of wires are extended to two ends of ferrite basis material and parallel connected to two electrodes. Characters are that several wires are setup between diaphragms, and each lead between upper and lower diaphragms are connected in serial. The ends of wires from top diaphragm and bottom diaphragm are connected in parallel. Based on needs of impedance value, the length, width of leads and margin can be designed. Comparing with plane and mono layer type, the invented bead provides large impedance value (larger than 120 omega) and large current value. Product with different impedance values can be made to meet needs of different equipments.
Description
Technical field
What the present invention relates to is a kind of magnetic bead of architecture advances, especially a kind of high resistant Chinese People's Anti-Japanese Military and Political College's current mode chip magnetic bead and manufacture method thereof.
Hold the art background
Since the late nineteen eighties, be that the electronics and information industry of representative has obtained fast development with electronic computer and communication etc.Electronic equipment is advanced by leaps and bounds towards miniaturization, lightweight, high performance direction, and the high density surface mounting technique more and more comes into one's own, and has promoted microminaturization, the chip type, integrated of all kinds of electronic devices and components greatly.But the chip components and parts size is more and more littler, and its electric current that bears is also more and more littler, has just limited the utilization of chip magnetic bead in the filtering of complete electronic set power unit.(because power unit the moment of switch surge current very big), therefore, just must study that a kind of size is little, resistance value is high, bear the magnetic bead of big electric current.The forming method of making the chip magnetic bead at present has two kinds substantially: a kind of is pure dry process, and another kind is pure wet processing, and wet method generally adopts curtain coating mode moulding diaphragm.The Chinese invention patent publication number be CN:1189678A's " a kind of magnetic bead of the anti-high magnitude of current and manufacture method thereof " be exactly a kind of chip type magnetic bead that can bear big electric current.This invention magnetic bead is made of several layers of ferrite base material and interior lead thereof, and characteristics are to have several (two or more) not staggered mutually lead to extend to ferritic base material end face, and the free end of lead is in parallel by electrically directly forming of two termination electrodes.The ferrite inside conductor is not staggered mutually, with the resistance value of control magnetic bead, is electrically connected with its parallel connection, to reduce its D.C. resistance by two end electrodes by the lead free end.The purpose of this invention is the mode by the D.C. resistance that reduces magnetic bead, reaches the effect that improves the anti-electric current of magnetic bead.From the content analysis of this patent disclosure as seen, the magnetic bead of this structure is staggered mutually individual layer planar structure owing to be arranged on the interior lead of ferrite, and directly draws on same plane, so it can't make lead do length, resistance value can't be done height, and high impedance can only arrive 120 Ω.And there is different requirements in market to big current mode magnetic bead, is not being met greater than the demand of 120 Ω resistance values.
Summary of the invention
The objective of the invention is at above-mentioned magnetic bead because of structural design not science be directed at the moon, deficiency that resistance value is low, high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead and the manufacture method thereof of a kind of impedance greater than 120 Ω are provided.
High resistant of the present invention Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead, comprise: electrode, the lead that ferrite base material and several set within it and do not interlock mutually, it is in parallel with the electrode at two ends that the two ends of this several wires all extend to ferrite base material two ends, it is characterized in that: described ferrite base material is by bedding iron oxysome diaphragm, ferrite diaphragm and top layer ferrite diaphragm stack the structure that lamination forms in the middle of the multilayer, described several wires is separately positioned between each diaphragm, the corresponding one by one serial connection of each lead between the levels diaphragm, be that lead one end between the ground floor diaphragm extends to the diaphragm end and draws, second layer lead one end corresponding between the other end of lead and following skim sheet connects, the other end of second layer lead is connected with the corresponding end of descending the 3rd layer conductor between skim sheet again, by that analogy, lead one end between bottom diaphragm extends to the diaphragm end and draws, and derivative conductor wire end forms the parallel connection of each lead between bedding iron oxysome diaphragm and top layer ferrite diaphragm by the electric connection of electrode.
Several wires between described each diaphragm is shaped as straight line or curve.
The manufacture method of high resistant of the present invention Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead is: the mode moulding diaphragm that adopts silk screen printing, the material of diaphragm is NiCuZn ferrite slurry, printed coil silver conductor on the ferrite diaphragm, again make which floor diaphragm as upper substrate thereafter, through cutting, burn till etc. after the operation, promptly get the chip magnetic bead.Its method is as follows:
1, preparation one bedding iron oxysome diaphragm;
2, print the ground floor lead on bedding iron oxysome diaphragm, an end of ground floor lead extends to an end of this ferrite diaphragm and draws, and is used for the connection of electrode, and the other end of ground floor lead is the link of following layer conductor;
3, be printed on the middle ferrite diaphragm of printing one deck on the bedding iron oxysome diaphragm of ground floor lead, this centre ferrite diaphragm leaves for its preformed hole that is connected with following layer conductor corresponding to the link of ground floor lead on the bedding iron oxysome diaphragm;
4, print second layer lead on middle ferrite diaphragm, an end of second layer lead is connected with last ground floor wire connecting ends by the preformed hole on the middle ferrite diaphragm, and the other end of second layer lead is the link with following layer conductor;
5, republish ferrite diaphragm in the middle of one deck on the middle ferrite diaphragm of second layer lead being printed on, this centre ferrite diaphragm leaves its preformed hole that is connected with following layer conductor of confession corresponding to the link of second layer lead on the ferrite diaphragm in the middle of the upper strata;
6, print the 3rd layer conductor on middle ferrite diaphragm, an end of the 3rd layer conductor is connected with second layer wire connecting ends by the preformed hole on the middle ferrite diaphragm, and the other end of the 3rd layer conductor is the link with following layer conductor;
7, according to the number of plies of the required anti-magnitude of current and middle ferrite diaphragm and lead, repeat above-mentioned 3-6 step;
8, lead one end of in the end printing on the ferrite diaphragm in the middle of one deck is connected with topping wire, and the other end extends to an end of this ferrite diaphragm and draws, and is used for the connection of electrode;
9, in the end print top layer ferrite diaphragm on the middle ferrite diaphragm of one deck;
10, the ferrite base material two ends of the lamination structure that forms at above-mentioned bedding iron oxysome diaphragm, middle ferrite diaphragm and top layer ferrite diaphragm are provided with electrode respectively, and electrically connect with the exit of lead, promptly make the magnetic bead that has several parallel conducting wires in it.
The design principle of high resistant of the present invention Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead is: utilize on the basis of principle of shunting in parallel, adopted through hole transition method to realize the connection of upper and lower Different Plane upper conductor, the exit of lead is drawn from Different Plane respectively, the centre can require the number of plies that stacks of flexible design ferrite diaphragms be used for the more laying of long lead according to different resistance values, and the rapid method that promptly repeats steps 3-6 improves the length of solid conductor.
Improve the magnitude of current and the resistance value of chip magnetic bead with this scheme.
High resistant of the present invention Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead design science, rational in infrastructure, manufacture craft is simple, adopt the present invention program to require the flexible design conductor length according to different resistance values, and can be according to the different size requirement, design the magnetic bead of a series of anti-big electric current high impedance of different live widths and Liu Bian amount, changed the too anti-current value of resistance value that plane individual layer lead is drawn and receiving electrode institute can not reach, produce impedance greater than magnetic bead products 120 Ω, different high impedance value.To satisfy the use needs of distinct device.
The concrete structure and the manufacture method of high resistant of the present invention Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead are provided in detail by the following drawings and embodiment.
Description of drawings
Fig. 1 is the structural representation of high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead;
Fig. 2 is the high resistant current mode chip magnetic bead A-A of a Chinese People's Anti-Japanese Military and Political College position profile structural representation shown in Figure 1;
Fig. 3 is the high resistant current mode chip magnetic bead B-B of a Chinese People's Anti-Japanese Military and Political College position profile structural representation shown in Figure 1;
Fig. 4 is the high resistant current mode chip magnetic bead C-C of a Chinese People's Anti-Japanese Military and Political College position profile structural representation shown in Figure 1;
Fig. 5 is the high resistant current mode chip magnetic bead D-D of a Chinese People's Anti-Japanese Military and Political College position profile structural representation shown in Figure 1;
Fig. 6 is the high resistant current mode chip magnetic bead E-E of a Chinese People's Anti-Japanese Military and Political College position profile structural representation shown in Figure 1.
Embodiment
Embodiment: can be clear that from Fig. 1, high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead is made up of electrode 1, ferrite base material 2 and the not staggered mutually lead 3 that sets within it, described ferrite base material 2 stacks the structure that lamination forms by ferrite diaphragm 22,23,24,25 and top layer ferrite diaphragm 26 in the middle of bedding iron oxysome diaphragm 21, the multilayer, and 21,22,23,24,25,26 on each diaphragm is provided with not staggered mutually three leads 31,32,33. Levels diaphragm 21,22 ground floor lead 31,32,33 1 ends all extend to diaphragm 21,22 ends are drawn, for with electrode 1 electricity connection end, ground floor lead 31,32,33 the other end and following skim sheet 22,23 second layer lead 31a, 32a, 33a one end connects, second layer lead 31a, 32a, the other end of 33a and following skim sheet 23,24 the 3rd layer conductor 31b, 32b, 33b one end connects, the 3rd layer conductor 31b, 32b, the other end of 33b and following skim sheet 24,25 the 4th layer conductor 31c, 32c, 33c one end connects, the 4th layer conductor 31c, 32c, the other end of 33c and following skim sheet 25,26 layer 5 lead 31d, 32d, 33d one end connects, layer 5 lead 31d, 32d, the other end of 33d all extends to diaphragm 25,26 ends are drawn, for the electrode electricity connection end; Two electrodes 1 place the two ends of ferrite base material 2 to be connected with the wire connecting ends of drawing respectively, form the parallel connection of each lead.The manufacture method step (referring to Fig. 2) of above-mentioned high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead:
1, preparation one bedding iron oxysome diaphragm 21;
2, on bedding iron oxysome diaphragm 21, print ground floor lead 31,32,33, one end of ground floor lead 31,32,33 extends to an end of this ferrite diaphragm 21 and draws, be used for the connection of electrode, the other end of ground floor lead 31,32,33 is the link of following layer conductor;
3, be printed on the middle ferrite diaphragm 22 of printing one deck on the bedding iron oxysome diaphragm 21 of ground floor lead 31,32,33, this centre ferrite diaphragm 22 leaves for its preformed hole that is connected with following layer conductor corresponding to the link of ground floor lead 31,32,33 on the bedding iron oxysome diaphragm 21;
4, on middle ferrite diaphragm 22, print second layer lead 31a, 32a, 33a, the end of second layer lead 31a, 32a, 33a is connected with last ground floor lead 31,32,33 links by the preformed hole on the middle ferrite diaphragm 22, and the other end of second layer lead 31a, 32a, 33a is the link with following layer conductor;
5, republish ferrite diaphragm 23 in the middle of one deck on the middle ferrite diaphragm 22 of second layer lead 31a, 32a, 33a being printed on, this centre ferrite diaphragm 23 leaves confession itself and the preformed hole that is connected with layer conductor corresponding to the link of second layer lead 31a, 32a, 33a on the ferrite diaphragm 22 in the middle of the upper strata;
6, on middle ferrite diaphragm 23, print the 3rd layer conductor 31b, 32b, 33b, the end of the 3rd layer conductor 31b, 32b, 33b is connected with second layer lead 31a, 32a, 33a link by the preformed hole on the middle ferrite diaphragm 23, and the other end of the 3rd layer conductor 31b, 32b, 33b is the link with following layer conductor;
7, republish ferrite diaphragm 24 in the middle of one deck on the middle ferrite diaphragm 23 of the 3rd layer conductor 31b, 32b, 33b being printed on, this centre ferrite diaphragm 24 leaves its preformed hole that is connected with following layer conductor of confession corresponding to the link of the 3rd layer conductor 31b, 32b, 33b on the ferrite diaphragm 23 in the middle of the upper strata;
8, on middle ferrite diaphragm 24, print the 4th layer conductor 31c, 32c, 33c, the end of the 4th layer conductor 31c, 32c, 33c is connected with the 3rd layer conductor 31b, 32b, 33b link by the preformed hole on the middle ferrite diaphragm 24, and the other end of the 4th layer conductor 31c, 32c, 33c is the link with following layer conductor;
9, republish ferrite diaphragm 25 in the middle of one deck on the middle ferrite diaphragm 24 of the 4th layer conductor 31c, 32c, 33c being printed on, this centre ferrite diaphragm 25 leaves its preformed hole that is connected with following layer conductor of confession corresponding to the link of the 4th layer conductor 31c, 32c, 33c on the ferrite diaphragm 24 in the middle of the upper strata;
10, on middle ferrite diaphragm 25, print layer 5 lead 31d, 32d, 33d, the end of layer 5 lead 31d, 32d, 33d is connected with the 4th layer conductor 31c, 32c, 33c link by the preformed hole on the middle ferrite diaphragm 25, the other end of layer 5 lead 31d, 32d, 33d extends to an end of this ferrite diaphragm and draws, and is used for the connection of electrode;
11, print top layer ferrite diaphragm 26 on layer 5 lead 31d, 32d, 33 the middle ferrite diaphragm 25 being printed on;
12, ferrite base material 2 two ends of the lamination structure that forms at above-mentioned bedding iron oxysome diaphragm 21, middle ferrite diaphragm 22,23,24,25 and top layer ferrite diaphragm 26 are provided with electrode 1 respectively, from ferrite base material 2 double-end leads 31,32,33 respectively with electrode 1 electrically and connect, promptly make the magnetic bead that has several parallel conducting wires in it.
Claims (3)
1, a kind of high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead, comprise: electrode, the lead that ferrite base material and several set within it and do not interlock mutually, it is in parallel with the electrode at two ends that the two ends of this several wires all extend to ferrite base material two ends, it is characterized in that: described ferrite base material is by bedding iron oxysome diaphragm, ferrite diaphragm and top layer ferrite diaphragm stack the structure that lamination forms in the middle of the multilayer, described several wires is separately positioned between each diaphragm, the corresponding one by one serial connection of each lead between the levels diaphragm, be that lead one end between the ground floor diaphragm extends to the diaphragm end and draws, second layer lead one end corresponding between the other end of ground floor lead and following skim sheet connects, the other end of second layer lead connects with descending the 3rd corresponding between skim sheet layer conductor again, by that analogy, lead one end between bottom diaphragm extends to the diaphragm end and draws, and derivative conductor wire end forms the parallel connection of each lead between bedding iron oxysome diaphragm and top layer ferrite diaphragm by the electric connection of electrode.
2, according to the described high resistant of claim 1 Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead, it is characterized in that: the several wires between each diaphragm is shaped as straight line or curve.
3, the manufacture method of above-mentioned high resistant Chinese People's Anti-Japanese Military and Political College current mode chip magnetic bead is:
(1) preparation one bedding iron oxysome diaphragm;
(2) print the ground floor lead on bedding iron oxysome diaphragm, an end of ground floor lead extends to an end of this ferrite diaphragm and draws, and is used for the connection of electrode, and the other end of ground floor lead is the link of following layer conductor;
(3) be printed on the middle ferrite diaphragm of printing one deck on the bedding iron oxysome diaphragm of ground floor lead, this centre ferrite diaphragm leaves for its preformed hole that is connected with following layer conductor corresponding to the link of ground floor lead on the bedding iron oxysome diaphragm;
(4) print second layer lead on middle ferrite diaphragm, an end of second layer lead is connected with last ground floor wire connecting ends by the preformed hole on the middle ferrite diaphragm, and the other end of second layer lead is the link with following layer conductor;
(5) republish ferrite diaphragm in the middle of one deck on the middle ferrite diaphragm of second layer lead being printed on, this centre ferrite diaphragm leaves its preformed hole that is connected with following layer conductor of confession corresponding to the link of second layer lead on the ferrite diaphragm in the middle of the upper strata;
(6) print the 3rd layer conductor on middle ferrite diaphragm, an end of the 3rd layer conductor is connected with second layer wire connecting ends by the preformed hole on the middle ferrite diaphragm, and the other end of the 3rd layer conductor is the link with following layer conductor;
(7) according to the number of plies of the required anti-magnitude of current and middle ferrite diaphragm and lead, repeat above-mentioned steps;
(8) lead one end of in the end printing on the ferrite diaphragm in the middle of one deck is connected with topping wire, and the other end extends to an end of this ferrite diaphragm and draws, and is used for the connection of electrode;
(9) in the end print top layer ferrite diaphragm on the middle ferrite diaphragm of one deck;
(10) the ferrite base material two ends of the lamination structure that forms at above-mentioned bedding iron oxysome diaphragm, middle ferrite diaphragm and top layer ferrite diaphragm are provided with electrode respectively, and electrically connect with the exit of lead, promptly make the magnetic bead that has several parallel conducting wires in it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031397298A CN1479327A (en) | 2003-07-03 | 2003-07-03 | High impedance large current piece type magnetic pearl and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031397298A CN1479327A (en) | 2003-07-03 | 2003-07-03 | High impedance large current piece type magnetic pearl and its manufacturing method |
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| Publication Number | Publication Date |
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| CN1479327A true CN1479327A (en) | 2004-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA031397298A Pending CN1479327A (en) | 2003-07-03 | 2003-07-03 | High impedance large current piece type magnetic pearl and its manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103387388A (en) * | 2012-05-07 | 2013-11-13 | 深圳振华富电子有限公司 | Ferrite material, small large-current laminated-chip wideband magnetic beads, and preparation method thereof |
| CN104051126A (en) * | 2014-06-09 | 2014-09-17 | 深圳振华富电子有限公司 | Laminate type magnetic ball |
| CN113658789A (en) * | 2021-08-18 | 2021-11-16 | 广东风华邦科电子有限公司 | Preparation method for improving current resistance of sheet type multilayer thick silver magnetic bead |
-
2003
- 2003-07-03 CN CNA031397298A patent/CN1479327A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103387388A (en) * | 2012-05-07 | 2013-11-13 | 深圳振华富电子有限公司 | Ferrite material, small large-current laminated-chip wideband magnetic beads, and preparation method thereof |
| CN104051126A (en) * | 2014-06-09 | 2014-09-17 | 深圳振华富电子有限公司 | Laminate type magnetic ball |
| CN113658789A (en) * | 2021-08-18 | 2021-11-16 | 广东风华邦科电子有限公司 | Preparation method for improving current resistance of sheet type multilayer thick silver magnetic bead |
| CN113658789B (en) * | 2021-08-18 | 2024-03-29 | 广东风华邦科电子有限公司 | Preparation method for improving current resistance of sheet type multi-layer thick silver magnetic beads |
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