CN101059463A - Gas sensor chip, sensor and sensor chip production method - Google Patents
Gas sensor chip, sensor and sensor chip production method Download PDFInfo
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- CN101059463A CN101059463A CN 200710054450 CN200710054450A CN101059463A CN 101059463 A CN101059463 A CN 101059463A CN 200710054450 CN200710054450 CN 200710054450 CN 200710054450 A CN200710054450 A CN 200710054450A CN 101059463 A CN101059463 A CN 101059463A
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- gas sensor
- electrodes conduct
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- conduct band
- resistance heater
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Abstract
The invention relates to a gas sensor chip, comprising a sheet ceramic baseboard, an electrode conductive band, a resistance heater and a gas sensitive paint, wherein the electrode conductive band, the resistance heater and the gas sensitive paint via silk screen printing method are printed on the ceramic baseboard, the gas sensor chip can effectively reduce power consumption. And the silk screen printing method can significantly improve the producing efficiency and property consistence of the gas sensor. The invention also discloses a gas sensor with the gas sensor chip.
Description
Technical field
The invention belongs to the gas sensor technical field, relate in particular to gas sensor and its chip structure that adopts, and the preparation method of sensor chip.
Background technology
The structure of present existing gas sensor chip as shown in Figure 1, comprise the heating electrode 10 of the potential electrode 11 of spiral helicine metal platinum system, spiral helicine metal platinum system and spherical shell 12, heating electrode 10 is set among the potential electrode 11, heating electrode 10 does not contact with potential electrode 11, heating electrode 10 and potential electrode 11 all are arranged in the spherical shell 12, the contact conductor at potential electrode 11 two ends extends to outside the shell 12, and the contact conductor of heating electrode 10 1 ends extends to outside the shell 12.
The gas sensor chip of said structure, its heating electrode and potential electrode are spiral helicine platinum filament, this just makes the power consumption of gas sensor chip bigger, and heating electrode need be set among the potential electrode, just need manual operations when producing this gas sensor chip, production efficiency is lower.
Summary of the invention
The objective of the invention is at the existing in prior technology deficiency, a kind of low-power consumption is provided, is easy to the gas sensor and the sensor chip of large-scale production.
For achieving the above object, the invention provides a kind of gas sensor chip, the ceramic substrate, electrodes conduct band, electric resistance heater and the air-sensitive coating that comprise sheet, described electrodes conduct band, electric resistance heater and air-sensitive coating are printed on the described ceramic substrate in proper order by the method for serigraphy, described electrodes conduct band is two-layer, and described electric resistance heater is between two-layer electrodes conduct band.
For achieving the above object, the invention provides a kind of preparation method of described gas sensor chip, as follows:
Step 1: form the electrodes conduct band on the described ceramic substrate thereby the method for electrode slurry by serigraphy be printed on;
Step 2: form electric resistance heater on the described ceramic substrate thereby the method for well heater slurry by serigraphy be printed on;
Step 3: the method for electrode slurry by serigraphy is printed on the described electrodes conduct band, from and form one deck electrodes conduct band;
Step 4: the method for air-sensitive coating by serigraphy is printed on the described ceramic substrate, makes air-sensitive coating cover described electrodes conduct band and electric resistance heater;
Step 5: adopt platinum, gold or platinum alloy to make contact conductor and also be connected with described electrodes conduct band by mode bonding or welding.
For achieving the above object, the invention provides a kind of gas sensor, adopt gas sensor chip recited above, the contact conductor of described gas sensor chip is connected with the outer lead pin.
The invention has the advantages that, method by serigraphy is printed on electrode slurry and well heater slurry and has formed electrodes conduct band and electric resistance heater on the ceramic substrate, can reduce power consumption effectively, and owing to be the method that adopts serigraphy, so can improve the production efficiency and the uniformity in product performance of gas sensor significantly.
Also in conjunction with the accompanying drawings the present invention is described in further detail below by specific embodiment.
Description of drawings
Fig. 1 is the structural drawing of existing gas sensor chip;
Fig. 2 is the cut-open view of gas sensor chip specific embodiment one of the present invention;
Fig. 3 is the design sketch of step 1 among the gas sensor chip preparation method of the present invention;
Fig. 4 is the design sketch of step 2 among the gas sensor chip preparation method of the present invention;
Fig. 5 is the design sketch of step 3 among the gas sensor chip preparation method of the present invention;
Fig. 6 is the design sketch of step 4 among the gas sensor chip preparation method of the present invention;
Fig. 7 is the fragmentary, perspective view of gas sensor specific embodiment one of the present invention;
Fig. 8 is the partial top view of gas sensor specific embodiment one of the present invention;
Fig. 9 is the outside drawing of gas sensor specific embodiment one of the present invention;
Figure 10 is the cut-open view of gas sensor chip specific embodiment two of the present invention.
Description of reference numerals: 1. ceramic substrate, 2. electrodes conduct band, 3. electric resistance heater, 4. air-sensitive coating, 5. contact conductor, 6. outer lead pin, 7. gas sensor chip, 8. base, 9. pipe cap, 10. heating electrode, 11. potential electrode, 12. shells.
Embodiment
Fig. 2 is the structural representation of gas sensor chip specific embodiment one, as shown in Figure 2, the ceramic substrate 1 that comprises sheet, electrodes conduct band 2, electric resistance heater 3 and air-sensitive coating 4, described electrodes conduct band 2, electric resistance heater 3 and air-sensitive coating 4 are printed on the described ceramic substrate 1 in proper order by the method for serigraphy, described electrodes conduct band 2 is two-layer, described electric resistance heater 3 is between two-layer electrodes conduct band 2, the length of described ceramic substrate 1, wide, thickly be respectively 1 millimeter, 1 millimeter and 0.10 millimeter, described electrodes conduct band 2 and electric resistance heater 3 are strip.
For described gas sensor chip, its preparation method is as follows:
Step 1: thus ruthenic oxide or gold adopted and other compound that mixes is printed on electrode slurry as the method for electrode slurry by serigraphy and forms electrodes conduct band 2 on the described ceramic substrate 1, as shown in Figure 3;
Step 2: thus ruthenic oxide or platinum adopted and other compounds that mix are printed on the method for well heater slurry by serigraphy and form electric resistance heater 3 on the described ceramic substrate 1, as shown in Figure 4;
Step 3: adopt ruthenic oxide or gold and other compound that mixes is printed on electrode slurry on the electrodes conduct band 2 that produces in the step 1 as the method for electrode slurry by serigraphy, from and form one deck electrodes conduct band 2, as shown in Figure 5;
Step 4: the method for air-sensitive coating 4 by serigraphy is printed on the described ceramic substrate 1, makes air-sensitive coating 4 cover described electrodes conduct band 2 and electric resistance heater 3 fully, as shown in Figure 6;
Step 5: adopt platinum, gold or platinum alloy to make contact conductor 5 and also be connected with described electrodes conduct band 2 by mode bonding or welding.
Gas sensor chip in the present embodiment, method by serigraphy is printed on electrode slurry and well heater slurry and has formed electrodes conduct band and electric resistance heater on the ceramic substrate, can reduce power consumption effectively, and owing to be the method that adopts serigraphy, so can improve the production efficiency and the uniformity in product performance of gas sensor significantly, electrodes conduct band and electric resistance heater are strip, and be just convenient accurate when printing.
Fig. 7, Fig. 8 are respectively the fragmentary, perspective view and the partial top view of gas sensor specific embodiment one of the present invention, Fig. 9 is the outside drawing of gas sensor specific embodiment one of the present invention, gas sensor in the present embodiment adopts above-mentioned gas sensor chip 7, the contact conductor 5 of described gas sensor chip 7 is connected with gas sensor outer lead pin 6, described terminal pins 6 is fixed on the base 8, pipe cap 9 is arranged on the base 8, as shown in Figure 9.
The described gas sensor of present embodiment, owing to adopt gas sensor chip 7, so have low-power consumption, the advantage that is easy to produce in batches.
Figure 10 is the structural representation of gas sensor chip specific embodiment two, present embodiment is on the basis of embodiment one, the length and width of described ceramic substrate 1, thickly be respectively 3 millimeters, 3 millimeters and 0.40 millimeter, described electrodes conduct band 2 and electric resistance heater 3 are L shaped.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (7)
1. gas sensor chip, it is characterized in that comprising ceramic substrate (1), electrodes conduct band (2), electric resistance heater (3) and the air-sensitive coating (4) of sheet, described electrodes conduct band (2), electric resistance heater (3) and air-sensitive coating (4) are printed on the described ceramic substrate (1) in proper order by the method for serigraphy, described electrodes conduct band (2) is two-layer, described electric resistance heater (3) is positioned between the two-layer electrodes conduct band (2), is connected with the contact conductor (5) of platinum, gold or platinum alloy material on the described electrodes conduct band (2).
2. gas sensor chip according to claim 1 is characterized in that described electrodes conduct band (2) and electric resistance heater (3) are rectangular property or L shaped.
3. gas sensor chip according to claim 1, the length that it is characterized in that described ceramic substrate (1) are 1 millimeter～3 millimeters, and width is 1 millimeter～3 millimeters, and thickness is 0.10 millimeter～0.40 millimeter.
4. a method for preparing gas sensor chip is characterized in that, may further comprise the steps:
Step 1: the method for electrode slurry by serigraphy be printed on described ceramic substrate (1) thereby go up form electrodes conduct band (2);
Step 2: the method for well heater slurry by serigraphy be printed on described ceramic substrate (1) thereby go up form electric resistance heater (3);
Step 3: the method for electrode slurry by serigraphy is printed on the described electrodes conduct band (2), from and form one deck electrodes conduct band (2);
Step 4: the method for air-sensitive coating (4) by serigraphy is printed on the described ceramic substrate (1), makes air-sensitive coating (4) cover described electrodes conduct band (2) and electric resistance heater (3);
Step 5: adopt platinum, gold or platinum alloy to make contact conductor (5) and also be connected with described electrodes conduct band (2) by mode bonding or welding.
5. gas sensor, it is characterized in that comprising gas sensor chip (7), base (8) and pipe cap (9), described base (8) is provided with outer lead pin (6), described pipe cap (9) is covered on described base (8) top, described gas sensor chip (7) comprises the ceramic substrate (1) of sheet, electrodes conduct band (2), electric resistance heater (3), air-sensitive coating (4) and platinum, the contact conductor of gold or platinum alloy material (5), described electrodes conduct band (2), electric resistance heater (3) and air-sensitive coating (4) are printed on the described ceramic substrate (1) in proper order by the method for serigraphy, described electrodes conduct band (2) is two-layer, described electric resistance heater (3) is positioned between the two-layer electrodes conduct band (2), described contact conductor (5) is connected with described electrodes conduct band (2) by mode bonding or welding, and the contact conductor (5) of described gas sensor chip (7) is connected with the outer lead pin (6) of described gas sensor.
6. gas sensor according to claim 5 is characterized in that the electrodes conduct band (2) of described gas sensor chip (7) and electric resistance heater (3) are rectangular property or L shaped.
7. according to claim 5 or 6 arbitrary described gas sensors, the length that it is characterized in that the ceramic substrate (1) of described gas sensor chip (7) is 1 millimeter～3 millimeters, and width is 1 millimeter～3 millimeters, and thickness is 0.10 millimeter～0.40 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2007100544509A CN101059463B (en) | 2007-05-29 | 2007-05-29 | Gas sensor chip, sensor and sensor chip production method |
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| CN2007100544509A CN101059463B (en) | 2007-05-29 | 2007-05-29 | Gas sensor chip, sensor and sensor chip production method |
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| CN101059463A true CN101059463A (en) | 2007-10-24 |
| CN101059463B CN101059463B (en) | 2010-11-10 |
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| CN2007100544509A Active CN101059463B (en) | 2007-05-29 | 2007-05-29 | Gas sensor chip, sensor and sensor chip production method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975803A (en) * | 2010-09-16 | 2011-02-16 | 郑州炜盛电子科技有限公司 | Planar gas sensor and manufacturing method thereof |
| CN103293186A (en) * | 2013-05-10 | 2013-09-11 | 华中科技大学 | Method for manufacturing metal oxide semiconductor (MOS) gas sensor array with porous network structure |
| CN103675038A (en) * | 2013-12-13 | 2014-03-26 | 苏州纳格光电科技有限公司 | Nanocrystalline metal oxide functionalized carbon nanotube material and formaldehyde gas sensor |
| CN104391026A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Preparation method of gas sensor chip |
| CN104407035A (en) * | 2014-11-14 | 2015-03-11 | 无锡信大气象传感网科技有限公司 | Gas sensor chip |
| CN104597087A (en) * | 2014-11-14 | 2015-05-06 | 无锡信大气象传感网科技有限公司 | Manufacturing method of gas sensor chip |
| CN107003276A (en) * | 2014-11-25 | 2017-08-01 | 罗伯特·博世有限公司 | Ceramic sensor element for exhaust sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102243195A (en) * | 2011-04-13 | 2011-11-16 | 刘震国 | A resistance-type nitrogen dioxide gas sensor, and an apparatus manufactured with the sensor |
-
2007
- 2007-05-29 CN CN2007100544509A patent/CN101059463B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975803A (en) * | 2010-09-16 | 2011-02-16 | 郑州炜盛电子科技有限公司 | Planar gas sensor and manufacturing method thereof |
| CN103293186A (en) * | 2013-05-10 | 2013-09-11 | 华中科技大学 | Method for manufacturing metal oxide semiconductor (MOS) gas sensor array with porous network structure |
| CN103675038A (en) * | 2013-12-13 | 2014-03-26 | 苏州纳格光电科技有限公司 | Nanocrystalline metal oxide functionalized carbon nanotube material and formaldehyde gas sensor |
| CN104391026A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Preparation method of gas sensor chip |
| CN104407035A (en) * | 2014-11-14 | 2015-03-11 | 无锡信大气象传感网科技有限公司 | Gas sensor chip |
| CN104597087A (en) * | 2014-11-14 | 2015-05-06 | 无锡信大气象传感网科技有限公司 | Manufacturing method of gas sensor chip |
| CN107003276A (en) * | 2014-11-25 | 2017-08-01 | 罗伯特·博世有限公司 | Ceramic sensor element for exhaust sensor |
| CN107003276B (en) * | 2014-11-25 | 2020-08-11 | 罗伯特·博世有限公司 | Ceramic sensor element for an exhaust gas sensor |
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| Publication number | Publication date |
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| CN101059463B (en) | 2010-11-10 |
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Inventor after: Wang Lili Inventor after: Jin Guixin Inventor after: Gu Ruiqin Inventor after: Chen Lingfei Inventor after: Wang Sanliang Inventor after: Qin Dongzhen Inventor after: Jiao Guidong Inventor after: Qi Mingfeng Inventor before: Qi Mingfeng Inventor before: Wang Lili Inventor before: Wang Sanliang Inventor before: Qin Dongzhen Inventor before: Jiao Guidong |
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Free format text: CORRECT: INVENTOR; FROM: QI MINGFENG WANG LILI WANG SANLIANG QIN DONGZHEN JIAO GUIDONG TO: WANG LILI JIN GUIXIN GU RUIQIN CHEN LINGFEI WANG SANLIANG QIN DONGZHEN JIAO GUIDONG QI MINGFENG |