CN1472619A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN1472619A CN1472619A CNA021278377A CN02127837A CN1472619A CN 1472619 A CN1472619 A CN 1472619A CN A021278377 A CNA021278377 A CN A021278377A CN 02127837 A CN02127837 A CN 02127837A CN 1472619 A CN1472619 A CN 1472619A
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- China
- Prior art keywords
- heat radiation
- orifice plate
- hole
- panel
- radiation orifice
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A heat radiating device for computer shell comprises shell side plate and heat radiating hole plate, of which the shell side plate has the first and the second opening and the heat radiating hole phate has multiairhole for heat radiation. The heat radiating hole plate can be selectively set at the first and the second opening.
Description
Technical field
The present invention relates to a kind of computer radiating apparatus, relate in particular to a kind of computer chassis heat abstractor.
Background technology
Computer chassis is to be used for protecting computer not to be subjected to the infringement of dust aqueous vapor, to reach and protect inner member.But computer chassis also not exclusively is a stuffy room without ventilation, and the casing back can be reserved the louvre of power supply fan usually, keeps the interior separate ventilation of main frame smooth and easy.In addition, computer chassis can be reserved fixing side plate wind hole at side panel, and flowing of heat radiation fluid assisted in this side plate wind hole, and suitable percentage of open area can not increase any active heat removal element, as fan, situation under, the component temperature on hard disc (Hard Disc), the AGP card is reduced.
Therefore, computer chassis design at present has side plate wind hole more.Even, all arrange side plate wind hole on some computer chassis side plate.But if housing side wall is the crosswind hole, can cause cooling fluid not concentrated, can't bring into play the cooling effect of expectation.
As shown in Figure 1, the side plate wind hole 103 of known computer chassis 100 is positioned at the rear end of housing side wall 101, and the purpose system that side plate wind hole 103 is provided with herein increases gas flow for the cooling of peripheral element commissure interface (PeripheralComponent Interconnect interface) 105 places.In addition, as shown in Figure 2, the crosswind hole 203 of another known computer chassis 200 is positioned at the front end of housing side wall 201, and the purpose system that crosswind hole 203 is provided with herein increases the cooling of gas flow for the hard disc part.
And at different motherboards, the internal system element distributes when changing to some extent, and therefore the optimum position in crosswind hole needs to adjust the position, and then need to redesign different housing side walls this moment, increases all many inconvenience of deviser and user.
Summary of the invention
For addressing the above problem, the invention provides a kind of computer chassis heat abstractor, the louvre of this device is the shift position according to need, or changes shape, not only increases deviser and user's convenience, and increases the surcharge of this computer chassis.
This computer chassis heat abstractor comprises housing side wall and heat radiation orifice plate, and this housing side wall has first hole and second hole.And the heat radiation orifice plate has a plurality of heat radiation wind hole, and this heat radiation orifice plate selectivity on demand is installed in first hole and second hole.This heat abstractor further has panel, and when the heat radiation orifice plate was installed in first hole, panel was installed in second hole, and when the heat radiation orifice plate was installed in second hole, panel was installed in first hole.
In addition, the present invention also provides another kind of computer chassis heat abstractor.This device comprises a heat radiation orifice plate and a housing side wall, this heat radiation orifice plate has a plurality of heat radiation wind hole, and this housing side wall has a perforate, this perforate has the primary importance and the second place, this verge of opening has first chute and second chute, and heat radiation orifice plate cunning is embedded between first chute and second chute, and selectivity is installed in the primary importance and the second place on demand.When the heat radiation orifice plate was installed in primary importance, the heat radiation orifice plate was installed in primary importance, and when the heat radiation orifice plate was installed in the second place, the heat radiation orifice plate was installed in the second place.
This heat abstractor further comprises panel, and this panel cunning is embedded between first chute and second chute, and when the heat radiation orifice plate was installed in primary importance, panel was installed in the second place, and when the heat radiation orifice plate was installed in the second place, panel was installed in primary importance.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 has disclosed known computer chassis heat abstractor.
Fig. 2 has disclosed another known computer chassis heat abstractor.
Fig. 3 has disclosed the first embodiment of the present invention.
Fig. 4 has disclosed the second embodiment of the present invention.
Fig. 5 has disclosed the structure of heat radiation orifice plate.
Fig. 6 has disclosed the combination of heat radiation orifice plate and fan.
Embodiment
The invention provides a kind of heat radiator on casing.This heat abstractor utilizes side plate, heat radiation orifice plate and the panel of computer chassis to reach the purpose of heat radiation.This housing side wall has first hole and second hole, and this heat radiation orifice plate has a plurality of heat radiation wind hole.
This heat radiation orifice plate selectivity on demand is installed in first hole and second hole of housing side wall.This heat abstractor further comprises panel, this panel does not have any heat radiation wind hole, and when the heat radiation orifice plate is installed in first hole of housing side wall, this panel then is installed in second hole of housing side wall, when the heat radiation orifice plate was installed in second hole of housing side wall, this panel then was installed in first hole of this housing side wall.
The figure three explanation first embodiment of the present invention.As shown in Figure 3, this computer chassis 300 has housing side wall 301, this housing side wall 301 has 9 holes 302,303,304,305,306,307,308,309 and 310, hole 302,305,308 and 309 is to install panel 311,313,315 and 316 respectively, and hole 303,306 and 310 is to install heat radiation orifice plate 312,314 and 317 respectively.The user can be on demand, and installing heat radiation orifice plate is forced the computer components of cooling corresponding to this hole location in arbitrary hole, and the device panel is in other hole.For example, the orifice plate that will dispel the heat is installed in hole 304, and panel is installed in hole 307.The hole number that has of this housing side wall can change to some extent according to deviser's demand again, and in addition, panel number and heat radiation orifice plate number also can increase and decrease on demand.But what pay special attention to is, if all holes installing heat radiation orifice plate, or all holes all install panel, then can't reach the effect of heat radiation.
The present invention also provides another heat radiator on casing in addition, and this heat abstractor has housing side wall, first chute, second chute and heat radiation orifice plate.This housing side wall has perforate, and this perforate has the primary importance and the second place, and this first chute and second chute system are arranged at the edge of perforate.This heat radiation orifice plate then has a plurality of heat radiation wind hole can be for heat radiation.
This heat radiation orifice plate cunning is embedded between first chute and second chute, and selectivity is installed in the primary importance and the second place on demand.In addition, the present invention further comprises panel, and this panel cunning is embedded between first chute and second chute, when the heat radiation orifice plate is installed in primary importance, panel then is installed in the second place, and when the heat radiation orifice plate was installed in the second place, panel is position installing primary importance then.
Fig. 4 promptly illustrates the second embodiment of the present invention.This embodiment has housing side wall 400, and this housing side wall 400 has 3 perforates 401,402 and 403, and perforate 401 has chute 4011 and chute 4013, and perforate 402 has chute 4021 and chute 4023, and perforate 403 has chute 4031 and chute 4033.Shown in figure four, each perforate has 3 positions, has primary importance 4061, the second place 4063 and the 3rd position 4065 as perforate 403.The user can be embedded in panel and heat radiation orifice plate cunning between two chutes of perforate on demand.
In this embodiment, panel 451 sliding being embedded between chute 4011 and the chute 4013, panel 451 is installed in primary importance 4071.Heat radiation orifice plate 453 sliding being embedded between chute 4011 and the chute 4013 when heat radiation orifice plate 453 is installed in the second place 4073, force cooling corresponding to this regional computer components.And heat radiation orifice plate 455 sliding being embedded between the chute 4021 and chute 4023 of perforate 402.Similarly, if the heat radiation orifice plate is all installed in the zone of all perforates, or the zone of all perforates all installs panel, then can't reach the effect of heat radiation.
As shown in Figure 5, the edge of heat radiation orifice plate 304 has elasticity thing 3041, and this elasticity thing 3041 can be linked to the edge of hole for heat radiation orifice plate 304, to be installed in hole.And for preventing electromagnetic interference (EMI) (electromagnetic interference), the material of this elasticity thing 3041 is a conductive rubber, for covering electromagnetic interference (EMI).Similarly, the edge of panel 305 also has elasticity thing 3051, and this elasticity thing 3051 can supply to be connected in the edge of hole, and the material of this elasticity thing 3051 is a conductive rubber.In addition, the position of the louvre of this heat radiation orifice plate can be done to change on the figure, and this heat radiation orifice plate and panel also can have different colors, arrange in pairs or groups voluntarily for the user.
Fig. 6 is that explanation heat radiation orifice plate 304 of the present invention can provide initiatively distinguished and admirable for assembling fan 3041, strengthens the effect of heat radiation.This heat radiation orifice plate 304 can utilize the louvre 3043,3045,3047 and 3049 at edge to connect fan 3081.The user can be on demand, the orifice plate group of will dispelling the heat 304 dress fans 3081, and will dispel the heat orifice plate 304 and fan 3081 be assembled in arbitrary hole of computer side plate, or cunning is embedded in arbitrary perforate of computer side plate.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and the above-mentioned preferred embodiment that discloses not is the restriction to category of the present invention.On the contrary, the above-mentioned explanation and the arrangement of various change and isotropism are all the category that the present invention desires to be protected.Therefore, the category of the claim that the present invention applied for should be done the broadest explanation according to above-mentioned explanation, and contains the change that institute might equalization and the arrangement of tool isotropism.
Claims (20)
1. computer chassis heat abstractor comprises:
One housing side wall, this housing side wall have first hole and second hole; And
One heat radiation orifice plate, this heat radiation orifice plate has a plurality of heat radiation wind hole;
Wherein this heat radiation orifice plate selectivity is installed in this first hole and this second hole.
2. device as claimed in claim 1 is characterized in that, further comprises the edge that an elasticity thing is connected in this heat radiation orifice plate.
3. device as claimed in claim 2 is characterized in that, the material of this elasticity thing is a conductive rubber.
4. device as claimed in claim 1 is characterized in that, this heat radiation orifice plate selectivity is assembled a fan.
5. device as claimed in claim 1 is characterized in that, further comprises a panel, when this heat radiation orifice plate is installed in this first hole, this panel is installed in this second hole, and when this heat radiation orifice plate was installed in this second hole, this panel was installed in this first hole.
6. device as claimed in claim 5 is characterized in that, further comprises the edge that an elasticity thing is connected in this panel.
7. device as claimed in claim 6 is characterized in that, the material of this elasticity thing is a conductive rubber.
8. computer chassis heat abstractor comprises:
One heat radiation orifice plate, this heat radiation orifice plate has a plurality of heat radiation wind hole;
One panel; And
One housing side wall, this housing side wall have first hole and second hole;
Wherein when this heat radiation orifice plate was installed in this first hole, this panel was installed in this second hole, and when this heat radiation orifice plate was installed in this second hole, this panel was installed in this first hole.
9. device as claimed in claim 8 is characterized in that, further comprises the first elasticity thing and the second elasticity thing, and this first elasticity thing is connected in an edge of this heat radiation orifice plate, and this second elasticity thing is connected in an edge of this panel.
10. device as claimed in claim 9 is characterized in that, the material of this first elasticity thing and this second elasticity thing is a conductive rubber.
11. a computer chassis heat abstractor comprises:
One heat radiation orifice plate, this heat radiation orifice plate has a plurality of heat radiation wind hole; And
One housing side wall, this side plate has a perforate, and this perforate has the primary importance and the second place, and this verge of opening has first chute and second chute;
Wherein this heat radiation orifice plate cunning is embedded between this first chute and this second chute, and selectivity is installed in the primary importance and the second place.
12. device as claimed in claim 11 is characterized in that, an elasticity thing is connected in an edge of this heat radiation orifice plate.
13. device as claimed in claim 12 is characterized in that, the material of this elasticity thing is a conductive rubber.
14. device as claimed in claim 11 is characterized in that, this heat radiation orifice plate selectivity is assembled a fan.
15. device as claimed in claim 11, it is characterized in that, further comprise a panel, this panel cunning is embedded between this first chute and this second chute, when this heat radiation orifice plate is positioned at this primary importance, this panel is installed in this second place, and when this heat radiation orifice plate was positioned at this second place, this panel was installed in this primary importance.
16. device as claimed in claim 15 is characterized in that, further comprises the edge that an elasticity thing is connected in this panel.
17. device as claimed in claim 16 is characterized in that, the material of this elasticity thing is a conductive rubber.
18. a computer chassis heat abstractor comprises:
One heat radiation orifice plate, this heat radiation orifice plate has a plurality of heat radiation wind hole;
One panel; And
One housing side wall, this side plate has a perforate, and this perforate has the primary importance and the second place, and this verge of opening has first chute and second chute;
Wherein working as this heat radiation orifice plate and this panel cunning is embedded between this first chute and this second chute, when this heat radiation orifice plate is installed in primary importance, this panel is installed in the second place, and when this heat radiation orifice plate was installed in this second place, this panel was installed in this primary importance.
19. device as claimed in claim 18 is characterized in that, further comprises the first elasticity thing and the second elasticity thing, this first elasticity thing is connected in an edge of this heat radiation orifice plate, and this second elasticity thing is connected in an edge of this panel.
20. device as claimed in claim 19 is characterized in that, wherein the material of this first elasticity thing and this second elasticity thing is a conductive rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127837 CN1220926C (en) | 2002-08-02 | 2002-08-02 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127837 CN1220926C (en) | 2002-08-02 | 2002-08-02 | Radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1472619A true CN1472619A (en) | 2004-02-04 |
| CN1220926C CN1220926C (en) | 2005-09-28 |
Family
ID=34143637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02127837 Expired - Fee Related CN1220926C (en) | 2002-08-02 | 2002-08-02 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1220926C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111399607A (en) * | 2020-03-06 | 2020-07-10 | 苏州浪潮智能科技有限公司 | Server case and movable perforated separation blade heat dissipation structure thereof |
-
2002
- 2002-08-02 CN CN 02127837 patent/CN1220926C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111399607A (en) * | 2020-03-06 | 2020-07-10 | 苏州浪潮智能科技有限公司 | Server case and movable perforated separation blade heat dissipation structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1220926C (en) | 2005-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050928 Termination date: 20160802 |