CN1447383A - Handling method of changing attributes of manufacturing processes for semi-conductor equipment - Google Patents
Handling method of changing attributes of manufacturing processes for semi-conductor equipment Download PDFInfo
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- CN1447383A CN1447383A CN 02108133 CN02108133A CN1447383A CN 1447383 A CN1447383 A CN 1447383A CN 02108133 CN02108133 CN 02108133 CN 02108133 A CN02108133 A CN 02108133A CN 1447383 A CN1447383 A CN 1447383A
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Abstract
A method is suitable for the system for controlling manufacturing processes of semi-conductor. The system at least includes the device data module storing attribute data of multiple manufacturing processes and the data module of the manufacturing processes storing the manufacturing process data relevant to the attribute data. Moreover, each manufacturing process data possesses at least, one established device code name. First, one attribute data of manufacturing process is changed to another attirubte data of manufacturing process. Then, the established device code name in the manufacturing process data located before the attribute data of manufacturing process is changed to the marker denoting the invalid device code name. The operation interface of the control system is unable to select the invalid device code name so as to prevent metallic cross contamination happened to chips in the device.
Description
Technical field
The present invention relates to a kind of semiconductor manufacture flow path, particularly relate to a kind of method of handling changing attributes of manufacturing processes for semi-conductor equipment, scrap in order to prevent chip from the equipment of different manufacturing process attributes, the metal cross staining taking place.
Background technology
In the semiconductor fabrication of complexity, generally manufacturing process is divided into leading portion, stage casing and three kinds of attributes of back segment, the cleanliness factor of employed manufacturing process program (recipe) difference and requirement is also inequality in each manufacturing process attribute.Generally speaking, the cleanliness factor of leading portion manufacturing process is higher, and the back segment manufacturing process is lower because of containing the metal impurities cleanliness factor, so exclusive manufacturing process equipment, for example depositing device, etching machines and milling apparatus etc. all must be arranged in each manufacturing process attribute.Therefore, when carrying out chip manufacturing in proper order to the back segment manufacturing process, need chip is inserted equipment corresponding to the manufacturing process attribute to prevent pollution by leading portion manufacturing process, stage casing manufacturing process.For example, if will carry out the equipment that the chip of leading portion manufacturing process is inserted the back segment manufacturing process, chip can be subjected to metallic pollution and scrap.On the contrary, the chip that will carry out the back segment manufacturing process is inserted the equipment of leading portion manufacturing process, and equipment can be subjected to chip and pollute and reduce original cleanliness factor and can't carry out the leading portion manufacturing process again.
Yet sometimes for output (throughput) or factor such as research and development product etc., equipment needs to support mutually and changes original attribute to carry out the manufacturing process behind the change attribute.Therefore be necessary to be improved at above-mentioned problem.In traditional semiconductor control system, whether the manufacturing process attribute that operation-interface (OPI) can't be distinguished equipment changes, thereby can't prevent that the situation of carrying out different manufacturing process attributes in same equipment from taking place.Thus, if there is product during manufacture, carry out manufacturing process before equipment does not change attribute at the equipment that changed attribute, will cause serious pollution and make product rejection, cause manufacturing cost significantly to increase because of artificial careless mistake is careless.
Summary of the invention
The object of the present invention is to provide a kind of method of handling changing attributes of manufacturing processes for semi-conductor equipment, prevent that chip from because of the manufacturing process attribute change of semiconductor equipment the metal cross staining taking place during manufacture.
The object of the present invention is to provide a kind of method of handling changing attributes of manufacturing processes for semi-conductor equipment, be applicable to semiconductor manufacturing process control system, this system comprises at least: a device data module, in order to store a plurality of manufacturing process attribute datas, an and manufacturing process data module, in order to store the manufacturing process data of corresponding these manufacturing process attribute datas, each manufacturing process data has at least one both locking equipments code name.When the manufacturing process attribute data changed, in the manufacturing process data before the changing attributes of manufacturing processes data, both the locking equipment code name can change to an invalid equipment code name.The operation-interface of control system (OPI) can't be selected the equipment of corresponding invalid equipment code name, to prevent chip the metal cross staining takes place in this equipment.
According to above-mentioned purpose, the invention provides a kind of method of handling changing attributes of manufacturing processes for semi-conductor equipment, be applicable to semiconductor manufacturing process control system, this semiconductor manufacture flow path control system comprises a device data module at least, in order to a plurality of equipment code names of storing corresponding a plurality of semiconductor equipments and a plurality of manufacturing process attribute datas of corresponding described equipment code name, an and manufacturing process data module, in order to store a plurality of manufacturing process data of corresponding these manufacturing process attribute datas, wherein each manufacturing process data has an at least one both locking equipments code name and a stand-by equipment code name, comprises the following steps: the manufacturing process attribute data of an equipment code name is changed to another manufacturing process attribute data; In corresponding to the manufacturing process data before the changing attributes of manufacturing processes data, both the locking equipment code name changed to an invalid equipment code name, simultaneously in the manufacturing process data corresponding to manufacturing process attribute data after changing, the stand-by equipment code name is changed to the both locking equipments code name that is not altered to the invalid equipment code name; And selected corresponding manufacturing process equipment to carry out semiconductor manufacture flow path according to both locking equipment code names and stand-by equipment code name by an operation-interface.Wherein, these manufacturing process attribute data systems are divided into leading portion manufacturing process attribute, stage casing manufacturing process attribute and back segment manufacturing process attribute, and manufacturing process data system is divided into leading portion manufacturing process, stage casing manufacturing process and back segment manufacturing process.In addition, both the locking equipment code name was one of equipment code name, and the invalid equipment code name is a tool marking arrangement code name and described operation-interface can't be selected.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Fig. 1 is according to schematic diagram in the semiconductor manufacture flow path control system of the embodiment of the invention;
Fig. 2 is the semiconductor manufacture flow path control system schematic diagram according to the change device fabrication flow process attribute of Fig. 1; And
Fig. 3 is the method flow diagram according to the processing changing attributes of manufacturing processes for semi-conductor equipment of the embodiment of the invention.Symbol description 10--device data module; 10a--equipment code name; 10b--manufacturing process attribute data; The 10c--device data; 20--manufacturing process data module; 20a--manufacturing process data; 20b--is the locking equipment code name both; 20c--stand-by equipment code name; The 30--operation-interface.
Embodiment
Below cooperate Fig. 1 the semiconductor manufacture flow path control system of the embodiment of the invention and the method for processing changing attributes of manufacturing processes for semi-conductor equipment to be described to Fig. 3.
Fig. 1 is according to schematic diagram in the semiconductor manufacturing process control system of the embodiment of the invention.This system includes a device data module 10, a manufacturing process data module 20 and an operation-interface 30 at least in order to handle the manufacturing process attribute change of a plurality of semiconductor equipments.Device data module 10 is in order to store a plurality of equipment code name 10a (for example, E of corresponding these semiconductor equipments (not illustrating)
1, E
2, E
3, E
4, E
5), a plurality of manufacturing process attribute data 10b (for example, A, M, B, A, B) of corresponding these equipment code names 10a and a plurality of device data 10c of corresponding these equipment code names 10a.In the present embodiment, among the above-mentioned manufacturing process attribute data 10b, B is expressed as the leading portion manufacturing process, M is expressed as the stage casing manufacturing process and A is expressed as the back segment manufacturing process.In addition, a plurality of device data 10c then store the master data of corresponding equipment.Moreover in the device data module 10 of present embodiment, an equipment code name 10a, a manufacturing process attribute data 10b and more than one device data 10c system constitute an equipment list (equipment table).That is, device data module 10 is made of a plurality of equipment lists, for example five.
Manufacturing process data module 20 is to be associated with device data module 10, in order to a plurality of manufacturing process data 20a of storing corresponding these manufacturing process attribute datas 10b (for example, back segment attribute (A), stage casing attribute (M), leading portion attribute (B)), wherein each manufacturing process data 20a has an at least one both locking equipments code name 20b and a stand-by equipment code name 20c.One manufacturing process data 20a, at least one both locking equipments code name 20b and stand-by equipment code name 20c system constitute device cluster family table (equipment group table).That is, manufacturing process data module 20 is constituted for example three by a plurality of device cluster family tables.Illustrate, in the present embodiment, corresponding to device data module 10, when manufacturing process data 20a was A, both locking equipment code name 20b was E
1, E
4When manufacturing process data 20a was M, both locking equipment code name 20b was E
2When manufacturing process data 20a was B, both locking equipment code name 20b was E
3, E
5That is, both the locking equipment code name is these equipment code names 10a (for example, E
1, E
2, E
3, E
4, E
5One of).In addition, the equipment code name 10a in this system there is no changing attributes of manufacturing processes, so stand-by equipment code name 20c is a null device code name herein, and with " X " expression.
Operation-interface 30 is to be associated with manufacturing process data module 20, selects these corresponding manufacturing process equipment (not illustrating) to carry out semiconductor manufacture flow path in order to foundation both locking equipment code name 20b and stand-by equipment code name 20c.
Fig. 2 is the semiconductor manufacture flow path control system schematic diagram according to the change device fabrication flow process attribute of Fig. 1.For example, when the manufacturing process attribute data 10b of change one equipment code name 10a is another manufacturing process attribute data 10b, for example with an equipment code name 10a (E
1) the manufacturing process attribute change to leading portion manufacturing process (B) by back segment manufacturing process (A).Corresponding to E
1Manufacturing process attribute data 10b change B by A, corresponding to the manufacturing process data 20a before the changing attributes of manufacturing processes data 10b (that is, and A) in, a both locking equipment code name 20b (E
1) be to change to an invalid equipment code name, a tool marking arrangement code name for example is as indicating dotted portion among the figure.Simultaneously, corresponding to the manufacturing process data 20a behind the changing attributes of manufacturing processes data 10b (that is, and B) in, stand-by equipment code name 20c changes to the both locking equipments code name 20b that is not altered to the invalid equipment code name by the null device code name and (that is, changes to E by X
1).In the present embodiment, operation-interface 30 can't select tool marking arrangement code name and null device code name to carry out semiconductor manufacture flow path, as mentioned above.
Fig. 3 is the method flow diagram according to the processing changing attributes of manufacturing processes for semi-conductor equipment of the embodiment of the invention, is applicable to above-mentioned semiconductor manufacture flow path control system.At first, carry out first step S30, with equipment code name 10a, for example E
1Manufacturing process attribute data 10b change to another manufacturing process attribute data 10b, for example change to B by A.Next, carry out the second step S32, corresponding to the manufacturing process data 20a before the changing attributes of manufacturing processes data 10b (that is, and A) in, will be both locking equipment code name 20b (E
1) change to an invalid equipment code name, this both locking equipment code name 20b (E of mark for example
1).Simultaneously, carry out third step S34, (promptly corresponding to the manufacturing process data 20a behind the changing attributes of manufacturing processes data 10b, B) in, with stand-by equipment code name 20c, for example a null device code name changes to the both locking equipments code name 20b that is not altered to the invalid equipment code name.That is, change to E by X
1At last, carry out the 4th step S36, selected corresponding manufacturing process equipment to carry out semiconductor manufacture flow path by operation-interface 30 foundations both locking equipment code name 20b and stand-by equipment code name 20c.Wherein, operation-interface 30 can't select tool marking arrangement code name and null device code name to carry out semiconductor manufacture flow path.Thus,, also can't use described equipment, thereby prevent between the different manufacturing process metal cross staining to take place and make problems such as chip rejection or contaminated equipment even when chip is sent into the equipment of changing attributes of manufacturing processes because of carelessness.
Though the present invention with preferred embodiment openly as above; right its is not in order to qualification the present invention, any those of ordinary skills, without departing from the spirit and scope of the present invention; when can doing to change and retouching, so protection scope of the present invention is when being as the criterion with claim.
Claims (14)
1. a semiconductor manufacture flow path control system changes in order to the manufacturing process attribute of handling a plurality of semiconductor equipments, it is characterized in that described system comprises:
One device data module is in order to a plurality of equipment code names of storing corresponding described semiconductor equipment and a plurality of manufacturing process attribute datas of corresponding described equipment code name; And
One manufacturing process data module, in order to store a plurality of manufacturing process data of corresponding described manufacturing process attribute data, wherein each described manufacturing process data has an at least one both locking equipments code name and a stand-by equipment code name;
Wherein, when the described manufacturing process attribute data of change one described equipment code name is another manufacturing process attribute data, in the described manufacturing process data before the described manufacturing process attribute data of change, described both locking equipments code name is to change to an invalid equipment code name, and in the described manufacturing process data behind the described manufacturing process attribute data of change, described stand-by equipment code name is to change to the described both locking equipments code name that is not altered to the invalid equipment code name.
2. semiconductor manufacture flow path control system as claimed in claim 1, it is characterized in that, described control system also comprises an operation-interface, in order to select corresponding described manufacturing process equipment to carry out semiconductor manufacture flow path according to described both locking equipments code name and described stand-by equipment code name.
3. semiconductor manufacture flow path control system as claimed in claim 1 is characterized in that, described manufacturing process attribute data is divided into leading portion manufacturing process attribute, stage casing manufacturing process attribute and back segment manufacturing process attribute.
4. semiconductor manufacture flow path control system as claimed in claim 1 is characterized in that, described manufacturing process data are divided into leading portion manufacturing process, stage casing manufacturing process and back segment manufacturing process.
5. semiconductor manufacture flow path control system as claimed in claim 1 is characterized in that, described both locking equipments code name is one of described equipment code name.
6. semiconductor manufacture flow path control system as claimed in claim 2 is characterized in that, described invalid equipment code name is that a tool marking arrangement code name can't be selected described operation-interface.
7. semiconductor manufacture flow path control system as claimed in claim 2 is characterized in that, the described not stand-by equipment code name of change is that a null device code name can't be selected described operation-interface.
8. method of handling changing attributes of manufacturing processes for semi-conductor equipment, be applicable to semiconductor manufacturing process control system, it is characterized in that, described semiconductor manufacture flow path control system comprises a device data module, in order to a plurality of equipment code names of storing corresponding a plurality of semiconductor equipments and a plurality of manufacturing process attribute datas of corresponding described equipment code name, an and manufacturing process data module, in order to store a plurality of manufacturing process data of corresponding described manufacturing process attribute data, wherein each described manufacturing process data has an at least one both locking equipments code name and a stand-by equipment code name, comprises the following steps:
The described manufacturing process attribute data of one described equipment code name is changed to another manufacturing process attribute data; And
In corresponding to the described manufacturing process data before the described manufacturing process attribute data of change, described both locking equipments code name is changed to an invalid equipment code name, simultaneously in the described manufacturing process data corresponding to described manufacturing process attribute data after changing, described stand-by equipment code name is changed to the described both locking equipments code name that is not altered to the invalid equipment code name.
9. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 8, it is characterized in that described method method also comprises by an operation-interface selects corresponding described manufacturing process equipment to carry out the step of semiconductor manufacture flow path according to described both locking equipments code name and described stand-by equipment code name.
10. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 8 is characterized in that, described manufacturing process attribute data is divided into leading portion manufacturing process attribute, stage casing manufacturing process attribute and back segment manufacturing process attribute.
11. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 8 is characterized in that, described manufacturing process data are divided into leading portion manufacturing process, stage casing manufacturing process and back segment manufacturing process.
12. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 8 is characterized in that, described both locking equipments code name is one of described equipment code name.
13. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 9 is characterized in that, described invalid equipment code name is that a tool marking arrangement code name can't be selected described operation-interface.
14. the method for processing changing attributes of manufacturing processes for semi-conductor equipment as claimed in claim 9 is characterized in that, the described not stand-by equipment code name of change is that a null device code name can't be selected described operation-interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021081336A CN1178273C (en) | 2002-03-27 | 2002-03-27 | Handling method of changing attributes of manufacturing processes for semi-conductor equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021081336A CN1178273C (en) | 2002-03-27 | 2002-03-27 | Handling method of changing attributes of manufacturing processes for semi-conductor equipment |
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| Publication Number | Publication Date |
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| CN1447383A true CN1447383A (en) | 2003-10-08 |
| CN1178273C CN1178273C (en) | 2004-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021081336A Expired - Fee Related CN1178273C (en) | 2002-03-27 | 2002-03-27 | Handling method of changing attributes of manufacturing processes for semi-conductor equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329950C (en) * | 2004-03-03 | 2007-08-01 | 台湾积体电路制造股份有限公司 | System and method for process contamination prevention for semiconductor manufacturing |
| CN1744116B (en) * | 2004-09-03 | 2012-05-16 | 台湾积体电路制造股份有限公司 | System and method for semiconductor manufacturing automation |
| CN105094069A (en) * | 2014-05-15 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Process control method and system in manufacturing process of semiconductor device |
-
2002
- 2002-03-27 CN CNB021081336A patent/CN1178273C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329950C (en) * | 2004-03-03 | 2007-08-01 | 台湾积体电路制造股份有限公司 | System and method for process contamination prevention for semiconductor manufacturing |
| CN1744116B (en) * | 2004-09-03 | 2012-05-16 | 台湾积体电路制造股份有限公司 | System and method for semiconductor manufacturing automation |
| CN105094069A (en) * | 2014-05-15 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Process control method and system in manufacturing process of semiconductor device |
| CN105094069B (en) * | 2014-05-15 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | Process control method and system in fabrication of semiconductor device |
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|---|---|
| CN1178273C (en) | 2004-12-01 |
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