CN1447191A - Vibration carving and writing method for optical probe scan IC in photoetching system - Google Patents

Vibration carving and writing method for optical probe scan IC in photoetching system Download PDF

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Publication number
CN1447191A
CN1447191A CN 02116309 CN02116309A CN1447191A CN 1447191 A CN1447191 A CN 1447191A CN 02116309 CN02116309 CN 02116309 CN 02116309 A CN02116309 A CN 02116309A CN 1447191 A CN1447191 A CN 1447191A
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CN
China
Prior art keywords
scanning
vibration
carving
optical probe
amplitude
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Granted
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CN 02116309
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Chinese (zh)
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CN1195247C (en
Inventor
徐端颐
钱坤
齐国生
蒋培军
范晓冬
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Tsinghua University
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Tsinghua University
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Application filed by Tsinghua University filed Critical Tsinghua University
Priority to CNB02116309XA priority Critical patent/CN1195247C/en
Priority to US10/389,043 priority patent/US7012270B2/en
Publication of CN1447191A publication Critical patent/CN1447191A/en
Application granted granted Critical
Publication of CN1195247C publication Critical patent/CN1195247C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A vibration masking method in optical probing scanning IC photo mask system characterizes in that after control data for diagram lines waisted for photo masking is formed according to circuit or mask diagrams, as optical probe scans along the main movement direction x, a step amplitude value of small amplitude vibration along y direction is assisted which is adjusted according to diagram line position and line width or fixed. This x-y direction complex scanning-y direction step complex scanning cab reduce step times greatly compared with single x direction scan and single y direction step.

Description

Vibration carving and writing method in the optical probe scan IC etching system
Technical field
The present invention relates to vibration carving and writing method in a kind of optical probe scanning IC photoetching system, belong to the integrated circuit (IC) etching technical field.
Background technology
But the optical probe scanning technology is widely used in your system of large scale integrated circuit melon and fruit as a kind of traditional optical exposure method, can not only be used for the inscription that circuitous pattern also can be used for mask pattern.It mainly takes list (X) scanning direction---the simple scanning mode of single (Y) direction stepping.Scanning times is the stroke of Y direction and the ratio of stepping accuracy, and stroke depends on figure or mask width, and stepping accuracy depends on the minimum feature of figure or mask.At present, graphics area causes the inscription efficient of optical probe scanning mode to reduce in the certain continuous expansion of figure length breadth ratio and live width constantly reduces.If improve the standard scanning direction speed simply, will cause problems such as kinetic stability, line of motion, sampling and control, the performance of devices such as worktable and probe also there is higher requirement.If keep horizontal sweep speed constant (or suitably reducing), with single (X) scanning direction---the scan mode of single (Y) direction stepping, change X-Y direction compound scan into---the mode (hereinafter referred to as compound scan) of Y direction stepping, scanning times is Y direction total kilometres and the ratio of light probe at Y direction amplitude, can significantly reduce the stepping number of times, shorten working hours, improve and inscribe efficient.
Summary of the invention
The object of the present invention is to provide a kind ofly on the basis of simple scanning mode, when carrying out horizontal scanning, light probe slightly vibrates in vertical direction.But its stepping amplitude can be according to the live width of figure and stationkeeping or fixing, and the optical probe scanning IC photoetching system of inscribing according to graph position switch probe light source again is with the method for vibration carving and writing.
The invention is characterized in: after according to the control data of pattern line for the treatment of photoetching, when light probe when direction of primary motion X moves as scan exposure, be aided with the stepping amplitude of the small size oscillating mode of Y direction.The amplitude of the small size vibration of described Y direction is according to the position of pattern line and width adjustment.The amplitude of the small size vibration of described Y direction is fixed.Described figure is a mask pattern.
It has realized intended purposes.
Description of drawings
Fig. 1: be light probe system light path figure
Fig. 2: for oscillating scanning becomes figure principle synoptic diagram
Fig. 3: be the working routine block diagram
Fig. 4: be circuit controling drawing
Embodiment
Ask for an interview Fig. 1.The 1st, LASER Light Source, the 2nd, collimation lens, the 3rd, polarization spectroscope, the 4th, quarter-wave plate, the 5th, object lens, the 6th, silicon chip to be carved, the 7th, photodetector, the 8th, condenser lens, the 9th, piezoelectric ceramics.
Goodbye Fig. 2.For representing that white box is represented not sensitization of material, black box is represented sensitization to spot size with the square frame size.Below in conjunction with Fig. 2 workflow is done simple declaration.
Now not fixed amplitude scanning describe for example.Rectangle domain representation chip, the minimum scanning element of square expression, the entire chip area is 18 * 8, has four sections lines to be scanned on this chip.The setting chip upper left corner is true origin (0,0), X tangential movement speed 10mm/s, when worktable from the true origin setting in motion and laser interferometer colleague when beginning to count, open laser instrument, light probe begins vibration, and amplitude is a line thickness to be scanned---and two minimum scanning elements (being designated hereinafter simply as 2), sweep length is 7.Working table movement is to (7,0), finish first section lines scanning after, close laser instrument, light probe stop vibration.Worktable continues to move along directions X, moves to the chip other end (18,0), and step distance is 2, and this point is expressed as (18,2).After having scanned first section lines to be scanned, worktable begins to move in the other direction along X-axis.During the position of working table movement to the second section lines (16,2), open laser instrument, the light probe amplitude is 3, and sweep length is 11.In case working table movement to (5,2), is just finished the scanning of second section lines, closes laser instrument, light probe stops vibration.Worktable continues to move in the other direction along X, moves to a bit (0,2) of chip left end, and step distance is 3, this point coordinate should be expressed as (0,5), promptly begins to do X to scanning motion behind the 5th unit on the Y-axis, moves to (1,5), open laser instrument, probe does not vibrate.Working table movement is closed laser instrument to (4,5).Working table movement is to (18,5), and this moment, step distance was 1, and this point should be expressed as to (18,6).Finish the scanning of the 3rd line segment.Worktable is done counter motion along X-axis once more.Open laser instrument, the probe amplitude is 2, and working table movement is closed laser instrument to (7,6), and light probe stops vibration.Working table movement is to (0,6), and step distance is 2, and this point is expressed as (0,8), finishes scanning.
Fig. 3 is system's main program flow chart.When initialization, set the worktable initial position (x, y), the horizontal movement velocity of worktable, the horizontal times of exercise of worktable is a scanning times, the small size vibration amplitude when at every turn scanning, it equates with the stepping amplitude, also has the length of chip and wide.At this moment, in the time of also will setting the each scanning motion of worktable, the coordinate initial sum stop value of scanning area, i.e. the length and width size of scanning area.Now be that example describes with Fig. 2.Chip area is 18 * 8, and scanning times is 4, and the also stepping amplitude of small size vibration amplitude when at every turn scanning is 2,3,1,2, and unit is minimum scanning element, and the horizontal speed of worktable is 10mm/s.During worktable directions X motion for the first time, the coordinate starting point of scanning area is (0,0), and terminal point is point (5,0); During worktable directions X counter motion for the first time, the starting point of scanning area is point (16,2), and terminal point is (5,2); During the worktable directions X positive movement second time, the starting point of scanning area is (1,5), and terminal point is (4,5); During worktable directions X counter motion for the second time, the scanning area starting point is (18,6), and emphasis is (7,6).Under computer control, worktable one enters scanning area, and computing machine just sends inscribes instruction, in case disengaging scanning area, just sculpture in human hair write command not is exactly in fact to make laser instrument open make the light probe vibration simultaneously again, stops vibration otherwise just close the note laser instrument with seasonal light probe.Its main program flow chart sees 3.
Fig. 4 is for carrying out the schematic block circuit diagram of above-mentioned main program flow chart.Single-chip microcomputer (89C51) is to go control linkage to make light probe that slightly vibration take place in the piezoelectric ceramics of object lens through bus.

Claims (4)

1. the vibration carving and writing method of the not fixed light probe amplitude in the optical probe scanning system, the step that contains directions X scanning and the stepping of Y direction, it is characterized in that: behind control data according to the pattern line for the treatment of photoetching, when light probe when direction of primary motion X moves as scan exposure, be aided with the stepping amplitude of the small size oscillating mode of Y direction.
2. according to the optical probe scanning IC photoetching system vibration carving and writing method of claim 1, it is characterized in that: the amplitude of the small size vibration of described Y direction is according to the position of pattern line and width adjustment.
3. according to the optical probe scanning IC photoetching system vibration carving and writing method of claim 1, it is characterized in that: the amplitude of the small size vibration of described Y direction is fixed.
4. according to the optical probe scanning IC photoetching system vibration carving and writing method of claim 1, it is characterized in that: described figure is a mask pattern.
CNB02116309XA 2002-03-15 2002-03-22 Vibration carving and writing method for optical probe scan IC in photoetching system Expired - Fee Related CN1195247C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB02116309XA CN1195247C (en) 2002-03-22 2002-03-22 Vibration carving and writing method for optical probe scan IC in photoetching system
US10/389,043 US7012270B2 (en) 2002-03-15 2003-03-14 Photolithography system having multiple adjustable light sources

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB02116309XA CN1195247C (en) 2002-03-22 2002-03-22 Vibration carving and writing method for optical probe scan IC in photoetching system

Publications (2)

Publication Number Publication Date
CN1447191A true CN1447191A (en) 2003-10-08
CN1195247C CN1195247C (en) 2005-03-30

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CNB02116309XA Expired - Fee Related CN1195247C (en) 2002-03-15 2002-03-22 Vibration carving and writing method for optical probe scan IC in photoetching system

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112756801A (en) * 2020-12-18 2021-05-07 浙江泰仑电力集团有限责任公司 Laser foreign matter removing device and method based on lens micro-vibration and steering control

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112756801A (en) * 2020-12-18 2021-05-07 浙江泰仑电力集团有限责任公司 Laser foreign matter removing device and method based on lens micro-vibration and steering control

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