CN1433931A - Package method electronic ship made from wafen - Google Patents
Package method electronic ship made from wafen Download PDFInfo
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- CN1433931A CN1433931A CN 02102588 CN02102588A CN1433931A CN 1433931 A CN1433931 A CN 1433931A CN 02102588 CN02102588 CN 02102588 CN 02102588 A CN02102588 A CN 02102588A CN 1433931 A CN1433931 A CN 1433931A
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- wafer
- electronic chip
- chip component
- photoresist
- hole slot
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Abstract
The method for packaging electronic chip element made of wafer includes the following steps: 1. making electronic chip elements on the wafer and making them spaced and arranged; 2. in the above-mentioned wafer etching the portion where the electronic chip elements are not formed to obtain slot; 3. utilizing vacuum film-pressing equipment to cover the wafer with etched slot with photo resist film or soaking the whole wafer in the container tank with photoresist, so that the whole wafer is covered with a layer of photoresist; 4. heating wafer and drying the photo resist film or photoresist to make it tightly combined on the wafer; and 5. finally, separating out the electronic chip elements from the wafer so as to obtain the packaged electric chip element unit.
Description
Affiliated technical field
The present invention relates to a kind of packing method, particularly a kind of packing method of making electronic chip component with wafer.
Background technology
The electronic chip component of commonly seeing, shown in A to C among Fig. 1, be earlier component structure to be made on the ceramic substrate 100, secondly with the ceramic substrate of the complete making component structure of monoblock according to required, be cut into other electronic chip component unit 110 by cutting implement 800; Utilize splash method (Sputtering) or other modes then, poting materials is sprayed thin film and made its drying by splash facility 900 on electronic chip component unit 110; 3. or utilize cladding process (end illustrates), the heat radiation polymeric layer is coated on the electronic chip component unit 110, promptly gets packaged electronic chip component.
Above-mentioned electronic chip packing manufacture method, be that certain effect is arranged, but still have deficiency when implementing: 1, utilize the cladding process polymeric layer that will dispel the heat to be coated on the cutting electronic chip component unit later, or sputtering method (Sputtering) is sprayed the mode of thin film on the electronic chip unit by splashing device, owing to be for it to mono-electronic chip component unit, so time-consuming taking a lot of work, and after the splash packing film of electronic chip unit, packing film is that whole electronic chip component unit is covered, the packing film of wiring face must be removed in use, its production process is many and inconvenient.
Because above-mentioned packing method has its shortcoming, so another packing method is arranged, after electronic chip component is formed on the substrate, earlier with the electronic chip component cocoon packing film on the substrate, and then be cut into the electronic chip component unit, but this kind packing method, can't be with the side face cocoon packing film of electronic chip component, often to do encapsulation for the second time in use, inconvenience is also arranged.
Because there is above-mentioned shortcoming in the manufacture method of the electronic chip component of commonly seeing, the contriver is at the road of this shortcoming research improvement, and the research improvement has generation of the present invention finally when long.
Summary of the invention
Technical matters to be solved by this invention is at the above-mentioned deficiency of prior art, and to provide one one kinds of packing methods of making electronic chip component with wafer.
According to the packing method of this kind electronic chip component of the present invention, it can promptly reach the purpose of packing electronic chip component, and can save manufacturing cost and process: this is first purpose of the present invention.
According to the packing method of this kind electronic chip component of the present invention, it not only can promptly reach the purpose of packing electronic chip component, and has kept the preferable quality of electronic chip component; This is a further object of the present invention.
According to the packing method of this kind electronic chip component of the present invention, the packing of the electronic chip component that its packing is finished is complete packing, need not remake the situation of inconvenience such as packing for the second time during use.
Above-mentioned technical matters of the present invention is realized by following technical scheme.
A kind of packing method of making electronic chip component with wafer; It is characterized in that comprising the following steps:
Electronic chip component is made on the substrate of wafer, electronic chip component is distributed in distance; Spaced etch between the electronic chip component of above-mentioned wafer is become microscler hole slot; By the facility of vacuum film pressing, on the wafer of the electronic chip component of the microscler hole slot of etching, lining last layer photoresistance film;
With wafer heating, the photoresistance film is fitted tightly on the cell wall of the electronic chip component of wafer and microscler hole slot; And
Wafer is divided into other electronic chip component.
Except that above-mentioned essential features, in specific implementation process, also can replenish following technology contents:
The electronic chip component that has wherein etched microscler hole slot is that the full wafer wafer impregnated in the tank that photoresist is housed, and makes the complete lining one deck of wafer photoresist.
The invention has the advantages that:
Save manufacturing cost and process: can keep the preferable quality of electronic chip component; Need not to remake packing for the second time during use.
As for detailed construction of the present invention, application principle, effect and effect, then can be understood completely with reference to the explanation that the following example and accompanying drawing are done:
Description of drawings
Fig. 1 is the embodiment scheme drawing of manufacture method of electronic chip component of commonly seeing.
Fig. 2 is this kind of the present invention made the packing method of electronic chip component with wafer a order drawing.
Fig. 3 is the packing method with wafer manufacturing electronic chip component of the present invention, the scheme drawing of wafer wherein.
Fig. 3 A figure is the structural representation of wafer among Fig. 3.
Fig. 4 A of the present inventionly makes the packing method of electronic chip component with wafer, wherein in the vacuum film pressing processing procedure, and the scheme drawing of photoresistance film close attachment on wafer.
Fig. 4 B of the present inventionly makes the packing method of electronic chip component with wafer, wherein the structural representation of the made electronic chip component of vacuum film pressing.
Fig. 5 A is the packing method with wafer manufacturing electronic chip component of the present invention, and wherein the full wafer wafer impregnated in and is equipped with in the photoresist groove, makes the scheme drawing of the complete lining one deck of wafer photoresist.
Fig. 5 B is the packing method with wafer manufacturing electronic chip component of the present invention, wherein floods the structural representation of the electronic chip component of photoresist.
The specific embodiment
A to C is the embodiment scheme drawing of manufacture method of electronic chip component of commonly seeing among Fig. 1; Its effect and its shortcoming, as previously mentioned, repeated description no longer herein
Fig. 2 is this kind of the present invention made the packing method of electronic chip component with wafer a order drawing; Shown in this figure, the present invention includes a plurality of programs: 1, earlier electronic chip component is made on the wafer (wafer), electronic chip component is distributed in distance (program A), and electronic chip component interval one distance (please refer to Fig. 3) that two between-line spacings are arranged; 2, secondly,,, etch microscler hole slot (program B) according to the interval width of electronic chip component on the wafer with not forming the part of electronic chip component in the above-mentioned wafer; 3, by the facility of vacuum film pressing, lining photoresistance film (PhotoResist Film) (program C1) on the wafer that etches microscler hole slot, also the full wafer wafer can be impregnated in the tank of liquid photoresist, make the complete lining one deck of wafer photoresist (program D1); 4,, make the photoresistance film fit tightly on wafer (program C2) or make the dry and lining one deck photoresist (program D2) of the photoresist universe with wafer heating; 5, at last part chip component is split from wafer, be the electronic chip component unit (program E) that packing is finished.
Fig. 3 is the packing method with wafer manufacturing electronic chip component of the present invention, the wherein scheme drawing of wafer; The present invention makes the shape (program A) that the surface has the wafer of electronic chip component structure earlier; The constructional drawing of wafer 10 is as shown in Fig. 2 A; The structure 101,102 that wherein has a plurality of electronic chips on the wafer 10 ..., the structure 101,102 of electronic chip component is distributed in distance, and has one at interval and make between the adjacent electronic chip component structure 101,102 of two rows; After wafer 10 etchings, in above-mentioned electronic chip component structure 101, interval between 102 forms the microscler hole slot 11 that penetrates wafer 10 plate bodys, so the distance between the microscler hole slot 11 is the predetermined width between the two row electronic chip components 14, in order to the cutting and the packing of electronic chip component.
Fig. 4 A of the present inventionly makes the packing method of electronic chip component with wafer, wherein vacuum film pressing by hole slot the scheme drawing of close attachment on electronic chip component; As can be seen from Figure, the wafer 10 that has etched microscler hole slot 110 can place vacuum environment, by vacuum hot pressing technique, one deck photoresistance (sensitization) film (Photo Resist Film) 12 is coated on (program C1) on the wafer 10, and heating (program C2), make fitting tightly on wafer 10, and the wafer 10 of electronic chip component structure is coated.
In addition, when wafer 10 is made in non-vacuum environment, can make by the mode that the wafer 10 that will etch microscler hole slot 110 impregnated in the photoresist groove; As shown in Fig. 5 A, the wafer that full wafer has been etched microscler hole slot 110 impregnated in the tank that photoresist 12 is housed, make the surface of wafer 10 (comprise electronic chip component structure with microscler hole slot 110) one deck photoresist 13 (program D1) that fully is covered, and make it dry and allow photoresist be attached to (program D2) on the wafer, shown in Fig. 5 A.
At last wafer is divided into the electronic chip component (program E) of a grain by microscler hole slot, as shown in Fig. 4 B and Fig. 5 B; Wherein, shown in Fig. 4 B, be wafer in vacuum environment by the made electronic chip component of press mold, and Fig. 5 B to be wafer impregnated in the photoresist dry made electronic chip component in back.
By above-mentioned operation structure, this kind of the present invention made the packing method of electronic chip component with wafer, can effectively form the default interval of display electronic component on the wafer, become microscler hole slot, again also to heat with photoresist and vacuum film pressing by etching, or the mode of utilization dipping photoresist, pack electronic chip component apace, save manufacturing cost and the effect of time and reach, and be not seen in public use, close the regulation in patent law, the spy files an application.
Need Chen Mingzhe, the above is the preferable specific embodiment of the present invention, if comply with the change that conception of the present invention is done, and when the function that it produced does not exceed specification sheets and graphic contain spiritual yet, all should be within the scope of the invention.
Claims (2)
1, a kind of packing method of making electronic chip component with wafer; It is characterized in that comprising the following steps:
Electronic chip component is made on the substrate of wafer, electronic chip component is distributed in distance; Spaced etch between the electronic chip component of above-mentioned wafer is become microscler hole slot; By the facility of vacuum film pressing, on the wafer of the electronic chip component of the microscler hole slot of etching, lining last layer photoresistance film;
With wafer heating, the photoresistance film is fitted tightly on the cell wall of the electronic chip component of wafer and microscler hole slot: and
Wafer is divided into other electronic chip component.
2, the packing method of making electronic chip component with wafer according to claim 1, it is characterized in that: the electronic chip component that has wherein etched microscler hole slot is that the full wafer wafer impregnated in the tank that photoresist is housed, and makes the complete lining one deck of wafer photoresist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021025886A CN1178821C (en) | 2002-01-25 | 2002-01-25 | Package method electronic ship made from wafen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021025886A CN1178821C (en) | 2002-01-25 | 2002-01-25 | Package method electronic ship made from wafen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1433931A true CN1433931A (en) | 2003-08-06 |
| CN1178821C CN1178821C (en) | 2004-12-08 |
Family
ID=27627617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021025886A Expired - Fee Related CN1178821C (en) | 2002-01-25 | 2002-01-25 | Package method electronic ship made from wafen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1178821C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169824A (en) * | 2010-02-03 | 2011-08-31 | 志圣工业股份有限公司 | Process and device for laminating film on wafer |
| CN103518258A (en) * | 2011-07-29 | 2014-01-15 | 库拉米克电子学有限公司 | Packaging for substrates and packaging unit having such packaging |
-
2002
- 2002-01-25 CN CNB021025886A patent/CN1178821C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169824A (en) * | 2010-02-03 | 2011-08-31 | 志圣工业股份有限公司 | Process and device for laminating film on wafer |
| CN103518258A (en) * | 2011-07-29 | 2014-01-15 | 库拉米克电子学有限公司 | Packaging for substrates and packaging unit having such packaging |
| CN103518258B (en) * | 2011-07-29 | 2016-08-31 | 库拉米克电子学有限公司 | For the packaging of substrate and have the packaging unit of this packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1178821C (en) | 2004-12-08 |
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