CN1430099A - Manufacturing method of micro-pipeline - Google Patents
Manufacturing method of micro-pipeline Download PDFInfo
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- CN1430099A CN1430099A CN 01138148 CN01138148A CN1430099A CN 1430099 A CN1430099 A CN 1430099A CN 01138148 CN01138148 CN 01138148 CN 01138148 A CN01138148 A CN 01138148A CN 1430099 A CN1430099 A CN 1430099A
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- microchannel
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Abstract
A process for preparing microtube features that the microtube pattern prepared on positive photoresist by photoetching technique is crosslinked by negative photoresist for direct fixing and packaging. Its advantages are smooth surface, simple process, and high transparency of microtube.
Description
Technical field:
The present invention relates to the process technology of micromechanics, particularly the method that microchannel is wherein made.
Background technology:
Microelectromechanical systems is the new and high technology of a multidisciplinary intersection, and it has opened up new field for each subject development.The microfluid mechanics is an indispensable part in the microelectromechanical systems research, and microchannel is one of vitals of microfluid system.
At present, the processing of microchannel mainly is to adopt silicon etching process.Wherein, 1. can adopt bonding techniques processing: the photoresist figure of the microchannel that on two silicon chips, obtains respectively earlier, the method of utilizing etching again with this microchannel figure transfer to silicon chip, at last with two wafer bondings that the microchannel figure arranged, obtain packaged microchannel (referring to Etchingtechnology for microchannels, Proc.IEEE MEMS Workshop, 1997, p147-152).2. also can adopt and bury technology processing: as long as on a silicon chip, obtain earlier the photoresist figure of microchannel; the method of utilizing etching again with this microchannel figure transfer to silicon chip; promptly in the process of etching; the groove of elder generation's etching certain depth; again sidewall is protected; only carry out etching from the bottom of groove; after obtaining required figure; add filling material to the top of groove again; obtain packaged microchannel (referring to Micromachining of Buried Micro Channels inSilicon; J.Microelectromechanical System; Vol.9; 94-102,2000).These two kinds of methods all only are applicable to silicon materials, and the microchannel figure of etching gained is subjected to certain restriction; And in the bonding techniques, the bonding of figure needs accurately to aim at, and technology difficulty is bigger; Bury in the technology complex technical process; These have brought adverse effect all for the processing of microchannel.In addition, the pattern of microchannel also is not easy to detect, and is unfavorable for the improvement of processing technology; The surfaceness of microchannel of processing gained is also bigger, and convection cell mobile has bigger influence.
Summary of the invention:
The objective of the invention is to propose a kind of method for making of microchannel, go for multiple material, and can realize the high-quality processing of complicated microchannel.
The concrete processing step of microchannel method for making of the present invention is as follows:
1) mask of making microchannel figure;
2) making microchannel on substrate or cover plate imports and exports;
3) on substrate, coat positive photoresist, on this glue-line, make the photoresist figure of microchannel by photoetching process;
4) on cover plate, coat negative photoresist and oven dry, again that itself and substrate is bonding;
5) see through cover plate or substrate negative photoresist is exposed, make it crosslinked;
6) substrate and cover plate are carried out cleaning treatment, remove positive photoresist and uncrosslinked negative photoresist.
That is to say that the present invention utilizes photoetching process to make the figure of microchannel earlier on positive photoresist, utilize the crosslinked directly fixing and encapsulation of negative photoresist again this figure.Its concrete manufacturing process is:
1) mask of making microchannel figure
Utilize prior art to make mask in the microchannel figure of needs processing.As: utilize pattern generator or beamwriter lithography to be made into normal masks, perhaps, utilize ultraviolet photolithographic or synchrotron radiation optical graving to make X ray mask (just needing when just thinking to use the synchrotron radiation photoetching in the subsequent technique) again.
2) making microchannel on substrate or cover plate imports and exports
The material of substrate and cover plate should have profile pattern preferably, and guarantee that its performance can not change because of subsequent technique, can adopt metal or inorganic material, for example copper, aluminium, glass etc., transparent or opaque all can but both one of must be transparent.If can carry out the material of machining, just can directly process thereon, as: punching; If cannot carry out the material of machining, then import and export can be etched on it, lithographic method can be common wet method or dry etching, as: aciding.
3) on substrate, coat positive photoresist, on this glue-line, make the photoresist figure of microchannel by photoetching process
Wherein, photoetching process can adopt ultraviolet photolithographic or laser lithography, synchrotron radiation photoetching etc., lithography type that it is concrete and parameter (as exposure wavelength and exposure dose, development conditions etc.) utilize photoresist service manual or explanation, select according to the material and the thickness of the positive photoresist that is adopted; And the material of positive photoresist and thickness should decide according to the material of the negative photoresist that is adopted in the height of microchannel figure and the subsequent technique, makes the best coating thickness of selected positive photoresist can satisfy the requirement for height of microchannel figure and its glass temperature bake out temperature greater than negative photoresist.
4) on cover plate, coat negative photoresist and oven dry, again that itself and substrate is bonding
Wherein, the material of negative photoresist should decide according to the performance requirement (as: water wettability, biocompatibility etc.) of moving phase, and should guarantee simultaneously that its bake out temperature is not more than the glass temperature of positive photoresist, its best coating thickness should be greater than the thickness of positive photoresist (make it with substrate bonding then the positive photoresist figure is covered fully).If the thickness of negative photoresist and performance can not meet the demands simultaneously, then should satisfy thickness requirement earlier, by process of surface treatment (as: Cement Composite Treated by Plasma) the microchannel tube wall that is formed by negative photoresist at last be carried out modification, makes it to satisfy performance requirement again.When bonding, preferably substrate and positive photoresist also are heated to the bake out temperature of negative photoresist, so that not occurrence temperature cataclysm of adhesion process, keep negative photoresist to have good flowability, positive photoresist figure indeformable.
5) see through cover plate or substrate negative photoresist is exposed, make it crosslinked
See through transparent substrate or cover plate negative photoresist is exposed, make it crosslinked; Importing and exporting the position or then will block with lighttight material with its corresponding position, make this place's negative photoresist be not exposed, crosslinked.Wherein, exposure light source can adopt ultraviolet light or laser, and exposure wavelength and exposure dose etc. is also selected according to the thickness and the material of photoresist; Some photoresist also should carry out back baking process so that cross-linking effect is better according to its technological requirement.
6) substrate and cover plate are carried out cleaning treatment, remove positive photoresist and uncrosslinked negative photoresist
Place solvent to carry out cleaning treatment simultaneously substrate and cover plate, to remove positive photoresist and uncrosslinked negative photoresist, only stay the negative photoresist after crosslinked, promptly obtain packaged microchannel (just the position of original positive photoresist figure just becomes real operable microchannel).Selected solvent material reply positive photoresist dissolves fast but is very little to the influence of the negative photoresist after crosslinked.
In sum, compared with prior art, adopt the directly fixing and encapsulation of the crosslinked way of negative photoresist because the present invention is the microchannel figure that will utilize photoetching process to make on positive photoresist, thereby have the following advantages:
1. substrate and cover plate go for multiple material, and the negative photoresist that forms the microchannel tube wall also can be selected, thereby scope of application broad, can satisfy the performance requirement of moving phase preferably;
2. the three-dimensional photoetching glue pattern of the various complexity of utilizing photoetching method to obtain directly can be fixed up, expand the range of work of microchannel figure, solved the restriction of silicon etching process effectively the microchannel figure;
3. solved the bigger defective of microchannel surfaceness that silicon etching process brings, made the microchannel quality of processing higher;
4. technological process is simple to operation, has overcome processing difficulties of the prior art;
5. the microchannel that obtains is transparent, helps the pattern of microchannel is detected, and also provides possibility for the detection that utilizes optical means to carry out fluid.
Embodiment:
Below in conjunction with embodiment the concrete manufacturing process of microchannel is described further: one, highly be the making of the hydrophilic simple flat surface microchannel of 5 μ m
1) making of microchannel pattern mask
Utilize pattern generator to be made into normal masks in the microchannel figure of required processing.Perhaps, the also direct suitable mask of outsourcing.
2) making of microchannel import and export
Get the thick glass of 2mm as substrate, go up in place and reserve the square import and export figure of 4mm, adopt acid-proof substances silica gel to cover remainder, utilize hydrofluorite (HF) aciding to carry out etching again, to import and export figure transfer to glass substrate, when etching reaches the another side of substrate, when forming through hole, stops etching, clean with deionized water, again silica gel is peeled off, obtained importing and exporting.
3) making of microchannel photoresist figure
On glass substrate, coat the thick AZ4620 positive photoresist of 5 μ m, utilize the mask of microchannel figure under the uv-exposure machine, to expose (placement location of mask should make the figure of microchannel communicate with on-chip import and export), exposure is carried out at normal temperatures and pressures, exposure wavelength is g line and i line, exposure dose 250mJ/cm
2Adopt wet development, clean with deionized water wash after the development, dry by the fire 120 ℃ of following backs, can obtain the photoresist figure of microchannel on substrate.
4) substrate and cover plate is bonding
Get the thick aluminium flake of 2mm as cover plate, coat the negative photoresist polyvinyl cinnamate of thickness 20 μ m, 90 ℃ of oven dry down; Substrate is also 90 ℃ of heating down; 90 ℃ of flowabilities that keep negative photoresist of constant temperature, cover plate and substrate is bonding; Naturally reduce temperature then to room temperature, negative photoresist is solidified.
5) negative photoresist is crosslinked
Substrate after bonding and cover plate are placed under the uv-exposure machine, see through transparent substrate exposure (adopting the square copper sheet of 6mm to block in on-chip import and export position), exposure is carried out at normal temperatures and pressures, exposure wavelength is g line and i line, exposure dose 600mJ/cm
2
6) cleaning treatment
Substrate and cover plate are placed the acetone rinsing, remove the microchannel figure of positive photoresist and uncrosslinked negative photoresist: after basic the cleaning, substrate and cover plate are taken out, place clean acetone ultrasonic cleaning, take out the back and use deionized water wash, obtain packaged microchannel.
Microchannel to the said process gained carries out the pattern detection, and its testing result is:
The microscope test result shows that microchannel is transparent smooth, and sidewall is steep, and figure is clear to link up, and can be observed flowing of fluid; Step instrument test result shows that the surfaceness of microchannel figure is 46.7 , and the height of pipeline is 5.02 μ m.Two, highly be the making of complex three-dimensional microchannel of the hydrophobic nature of 300 μ m
1) making of microchannel pattern mask
Utilize pattern generator to be made into normal masks in the microchannel figure of required processing, utilize normal masks to carry out ultraviolet photolithographic again and be made into the X ray mask.Perhaps, the also direct suitable mask of outsourcing.
2) making of microchannel import and export
Get the thick copper sheet of 10mm as cover plate, utilize to be machined in punching (diameter 4mm circular hole) on the copper sheet, obtain microchannel and import and export, clean with acetone, deionized water successively.
3) making of microchannel photoresist figure
Get the thick glass of 2mm as substrate, on substrate, coat the thick positive photoresist PMMA of 300 μ m, utilize the X ray mask of microchannel figure, expose at synchrotron radiation light source LIGA station, Hefei.Utilize sample stage inclination and rotation to carry out multiexposure, multiple exposure, make the figure of each time exposure on three dimensions, intersect mutually and be connected, obtain complicated three-dimensional micro-pipe figure.Exposure is carried out in the He of 100mbar gas, and exposure wavelength 0.1～0.7nm, exposure dose are 2000mAmin; Adopt wet development, clean after the development with deionized water wash, can on substrate, obtain the photoresist figure of microchannel.
3) substrate and cover plate is bonding
On cover plate, coat the negative photoresist SU8 of thickness 500 μ m, 96 ℃ of oven dry down; 96 ℃ of heating down of substrate; 96 ℃ of constant temperature keep the flowabilities of negative photoresist, bonding with the substrate that microchannel photoresist figure is arranged (placement location when bonding should make on-chip microchannel figure communicate with import and export on the cover plate); Naturally reduce temperature to room temperature, negative photoresist is solidified.
4) negative photoresist is crosslinked
Substrate after bonding and cover plate are placed under the uv-exposure machine, see through transparent substrate exposure (importing and exporting the corresponding section, position with cover plate on substrate adopts the square copper sheet of 6mm to block), exposure is carried out at normal temperatures and pressures, exposure wavelength 350～400nm, exposure dose 2500mJ/cm
2, the back 96 ℃ of following back bakings that expose made negative photoresist crosslinked in 30 minutes.
6) cleaning treatment
Substrate and cover plate are placed the acetone rinsing, remove the microchannel figure of positive photoresist and uncrosslinked negative photoresist; After basic the cleaning, substrate and cover plate are taken out, place clean acetone ultrasonic cleaning, take out the back and use deionized water wash, obtain packaged microchannel.
Microchannel to the said process gained carries out the pattern detection, and its testing result is:
The microscope test result shows that microchannel is transparent smooth, and figure is clear to link up, and the microchannel of multilayer complexity is communicated with each other, and can be observed flowing of fluid; Step instrument test result shows that the surfaceness of microchannel figure is 32.6 , and the height of pipeline is 300.4 μ m.
Claims (1)
1. the method for making of a microchannel, its concrete processing step is as follows:
1) mask of making microchannel figure;
2) making microchannel on substrate or cover plate imports and exports;
3) on substrate, coat positive photoresist, on this glue-line, make the photoresist figure of microchannel by photoetching process;
It is characterized in that:
4) on cover plate, coat negative photoresist and oven dry, again that itself and substrate is bonding;
5) see through cover plate or substrate negative photoresist is exposed, make it crosslinked;
6) substrate and cover plate are carried out cleaning treatment, remove positive photoresist and uncrosslinked negative photoresist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011381485A CN1187653C (en) | 2001-12-31 | 2001-12-31 | Manufacturing method of micro-pipeline |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011381485A CN1187653C (en) | 2001-12-31 | 2001-12-31 | Manufacturing method of micro-pipeline |
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| Publication Number | Publication Date |
|---|---|
| CN1430099A true CN1430099A (en) | 2003-07-16 |
| CN1187653C CN1187653C (en) | 2005-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB011381485A Expired - Fee Related CN1187653C (en) | 2001-12-31 | 2001-12-31 | Manufacturing method of micro-pipeline |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301896C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
| CN1301897C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Method for making minisize flow passage by lead frame technology |
| CN102175287A (en) * | 2010-12-30 | 2011-09-07 | 国家纳米技术与工程研究院 | Measurement component of flow meter chip based on MEMS (micro electronic mechanical system) technology and manufacturing method thereof |
| CN101634805B (en) * | 2008-07-25 | 2012-01-25 | 中芯国际集成电路制造(上海)有限公司 | Peripheral shading mask structure used for manufacturing semiconductor wafer and manufacturing method thereof |
-
2001
- 2001-12-31 CN CNB011381485A patent/CN1187653C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301896C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Minisize circulating flow passage device made by lead frame |
| CN1301897C (en) * | 2004-03-17 | 2007-02-28 | 升达科技股份有限公司 | Method for making minisize flow passage by lead frame technology |
| CN101634805B (en) * | 2008-07-25 | 2012-01-25 | 中芯国际集成电路制造(上海)有限公司 | Peripheral shading mask structure used for manufacturing semiconductor wafer and manufacturing method thereof |
| CN102175287A (en) * | 2010-12-30 | 2011-09-07 | 国家纳米技术与工程研究院 | Measurement component of flow meter chip based on MEMS (micro electronic mechanical system) technology and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1187653C (en) | 2005-02-02 |
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