A kind of manufacture method of lead-acid accumulator grid and equipment
Technical field:
The present invention relates to a kind of battery material, be specifically related to a kind of manufacture method and equipment of lead-a cid battery electrode plate grid
Background technology
A kind of novel lead-acid storage battery that battery industry occurs in recent years is referred to as lead-a cid battery or horizon battery, and base material one grid of its pole plate also is called plumbous cloth, its manufacturing process, adopting with the glass filament bundle at present is core, and the cold-extruded lead extrusion prepares spongy lead, is woven into net, soldering polar ear aftershaping then.With the plumbous cloth that this weaving manner is made, lack of homogeneity, the surface density error is general 〉=60g/m
2Though plumbous consumption is lower than the casting grid of traditional lead acid accumulator, also there is the too high problem of the plumbous consumption of grid.
Summary of the invention
Technical problem to be solved by this invention is: solve the too high problem of big, the plumbous consumption of plumbous cloth, lack of homogeneity, surface density error that existing lead-a cid battery electrode plate grid forms with the galvanized wire braiding, and a kind of even continuously, little (≤30g/m of surface density error is provided
2), the manufacture method and the equipment of electrical property unanimity, gravimetric specific energy height, lead-a cid battery electrode plate grid that plumbous consumption is low.
The technical solution used in the present invention is:
The present invention adopts physical vapour deposition (PVD)-electro-deposition-heat treated group technology, with the technology and equipment of continuous production strip metal material, makes uniform plumbous cloth grid continuously.
The technology of above-mentioned physical vapour deposition (PVD), comprise a certain or two kinds of combinations respectively in sputter plating, evaporation plating, the ion plating, for example magnetron sputtering and vacuum evaporation coating combination, arc ion plating and magnetron sputtering combination, plating lead (Pb) or tin (Sn) monometallic or Pb-Sn alloy on nonmetal strip material, Sn content 5-70% in the alloy, the thickness 0.3-3 μ m of the coat of metal reaches the purpose of conductionization.
Above-mentioned physical vapor deposition (PVD) equipment can adopt a certain coating machine in evaporation plating, sputter plating, the ion plating, it also can be the extraordinary coating machine that above-mentioned three kinds of coating methods are made up respectively, for example arc evaporation plates and the coating machine of magnetron sputtering combination, perhaps arc ion plating and magnetron sputtering the combination coating machine, coating machine has permanent tension gearing.
Above-mentioned electrodeposition technology, be meant the strip material of nonmetal strip material behind PVD plating lead (Pb) or tin (Sn) monometallic or Pb-Sn alloy, electro-deposition Pb or the first electro-deposition Pb-Sn alloy combined plating that forms of electro-deposition Pb again in special equipment again, wherein the Sn content of Pb-Sn alloy is 5-60%, and the thickness of single-layer metal Pb is 50-1000 μ m; In the combined plating, the thickness of Pb-Sn is 30-980 μ m, and the thickness of Pb is 20-970 μ m.
Described electrodeposition apparatus comprises continuous electro-deposition equipment and chip electrodeposition apparatus; And continuous electro-deposition equipment comprises fast (multiple-grooved of speed 〉=0.4m/min) and (walking speed≤0.2m/min) single groove electrodeposition apparatus, multiple-grooved electrodeposition apparatus such as utility model patent " the whole electrolysis tank of serialization strip foaming nickel " (license notification number CN2337160Y) fast at a slow speed.
Plating lead (Pb) or tin (Sn) monometallic or Pb-Sn alloy on the aforesaid nonmetal strip material, nonmetal strip material can be one or both the combination in macromolecular fibre net, fiber cloth, nonwoven fabrics, the polyurethane sponge, the fabric width of strip material can be 0.3-1.2m, and length is 2-300m.
The electrodeposition technology condition is as follows:
1, electro-deposition Pb can adopt following electrolyte and process conditions:
1.1 electrolyte
A, boron fluorate type
Boron fluoric acid lead [Pb (BF
4)
2] 120g/L
Boron fluoric acid (HBF
4) 30g/L (dissociating)
Boric acid (H
3BO
3) 15g/L
Peptone 0.1-0.5g/L
Temperature 15-35 ℃
Cathode-current density 1-5A/dm
2
B, sulfamate type
Sulfamic acid lead [Pb (SO
3NH
2)
2] 150g/L is (with Pb
2+Meter)
Sulfamic acid HN
2SO
350g/L (dissociating)
Dimethylene biphenol 0.5g/L
[(CH
2)
2(C
6H
5OH)
2]
Temperature 20-50 ℃
Cathode-current density 1-5A/dm
2
C, perchlorate type
Lead perchlorate [Pb (ClO
4)
2] 50g/L is (with Pb
2+Meter)
Perchloric acid (HClO
4) 10g/L
Peptone 0.1-0.3g/L
Temperature 25-50 ℃
Cathode-current density 1-4A/dm
2
D, tartrate type
Lead oxide (PbO) or 100-120g/L are (with Pb
2+Meter)
Lead hydroxide (PbOH)
Sodium potassium tartrate tetrahydrate (KnaC
4H
4O
6.4H
2O) 100-125g/L
Potassium hydroxide (KOH) 40-60g/L
Peach gum 0.2-0.4g/L
Temperature 30-45 ℃
Cathode-current density 1-3A/dm
2
1.2 other technological parameters
The band walking speed
0.2-1.5m/min
2. electro-deposition Pb-Sn alloy can adopt following electrolyte and process conditions
2.1 electrolyte
A. boron fluorate type
Boron fluoric acid lead [Pb (BF
4)
2] 20-140g/L is (with Pb
2+Meter)
Inferior tin [Sn (the BF of boron fluoric acid
4)
2] 5-60g/L is (with Sn
2+Meter)
Boron fluoric acid (HBF
4) 50-60g/L (dissociating)
Boric acid (H
3BO
3) 20-30g/L (excessive)
Resorcinol [C
6H
4(OH)
2] 0.3-2g/L
Polyethylene glycol H (OCH
2CH
2)
nOH 0.2-1.5g/L
Temperature 20-40 ℃
Cathode-current density 1-4A/dm
2
B. sulfamate type
Sulfamic acid [Pb (SO
3NH
2)
2] 30-110g/L is (with Pb
2+Meter)
Inferior tin [Sn (the SO of sulfamic acid
3NH
2)
2] 5-50g/L is ((with Sn
2+Meter)
Sulfamic acid (HNH
2SO
3) 110-150g/L
Boric acid (H
3BO
3) 30-40g/L
Temperature 30-45 ℃
Cathode-current density 5-15A/dm
2
2.2 other technological parameters
The band walking speed
0.2-1.5m/min
Temperature 25-35 ℃
Cathode-current density 3-5A/dm
2
Combined plating through electro-deposition individual layer lead and plumbous and its alloy forms after the grid skeleton, should carry out temper under the protection of nitrogen atmosphere and/or blanket of nitrogen continuously in the crawler type heat-treatment furnace.Answer with elimination and to carry out temper in the heat-treatment furnace continuously.To eliminate stress.Heat treatment temperature<300 ℃, processing time<10-45min, the selection of actual temp and time, should not be carbonized with the nonmetal band in the grid is principle.
The present invention compares with the plumbous cloth grid manufacturing technology of present employing, has following advantage and good effect: can reduce plumbous consumption 30%.Owing to adopted the PVD technology, compare with the technology that adopts electroless lead plating, can save the waste water treatment expense of electroless lead plating.Owing to adopted special continuous electroplating special equipment, the surface density precision of continuous band-shaped plumbous cloth is controlled at≤± 30g/m
2Level, be better than present plumbous cloth manufacturing technology, latter's surface density trueness error 〉=± 60g/m
2, because plumbous cloth surface density is even,, electrical property consistency low with the cost of the lead-a cid battery of this patent made, gravimetric specific energy, life-span etc. are improved.Be a kind of large-scale production, high-quality novel energy material of being suitable for.
Therefore, the plumbous cloth grid that the present invention is novel, reasonable in design, technology is advanced, make is evenly continuous, and plumbous consumption is low, and technical performance is good.
Description of drawings
Fig. 1 is a Pvd equipment embodiment schematic diagram of the present invention
Fig. 2 is a magnetic control target new construction schematic diagram among Fig. 1.
Embodiment
The present invention adopts " physical vapour deposition (PVD)-electro-deposition-heat treatment " COMBINED PROCESS, adopt patented technology and the special equipment of producing banded nonmetallic materials continuously, make uniform plumbous cloth grid continuously, because system is provided with the device of On-line Control surface density, the mass density of lead or lead alloy accurately can be controlled at optimum range.The surface density error≤± 30g/m
2The plumbous consumption of grid is reduced, and the gravimetric specific energy of battery improve.Adopt " physical vapor deposition (PVD)-electro-deposition-heat treatment " combination technique, prepare continuous, uniform plumbous cloth accumulator cell lead cloth grid, the amplitude 0.3-1.2m of plumbous cloth grid, continuous length 2-300m.Or fabric width 0.3-1.2m, length is the plumbous cloth grid of the sheet of 0.3-2m.
Adopt PVD method plating monometallic Pb, Sn or Pb-Sn alloy on nonmetal porous strip, thickness of coating is 0.3-3 μ m, and Sn content is 5-70% in the alloy, reaches the purpose of the leading electrification of electro-deposition.
The combined plating of electro-deposition Pb or Pb-Sn alloy and Pb, the Sn content in the alloy is 5-60%.
Be used to make the nonmetal porous strip of grid, be macromolecular fibre mesh grid, cloth, for example nylon fiber, polyester fiber, polyolefine fiber, Fypro, vinal, polypropylene fibre, nonwoven fabrics, polyurethane sponge.
When continuous electro-deposition Pb and Pb-Sn alloy combination coating, on the whole special equipment of quick multiple-grooved, can select the group technology of boron fluorate type or sulfamate type electrolyte for use.
The electrodeposition technology condition is as follows:
1, electro-deposition Pb can adopt following electrolyte and process conditions:
1.1 electrolyte
A, boron fluorate type
Boron fluoric acid lead [Pb (BF
4)
2] 120g/L boron fluoric acid (HBF
4) 30g/L (dissociating) boric acid (H
3BO
3) 15-35 ℃ of cathode-current density 1-5A/dm of 15g/L peptone 0.1-0.5g/L temperature
2B, sulfamate type sulfamic acid lead [Pb (SO
3NH
2)
2] 150g/L is (with Pb
2+Meter) sulfamic acid HNH
2SO
350g/L (dissociating) dimethylene biphenol 0.5g/L[(CH
2)
2(C
6H
5OH)
2] temperature 20-50 ℃ cathode-current density 1-5A/dm
2C, perchlorate type lead perchlorate [Pb (ClO
4)
2] 50g/L is (with Pb
2+Meter) perchloric acid (HClO
4) 25-50 ℃ of cathode-current density 1-4A/dm of 10g/L peptone 0.1-0.3g/L temperature
2D, tartrate type lead oxide (PbO) or 100-120g/L are (with Pb
2+Meter) lead hydroxide (PbOH) sodium potassium tartrate tetrahydrate (KnaC
4H
4O
6.4H
2O) 100-125g/L potassium hydroxide (KOH) 45-60g/L peach gum 0.2-0.4g/L
Temperature 30-45 ℃
Cathode-current density 1-3A/dm
2
1.2 other technological parameters
The band walking speed
0.2-1.5m/min
2. electro-deposition Pb-Sn alloy can adopt following electrolyte and process conditions
2.1 electrolyte
A. boron fluorate type
Boron fluoric acid lead [Pb (BF
4)
2] 20-140g/L is (with Pb
2+Meter)
Inferior tin [Sn (the BF of boron fluoric acid
4)
2] 5-60g/L is (with Sn
2+Meter)
Boron fluoric acid (HBF
4) 50-60g/L (dissociating)
Boric acid (H
3BO
3) 20-30g/L (excessive)
Resorcinol [C
6H
4(OH)
2] 0.3-2g/L
Polyethylene glycol [H (OCH
2CH
2)
nOH] 0.2-1.5g/L
Temperature 20-40 ℃
Cathode-current density 1-4A/dm
2
B. sulfamate type
Sulfamic acid lead [Pb (SO
3NH
2)
2] p+104 * 30-110g/L is (with Pb
2+Meter)
Inferior tin [Sn (the SO of sulfamic acid
3NH
2)
2] 5-50g/L is ((with Sn
2+Meter)
Sulfamic acid (HNH
2SO
3) 110-150g/L
Boric acid (H
3BO
3) 30-40g/L
Temperature 30-45 ℃
Cathode-current density 5-15A/dm
2
2.2 other technological parameters
The band walking speed
0.2-1.5m/min
Temperature 25-35 ℃
Cathode-current density 3-5A/dm
2
In " physical vapor deposition (PVD)-electro-deposition-heat treatment " combination technique that the present invention adopts, the PVD coating machine that adopts, be a certain coating machine in evaporation plating, sputter plating, the ion plating, also can be the extraordinary coating machine that above-mentioned film plating process is made up respectively, for example arc evaporation plating and magnetron sputtering combination; The coating machine of arc ion plating and magnetron sputtering combination, coating machine has the constant force transmission device.Embodiment schematic diagram referring to Fig. 1, Fig. 2.
The electrodeposition apparatus that adopts is speed (the single groove of walking speed≤0.2m/min) of being careful, also can be that (the whole electroplating bath of the multiple-grooved of walking speed 〉=0.4m/min) is as similar patent equipment " the whole electroplating bath of serialization strip foaming nickel " (license notification number CN2337160Y) for fast walking speed.Also can adopt the plumbous cloth material of conventional electroplating bath electro-deposition sheet.The Equipment for Heating Processing that adopts be the horizontal heat-treatment furnace of conventional crawler-tread or with the electricity of galvanic deposition cell disjunctor heating furnace frequently.
The present invention adopts the physical vapor deposition (PVD) Processes and apparatus to be: in devices of coiled vacuum coating machine, adopt magnetron sputtering, evaporation plating, wherein any both the combined composite type physical gas-phase deposite methods of ion plating that nonmetal band is carried out the continuous conduction processing.
The equipment of said method of the present invention is devices of coiled vacuum coating machine, two ends are respectively the rolling chamber and unreel the chamber, the indoor rolling roller that is equipped with of rolling, unreel indoor being equipped with and unreel roller, rolling chamber and unreel and be connected and installed with magnetic control film coating chamber, electric arc deposited chamber or magnetic control film coating chamber, arc ion plating chamber and dividing plate, cold cover, pretreatment chamber, guide roller, measuring roller between the chamber, the indoor magnetic control target that is equipped with of magnetron sputtering is equipped with the arc evaporation target in the electric arc deposited chamber.
" equipment " of the present invention is meant the host machine part of integral device.Host machine part comprises and unreels chamber, rolling chamber, coating chamber, control cubicle.Except that main frame, integral device also comprises supporting parts such as pumped vacuum systems, cooling system, power-supply system.Host machine part is as one of example of composite type PVD technology, particularly by arc evaporation coating chamber, magnetron sputtering plating chamber, unreel the combining structure of chamber, rolling chamber, as Fig. 1.The feature of this technology is: the both sides of magnetic control film coating chamber 4 and arc coating deposition chamber 6 respectively dispose 8 groups of above magnetic controlled sputtering target 5 and some groups of arc evaporation targets 7, use perpendicular to the cooling jacket 9 of target surface in the middle of the target up and down and be separated by, form several plated film intervals, avoid accumulation of heat, can in time each interval heat that produces be taken away.Effectively improved the situation that nonmetal band is long because of the plating time and the too high sponge of causing of sputtering chamber temperature is aging, tensile strength reduces.Nonmetal band passes through from the centre of coating chamber, and the particle of accepting magnetic control spattering target and arc evaporation target continuously deposits and the formation metal conductive film.Owing to adopted and part power unwinding and rewinding device and vertical body design a little, make the extended state behind the nonmetal band metal lining can be controlled at raw-material state.
" equipment " of the present invention also is particularly related to the structural design of novel magnetic control mosaic target.This design had both improved target utilization and deposition rate; Conveniently change target again, saved the time of changing target.As Fig. 2 is novel magnetic control mosaic target structure chart, and target plate 1 is fixed on the dividing plate 2 by middle press strip 4 and limit press strip 7, and when target plate etched into the degree that needs replacing, as long as press strip is unclamped, the target plate of changing same size got final product.
Magnetic filter has been installed on arc evaporation source, has been made the burn drawback of sponge of evaporation particle obtain effectively overcoming.
Adopted cooling system efficiently between each relatively independent coating chamber, guarantee nonmetal band reason influence of thermal effect not in coating process, effusion micromolecule organic gas influences the change of carrying out and cause the sponge physical and chemical performance smoothly of coating process.Polyurethane sponge is a macromolecular compound, drawback such as very easily produce venting, bond fission in the PVD process, wear out, burn.Use perpendicular to the cooling jacket 9 of target surface in the middle of the target about the present invention has designed and be separated by, form several plated film intervals, avoid heat accumulation, each interval heat isolation that produces is also in time taken away, thereby improved the situation that polyurethane sponge is long because of the plating time and the too high sponge of causing of coating chamber temperature is aging, tensile strength reduces effectively.The band speed of travel can be increased to more than the 200cm/min by 30-60cm/min second during plated film, and the tensile strength of sponge still keeps good.The metal of every square metre of plating improves greatly, thereby has improved the saturating property of plating of sponge, has guaranteed that the direct coupling of sponge in high speed tape transport electro-deposition operation after the conductionization processing moved.The alligatoring preliminary treatment that need not adopt single magnetron sputtering to carry out sponge; Also need not increase the preplating operation one after single magnetron sputtering, the electro-deposition operation with the high speed tape transport is complementary by this.
This patent adopts novel magnetic control mosaic target to improve target utilization and deposition rate.Fig. 2 is novel magnetic control mosaic target structure chart, and target plate 1 is fixed on the dividing plate 2 by middle press strip 4 and limit press strip 7, when target plate etches into the degree that needs replacing, as long as press strip is unclamped, the target plate of changing same size gets final product, and has both improved target utilization, has saved the time of changing target again.The power of magnetic control target depends on the effect of target cooling.In Fig. 2, provide big flow cooling water by water pipe 10, reach desirable cooling effect.
Employing parts the power train system a little, guarantees that the hole of sponge is indeformable, and walking speed is even.
Adopt combination PVD technology as follows to the technological process of nonmetal band material work conductionization processing:
Organic porous matter band → unreel → guide roller → preliminary treatment → composite type PVD plated film → measuring roller → rolling.Whole process is all carried out under vacuum state.Fig. 1 is for adopting one of combination PVD The Application of Technology example, and its main equipment structural principle is as figure.Among Fig. 1: reeling(unreeling)chamber 1 both can have been done rolling with receipts (putting) scroll 2 and also can unreel, and the position of magnetic control film coating chamber 4 will be adjusted up and down when adopting different tape transport directions; 3 pairs of sponges of measuring roller do the technology control survey, as length metering; Magnetic control film coating chamber 4 is finished the magnetron sputtering operation; Magnetic control target 5 provides the metal for the treatment of plating; The operation of electric arc evaporation is finished in arc coating deposition chamber 6; Electric arc target 7 provides plating metal; Dividing plate 8 separates magnetron sputtering chamber 4 and arc evaporation coating chamber 6; Cooling jacket 9 is mainly used in and reduces the coating chamber temperature; There is the special foam metal of asking that has in 10 pairs of pretreatment chamber, and as surface state, make special pre-treatment; Guide roller 11 prevents that band from wandering off; Put (receipts) volume chamber 12 and put (receipts) scroll 13 and work (receipts) volume effect of putting.
In the electric arc deposited chamber, igniting of arc source generally has two kinds of methods: a kind of is that trigger in the gap, promptly by providing current impulse to make its conducting to an auxiliary triggering utmost point, thereby ignites electric arc between the main electrode; Another kind is that machinery triggers, i.e. contacting and drawing back and realize by arc electrode and cathode surface moment.In the electric arc deposited chamber, metal draws pin cause arc discharge with pulse current after, the arc light bright spot on cathode surface intensely, irregularly motion, radiate a large amount of cathode material particle and ion simultaneously, in the effect of electric field deposit to sponge.Magnetron sputtering plating chamber and arc evaporation coating chamber can also can be arranged recombinant alternately separately continuously.The cathode material of arc evaporation source can be made into the cylinder bulk, also can be the tabular of planar rectangular; The cathodic sputtering material of magnetron sputtering plating can be made into circular flat or rectangle plane or cylindrical, but direct current sputtering, but also radio frequency sputtering.
Description of reference numerals
Referring to Fig. 1, the 1-reeling(unreeling)chamber, 2-receives (putting) scroll, The 3-measuring roller, 4-magnetic control film coating chamber, 5-magnetic control target, 6-electric arc deposited chamber 7-arc evaporation target, the 8-dividing plate, the 9-cold water jacket, 10-pretreatment chamber, 11-guide roller, 12-are put (receipts) volume chamber, and 13-is put (receipts) scroll.
Referring to the structure cutaway view of Fig. 2 magnetic control embedding target, 14-target plate among the figure, Press strip in the middle of the magnet in the middle of the 15-dividing plate, 16-, 17-, 18-pole shoe, 19-Limit magnet, 20-limit press strip, 21-target frame, 22-target base plate, the 23-water pipe, 24-O shape sealing ring.