CN1409392A - 基板在芯片上的芯片阵列式球栅阵列封装的制造方法 - Google Patents

基板在芯片上的芯片阵列式球栅阵列封装的制造方法 Download PDF

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CN1409392A
CN1409392A CN02131630A CN02131630A CN1409392A CN 1409392 A CN1409392 A CN 1409392A CN 02131630 A CN02131630 A CN 02131630A CN 02131630 A CN02131630 A CN 02131630A CN 1409392 A CN1409392 A CN 1409392A
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chip
base board
board unit
grid array
spherical grid
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CN1218388C (zh
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彭镱良
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Advanced packaging and testing (Hongkong) Co.,Ltd.
Ase Assembly & Test (shanghai) Ltd
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LIWEI SCIENCE AND TECHNOLOGY Co Ltd
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Abstract

本发明公开了一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，其是在一基板的每一基板单元第一表面上各安装一芯片，使芯片正面黏接在该第一表面上，且呈矩阵排列的基板单元面积小于该芯片；接着利用打线法将复数引线从芯片正面耦合至基板单元的第二表面上；再以一封装胶体包覆保护该引线及芯片正面；最后于引线间的基板单元第二表面上形成有数个焊球。本发明切单完成后的封装结构符合实际芯片尺寸封装的需求，并具有提升产能、可靠性较佳与降低成本的功效。

Description

基板在芯片上的芯片阵列式球栅阵列封装的制造方法
技术领域
本发明涉及一种集成电路封装技术，特别是关于一种基板在芯片上的芯片阵列式球栅阵列封装(substrate on chip CA BGA)的制造方法。
背景技术
由于集成电路技术的进步，电子产品层次与功能提升的趋向可以归纳为多功能化、高速化、大容量化、高密度化、轻量化，为了达成这些需求，除了集成电路制程技术进步的推动外，许多新颖的构装技术与材料被开发出来。
传统的球珊阵列封装(Ball Grid Array，BGA)，是以印刷电路板作为电子封装基板，如图1所示，其封装结构为一基板10，其一表面是安装有一芯片12，并利用数引线14连接基板10及芯片12，另有一构装胶体(molding compound)16包覆芯片12及引线14；基板10底部是利用焊球(solder ball)18将芯片12电连接至其它电子装置上。BGA封装虽可提供较多引脚数，却受限于外型尺寸的限制，无法提供更小的体积结构。此乃因该种封装结构需保留相当空间给予打线的用，因此基板尺寸必须大于芯片尺寸，使其无法达到实际芯片尺寸封装的目的；而在散热功能上，因芯片完全被构装胶体包覆住，使其散热效果较差。
而为了因应高密度的封装装置，以发展更轻、薄、短、小的电子是统产品，芯片级封装(Wafer Level Package，WLP)技术应运而生，其基本定义为直接在硅芯片20上进行封装，再利用切割道22将硅芯片20切割(dicing)成复数个封装结构24，如图2所示，此芯片级封装结构24包括一芯片26，其上是直接设有复数个焊球(solder bump)28，使该封装结构24的平面面积与原始芯片26面积相当，且芯片级所使用的技术基本上源于上述的BGA技术，差别者仅为球形焊料的尺寸缩小。但就此种芯片级封装而言，受到芯片良率、封装测试设备的投资与成熟度等因素，使其发展具有瓶颈，且在良率测试方面及焊球接点可靠性问题亦一大问题。
因此，本发明即在针对上述的困扰，提出一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，以有效克服传统的缺失。
发明内容
本发明的主要目的是提供一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，使其制作出的封装大小及厚度均较小，以达到实际芯片尺寸封装的需求，且其重量亦较轻。
本发明的另一目的是提供一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，其是可提升产能，减少开模频率，并具有降低成本的功效。
本发明的再一目的是提供一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，其是具有较佳的可靠性，且制程所需的设备可沿用现有CA BGA设备。
本发明的又一目是提供一种基板在芯片上的芯片阵列式球栅阵列封装的制造方法，使制作出的封装结构大小可依客户或市场需求做弹性调整，以符合现有载具或夹具的规格。
为达到上述的目的，本发明首先提供一基板，其上是设有呈矩阵排列的复数个基板单元，且其是利用一框架连接在一起；于每一基板单元的第一表面上安装一面积较大的芯片，使芯片正面与该第一表面相黏接；将复数引线从芯片正面的电路端耦合至基板单元的第二表面上；再利用一封装胶体包覆该引线及芯片正面；最后在该引线间的基板单元的第二表面上形成有数个焊球。完成后进行切单步骤，即可得到复数个基板在芯片上的芯片阵列式球栅阵列封装装置。
下面藉由具体实施例并配合附图对本发明进行详细说明，以便更容易了解本发明的目的、技术内容、特点及其所达成的功效。
附图说明
图1为传统球门阵列封装的结构示意图；
图2为传统芯片级封装的示意图；
图3为本发明所使用的基板示意图；
图4为本发明进行芯片安装的示意图；
图5A图至图5D图是分别为本发明基板单元进行封装的各步骤结构剖视图。
图6为本发明制作出的另一实施例。
附图标号说明：10基板；12芯片；14引线；16构装胶体；18焊球；20硅芯片；22切割道；24芯片级封装结构；26芯片；28焊球；30基板；32基板单元；34框架；36切割道；38芯片；40引线；42封装胶体；44焊球。
具体实施方式
本发明是在一基板上预设有复数个基板单元，以直接于其上依序进行封装，形成复数个基板在芯片上的芯片阵列式球栅阵列封装结构，并利用芯片的面积尺寸较基板单元大的特性，使封装后的封装结构大小与芯片尺寸(chip size)相当。
图3至图5分别为本发明的较佳实施例在制作基板在芯片上的芯片阵列式球栅阵列封装的各步骤构造剖视图；如图所示，本发明的制造方法是包括有下列步骤：
首先，如图3所示，提供一半导体基板30，其上是设有呈网格状矩阵排列的复数个基板单元32，且每一该基板单元32利用一框架34连接在一起且为一体成型；在相邻二基板单元32之间是预设有一切割道36，且每一基板单元32各具有一第一表面及一第二表面。
请参阅图4所示，利用芯片黏结(die attach)技术，先将一芯片38反转后，再将芯片38的正面安装在半导体基板30的每一个基板单元32的第一表面上，请同时参考图5A所示的每一基板单元32的结构剖视图，芯片38的正面与基板单元32的第一表面黏接在一起，且该芯片38尺寸面积大于该基板单元32，使芯片38正面周围的电路端环绕在基板单元32周围而不会与基板单元32接触或被压迫。
接着，为了便于详细说明芯片38安装后的各步骤，下面将以基板单元32进行封装的各步骤结构剖视图来说明接续的各制程。如图5B所示，利用打线技术将复数引线40(通常为金线)从芯片38正面的电路端耦合至基板单元32的第二表面上，使其形成电性连接。最外层的封装胶体42，是使用模塑化合物(moldingcompound)(通常为环氧树脂(epoxy resin))经过压模成型，如图5C所示，包覆所有引线40、露出的芯片38正面以及部份的基板单元32第二表面，以提供机械性的保护作用，避免芯片38及引线40受到外力(例如碰撞、灰尘、或水气等)侵害。
最后，参见图5D，在该引线40间的基板单元32的第二表面上形成有复数个焊球44，以供安装至其它装置上并形成电性相接。当芯片阵列式球栅阵列封装完成后，更可以上述图4所示的每一基板单元32为一单位，依切割道36进行切单的步骤，即可完成整个封装制程，以得到复数个基板在芯片上的芯片阵列式球栅阵列封装装置结构。
其中，在该切单步骤中，若切割刀沿着芯片边缘进行切割，切单后，封装装置的尺寸大小即与原芯片尺寸相同。另外，本发明亦可配合客户或市场需求，调整切单后的产品大小，换言之，将相邻基板单元32之间的间距拉大，使其于切单步骤后，在芯片38旁边仍留有些许的封装胶体42，如图6所示，如此即可依据该封装胶体来弹性调整封装结构的尺寸，使其符合需求，例如客户须沿用现有的载具或治具时。
本发明采用基板在芯片上的方式进行封装，使完成的封装结构厚度将会小于传统CA BGA的厚度，达到实际芯片尺寸封装的需求，并符合轻、薄、短、小的市场需求。本发明是具有较佳的可靠性，其制程所需的设备可沿用现有CA BGA设备，且制作出的封装结构大小可依客户或市场需求做弹性调整，以符合现有载具或夹具的规格。
另外，藉由本发明的技术可使封装产品在切单后维持与原芯片尺寸同等大小，如此亦可增加基板排版率，以减少基板成本；此外，本发明亦使用矩阵方式设计基板，如此可提升产能，减少开模频率，进而达到降低成本的目的。
以上所述的实施例仅是为说明本发明的技术思想及特点，其目的在使本领域的熟练技术人员能够了解本发明的内容并据以实施，而不能用来限定本发明的范围。凡依本发明所揭示的精神所作的均等变化或修饰，仍应涵盖在本发明的范围内。

Claims (5)

1、一种基板在芯片上的芯片阵列式球栅阵列封装，包括：
提供一基板，其上设有呈矩阵排列的复数个基板单元，具有第一表面及第二表面，且每一该基板单元利用一框架连接在一起；
于每一该基板单元的第一表面上安装一芯片，使该芯片正面与该第一表面相黏接，且该芯片面积大于该基板单元；
以打线技术将复数引线从该芯片正面的电路端，耦合至该基板单元的第二表面上；
利用一封装胶体包覆该引线及该芯片正面；以及
在该引线间的该基板单元的第二表面上形成数焊球。
2、如权利要求1所述的芯片阵列式球栅阵列封装，其特征在于在形成焊球的步骤完成后，以上述每一该基板单元为一单位，进行切割。
3、如权利要求1所述的芯片阵列式球栅阵列封装，其特征在于在相邻该基板单元之间设有切割道。
4、如权利要求1所述的芯片阵列式球栅阵列封装，其特征在于封装胶体是环氧树脂。
5、如权利要求2所述的芯片阵列式球栅阵列封装，其特征在于在进行切单步骤时，依据该封装胶体来弹性调整整个封装结构的尺寸。
CN021316309A 2002-07-10 2002-09-11 基板在芯片上的芯片阵列式球栅阵列封装的制造方法 Expired - Fee Related CN1218388C (zh)

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