CN1401816A - Ion beam reinforced magnetic control sputter diffusion coating apparatus process - Google Patents

Ion beam reinforced magnetic control sputter diffusion coating apparatus process Download PDF

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Publication number
CN1401816A
CN1401816A CN 02110192 CN02110192A CN1401816A CN 1401816 A CN1401816 A CN 1401816A CN 02110192 CN02110192 CN 02110192 CN 02110192 A CN02110192 A CN 02110192A CN 1401816 A CN1401816 A CN 1401816A
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workpiece
ion
source
vacuum vessel
metal
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CN 02110192
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Chinese (zh)
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唐宾
潘俊德
徐重
田林海
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Taiyuan University of Technology
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Taiyuan University of Technology
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Abstract

An ion beam enhanced magnetically-controlled sputtering apparatus and process is characterized by the combination of unbalanced magnetically-controlled sputtering with ion implantation, that is, a medium-or low-energy ion source is arranged in an unbalanced magnetically-controlled sputtering apapratus. Under the action of negative pressure, the high-energy metal or alloy ion streams emitted from the sputtering source are quickly deposited on the preheated surface of workpiece and the nitrogen and carbon are then implanted to form a carbide or nitride modified coated layer on the surface of workpiece.

Description

Ion beam reinforced magnetic control sputter diffusion coating apparatus and technology
Technical field
Ion beam reinforced magnetic control sputter diffusion coating apparatus of the present invention and technology belong to the category of metal surface properties modification, are that fast and ionic fluid injects recoil and forms pseudo-diffusion layer and organically combine device and the technology that realizes the quick plating surface reforming layer in metal works surface the non-balance magnetically controlled sputter sedimentation velocity.
Background technology
Process for modifying surface nineties, the trend of development was that Combined Processing promptly blends plating, annotated and plating and be coated with and plate in addition laser treatment etc., though ion implantationly can obtain to inject preferably effect, but input horizon is very thin, inject energy, conventional I in order to overcome the thin shortcoming of modified layer, also to lay particular emphasis on to improve 2Injection method and the PI that develops now 3The injection method energy mostly is more than the 100kev, because input horizon is thin, equipment is very expensive, the X-ray protection complexity, and use is restricted.Fa Zhan Ion Beam Enhanced Deposit Technology (IBED) was that ion beam sputter depositing and energetic ion are injected the plating that combines and the compounding technology of notes in recent years, though there is depositing temperature low, coating densification and bonding strength advantages of higher, but because sedimentation velocity is low, coating speed is slow, and X-ray protection, insulation level require very tight, the equipment complexity, very expensive, use to promote also to be subjected to certain restriction.
Field ion implantation is queried to the necessity of high energy in recent years, what have studies show that when nitrogen is ion implantation to increasing the degree of depth of injecting recoil, it is more effective than improving energy of ions to improve beam current density, can obtain darker modified layer, the non-balance magnetically controlled sputter deposition technique is the new developing technology nineties, because unbalanced magnetic field is very strong, the sputter effect is also strong, the ionization of sputtering particle is from height, so sedimentation rate is fast, and advantage such as plated film density, bonding force are stronger.
Summary of the invention
The object of the invention is, a kind of ion source and non-balance magnetically controlled sputter source that middle low energy, big line are set in same device disclosed, utilize the non-balance magnetically controlled sputter source that atoms metal, the ion of a large amount of ionizations are provided, the low energy ion source is atoms metal, ion implantation pre-heated workpiece surface in utilizing again, both are organically combined, form the device and the technology of surface reforming layer at workpiece surface with certain diffusion layer.
The structure of ion beam reinforced magnetic control sputter diffusion coating apparatus of the present invention is characterized in that, but is in extracting vacuum, and final vacuum is 1 * 10 -3~5 * 10 -3Pa and energy fill gas body medium, dividing potential drop is 2 * 10 -2~8 * 10 -1In the vacuum vessel 1 of Pa, cathode rotation system is set, unbalanced magnetron sputtering system, middle low energy ion origin system, workpiece preheat system, be equipped with simultaneously bleed, airing system, its cathode rotation system is made up of tray for work pieces 9, workpiece 10 and rotating mechanism 6, unbalanced magnetron sputtering system is made up of non-balance magnetically controlled sputter target source 3,11 and direct supply 4,13, workpiece preheats system by well heater 17, heating power supply 16 is formed, airing system is made up of air feed bottle 12, inlet mouth 14, and air-bleed system is made up of mechanical pump 8 and diffusion pump 7.
Workpiece 10 places on the tray for work pieces 9, be positioned at the central authorities of vacuum vessel 1, non-balance magnetically controlled sputter target source 3,11 are symmetrically placed in vacuum vessel wall both sides, middle low energy ion source 15 places the top of vacuum vessel wall 1, at male receptacle wall 2 and controlled sputtering source 3, connect adjustable 0~1200V direct magnetic control power supply 4 between 11 respectively, 13, the direct supply 5 that between male receptacle wall 2 and workpiece 10, connects adjustable 0~1000V, well heater 17 two ends add adjustable ac source 16, it is characterized in that: one, non-balance magnetically controlled sputter target source 3, the 11st, constitute by asymmetrical strong magnet with by desiring the magnetic controlling target that metallic cementation and alloy or graphite carbon make, be placed in the both sides of wall of container and can in vacuum vessel, advance 0~50mm, because the magnetic field that asymmetrical strong magnet can produce very strong vertical and horizontal, make magnetic controlling target can sputter high-energy, high-density, the particle flux of the metal of high ionization level and alloy or carbon, (under 200~500V) attractions, arrive workpiece surface fast and form the cementation coating of desiring plating metal and alloy or carbon in the workpiece negative bias.
They are two years old, the ion source of laying at the vacuum vessel top 17 is middle low energy 3~50kev, big line 10~200mA, by non-balance magnetically controlled sputter target source 3,11 in workpiece plating metal and alloy layer, inject the nitride cementation coating that N can be formed with the metal or alloy of certain diffusion layer at workpiece surface by ion source.Injecting carbon can form the metallic carbide cementation coating at workpiece surface, can form metal carbon, nitrogen compound cementation coating when injecting carbon, nitrogen simultaneously.
Its three, in vacuum vessel 1, be provided with to workpiece 10 pre-warmed heating sources 17, can make workpiece be raised to 200~700 ℃ in advance, neither influence the performance of matrix, can increase the degree of depth of diffusion layer again, make coating really become cementation coating, improve bonding strength.
Its four, when desiring to ooze workpiece 10 plating metal carbonitride compounds, the temperature of workpiece is 200~700 ℃, magnetic control power source voltage 800~1000V, ion beam energy are 5~40kev, beam current density is 10~150mA, working gas is N 2Gas, carburetted hydrogen gas, Ar gas, dividing potential drop are 2 * 10 -2~8 * 10 -1Pa, workpiece bias are 200~500V.
Description of drawings
Accompanying drawing is ion beam reinforced magnetic control sputter diffusion coating apparatus and process schematic representation:
Label among the figure is: 1. vacuum tank 2. vacuum tank walls 3. unbalanced magnetron sputterings 4. magnetic control power supplys 5. workpiece bias power supplys 6. rotating mechanisms 7. diffusion pumps 8. mechanical pumps 9. tray for work pieces 10. workpiece 11. unbalanced magnetron sputterings 12. low energy ion source 16. heating power supplies, 17. heating sources in bottle 13. magnetic control power supplys 14. air inlets 15. of supplying gas
Embodiment
Below in conjunction with description of drawings technical characterictic of the present invention and working process.
When carrying out the plating metal nitride, at first mechanical pump 8 and the diffusion pump 7 by air-bleed system is extracted into 1 * 10 with vacuum vessel 1 -3~5 * 10 -3The Pa final vacuum after then heating source 17 is powered by heating power supply 16, preheats 200~700 ℃ to workpiece, charges into Ar gas by airing system 12, divides to be pressed in 2 * 10 -2~8 * 10 -1Pa, give non-balance magnetically controlled sputter target source 3 voltage supplied this moment is 800~1000V, give workpiece 10 biasings 200~500V, by non-balance magnetically controlled sputter target source 3,11 launch high-energy, high-density, the metal ion stream of high ionization level, under the attraction of workpiece negative bias, arrive the coating that workpiece surface forms metal and alloy at a high speed, in plating, open ion source 15, energizing quantity is 5~40kev, line 10~150mA, inject workpiece surface N ion, by non-balance magnetically controlled sputter target source 3,11 are plated on the metal of workpiece surface and the ion of alloy, rely on the bombardment of nitrogen ionic and be infused in the metal nitride cementation coating that workpiece surface is formed with the certain thickness diffusion layer, film and substrate combinating strength are improved greatly.
With plating CrN is example:
300~500 ℃ of workpiece temperatures, in 3 hours treatment times, cementation coating thickness can reach 3~5 μ m, and the pseudo-diffusion layer degree of depth can reach about 0.5~1 μ m.

Claims (5)

1. an ion beam reinforced magnetic control sputter diffusion coating apparatus is characterized in that, be can extracting vacuum, and in the vacuum vessel (1) of energy fill gas body medium, cathode rotation system is set, unbalanced magnetron sputtering system, middle low energy ion origin system, workpiece gives heating system, air-bleed system and airing system be equipped with simultaneously, its cathode rotation system is by tray for work pieces (9), workpiece (10) and rotating mechanism (6) are formed, unbalanced magnetron sputtering system is by magnetron sputtering target source (3), (11) and really flow power supply (4), (13) form, workpiece gives heating system and is made up of well heater (17) heating power supply (16), airing system is made up of air feed bottle (12) inlet mouth (14), air-bleed system is made up of mechanical pump (8) and diffusion pump (7), workpiece (10) places on the tray for work pieces (9), be positioned at vacuum vessel (1) central authorities, non-balance magnetically controlled sputter target source (3), (11) be symmetrically placed in vacuum vessel wall both sides, middle low energy ion source (15) places the top of container (1), in male receptacle wall (2) and non-balance magnetically controlled sputter target source (3), (11) connect adjustable 0~1200V direct supply (4) between respectively, (13), between male receptacle wall (2) and workpiece (10), connect adjustable 0~1000V direct supply (5), well heater (17) two ends connect adjustable ac source (16), its non-balance magnetically controlled sputter target source (3), (11) be by asymmetrical strong magnet with by desiring the plating metal, the difform magnetic controlling target that alloy or graphite carbon are made constitutes, be placed in the both sides of wall of container (2) and can advance 0~50mm distance in vacuum vessel, the ion source (15) that install at its vacuum vessel top is middle low energy, the large beam ion source.
2. according to the described a kind of ion beam reinforced magnetic control sputter diffusion coating apparatus of claim 1, it is characterized in that non-equilibrium magnetic controlled target source (3), (11) are to make circle, square by any metal alloy that can conduct electricity or graphite carbon, circular dimension φ 50~120 * 20~30mm, square size 200~400mm * 20~30mm.
3. adopt the described a kind of ionic fluid of claim 1 to strengthen the technology that magnetic control spatters the plating coating device, it is characterized in that at first vacuum vessel (1) being extracted into 1 * 10 by the mechanical pump (8) and the diffusion pump (7) of air-bleed system -3~5 * 10 -3The Pa final vacuum after then heating source (17) is powered by heating power supply (16), preheats 200~700 ℃ to workpiece, charges into Ar gas by airing system (12), divides to be pressed in 2 * 10 -2~8 * 10 -1Pa, give non-balance magnetically controlled sputter target source (3) voltage supplied this moment is 800~1000V, give workpiece (10) biasing 200~500V, launch high-energy by magnetron sputtering target, high-density, the metal ion stream of high ionization level, under the attraction of workpiece negative bias, arrive the coating that workpiece surface forms metal and alloy at a high speed, in plating, open ion source (15), energizing quantity is 5~40kev, line 10~150mA, inject workpiece surface N ion, be plated on the metal of workpiece surface and the ion of alloy, rely on the bombardment of nitrogen ionic and be infused in the metal nitride cementation coating that workpiece surface is formed with the certain thickness diffusion layer by the magnetic control source.
4. strengthen magnetron sputtering plating coating process according to the described a kind of ionic fluid of claim 3, the final vacuum that it is characterized in that vacuum vessel (1) is 1 * 10 -3~5 * 10 -3Pa, the gaseous media that charges into can be Ar gas, N 2Gas and hydrocarbon gas, operating pressure are 2 * 10 -2~8 * 10 -1Pa.
5. strengthen magnetron sputtering plating coating process according to the described a kind of ionic fluid of claim 3, it is characterized in that plating workpiece (10) temperature is 200~700 ℃, the voltage of supply in non-balance magnetically controlled sputter target source (3) is 700~1000V, ion beam energy 5~40kev, beam current density is 10~150mA, and operating air pressure is 2 * 10 -2~8 * 10 -2Pa, working bias voltage 200~500V.
CN 02110192 2002-03-20 2002-03-20 Ion beam reinforced magnetic control sputter diffusion coating apparatus process Pending CN1401816A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101634012B (en) * 2008-07-21 2011-05-25 中国科学院宁波材料技术与工程研究所 Ion beam assisting magnetic control sputtering deposition method for surface protection
CN103448341A (en) * 2012-06-01 2013-12-18 上海航天设备制造总厂 Salt spray corrosion resistant self-lubricating film for space moving part, and preparation method thereof
CN105862005A (en) * 2016-06-22 2016-08-17 重庆科技学院 Plasma enhanced magnetron sputtering system and method
CN106637109A (en) * 2016-10-18 2017-05-10 重庆科技学院 Magnetic-pole-assisted unbalanced magnetic control sputtering device
CN107400855A (en) * 2016-05-18 2017-11-28 今钛科技股份有限公司 Film forming apparatus and method
CN111238818A (en) * 2020-01-06 2020-06-05 北京卫星环境工程研究所 Sputtering pollution protection system for ignition test of electric thruster and design method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101634012B (en) * 2008-07-21 2011-05-25 中国科学院宁波材料技术与工程研究所 Ion beam assisting magnetic control sputtering deposition method for surface protection
CN103448341A (en) * 2012-06-01 2013-12-18 上海航天设备制造总厂 Salt spray corrosion resistant self-lubricating film for space moving part, and preparation method thereof
CN107400855A (en) * 2016-05-18 2017-11-28 今钛科技股份有限公司 Film forming apparatus and method
CN105862005A (en) * 2016-06-22 2016-08-17 重庆科技学院 Plasma enhanced magnetron sputtering system and method
CN106637109A (en) * 2016-10-18 2017-05-10 重庆科技学院 Magnetic-pole-assisted unbalanced magnetic control sputtering device
CN111238818A (en) * 2020-01-06 2020-06-05 北京卫星环境工程研究所 Sputtering pollution protection system for ignition test of electric thruster and design method thereof

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