CN1387740A - 压力传感器 - Google Patents
压力传感器 Download PDFInfo
- Publication number
- CN1387740A CN1387740A CN00815300A CN00815300A CN1387740A CN 1387740 A CN1387740 A CN 1387740A CN 00815300 A CN00815300 A CN 00815300A CN 00815300 A CN00815300 A CN 00815300A CN 1387740 A CN1387740 A CN 1387740A
- Authority
- CN
- China
- Prior art keywords
- opening
- transducer
- chamber
- vibrating membrane
- silicon substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 44
- 239000012528 membrane Substances 0.000 claims description 36
- 239000003990 capacitor Substances 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract description 2
- 238000010923 batch production Methods 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000519996 Teucrium chamaedrys Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0636—Protection against aggressive medium in general using particle filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Abstract
Description
Claims (16)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA199901253 | 1999-09-06 | ||
DKPA199901253 | 1999-09-06 | ||
US39071299A | 1999-09-07 | 1999-09-07 | |
DKPA199901265 | 1999-09-07 | ||
US09/390,712 | 1999-09-07 | ||
DKPA199901265 | 1999-09-07 | ||
US09/570,493 | 2000-05-12 | ||
US09/570,493 US6732588B1 (en) | 1999-09-07 | 2000-05-12 | Pressure transducer |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1387740A true CN1387740A (zh) | 2002-12-25 |
CN1205841C CN1205841C (zh) | 2005-06-08 |
Family
ID=27439456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008153000A Expired - Lifetime CN1205841C (zh) | 1999-09-06 | 2000-09-06 | 压力传感器 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1219136B1 (zh) |
JP (1) | JP2003508997A (zh) |
CN (1) | CN1205841C (zh) |
AT (1) | ATE243406T1 (zh) |
AU (1) | AU6984000A (zh) |
CA (1) | CA2383901A1 (zh) |
DE (1) | DE60003441T2 (zh) |
DK (1) | DK1219136T3 (zh) |
PL (1) | PL354000A1 (zh) |
WO (1) | WO2001019133A1 (zh) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100446204C (zh) * | 2003-07-19 | 2008-12-24 | 因芬尼昂技术股份公司 | 集成传感器芯片单元 |
CN100499877C (zh) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法 |
CN100515119C (zh) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | 一种用于硅微电容传声器中的芯片及其制备方法 |
CN103052011A (zh) * | 2011-10-13 | 2013-04-17 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
CN103130176A (zh) * | 2011-11-21 | 2013-06-05 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
CN103175552A (zh) * | 2011-12-26 | 2013-06-26 | 财团法人工业技术研究院 | 电容传感器及其制造方法和具该电容传感器的多功能元件 |
CN104066041A (zh) * | 2014-05-13 | 2014-09-24 | 冠研(上海)企业管理咨询有限公司 | 麦克风及麦克风阵列的封装方法 |
CN104080035A (zh) * | 2014-05-13 | 2014-10-01 | 冠研(上海)企业管理咨询有限公司 | 配置有麦克风或麦克风阵列的移动电子装置 |
CN104113809A (zh) * | 2014-05-13 | 2014-10-22 | 冠研(上海)企业管理咨询有限公司 | 麦克风封装结构 |
CN104469639A (zh) * | 2014-05-13 | 2015-03-25 | 冠研(上海)企业管理咨询有限公司 | 麦克风阵列 |
CN106796151A (zh) * | 2014-08-01 | 2017-05-31 | 卡尔·弗罗伊登伯格公司 | 传感器、包括传感器的过滤元件和这样的过滤元件的应用 |
CN109362013A (zh) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | 组合传感器 |
CN110345972A (zh) * | 2019-06-25 | 2019-10-18 | 歌尔股份有限公司 | 一种传感器及电子设备 |
CN111537054A (zh) * | 2020-06-20 | 2020-08-14 | 南京元感微电子有限公司 | 一种压力与水声集成传感器及其制备方法 |
CN112291690A (zh) * | 2019-07-22 | 2021-01-29 | 英飞凌科技股份有限公司 | 压力传感器 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7166910B2 (en) | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US8617934B1 (en) | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US7382048B2 (en) | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
US7501703B2 (en) | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
DE102004058879B4 (de) * | 2004-12-06 | 2013-11-07 | Austriamicrosystems Ag | MEMS-Mikrophon und Verfahren zur Herstellung |
JP2007036387A (ja) * | 2005-07-22 | 2007-02-08 | Star Micronics Co Ltd | マイクロホンアレー |
KR100722686B1 (ko) | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰 |
KR100722687B1 (ko) | 2006-05-09 | 2007-05-30 | 주식회사 비에스이 | 부가적인 백 챔버를 갖는 지향성 실리콘 콘덴서 마이크로폰 |
JP4770605B2 (ja) * | 2006-06-26 | 2011-09-14 | ヤマハ株式会社 | 平衡出力マイクロホンおよび平衡出力マイクロホンの製造方法 |
US7579678B2 (en) | 2006-09-04 | 2009-08-25 | Yamaha Corporation | Semiconductor microphone unit |
CN101358991B (zh) * | 2007-08-01 | 2011-02-16 | 中国电子科技集团公司第五十八研究所 | 微电子器件恒定加速度的检测方法 |
US8144906B2 (en) * | 2008-05-21 | 2012-03-27 | Akustica, Inc. | Wind immune microphone |
FR2963099B1 (fr) * | 2010-07-22 | 2013-10-04 | Commissariat Energie Atomique | Capteur de pression dynamique mems, en particulier pour des applications a la realisation de microphones |
FR2963192B1 (fr) * | 2010-07-22 | 2013-07-19 | Commissariat Energie Atomique | Générateur d'impulsions de pression de type mems |
US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
TWI550261B (zh) * | 2014-03-17 | 2016-09-21 | 立錡科技股份有限公司 | 微機電壓力計以及其製作方法 |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4207951C2 (de) * | 1992-03-10 | 1995-08-31 | Mannesmann Ag | Kapazitiver Druck- oder Differenzdrucksensor in Glas-Silizium-Technik |
DE4207950C1 (en) * | 1992-03-10 | 1993-05-13 | Mannesmann Ag, 4000 Duesseldorf, De | Capacitative differential pressure sensor - has two carrier plates of monocrystalline silicon@ with flat recesses etched to form measuring chamber by facing diaphragm plate of boron silicate glass |
EP0561566B1 (en) * | 1992-03-18 | 1999-07-28 | Knowles Electronics, Inc. | Solid state condenser and microphone |
WO1996022515A1 (en) * | 1995-01-19 | 1996-07-25 | Honeywell Inc. | Apparatus for detection of a diaphragm rupture in a pressure sensor |
US5936164A (en) * | 1997-08-27 | 1999-08-10 | Delco Electronics Corporation | All-silicon capacitive pressure sensor |
-
2000
- 2000-09-06 CN CNB008153000A patent/CN1205841C/zh not_active Expired - Lifetime
- 2000-09-06 JP JP2001522195A patent/JP2003508997A/ja active Pending
- 2000-09-06 DE DE60003441T patent/DE60003441T2/de not_active Expired - Lifetime
- 2000-09-06 CA CA002383901A patent/CA2383901A1/en not_active Abandoned
- 2000-09-06 AU AU69840/00A patent/AU6984000A/en not_active Abandoned
- 2000-09-06 DK DK00958264T patent/DK1219136T3/da active
- 2000-09-06 AT AT00958264T patent/ATE243406T1/de active
- 2000-09-06 EP EP00958264A patent/EP1219136B1/en not_active Expired - Lifetime
- 2000-09-06 WO PCT/DK2000/000490 patent/WO2001019133A1/en active IP Right Grant
- 2000-09-06 PL PL00354000A patent/PL354000A1/xx unknown
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100446204C (zh) * | 2003-07-19 | 2008-12-24 | 因芬尼昂技术股份公司 | 集成传感器芯片单元 |
CN100515119C (zh) * | 2003-08-12 | 2009-07-15 | 中国科学院声学研究所 | 一种用于硅微电容传声器中的芯片及其制备方法 |
CN100499877C (zh) * | 2003-12-17 | 2009-06-10 | 中国科学院声学研究所 | 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法 |
CN103052011A (zh) * | 2011-10-13 | 2013-04-17 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
CN103130176A (zh) * | 2011-11-21 | 2013-06-05 | 罗伯特·博世有限公司 | 微机械功能装置、尤其扬声器装置、以及相应的制造方法 |
US9154886B2 (en) | 2011-12-26 | 2015-10-06 | Industrial Technology Research Institute | Capacitive transducer manufacturing method, and multi-function device |
CN103175552A (zh) * | 2011-12-26 | 2013-06-26 | 财团法人工业技术研究院 | 电容传感器及其制造方法和具该电容传感器的多功能元件 |
CN103175552B (zh) * | 2011-12-26 | 2016-01-20 | 财团法人工业技术研究院 | 电容传感器及其制造方法和具该电容传感器的多功能元件 |
CN104066041B (zh) * | 2014-05-13 | 2018-01-02 | 冠研(上海)专利技术有限公司 | 麦克风及麦克风阵列的封装方法 |
CN104469639A (zh) * | 2014-05-13 | 2015-03-25 | 冠研(上海)企业管理咨询有限公司 | 麦克风阵列 |
CN104113809A (zh) * | 2014-05-13 | 2014-10-22 | 冠研(上海)企业管理咨询有限公司 | 麦克风封装结构 |
CN104080035A (zh) * | 2014-05-13 | 2014-10-01 | 冠研(上海)企业管理咨询有限公司 | 配置有麦克风或麦克风阵列的移动电子装置 |
CN104080035B (zh) * | 2014-05-13 | 2018-01-02 | 冠研(上海)专利技术有限公司 | 配置有麦克风或麦克风阵列的移动电子装置 |
CN104066041A (zh) * | 2014-05-13 | 2014-09-24 | 冠研(上海)企业管理咨询有限公司 | 麦克风及麦克风阵列的封装方法 |
CN106796151A (zh) * | 2014-08-01 | 2017-05-31 | 卡尔·弗罗伊登伯格公司 | 传感器、包括传感器的过滤元件和这样的过滤元件的应用 |
CN109362013A (zh) * | 2018-12-07 | 2019-02-19 | 歌尔股份有限公司 | 组合传感器 |
CN109362013B (zh) * | 2018-12-07 | 2023-11-14 | 潍坊歌尔微电子有限公司 | 组合传感器 |
CN110345972A (zh) * | 2019-06-25 | 2019-10-18 | 歌尔股份有限公司 | 一种传感器及电子设备 |
CN110345972B (zh) * | 2019-06-25 | 2021-12-31 | 潍坊歌尔微电子有限公司 | 一种传感器及电子设备 |
CN112291690A (zh) * | 2019-07-22 | 2021-01-29 | 英飞凌科技股份有限公司 | 压力传感器 |
CN112291690B (zh) * | 2019-07-22 | 2024-04-05 | 英飞凌科技股份有限公司 | 压力传感器 |
CN111537054A (zh) * | 2020-06-20 | 2020-08-14 | 南京元感微电子有限公司 | 一种压力与水声集成传感器及其制备方法 |
CN111537054B (zh) * | 2020-06-20 | 2020-09-29 | 南京元感微电子有限公司 | 一种压力与水声集成传感器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1219136A1 (en) | 2002-07-03 |
EP1219136B1 (en) | 2003-06-18 |
CN1205841C (zh) | 2005-06-08 |
DE60003441D1 (de) | 2003-07-24 |
JP2003508997A (ja) | 2003-03-04 |
AU6984000A (en) | 2001-04-10 |
ATE243406T1 (de) | 2003-07-15 |
DE60003441T2 (de) | 2004-04-29 |
WO2001019133A1 (en) | 2001-03-15 |
PL354000A1 (en) | 2003-12-15 |
CA2383901A1 (en) | 2001-03-15 |
DK1219136T3 (da) | 2003-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHENGYANG MENSI CO., LTD. Free format text: FORMER OWNER: MICROTRONICS A/S Effective date: 20030424 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20030424 Address after: Danish kongens Lyngby Applicant after: Sonion Clemens Limited by Share Ltd. Address before: Roskilde Applicant before: MICROTRONIC A/S |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: EPCOS PRIVATE LIMITED Free format text: FORMER OWNER: PARS MEMS CO., LTD. Effective date: 20121113 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: PARS MEMS CO., LTD. Free format text: FORMER NAME: SONION LYNGBY A/S |
|
CP03 | Change of name, title or address |
Address after: Roskilde Patentee after: MEMS Co.,Ltd. Address before: Denmark Frilandsmuseet Patentee before: Shengyang Lingbi Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121113 Address after: Singapore Singapore Patentee after: Epp Kos Private Ltd. Address before: Roskilde Patentee before: MEMS Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170524 Address after: Tokyo, Japan Patentee after: TDK Corp. Address before: Singapore Singapore Patentee before: Epp Kos Private Ltd. |
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TR01 | Transfer of patent right | ||
CX01 | Expiry of patent term |
Granted publication date: 20050608 |
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CX01 | Expiry of patent term |