CN1385759A - Three-dimensional microstructure manufacturing method and exposure device thereof - Google Patents
Three-dimensional microstructure manufacturing method and exposure device thereof Download PDFInfo
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- CN1385759A CN1385759A CN 01108436 CN01108436A CN1385759A CN 1385759 A CN1385759 A CN 1385759A CN 01108436 CN01108436 CN 01108436 CN 01108436 A CN01108436 A CN 01108436A CN 1385759 A CN1385759 A CN 1385759A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 16
- 238000009825 accumulation Methods 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 16
- 238000009826 distribution Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 238000007687 exposure technique Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 241000662429 Fenerbahce Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a method for manufacturing a three-dimensional microstructure and an exposure device used by the same. The method comprises repeatedly exposing photosensitive material with mask pattern generated by computer, moving exposure table, exposing different regions of the photosensitive material, and developing to form arbitrary continuous three-dimensional microstructure. The exposure device used by the method comprises a computer, a liquid crystal light valve, a projection lens and an exposure platform. The invention can manufacture the microstructure component with large total area, avoids the expensive and time-consuming plate making process in the traditional exposure technology, reduces the manufacturing cost of the microstructure, and further improves the manufacturing efficiency and the manufacturing precision.
Description
The present invention relates to a kind of method for making of three-dimensional microstructures, and the employed exposure device of this method.
In recent years, along with the rise of micro-optic machinery and Micro-Opto-Electro-Mechanical Systems, developed the manufacturing technology of multiple three-dimensional microstructures.Existing three-dimensional microstructures Micrometer-Nanometer Processing Technology comes from the large scale integrated circuit manufacturing process, and the most representative having is following several:
" optical engineering " 17 volume 570-573 pages or leaves " past of adamas optics milling; the present and the future " of publishing in 1978 disclose a kind of single-point diamond turning method (list of references: " Dimond turning ofoptics:the past; the presaent; and the exciting future ", Opt.Eng, 1978, Vol.17:570-573).The element delineation precision height that this method is made, but the residual trace granularity of milling big (greater than 10 microns) is unsuitable for making short wavelength's optics device.
The disclosed X-ray of " applied optics " 36 volumes 20 phase 4675-4680 pages or leaves of publishing in 1997 " at the low-cost many steps of batch making of the photosensitive use gray scale mask exposure technique single exposure on glass of high energy diffraction optical element " is carved electrotyping process technology (list of references: " Cost-effecyive massfabrication of multilevel diffractive optical element by useof a single optical exposure with a gray-scale mask on high-energy beam-sensitive glass ", Appl.Opt, 1997, Vol.36, No.20:4675-4680), can only produce the three-dimensional microstructures of stepped ramp type, and exist to need a plurality of masks and alignment repeatedly, complex process, defectives such as alignment error are arranged, the three-dimensional structure that is difficult to make continuous-surface shape.
" applied optics " 32 volume 14 phase 2526-2533 pages or leaves " making of continuous relief diffraction optics two-dimensional array element " disclosed electron beam and laser beam direct writing technology (lists of references: " Continuous-relief diffrative optical elements for two-dimentional array generation " of publishing in 1993, Appl.Opt.1993, Vol.32, No.14:2526-2533), though can regulate radiation intensity distributes to produce the continuous exposure amount, but Exposure mode is pointwise to be write, make efficiency is low, apparatus expensive and be difficult to safeguard.
" international optical engineering society conference record " 2687 volume 142-149 pages or leaves of publishing in 1996 " are made the new method of parabolic array ", and a civilian disclosed mask moves method (list of references: " Novelmethod for parabolic grating ", SPIE, 1996, Vol.2687:142-149), be to utilize binary mask to produce the distribution of continuous exposure amount to make microstructure.But this method requires the microstructure of required making to have symmetry, can not be used for the shaping of continuous-surface shape, therefore has certain limitation.
The object of the present invention is to provide a kind of method and employed exposure device of this method that is used to make any three-dimensional microstructures.
Purpose of the present invention is realized by following technical measures:
Making the method for three-dimensional microstructures finishes by following steps:
1. generate real-time mask graph by computer control;
2. utilize the real-time mask graph that generates that photosensitive material is carried out the exposure first time, obtain the exposure accumulation of n=1 exposure;
3. fixing exposure desk refreshes real-time mask graph, and photosensitive material is carried out the exposure second time, and the exposure that obtains to expose for n=2 time is accumulated;
4. repeat step 2.～3., make exposure frequency enough big, obtain the exposure accumulation of n=N exposure;
5. the moving exposure platform is under the projection exposure camera lens another exposure area of photosensitive material, and is heavy
Multiple step 1.～4.;
6. develop, form arbitrarily three-dimensional microstructures continuously.
In order to finish this method, exposure device used in the present invention comprises projection exposure camera lens, exposure desk and computing machine, electrical addressing (or light addressing) liquid crystal light valve as real-time mask places the top of projection exposure camera lens, the real-time mask graph that computer control produces is by the logical light unit of electrical addressing (or light addressing) liquid crystal light valve, again through the final minification of projection exposure camera lens to the focal plane, the focal plane of exposure camera lens overlaps with the light-sensitive surface of photosensitive material, and photosensitive material is positioned on the exposure desk.
Purpose of the present invention also can realize by following technical measures: the switch of the logical light unit of electrical addressing (or light addressing) liquid crystal light valve is by computer control.
Purpose of the present invention also can realize by following technical measures: the exposure desk of placing photosensitive material is removable, and the zones of different of photosensitive material all can be accepted exposure.
The present invention compared with prior art has following advantage: the present invention utilizes real-time mask that the method that photosensitive material carries out projection exposure, development is made three-dimensional microstructures.Because the present invention utilizes real-time mask to carry out projection exposure and has the Optical Parallel characteristic, so exposure efficiency is far above laser/direct electronic beam one-writing system.And after constantly refreshing mask graph and multiexposure, multiple exposure, once develop, avoided loaded down with trivial details alignment, contraposition technology in traditional microstructure making, further improved make efficiency; And alignment, the alignment error of therefore having avoided traditional microstructure method for making easily to produce, so further improved the making precision.
Simultaneously,,, can form any exposure distribution, thereby can form arbitrarily continuous three-dimensional microstructures, make the structure of making object unrestricted in conjunction with the control of time shutter because real-time mask of the present invention can produce any mask graph.
The exposure desk of exposure device of the present invention can move, and in conjunction with real-time mask exposure method, can make the zones of different of same photosensitive material produce different exposure distribution, therefore can make the big components and parts with microtexture of total area.
Exposure device of the present invention produces real-time mask in real time by computer programming control liquid crystal light valve, so saved mask-making technology expensive time-consuming in traditional exposure technique, has reduced manufacturing cost.
Description of drawings:
Fig. 1 makes the structural representation of the exposure device embodiment of three-dimensional microstructures for the present invention.
Fig. 2 makes for the present invention in the technological process of method embodiment of three-dimensional microstructures, the real-time mask synoptic diagram that exposes during exposure frequency n=1.
Fig. 3 is in the technological process of method for making, the exposure accumulation synoptic diagram during exposure frequency n=1.
Fig. 4 is in the technological process of method for making, the real-time mask synoptic diagram that exposes during exposure frequency n=2.
Fig. 5 is in the technological process of method for making, the exposure accumulation synoptic diagram during exposure frequency n=2.
Fig. 6 is in the technological process of method for making, the real-time mask synoptic diagram that exposes during exposure frequency n=3.
Fig. 7 is in the technological process of method for making, the exposure accumulation synoptic diagram during exposure frequency n=3.
Fig. 8 is in the technological process of method for making, the real-time mask synoptic diagram that exposes during exposure frequency n=N.
Fig. 9 is in the technological process of method for making, the exposure accumulation synoptic diagram during exposure frequency n=N.
As shown in Figure 1, the exposure device of the embodiment of the invention comprises projection exposure camera lens 2, exposure desk 4 and computing machine 5.Electrical addressing (or light addressing) liquid crystal light valve 1 as real-time mask places the top of projection exposure camera lens 2.The switch of each logical light unit of electrical addressing (or light addressing) liquid crystal light valve 1 plays the mask effect by computing machine 5 programming Control.A sample point of the corresponding mask graph in the logical light of each of liquid crystal light valve 1 unit.Because the switch situation of each logical light unit of liquid crystal light valve 1 can constantly refresh as required, so be called as real-time mask.Projection exposure camera lens 2 places the below of liquid crystal light valve 1.In real time mask graph sees through the logical light unit of liquid crystal light valve 1, again through 2 final minification of projection exposure camera lens to the camera lens focal plane.The focal plane of projection exposure camera lens 2 overlaps with the light-sensitive surface of photosensitive material 3.Photosensitive material 3 is positioned on the exposure desk 4.Exposure desk 4 is removable, therefore makes the zones of different of photosensitive material 3 all can accept exposure.
As Fig. 2～shown in Figure 9, each step of embodiment of method that the present invention makes three-dimensional microstructures is as follows:
1., fixing exposure desk 4, generate real-time mask graph by computing machine 5 controls.
2., by the logical light unit of computing machine 5 control liquid crystal light valves 1, make real-time mask graph see through the logical light unit of liquid crystal light valve 1, image on the photosensitive material 3 on projection exposure camera lens 2 image planes, and finish single exposure; At this moment, exposure frequency n=1, the real-time mask synoptic diagram of exposure as shown in Figure 2, exposure accumulation synoptic diagram is as shown in Figure 3.
3., exposure desk 4 maintains static, and refreshes real-time mask graph, carries out the exposure second time again.At this moment, exposure frequency n=2, the real-time mask synoptic diagram of exposure as shown in Figure 4, exposure accumulation synoptic diagram is as shown in Figure 5.
4., repeat 2.～3., through repeatedly reciprocal, (the real-time mask synoptic diagram of exposure frequency n=3 as shown in Figure 6 promptly to pass through n=3, exposure accumulation synoptic diagram is as shown in Figure 7), n=4 ... exposure repeatedly, make exposure frequency enough big, until n=N (the real-time mask synoptic diagram of exposure frequency n=N as shown in Figure 8, exposure accumulation synoptic diagram as shown in Figure 9) exposure, the accumulation that on photosensitive material 3, produces exposure distribution.When cumulative frequency n=N is enough big, be approximately continuous exposure distribution.Because mask can generate arbitrary graphic in real time,, can generate exposure distribution arbitrarily by control exposure and each time time shutter.
5., moving exposure platform 4, another zone of photosensitive material 3 is positioned at below the projection exposure camera lens 2, repeat 1.～4. step.Refresh in real time by mask, each exposure area is obtained and the different exposure distribution in a last exposure area, some exposure areas are spliced into a more large-area exposure distribution.
6., the photosensitive material 3 after the several regions exposure is once developed the arbitrarily continuous three-dimensional microstructures of formation.
Claims (4)
1, a kind of method for making of three-dimensional microstructures is characterized in that finishing by following steps:
1. generate real-time mask graph by computing machine (5) control;
2. utilize the real-time mask graph that generates that photosensitive material (3) is carried out the exposure first time, obtain
The exposure accumulation of n=1 exposure;
3. fixing exposure desk (4) refreshes real-time mask graph, and photosensitive material (3) is carried out second
Inferior exposure obtains the exposure accumulation of n=2 exposure;
4. repeat step 2.～3., make exposure frequency enough big, obtain the exposure of n=N exposure
Accumulation;
5. moving exposure platform (4) makes another exposure area of photosensitive material (3) be in projection exposure
Under the camera lens (2), repeat 1.～4. step;
6. develop, form arbitrarily three-dimensional microstructures continuously.
2, the employed exposure device of a kind of method for making of three-dimensional microstructures comprises projection exposure camera lens (2), exposure desk (4) and computing machine (5); It is characterized in that: the top that places projection exposure camera lens (2) as electrical addressing (or the light addressing) liquid crystal light valve (1) of real-time mask, the real-time mask graph that computing machine (5) control produces is by the logical light unit of electrical addressing (or light addressing) liquid crystal light valve (1), again through projection exposure camera lens (2) final minification to the focal plane, the focal plane of exposure camera lens (2) overlaps with the light-sensitive surface of photosensitive material (3), and photosensitive material (3) is positioned on the exposure desk (4).
3, exposure device according to claim 2 is characterized in that: the switch of the logical light unit of electrical addressing (or light addressing) liquid crystal light valve (1) is by computer control.
4, according to claim 2 and 3 described exposure devices, it is characterized in that: the exposure desk (4) of placing photosensitive material (3) is removable, and the zones of different of photosensitive material (3) all can be accepted exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01108436 CN1223906C (en) | 2001-05-16 | 2001-05-16 | Method for manufacturing three-dimensional microstructure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01108436 CN1223906C (en) | 2001-05-16 | 2001-05-16 | Method for manufacturing three-dimensional microstructure |
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| CN1385759A true CN1385759A (en) | 2002-12-18 |
| CN1223906C CN1223906C (en) | 2005-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01108436 Expired - Fee Related CN1223906C (en) | 2001-05-16 | 2001-05-16 | Method for manufacturing three-dimensional microstructure |
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| CN (1) | CN1223906C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1857990B (en) * | 2006-05-18 | 2010-05-12 | 西安交通大学 | Method for making complicate three dimension microstructure or micro device at low cost |
| CN101416114B (en) * | 2006-04-04 | 2011-03-02 | 特萨斯克里伯斯有限公司 | Device and method for microstructuring a storage medium and storage medium comprising a microstructured region |
| CN103913939A (en) * | 2013-01-04 | 2014-07-09 | 薄淑英 | Raster-scan-type stereoscopic exposure machine |
| TWI480587B (en) * | 2013-05-17 | 2015-04-11 | Sanko Device Ltd | Display having a stereoscopic 3d function and a touch-controlled function and method of manufacturing the same |
| CN105549273A (en) * | 2016-02-03 | 2016-05-04 | 京东方科技集团股份有限公司 | Spacer making method, substrate, display panel and display device |
| CN107678248A (en) * | 2017-10-12 | 2018-02-09 | 中国电子科技集团公司第十研究所 | A kind of manufacture method of optical 3-dimensional structure |
| CN111458976A (en) * | 2020-05-19 | 2020-07-28 | 中国科学院光电技术研究所 | Integrated forming method for manufacturing three-dimensional rotational symmetric microstructure |
| CN111965954A (en) * | 2020-09-09 | 2020-11-20 | 中国科学院光电技术研究所 | Exposure device with mask and substrate rotating coaxially relatively |
| CN112034691A (en) * | 2020-10-10 | 2020-12-04 | 华中科技大学 | Device and method for shading complementary light intensity mask plate double-beam projection lithography |
-
2001
- 2001-05-16 CN CN 01108436 patent/CN1223906C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101416114B (en) * | 2006-04-04 | 2011-03-02 | 特萨斯克里伯斯有限公司 | Device and method for microstructuring a storage medium and storage medium comprising a microstructured region |
| CN1857990B (en) * | 2006-05-18 | 2010-05-12 | 西安交通大学 | Method for making complicate three dimension microstructure or micro device at low cost |
| CN103913939A (en) * | 2013-01-04 | 2014-07-09 | 薄淑英 | Raster-scan-type stereoscopic exposure machine |
| CN103913939B (en) * | 2013-01-04 | 2017-03-15 | 北京康得新三维科技有限责任公司 | Grating scanning type solid exposure machine |
| TWI480587B (en) * | 2013-05-17 | 2015-04-11 | Sanko Device Ltd | Display having a stereoscopic 3d function and a touch-controlled function and method of manufacturing the same |
| CN105549273A (en) * | 2016-02-03 | 2016-05-04 | 京东方科技集团股份有限公司 | Spacer making method, substrate, display panel and display device |
| CN107678248A (en) * | 2017-10-12 | 2018-02-09 | 中国电子科技集团公司第十研究所 | A kind of manufacture method of optical 3-dimensional structure |
| CN111458976A (en) * | 2020-05-19 | 2020-07-28 | 中国科学院光电技术研究所 | Integrated forming method for manufacturing three-dimensional rotational symmetric microstructure |
| CN111458976B (en) * | 2020-05-19 | 2021-09-07 | 中国科学院光电技术研究所 | Integrated forming method for manufacturing three-dimensional rotational symmetric microstructure |
| CN111965954A (en) * | 2020-09-09 | 2020-11-20 | 中国科学院光电技术研究所 | Exposure device with mask and substrate rotating coaxially relatively |
| CN111965954B (en) * | 2020-09-09 | 2022-12-30 | 中国科学院光电技术研究所 | Exposure device with mask and substrate rotating coaxially relatively |
| CN112034691A (en) * | 2020-10-10 | 2020-12-04 | 华中科技大学 | Device and method for shading complementary light intensity mask plate double-beam projection lithography |
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| Publication number | Publication date |
|---|---|
| CN1223906C (en) | 2005-10-19 |
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