CN1381959A - Photoelectric transceiver - Google Patents
Photoelectric transceiver Download PDFInfo
- Publication number
- CN1381959A CN1381959A CN01117089A CN01117089A CN1381959A CN 1381959 A CN1381959 A CN 1381959A CN 01117089 A CN01117089 A CN 01117089A CN 01117089 A CN01117089 A CN 01117089A CN 1381959 A CN1381959 A CN 1381959A
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- China
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- cambered surface
- diode chip
- laser diode
- circuit board
- surface end
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
A photoelectric transceiver is composed of a first circuit boards, a transmitter (a laser diode), a receiver (a light diode) and a casing. The first circuit board, the laser diode and light diode are respectively sleeved by the said casing for preventing scatter of laser beam.
Description
The present invention relates to a kind of optoelectronic transceivers, particularly relate to a kind of optoelectronic transceivers that must not use shielding of metal cup-shaped and glass foaming lens.
Optoelectronic transceivers (opto-electronic transceiver) or optoelectric transceiver module are in order to being converted to the signal of telecommunication from the light signal of the optical fiber connector (fiber connector), or convert the electrical signal to light signal, so that send out by optical fiber.It is with an optical diode (photo diode) light signal to be converted to the signal of telecommunication, exports the circuit of back level then to; To become light signal to send out then from the electrical signal conversion of late-class circuit with a laser diode (laser diode).
With a kind of existing optoelectronic transceivers 10 shown in Figure 1 is example, and it comprises front end and rear end.Wherein the rear end mainly is a large circuit board 20, and its upper surface has a circuit (not shown), in order to handle the light signal and the signal of telecommunication; Its lower surface has 9 stitch, is projected on its lower surface.Front end mainly comprises a laser diode 30 and an optical diode (not shown).Shown in the amplification partly of Fig. 1, this laser diode 30 is that the mode with " To-package " encapsulates, that is with metal cup-shaped shielding 37 laser diode chips 33 that cover on the little circuit board 31 that are called " To-can ", and the front end (corresponding to the light outgoing route of this laser diode chip) of this metal cup-shaped shielding 37 has a transparent glass window, have glass foaming lens (ball lens) 38 on this transparent glass window, throw away again after assembling via these lens 38 by the emitted laser of this laser diode chip.This laser diode 30 and cover are connected to a pair of accurate sleeve (sleeve) 35.Can aim at an end of the lasso (ferrule) 61 of (fiber connector) in the optical fiber connector 60 by these alignment sleeve 35 these laser diodes 30, the other end of this lasso 61 is connected to optical fiber 70 then., therefore repeat no more because of being similar to this laser diode as for optical diode structure partly.
Still see also Fig. 1, in above-mentioned laser diode 30, this laser diode chip 33 is to form with the circuit on several external pins 39 and this large circuit board 20 to be electrically connected.In more detail, the external pins 39 of this laser diode 30 is inserted in the jack of big circuit 20 and is formed with this circuit and to be electrically connected.Yet it should be noted that the characteristic when this existing optoelectronic transceivers 10 can cause high frequency (for example more than the GHz) because of the problem of parasitic capacitance and stray inductance is not good, for example transmission rate (transmission rate) is good etc.Its parasitic capacitance mainly results between this metal cup-shaped shielding 37 and the large circuit board 20; Its stray inductance results from this external pins 39, because for high frequency, this external pins 39 is an inductance (because of it is conductor).
In addition, in this existing optoelectronic transceivers 10, except that the not good shortcoming of high-frequency transmission characteristic, comprise that still the manufacturing cost of glass foaming lens 38 is too high and be not suitable for small size form (smallform factor; SFF).The reason of wherein inapplicable small size form is because the volume of this metal cup-shaped shielding 37 is just not little originally than this laser diode chip 33, can make light transmit volume partly after being inserted in this alignment sleeve 35 and become bigger.Therefore, for promoting the high-frequency transmission characteristic and reducing manufacturing cost, need a kind of optoelectronic transceivers that addresses the above problem badly.
The objective of the invention is to propose a kind of optoelectronic transceivers, it can reduce parasitic capacitance and inductance, thereby improves high frequency characteristics, and reduces the volume of transceiver.
For achieving the above object, the present invention proposes a kind of optoelectronic transceivers (opto-electronictransceiver), comprises a first circuit board, a conveyer, a receiving system.Wherein this first circuit board has one first upper surface, one first lower surface and a plurality of pin, and this first upper surface has a circuit, and this pin is projected on this first lower surface.
This conveyer is positioned on this first circuit board, and this conveyer also comprises a second circuit board, a laser diode chip and one first alignment sleeve.Wherein this second circuit board has one second upper surface and one second lower surface, have lead on this second lower surface, and this second circuit board also is electrically connected on this first circuit board.In this implements, this laser diode chip is positioned on second upper surface of this second circuit board, this laser diode chip is electrically connected on the lead on this second lower surface, and this laser diode chip is exported a light signal (it is a laser) in response to the signal of telecommunication of the circuit on this first circuit board.
This first alignment sleeve is transparent or opaque, and have one first cambered surface end and one second cambered surface end, wherein this first cambered surface end and this second cambered surface end are positioned at the opposite end of this alignment sleeve, this first alignment sleeve coats second upper surface and this laser diode chip of this second circuit board, and this first cambered surface end is positioned on the light outgoing route of this semiconductor laser diode chip, specifically this first cambered surface end makes this this laser diode chip institute emitted laser can almost advance abreast in this first alignment sleeve and do not disperse, that is this first cambered surface end can be used as lens; In addition, this second cambered surface end then makes this laser can be projected to the lasso (ferrule) of the optical fiber connector that this first alignment sleeve connected with assembling, that is this second cambered surface end has the function of focusing.
This receiving system also is positioned on this first circuit board, and this receiving system also comprises a tertiary circuit plate, a luminous diode chip and one second alignment sleeve.Wherein this tertiary circuit plate has one the 3rd upper surface and one the 3rd lower surface, has lead on the 3rd lower surface, and this tertiary circuit plate also is electrically connected on this first circuit board.This luminous diode chip is positioned on the 3rd upper surface of this tertiary circuit plate, this luminous diode chip is electrically connected on the lead on the 3rd lower surface, and this luminous diode chip is in response to exporting the circuit of a signal of telecommunication to the first circuit board in a light signal to handle.In addition, optoelectronic transceivers of the present invention also comprises a shell, in order to coat this first circuit board, this conveyer and this receiving system.
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described.In the accompanying drawing:
Fig. 1 is the explosive view of an existing photelectric receiver.
Fig. 2 is the schematic diagram of photelectric receiver of the present invention.
Fig. 3 is the cross sectional plan view of alignment sleeve of the present invention.
The drawing reference numeral explanation:
10 existing optoelectronic transceivers 20 large circuit boards
30 laser diodes, 31 little circuit boards
30 laser diode chips, 35 alignment sleeve
37 metal cup-shapeds shield 38 glass foaming lens
39 external pins, 60 optical fiber connector
61 lassos, 70 optical fiber
100 optoelectronic transceivers, 200 first circuit boards
300 conveyers, 310 receiving systems
330 laser diode chips, 350 first alignment sleeve
The 360a first cambered surface end 360b second cambered surface end
500 receiving systems, 510 tertiary circuit plates
530 luminous diode chips, 550 second alignment sleeve
600 optical fiber connector, 610 lassos
The present invention discloses a kind of optoelectronic transceivers (opto-electronic transceiver) 100, as shown in Figure 2, comprises a first circuit board 200, a conveyer 300, a receiving system 500 at least.Wherein this first circuit board 200 has one first upper surface, one first lower surface and a plurality of pin 250, and this first upper surface has a circuit (not shown), and this pin 250 is projected on this first lower surface.
Still see also Fig. 2, this conveyer 300 is positioned on this first circuit board 200, and this conveyer 300 also comprises a second circuit board 310, a laser diode chip 330 (for example semiconductor laser diode chip) and one first alignment sleeve 350.Wherein this second circuit board 310 has one second upper surface and one second lower surface, having lead on this second lower surface (does not show, weld pad pad for example), and this second circuit board 310 also be electrically connected (for example can by the wire bonds mode) in this first circuit board 200.In this embodiment, this semiconductor laser diode chip 330 comprises that the limit penetrates laser diode (Fabry Perot laser diode; FPLD) chip and vertical cavity surface emitting laser diode (vertical cavity surface emitting laser diode; VCSEL), be positioned on second upper surface of this second circuit board 310, this semiconductor laser diode chip 330 is electrically coupled to the lead on this second lower surface, and this semiconductor laser diode chip 330 is exported a light signal (it is a laser) in response to the signal of telecommunication of the circuit on this first circuit board 200.
See also Fig. 2 and Fig. 3, wherein the cross sectional plan view of Fig. 3 first alignment sleeve 350 of the present invention.One end cover of this first alignment sleeve 350 is connected to the lasso (ferrule) 610 of optical fiber connector, a ceramic ferrule for example, and this first alignment sleeve 350 and have one first cambered surface end 360a and one second cambered surface end 360b, wherein this first cambered surface end 360a and this second cambered surface end 360b are positioned at the opposite end of this alignment sleeve 350.This first alignment sleeve 350 coats second upper surface and this semiconductor laser diode chip 330 of this second circuit board 310, and this first cambered surface end 360a is positioned on the light outgoing route of this semiconductor laser diode chip 330, specifically this first cambered surface end 360a makes 330 emitted laser of this semiconductor laser diode chip almost advance abreast in this first alignment sleeve 350 and do not disperse, that is this first cambered surface end 360a can be used as lens; In addition, this second cambered surface end 360b then aims at this lasso 610, and with so that this laser can be projected to the lasso (ferrule) 610 of the optical fiber connector 600 that this first alignment sleeve 350 connected with assembling, that is this second cambered surface end 360b has the function of focusing.In addition; in the formed space of second upper surface of these first alignment sleeve, 350 these second circuit boards 310 of coating, also be filled with inert gas (for example nitrogen); to protect this semiconductor laser diode chip 330, for example avoid this semiconductor laser diode chip 330 to make moist or corrode.In this embodiment, this first alignment sleeve 350 is that the mode with (but not limiting) ejection formation forms, and its material for example is PEI or ULTEM, but dielectric strength also can be used between other material of 22 to 33 approximately., therefore no longer given unnecessary details because identical as for second alignment sleeve 550 of Fig. 2 with this first alignment sleeve 350.
Please get back to Fig. 2, this receiving system 500 also is positioned on this first circuit board 200, and this receiving system 500 comprises a tertiary circuit plate 510, a luminous diode chip 530 and one second alignment sleeve 550.Wherein this tertiary circuit plate 510 has one the 3rd upper surface and one the 3rd lower surface, has the lead (not shown) on the 3rd lower surface, and this tertiary circuit plate 510 also is electrically connected (for example can by the wire bonds mode) in this first circuit board 200.This luminous diode chip 530 is positioned on the 3rd upper surface of this tertiary circuit plate 510, this luminous diode chip 530 is electrically connected on the lead on the 3rd lower surface, and this luminous diode chip 530 is in response to exporting the circuit of a signal of telecommunication to the first circuit board 200 in a light signal to handle.And this second cambered surface end 360b makes from the light signal of optical fiber and aims at this second alignment sleeve 550, and this first cambered surface end 360a then makes this light signal can be projected to this luminous diode chip 530 with assembling.In addition, optoelectronic transceivers 100 of the present invention also comprises a shell (not shown), in order to coat this first circuit board 200, this conveyer 300 and this receiving system 500.
It should be noted that, the present invention and prior art maximum one of different are that conveyer 300 of the present invention must not use metal cup-shaped shielding (promptly so-called " To can ") to coat laser diode chip, must not use the glass lens that foam to focus on.Because first alignment sleeve 350 of the present invention is except that but the substituted metal cup-shaped shields, above-mentioned first cambered surface end 360a and one second cambered surface end 360b also can replace existing glass foaming lens.So, the negative effect of parasitic capacitance of the prior art and inductance can be readily solved, so can promote the characteristic of high-frequency transmission effectively.In other words, the function of the metal cup-shaped shielding (To can) that the present invention must use prior art, glass foaming lens and alignment sleeve is incorporated in single the alignment sleeve 350, to save cost, processing step and to avoid parasitic capacitance and inductive effect.
The above is the preferred embodiments of the present invention only, is not in order to limit application protection range of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or modification, all should be included in protection scope of the present invention.
Claims (18)
1. an optoelectronic transceivers (opto-electronic transceiver) comprising:
One first circuit board has one first upper surface, one first lower surface and a plurality of pin, and this first upper surface has a circuit, and this pin is projected on and this first lower surface;
One conveyer is positioned on this first circuit board, and this conveyer also comprises:
One second circuit board;
One laser diode chip is positioned on this second circuit board, and this laser diode chip is electrically connected on this circuit, and this laser diode chip is exported a laser in response to a signal of telecommunication of this circuit;
One first alignment sleeve (sleeve), have one first cambered surface end and one second cambered surface end, this first cambered surface end and this second cambered surface end are positioned at the opposite end of this alignment sleeve, this first alignment sleeve coats this second circuit board and this laser diode chip, and this first cambered surface end is positioned on the light outgoing route of this laser diode chip, this first cambered surface end makes this laser advance abreast in this sleeve and do not disperse, and this second cambered surface end can throw away this laser with assembling;
One receiving system is positioned on this first circuit board, and this receiving system also comprises:
One tertiary circuit plate;
One optical diode (photo diode) chip is positioned on this tertiary circuit plate, and this luminous diode chip is electrically connected on this circuit, and this luminous diode chip is in response to exporting a signal of telecommunication to this circuit in a light signal;
One second alignment sleeve (sleeve); Have one first cambered surface end and one second cambered surface end, this first cambered surface end and this second cambered surface end are positioned at the opposite end of this second alignment sleeve, this second alignment sleeve coats this tertiary circuit plate and this luminous diode chip, and this second cambered surface end is positioned on the light input path of this luminous diode chip, this second cambered surface end is incident in this second alignment sleeve this light signal, and this first cambered surface end makes this light signal be projected to this luminous diode chip with assembling; And
One shell coats this first circuit board, this conveyer and this receiving system.
2. optoelectronic transceivers as claimed in claim 1, wherein above-mentioned laser diode chip comprises the semiconductor laser diode chip at least.
3. optoelectronic transceivers as claimed in claim 1, wherein above-mentioned laser diode chip comprise that at least the limit penetrates laser diode (Fabry-Perot laser diode; FPLD) chip and vertical cavity surface emitting laser diode (vertical cavity surface emitting laser diode; VCSEL).
4. optoelectronic transceivers as claimed in claim 1, wherein the second cambered surface end of above-mentioned first and second alignment sleeve is aimed at a lasso (ferrule) of optical fiber connector.
5. optoelectronic transceivers as claimed in claim 1, wherein above-mentioned first alignment sleeve coats in the formed space of above-mentioned second circuit board and also is filled with inert gas.
6. optoelectronic transceivers as claimed in claim 1, wherein above-mentioned light signal is from an optical fiber.
7. optoelectronic transceivers as claimed in claim 1, wherein above-mentioned first and second alignment sleeve is transparent or opaque.
8. optoelectronic transceivers as claimed in claim 1, wherein the dielectric strength of the material of above-mentioned first and second alignment sleeve is about 22 to 33.
9. an optoelectronic transceivers (optoelectronic transceiver) comprises at least:
One first circuit board has a circuit;
One conveyer is positioned on this first circuit board, and this conveyer also comprises:
One second circuit board has one second upper surface and one second lower surface, and this second lower surface has lead, and this second circuit board is electrically connected on this first circuit board;
One laser diode chip is positioned on second upper surface of this second circuit board, and this laser diode chip is electrically connected on the lead of this second lower surface, and this laser diode chip is in response in the signal of telecommunication of this circuit and export a laser;
One first alignment sleeve (sleeve), have one first cambered surface end and one second cambered surface end, this first cambered surface end and this second cambered surface end are positioned at the two opposite sides of this alignment sleeve, this first alignment sleeve coats this second circuit board and this laser diode chip, and this first cambered surface end is positioned on the light outgoing route of this laser diode chip, this first cambered surface end is advanced this laser abreast and is not dispersed the ejaculation of this second cambered surface end with making this laser gathering in this first sleeve;
One receiving system is positioned on this first circuit board, and this receiving system also comprises:
One tertiary circuit plate has one the 3rd upper surface and one the 3rd lower surface, and the 3rd lower surface has lead, and this tertiary circuit plate is electrically connected on this first circuit board;
One optical diode (photo diode) chip is positioned on the 3rd upper surface of this tertiary circuit plate, and this luminous diode chip is electrically connected on the lead of the 3rd lower surface, and this luminous diode chip is in response to exporting a signal of telecommunication in a light signal; And
One second alignment sleeve (sleeve), have one first cambered surface end and one second cambered surface end, this first cambered surface end and this second cambered surface end are positioned at the two opposite sides of this alignment sleeve, this second alignment sleeve coats upper surface and this luminous diode chip of this tertiary circuit plate, and this second cambered surface end is positioned on the light input path of this luminous diode chip, this second cambered surface end is incident in this second alignment sleeve a light signal, and this first cambered surface end makes this laser be projected to this luminous diode chip with assembling.
10. optoelectronic transceivers as claimed in claim 9 also comprises a shell, in order to coat this first circuit board, this conveyer and this receiving system.
11. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned first circuit board also has the pin of a plurality of projections.
12. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned laser diode chip comprises the semiconductor laser diode chip at least.
13. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned laser diode chip comprise that at least the limit penetrates laser diode (Fabry-Perot laser diode; FPLD) chip and vertical cavity surface emitting laser diode (vertical cavity surface emitting laser diode; VCSEL).
14. optoelectronic transceivers as claimed in claim 9, wherein the second cambered surface end of above-mentioned first and second alignment sleeve is aimed at a lasso of optical fiber connector.
15. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned first alignment sleeve coats in the formed space of above-mentioned second circuit board and also is filled with inert gas.
16. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned light signal is from an optical fiber.
17. optoelectronic transceivers as claimed in claim 9, wherein above-mentioned first and second alignment sleeve is transparent or opaque.
18. optoelectronic transceivers as claimed in claim 10, wherein the dielectric strength of the material of above-mentioned first and second alignment sleeve is roughly 22 to 33.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011170891A CN1260896C (en) | 2001-04-24 | 2001-04-24 | Photoelectric transceiver |
| CNB2006100036051A CN100399089C (en) | 2001-04-24 | 2001-04-24 | Photoelectric receiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011170891A CN1260896C (en) | 2001-04-24 | 2001-04-24 | Photoelectric transceiver |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100036051A Division CN100399089C (en) | 2001-04-24 | 2001-04-24 | Photoelectric receiver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1381959A true CN1381959A (en) | 2002-11-27 |
| CN1260896C CN1260896C (en) | 2006-06-21 |
Family
ID=4662658
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100036051A Expired - Fee Related CN100399089C (en) | 2001-04-24 | 2001-04-24 | Photoelectric receiver |
| CNB011170891A Expired - Fee Related CN1260896C (en) | 2001-04-24 | 2001-04-24 | Photoelectric transceiver |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100036051A Expired - Fee Related CN100399089C (en) | 2001-04-24 | 2001-04-24 | Photoelectric receiver |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN100399089C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100357771C (en) * | 2004-02-23 | 2007-12-26 | 台达电子工业股份有限公司 | Light transmission module and manufacturing method |
| CN1920606B (en) * | 2005-07-07 | 2011-04-06 | 阿瓦戈科技通用Ip(新加坡)股份有限公司 | Optoelectronic assembly with heat sink |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| CN102393552A (en) * | 2010-06-15 | 2012-03-28 | 安华高科技光纤Ip（新加坡）私人有限公司 | Connector system having electrical and optical links with optical link cleaner |
| CN106100514A (en) * | 2016-08-05 | 2016-11-09 | 天津蓝天太阳科技有限公司 | A kind of laser power supply system energy conversion module |
| CN106152958A (en) * | 2016-07-27 | 2016-11-23 | 陕西飞机工业（集团）有限公司 | A kind of antenna alignment ranging component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478689B (en) * | 2010-11-25 | 2015-04-01 | 鸿富锦精密工业（深圳）有限公司 | Optical fiber connector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912521A (en) * | 1987-10-30 | 1990-03-27 | International Business Machines Corporation | Electro-optical transducer assembly |
| US5069522A (en) * | 1990-01-09 | 1991-12-03 | International Business Machines Corporation | Optical fiber link card |
| US5528408A (en) * | 1994-10-12 | 1996-06-18 | Methode Electronics, Inc. | Small footprint optoelectronic transceiver with laser |
| US6213651B1 (en) * | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
-
2001
- 2001-04-24 CN CNB2006100036051A patent/CN100399089C/en not_active Expired - Fee Related
- 2001-04-24 CN CNB011170891A patent/CN1260896C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100357771C (en) * | 2004-02-23 | 2007-12-26 | 台达电子工业股份有限公司 | Light transmission module and manufacturing method |
| CN1920606B (en) * | 2005-07-07 | 2011-04-06 | 阿瓦戈科技通用Ip(新加坡)股份有限公司 | Optoelectronic assembly with heat sink |
| CN102393552A (en) * | 2010-06-15 | 2012-03-28 | 安华高科技光纤Ip（新加坡）私人有限公司 | Connector system having electrical and optical links with optical link cleaner |
| CN102393552B (en) * | 2010-06-15 | 2014-09-17 | 安华高科技通用Ip(新加坡)公司 | Connector system having electrical and optical links with optical link cleaner |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| CN106152958A (en) * | 2016-07-27 | 2016-11-23 | 陕西飞机工业（集团）有限公司 | A kind of antenna alignment ranging component |
| CN106100514A (en) * | 2016-08-05 | 2016-11-09 | 天津蓝天太阳科技有限公司 | A kind of laser power supply system energy conversion module |
| CN106100514B (en) * | 2016-08-05 | 2019-07-09 | 天津蓝天太阳科技有限公司 | A kind of laser power supply system energy conversion module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1815284A (en) | 2006-08-09 |
| CN1260896C (en) | 2006-06-21 |
| CN100399089C (en) | 2008-07-02 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhongda Electronic Components (Wujiang) Co., Ltd. Assignor: Delta Optoelectronics Inc. Contract fulfillment period: 2008.1.1 to 2013.12.31 contract change Contract record no.: 2009990000378 Denomination of invention: Photoelectric transceiver of information transmission system Granted publication date: 20060621 License type: Exclusive license Record date: 2009.4.28 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.1.1 TO 2013.12.31; CHANGE OF CONTRACT Name of requester: ZHONGDA ELECTRONIC COMPONENTS (WUJIANG) CO., LTD. Effective date: 20090428 |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060621 Termination date: 20160424 |