CN1369078A - Device and method for making devices comprising at least a chip fixed on support - Google Patents

Device and method for making devices comprising at least a chip fixed on support Download PDF

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Publication number
CN1369078A
CN1369078A CN00811463A CN00811463A CN1369078A CN 1369078 A CN1369078 A CN 1369078A CN 00811463 A CN00811463 A CN 00811463A CN 00811463 A CN00811463 A CN 00811463A CN 1369078 A CN1369078 A CN 1369078A
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CN
China
Prior art keywords
chip
bearing
substrate
contact pins
pad
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Pending
Application number
CN00811463A
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Chinese (zh)
Inventor
B·卡尔瓦斯
J·-C·菲达尔戈
P·帕特里斯
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Gemplus SA
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Gemplus SA
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Publication date
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Publication of CN1369078A publication Critical patent/CN1369078A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Apparatus For Radiation Diagnosis (AREA)

Abstract

The invention concerns a method for mounting on a support (16) at least a microcircuit in the form of a chip (2) produced on a very thin semiconductor substrate. The invention is characterised in that it comprises, for the or each chip, the following steps: a) providing at the chip at least an interconnection point in the form of a bump contact (8) in weldable material, the bump contact having a welding surface in the same plane as at least one of the chip faces (2a); b) providing at the level of the support at least an interconnection pad (14a) designed to be welded with a corresponding bump contact of the chip; c) placing the welding face of the or of each bump contact of the chip opposite the or each corresponding interconnection pad of the support; and d) welding the or each bump contact of the chip with the or each corresponding interconnection pad of the support. The invention also concerns a device, such as a chip card, produced from a chip as defined at point a).

Description

Be used to make the equipment and the method that comprise at least one electronic equipment that is fixed to the chip on the bearing
The present invention relates to a kind of equipment and method that comprises at least one electronic equipment that is fixed to a chip on the bearing that be used to make.
In some field, comprise in the field of intelligent cards, must on a relative thin and flexible bearing, a microcircuit or chip be installed.With regard to smart card, be necessary to make the existence of this chip can not cause an excessive thickness that surpasses the threshold value of determining by international standard (current this value is fixed as 50 μ m) on the one hand, be necessary that on the other hand it is enough reliable making the installation of this chip, even when this card stands higher deflection and twisting stress, also can use enduringly with permission.
In a conventional manner, by this chip mount is established for this purpose at one, in the cavity at this bearing degree of depth place, to avoid creating an excessive thickness.
Fig. 1 has shown that schematically one is installed a chip 6 to constitute the known example of a smart card on bearing 2.This chip 6 almost all is encapsulated in the cavity 3, so that its thickness is comprised within the thickness of bearing 2.This chip 6 has one group and connects pad 5 on the limit on its surface, it is towards the outside of cavity 3.These pads 5 are connected to respective contacts 7 on bearing by lead 9.Contact 7 can be positioned at the bottom of cavity, perhaps is arranged on the by-level face of a recessed region 11 of surrounding cavity, as illustrating in this example.These contacts 7 are electrically connected with contact region 13 conversely, are connected with a card reader resistance with permission.These contact regions 13 all are encapsulated in the recess 11, so that their thickness is also contained within the thickness of bearing 2.
In order to protect entire portion, formed a protective materials coating 15, the Zone Full that occupies with the internal edge that covers by cavity 3, lead 9 and a part of contact region 13.
This conventional art has several shortcomings.At first, in the connection pad 5 with chip 6 is electrically connected to the operation of contact 7, need to use very fine and exquisite lead 9, thereby formed frangible point.In addition, weld a large amount of tool processes of the action need of these leads 9 and decimal object time not.
In addition, the formation of cavity 3 needs a not only expensive but also weak procedure of processing concerning this card.
Also it should be noted that, when must on same bearing, connect several assemblies simultaneously, for example several chips or other are passive or during active component, are to be difficult to use based on the technology of an integrated chip in a cavity of a bearing.
In addition, designing and the compatible method of the automation tools that is used to produce in batches processing, adhere at high speed and welding chip allowing, is very important.
In view of these problems, the present invention proposes a kind of at least one method of installation on a bearing that is used for the microcircuit of chip form, it is characterized in that: for this chip or a plurality of chip, it comprises following steps:
A) provide a chip as an extremely thin semiconductor production, it have that at least one is made by weldable material, with the interconnection point of contact pins form, described pad have one in fact with the face of weld of at least one surface in same plane of described chip;
B) on this bearing, provide at least one interconnect area, be used for and the welding of the corresponding contact pad on this chip;
C) face of weld that will these one or more contact pins is placed on the described chip, and it faces corresponding one or more interconnect area on the bearing; And
D) will on one or more contact pins on the described chip and bearing, corresponding one or more interconnect area weld.
The present invention has advantageously used in an extremely thin substrate technology of producing chip, as in patent documentation WO-A-9802921 with the name of Kopin special as described in.This technology make especially arrange have 10 micron thickness or even the chip more much smaller in fact than this thickness become possibility.
Advantageously, the interconnect area of bearing produces on the part of abutment surface, is arranged in this surperficial general layout.In other words, there be not to create cavity or the recess that is used to hold this interconnect area thickness.Therefore, this interconnect area and chip are planned with regard to the whole plane on their that surfaces, place.By means of the present invention, this scheme is possible, because a special chip according to the definition configuration in a) of paragraph in the above is provided.
Preferably be that this one or more contact pins is formed from aluminium.
Similarly, also might make this one or more interconnect area or a plurality of zone with aluminium.
According to method of the present invention itself, provide especially by hot pressing or ultrasound wave and welded.
According to the first embodiment of the present invention, one or more contact pins of this chip runs through the thickness of this chip, so that have an all addressable surface on each surface of this chip.
This scheme makes that especially running through one or more pad by the thickness direction conveying capacity along this chip carries out welding step and become possibility.In other words, be used to the energy applications of welding on the contact pins surface that faces face of weld.
According to the favourable aspect of this embodiment, in step a), also provide a protectiveness substrate fixing this chip.Can after from chip, removing this substrate, carry out welding step then.
According to second embodiment of the present invention, in step a), also provide a protectiveness substrate that has first surface, fixes a core assembly sheet.
Before welding step, on this protectiveness substrate, to cut around at least one chip, the degree of depth of cutting reaches first surface at least of this substrate.After welding step, the bearing that is welded with one or more chip is separated from this protectiveness substrate.The previous fact of having cut around this chip makes that removing it with its cutting profile becomes possibility.It is possible carrying out above-mentioned cutting with the form of recess then, and this recess only partly runs through the thickness of this protectiveness substrate.In this case, be used for the thin slice of the substrate of all chips a remaining integral body, this is convenient to remove this chip after welding.
Advantageously, according to this second embodiment, at least when this bearing is separated, keep this protectiveness substrate to allow to remove this chip when separated by peeling off with this bearing of box lunch.
By insert a bonding coat between substrate is with respect to the second surface of first surface and a pedestal, this substrate can be fixed.
According to the variant of this second embodiment, depth of cut runs through this protectiveness substrate fully.When this protectiveness substrate can, for example by means of above-mentioned bonding coat, when being securely fixed on its pedestal, this scheme is possible.
The invention still further relates to a kind of equipment, such as a kind of smart card, has at least one microcircuit with chip form, wherein this microcircuit is installed on the bearing, and be connected at least one interconnect area that is used for this bearing, it is characterized in that: this one or more chip has at least one contact pins, and wherein this pad has a surface and is used for contacting with a corresponding contact district on bearing, this surface of contact faces this contact region on a surface of this chip.
Advantageously, the surface of contact of this contact pins in fact and face the chip surface of described interconnect area on same plane.
Preferably be, the interconnect area of bearing produces on the part of abutment surface, is arranged in the whole plane on this surface.
This one or more pad can be manufactured from aluminium.
According to first embodiment of this equipment, this one or more contact pins runs through this chip thickness.
Advantageously, the integral planar of the abutment surface of adhering to respect to it, this chip has an excessive thickness, is equal to or less than 50 microns.
By reading the most preferred embodiment to providing as just non-limiting example, and with reference to the accompanying drawings, the present invention will be better understood, and its advantage will more clearly reveal, wherein:
Fig. 1 described, and was the cross sectional view of a known smart cards, had shown the chip position in a cavity of bearing;
Fig. 2 is by a partial plan layout of a thin slice of use in an embodiment of the present invention, the generation of so-called silicon on insulator technology;
Fig. 3 is a so-called silicon on insulator technology of foundation, the cross section view of an assembly of being made up of an extremely thin chip, a protectiveness substrate and bonding pad;
Fig. 4 is a diagrammatic cross-section, has shown according to first embodiment of the invention among Fig. 3
The operation of shown die attach on its bearing; And Fig. 5 a is a diagrammatic cross-section to 5c, shown that wherein this thin slice comprises the extremely thin chip of producing according to so-called silicon on insulator technology according to thin slice of second embodiment of the invention preparation and with the continued operation on these die attach to one bearing.
Fig. 2 is a view that has shown a thin slice 12 that is produced by so-called silicon on insulator (SOI) technology.The extremely thin chip 2-of the feasible manufacturing of this technology is that the active parts of microcircuit becomes possibility.
The SOI technology that is used for obtaining having the chip of such geometrical property has been described with the name of Kopin especially at patent documentation WO-A-98 02921.For the sake of brevity, therefore will can not repeat this manufacturing details.
Chip 2 is embarked on journey on the protectiveness substrate 4 that is arranged in insulation, and substrate 4 generally is a glass, and it has constituted the main body of thin slice.This dielectric substrate 4 plays protection chip 2 in the middle of other things, these chips are owing to their fineness (about 10 microns), so be flexible.
By bonding pad 6, each chip 2 all is maintained on the cover glass substrate 4.These bonding pads 6 comprise little rectangular area, with respect to 45 ° of the limit of chip 2 rotations, and are positioned on the respective corners of each chip, so that make except the edge of thin slice 12, a pad 6 covers four joint angles of four different chips.Fig. 3 has shown an assembly 10 after thin slice 12 is cut into each cell surface that comprises a chip 2.Therefore, this assembly 10 comprise chip 2 itself, reach chip size it protectiveness substrate 4 and keep the bonding pad 6 of this chip on substrate by its angle.
Chip 2 has interconnection pad 8, and this makes to communicate between the external environment of the circuit that it comprises and this circuit becomes possibility, particularly about input/output signal and a supply voltage.
These pads 8 are made by regions of conductive material, and this material is an aluminium in this case.Because chip is 2 extremely thin-its thickness is no more than 100 microns, and in this example about 5 microns, therefore just might make the pad that interconnects like this so that make them all have surface of contact on each the surperficial 2a of chip 2 and 2b.In other words, each interconnection pad runs through the thickness of chip 2, as shown in Figure 3.
In an example shown, interconnection surface of contact 8a of pad and 8b flush with the respective surfaces 2a and the 2b of chip 2 in fact.Yet these surface of contact 8a and 8b can be recessed a little or more outstanding with respect to these respective surfaces 2a and 2b, though they are considered in fact on the integral planar of respective surfaces 2a, the 2b of chip.These connect pads be different from that those are known, with the pad (term also is called " bumps " in English) of projection form, its plane with respect to chip has a tangible projection, these projections accurately are used to create this interconnection.
During the manufacturing before its final bearing and handling, protectiveness substrate 4 and bonding pad 6 play this chip of protection in fact in die attach.
Fig. 4 has shown a step of adhering to a chip 2 according to first embodiment of the invention, after removing this protectiveness substrate 4 and bonding pad 6.In this first embodiment, the removing of this protectiveness substrate, via before the step of in the end fixing this chip, the operation of peeling off the protectiveness substrate carries out.
Should be attached to the communication interface 14 that it is made by exposed chip 2 on its bearing 16 surfaces then.According to the application of imagination, this communication interface 14 can play following effect:
---the input and output that connect this chip are to the external world, particularly Jie Chu card reader; And/or
---necessary interconnection is provided at this chip with between the element of making on this bearing.These elements can be: be integrated into an antenna in the bearing 2, so that constitute a known what is called " contactless card ", other is integrated into the circuit component (for example one or more other chip) in this card, or a power supply.
In this embodiment, this communication interface 14 is made by spray metal coating, is used to be provided at the different electrical connections between this chip and the element relevant with this bearing 16.Though have join domain 14a, these spray metal coatings are concentrated to support position and are used for receiving chip 2.Each join domain 14a of communication interface is in line perpendicular to the corresponding contact pad 8 on chip 2.It is made of aluminum that this communication interface comprises at least a portion of join domain 14a.
In case this chip join domain 14a is vis-a-vis placed, just carry out welding to connect the latter and the corresponding pad 8 on chip.It should be noted that: contact pins 8 is to run through pad; This chip makes its surperficial 2a or one of 2b or another just can be attached on its bearing 16 towards bearing 16.In this example, the surperficial 8b of contact pins faces join domain 14a.
Carry out welding by means of hot-pressing tool, wherein this hot-pressing tool provide a pressure to contact pins, and towards the surperficial 8b facing surfaces 8a of join domain 14a.For this reason, this hot-pressing tool has a soldering tip 18a, and wherein this soldering tip 18a has an xsect that is equal to or less than these contact pins 8 surfaces in fact, is used for relatively with the surperficial 8a of contact pins 8, then pad is pressed on its corresponding join domain 14a.Simultaneously, by producing vibration via pad 8, instrument 18 provides heat energy.This energy temperature at contact point place that raise, and cause the fusion of contact pins 8 and its join domain 14a.It should be noted that: these two linkage units all made of aluminum 8 and 14a and this hot-pressing technique are compatible fully.
This hot-pressing technique is well-known, and will no longer be described in detail here for the sake of brevity.
In a variant, it is also contemplated that the welding of implementing tie point 8 and 14a according to original known technology by ultrasound wave or laser beam.In these situations, same, welding energy can be applied to pad 8, with the surperficial 8b facing surfaces 8a that contacts with join domain, and so run through the thickness of this pad.
Naturally, might imagine with other metal or alloy and make this contact pins 8 and/or join domain, if their the compatible manufacturing technologies used and the words of welding.
Do not have embossment in fact, promptly do not have the use of the contact pins 8 of projection with respect to the corresponding surperficial 2a of substrate and 2b, make especially according to being welded into possibility automatically by english terminology " bumpless tapeautomatic boning " or " bumpless TAB " known technology implementation.This technology makes and implements to be welded into possibility with two-forty by chip 2 being installed on the belt, wherein this belt be passed to soldering appliance 18 in face of, bearing 16 also transmits synchronously with this bonding speed.Describe the second embodiment of the present invention referring now to Fig. 5, it also is used to weld the extremely thin chip with no protruding contact pins.These chips have identical characteristic basically with those chips of describing in first embodiment.Therefore, for the sake of brevity, with the difference of only describing wherein.
Shown in Fig. 5 a, chip 2 has and connects pad 8, and this pad only has a surface of contact, is positioned on the surperficial 2a with respect to the outside of protectiveness glass substrate 4.As first embodiment, by these contact pins of making according to so-called english terminology " bumpless " technology, the surperficial 2a with respect to their places does not have embossment in fact.In this example, pad 8 is also made of aluminum, although the compatibility of foundation and the solder technology that provides can be imagined other conductive material.
According to second embodiment, carry out the cutting of the assembly 10 of a part of thickness that once comprises chip 2, bonding pad 6 and substrate 4.This partial cut by means of cutting tool 20, realize that such as a rotation blade it forms the recess 24 perpendicular to the integral planar of thin slice 12 at each interval 22 of separating two adjacent chips 2.Each recess 24 passes the part of a bonding pad 6 (and no edge of a part of possible chip 2) and protectiveness glass substrate 4.The end points 24a of each recess is not conclusive, if it is at least below the surface level of die bottom surface 2b and in substrate and the words that face more than the surperficial 4b facing surfaces 4a of chip 2.
It should be noted that: recess 24 forms on a grid, and this grid is divided into chip 2 row and column (Fig. 2) on thin slice 12.Therefore, each in four of a chip 2 limits is all centered on by a recess 24.
In case made recess 24, just the surperficial 4a with thin slice 12 is placed on the platform 26, so that keep this thin slice thereon regularly.Can be by mechanically fixing this thin slice and/or fixing to obtain this by between the surperficial 4a of platform 26 and glass substrate 4, inserting a bonding agent.For instance, platform 26 can (this surface receives thin slice 12) have one deck mucous membrane 26a (Fig. 5 c) on its end face.Then, the assembly that comprises the thin slice 12 with recess 24 is ready for and carries out an operation, die attach is arrived on the bearing (film, card, P.e.c., grid etc.) of this chip plan use.
In this example, bearing 16 is identical with the bearing that is used for the first embodiment situation.Shown in Fig. 5 c, this bearing also have from the teeth outwards form, with the spray metal coating of the material of aluminium or other and the solder technology compatibility used, place, its end puts together to form join domain 14a, and wherein each join domain is used for being connected with a corresponding pad 8 on the chip 2.As shown in the figure, bearing 16 has a form of band continuously, in case welding operation finishes, it just will be cut into independent equipment (for example smart card).
In order between the corresponding join domain 12 on pad on the chip 28 and the bearing, to implement welding, use a hot-pressing tool 18 of before in the first embodiment situation, describing.
Each pad 8 on a chip 2 below a 18a of this hot-pressing tool and its corresponding join domain 14a be complementary.By below it, moving the belt that forms bearing 16 along the direction of arrow and correspondingly moving the platform 26 that keeps this thin slice 12, just can obtain this scheme.A 18a of hot-pressing tool 18 only be positioned at bearing, with above the surperficial 16a facing surfaces 16b that is used to receive a chip 2.
Shown in Fig. 5 c, the belt that forms bearing 16 advances according to a curvilinear path, and when thin slice 12 is positioned at tangentially the protuberance of support slice 12, itself and hot-pressing tool linearity are vertical.At this moment, face the corresponding join domain 14a that on bearing 16, forms at a pad 8 on the chip.Hot-pressing tool 18 is carried out the welding of pad 8 and join domain 14a by applying the thickness that energy runs through bearing 16 and pad 8 then.Therefore each chip 2 all is welded on its bearing, and the track of belt moves it to protectiveness substrate 4 directions away from it.Therefore produced the power that chip 2 is pulled away from or separates from its protectiveness substrate 4.The latter is because it is maintained on its platform, so allow this chip to separate from bonding pad 6 when chip leaves this substrate.This is because the bounding force between pad 8 and join domain 14a is higher than bonding pad 6 in fact.Similarly, even when substrate is weakened by recess 24, the bounding force of bonding pad 6 in fact also is lower than the fracture strength of substrate 4.It should be noted that: when chip separated from its protectiveness substrate 4, this bonding pad 6 remained on the latter.
Very clear, recess 24 plays the effect that separates around the limit of each chip 2 in fact.The fact that they have partly broken through the thickness of this protectiveness substrate 4 does not play a decisive role in welding process, this described just now.This is because the thickness of protectiveness substrate 4 is partly broken through, for no other reason than that current cutting technique makes that accurately limiting this depth of cut is that the thickness of chip is impossible, wherein this chip thickness in fact can be less than 10 microns.Therefore, the recess in the substrate depths is because the tolerance in the precision of cutting tool 20.According to the variant of second embodiment, thin slice 12 is cut fully in the position of recess 24, so that each part of the protectiveness substrate 4 around a chip 2 is mechanically to separate from the remainder of this thin slice 12.Qie Ge assembly was kept its structure before being cut by this mucous membrane 26a like this.In this variant, at these protectiveness substrate 4 places, the separating force that is caused by removing of the bearing 16 that has welding chip 2 is all calculated by the bounding force of this mucous membrane 26a.
Naturally, the variant of second embodiment and it also makes and uses other solder technology, becomes possibility such as ultrasonic soldering, laser bonding etc.
For first and second embodiment, might provide a subsequent step, i.e. protective seam of deposition on the exposed part at least of one or more chip on their bearings.This deposition can realize by adhering to a meticulous film or spraying a kind of lacquer.
Naturally, scope of the present invention extends to all application that need adhere to an extremely thin chip on a surface of a bearing, and wherein this bearing not only can be flexible (film, plate, plastic clip, or the like) but also can be rigidity.

Claims (21)

1. one kind is used for going up at least one method with the microcircuit of chip (2) form of installation at a bearing (16), and it is characterized in that: for this one or more chip, it comprises following steps:
A) provide a chip made from an extremely thin semiconductor form, this chip have at least one by weldable material make, with the interconnection point of a contact pins (8) form, described pad have one in fact with at least one surface (2a of described chip; 2a, 2b) face of weld in same plane;
B) (16) are located on bearing, provide at least one interconnect area (14a) to be used for and a corresponding contact pad welding on this chip;
C) will face corresponding one or more interconnect area on bearing at the face of weld of one or more contact pins on the described chip; And
D) one or more contact pins on the described chip of welding and the corresponding one or more interconnect area on bearing.
2. the method for claim 1 is characterized in that: this interconnect area (14a) goes up in the surface on a surface (16a) of this bearing (a 16) part and produces, and it is arranged in this surperficial integral planar.
3. as claim 1 or 2 described methods, it is characterized in that: this one or more contact pins (8) is formed from aluminium.
4. as any one described method in the claim 1 to 3, it is characterized in that: this one or more interconnect area (14a) is formed from aluminium.
5. as any one described method in the claim 1 to 4, it is characterized in that: this welding step d) carry out by hot pressing.
6. as any one described method in the claim 1 to 4, it is characterized in that: this welding step d) carry out by ultrasound wave.
7. as any one described method in the claim 1 to 6, it is characterized in that: one or more contact pins (8) on chip (2) runs through the thickness of described chip, all has an addressable surface so that make on each surface (2a, 2b) at this chip.
8. method as claimed in claim 7 is characterized in that: this welding step d) be by the thickness direction along described chip (2) energy transport to be run through this one or more pad (8) to carry out.
9. as claim 7 or 8 described methods, it is characterized in that: in step a), also provide a protectiveness substrate (4) of fixing this chip (2), and after from this chip, removing this substrate, carried out welding step).
10. as any one described method in the claim 1 to 6, it is characterized in that:
-in step a), also providing a protectiveness substrate (4), it has first surface (4b) and is used for fixing a core assembly sheet (2), and
-in welding step) and on this protectiveness substrate, cut (24) around at least one chip before, and depth of cut reaches the described first surface (4b) of this substrate at least, and
-in welding step) afterwards, the bearing (16) that has one or more chip of its welding separates from protect expansion property substrate (4).
11. method as claimed in claim 10 is characterized in that: at least during this bearing of described separation (16), keep this protectiveness substrate (4) and allow to remove this chip (2) when separated by peeling off with this bearing of box lunch.
12. method as claimed in claim 11 is characterized in that: by it and first surface (4a) opposing second surface (4b) and a pedestal (26) between insert a bonding coat (26a) and keep this protectiveness substrate (4).
13. as any one described method in the claim 10 to 12, it is characterized in that: cutting constitutes the recess (24) of the thickness of only partly breaking through this protectiveness substrate (4).
14. method as claimed in claim 12 is characterized in that: cutting runs through the thickness of this protectiveness substrate (4) fully.
15. equipment that comprises at least one with the microcircuit of chip (2) form, wherein this microcircuit is installed in a bearing (16) and goes up and be connected at least one interconnect area (14a) on this bearing, it is characterized in that: this one or more chip (2) has at least one contact pins (8), this pad (8) has a surface and is used for contacting with a corresponding contact district on this bearing, and described surface in contact faces described contact region on a surface of this chip.
16. equipment as claimed in claim 15 is characterized in that: the described surface in contact of contact pins (8) in fact and face the described chip surface (2a of described interconnect area (14a); 2a, 2b) on same plane.
17. as claim 15 or 16 described equipment, it is characterized in that: the described interconnect area (14a) of bearing (16) is made on the surperficial part on these (16) surfaces of bearing (16a), and it is arranged in this surperficial integral planar.
18. as any one described equipment in the claim 15 to 17, it is characterized in that: this one or more contact pins (8) is formed from aluminium.
19. as any one described equipment in the claim 15 to 18, it is characterized in that: this one or more contact pins (8) runs through the thickness of this chip.
20. as any one described equipment in the claim 15 to 19, it is characterized in that: have an excessive thickness the integral planar on the surface (16a) of the bearing (16) that chip (2) adheres to respect to it, it is equal to or less than 50 microns.
21. as any one described equipment in the claim 1 to 20, it is characterized in that: it is a smart card.
CN00811463A 1999-06-15 2000-05-30 Device and method for making devices comprising at least a chip fixed on support Pending CN1369078A (en)

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FR9907551A FR2795201B1 (en) 1999-06-15 1999-06-15 DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES COMPRISING AT LEAST ONE CHIP FIXED ON A SUPPORT
FR99/07551 1999-06-15

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JP3739752B2 (en) * 2003-02-07 2006-01-25 株式会社 ハリーズ Small-piece transfer device capable of random-cycle shifting
US20050003650A1 (en) * 2003-07-02 2005-01-06 Shriram Ramanathan Three-dimensional stacked substrate arrangements
JP4091096B2 (en) * 2004-12-03 2008-05-28 株式会社 ハリーズ Interposer joining device
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