CN1357749A - Integrated miniature inductance displacement sensor and its making process - Google Patents

Abstract

The integral miniature inductance displacement sensor includes iron core, coil, measured matter, substrate and magnetic conducting plate. It is made through the processes of photoetching to obtain channels on substrate; sputtering to form one layer of conductor on the substrate; photoetching for the second time to form conducting layer in the channels; electroforming to form coil and iron core in proper position of the channel; and connecting the substrate with coil and iron core with magnetic conducting plate. The integral making process results in small size, light weight, high production efficiency and high consistency for the miniature inductance displacement sensor. The sensor is used in measuring micro displacement.

Description

A kind of integrated miniature inductance displacement sensor and preparation method thereof

The invention belongs to message area sensor class, relate to a kind of inductive type displacement transducer and preparation method thereof improve.

Inductance displacement sensor is mainly used in and carries out micro-displacement measurement.At present both at home and abroad the inductance displacement sensor structure that generally adopts of institute includes as shown in Figure 1: testee 3 compositions of coil 1, iron core 2 and magnetic conduction, and coil is wrapped on the iron core, and its each parts are assembled by single part.Its principle of work is: the sinusoidal signal that passes to certain amplitude and frequency in the coil, in when, between the object of magnetic conduction is with inductance displacement sensor relative displacement taking place, magnetic flux in the iron core will change, the amplitude of signal and frequency all will produce corresponding the variation in the coil at this moment, pass through subsequent conditioning circuit, the variation of measuring-signal obtains the size of displacement.But owing to each parts separate, thereby need assembling, make its volume bigger, cause the consistance of production relatively poor, production efficiency is lower.

The object of the invention is to address the above problem, and provides a kind of integrated level height, the miniature inductance displacement sensor that volume size is little.

One-piece construction of the present invention includes as shown in Figure 2: iron core 1, coil 2, measured object 3, substrate 4, magnetic conductive board 5, iron core and coil place in the suprabasil groove, and iron core is in the inside of coil, and substrate is fixedly connected with magnetic conductive board.

Preparation method of the present invention is:

1) in substrate, obtains groove by photoetching, etching process;

2) one deck conductor will be sputtered again in the substrate;

3) once more photoetching, corrosion are carried out in substrate, made bottom portion of groove have one deck conductive layer;

4) by electroforming process with coil and iron core electroforming to the corresponding position of groove;

5) substrate that will have coil and an iron core is fixedlyed connected with magnetic conductive board, then finishes the making of integrated miniature inductance displacement sensor.

Dynamic duty process of the present invention: the sinusoidal signal that passes to certain amplitude and frequency in the coil, in when, between the measured object of magnetic conduction is with inductance displacement sensor relative displacement taking place, magnetic flux in the iron core will change, the amplitude of signal and frequency all will produce corresponding the variation in the coil at this moment, by other metering circuit, measure the variation of signal, obtain the size of displacement.

Good effect of the present invention: because this structure adopts each parts integrated form manufacturing technology, overcome the shortcoming that adopts resolution element to bring in the prior art, provide a kind of one-piece construction size that makes little, weight saving, be convenient to produce in batches, production efficiency height, consistance be the preparation method of integrated miniature inductance displacement sensor preferably

Description of drawings:

Fig. 1 is the prior art structural representation

Fig. 2 is a structural front view of the present invention

Fig. 3 is a structure cut-open view of the present invention

Fig. 4 is a most preferred embodiment structural drawing of the present invention

Fig. 2, Fig. 3, shown in Figure 4ly have: iron core 1, coil 2, measured object 3, substrate 4, magnetic conductive board 5.

Embodiments of the invention: iron core 1 adopts permalloy, uses the micromechanical process electroforming to substrate 1 inside.The conductive material of low resistances such as coil 2 employing copper, easy electroforming.Substrate 4 can be adopted silicon chip or glass sheet, is rectangle for improving its profile of raw material utilization rate.Magnetic conductive board 5 can adopt electrical pure iron, and its planform can be determined according to the shape of substrate 4.For improving measuring accuracy, the present invention also can adopt difference structure, as shown in Figure 4, adopts magnetic conductive board to be fixedly connected on the connected mode of a side of two integrated miniature inductance displacement sensors placed side by side.

Claims (2)

1, a kind of integrated miniature inductance displacement sensor, include: iron core 1, coil 2, measured object 3 is characterized in that: also comprise substrate 4 and magnetic conductive board 5, iron core 1 and coil 2 place in the groove in the substrate 4, iron core 1 is in the inside of coil 2, and substrate 4 is fixedly connected with magnetic conductive board 5.

2, a kind of preparation method of integrated miniature inductance displacement sensor is characterized in that:

1) in substrate, obtains groove by photoetching, etching process;

2) one deck conductor will be sputtered again in the substrate;

3) once more photoetching, corrosion are carried out in substrate, made bottom portion of groove have one deck conductive layer;

4) by electroforming process with coil and iron core electroforming to the corresponding position of groove;

5) substrate that will have coil and an iron core is fixedlyed connected with magnetic conductive board, then finishes the making of integrated miniature inductance displacement sensor.

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