CN1357441A - Synthetic resin molded article and its making process - Google Patents
Synthetic resin molded article and its making process Download PDFInfo
- Publication number
- CN1357441A CN1357441A CN 01134698 CN01134698A CN1357441A CN 1357441 A CN1357441 A CN 1357441A CN 01134698 CN01134698 CN 01134698 CN 01134698 A CN01134698 A CN 01134698A CN 1357441 A CN1357441 A CN 1357441A
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- synthetic resin
- formed product
- resin formed
- back lighting
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Abstract
Provided is a synthetic resin molding which makes an excellent back lighting possible even when the main body of the molding is made of an opaque or translucent synthetic resin. The synthetic resin molding 1 is opaque or translucent, and the molding 1 capable of back lighting is constituted. A light transmitting window 8 (not always necessary for a translucent resin) is formed at a prescribed position of the molding 1, the window 8 is shielded by a synthetic resin sheet 5 which is welded/joined to the surface or back of the molding 1, and the molding 1 which makes back lighting possible in relation to light transmissible patterns and characters 3 which are printed on the sheet 5 is constituted.
Description
Invention field
But the present invention relates to the to have backlight illumination heterogeneous superficial layer of printing surface of (behind the back side or transverse direction irradiates light of goods, when the front is seen, can see the pattern and the literal of printing brightly) or the synthetic resin formed product of the inside layer.
Prior art
The panels of the instrument board of automobile or idle call operation board or audio and video products etc. make pattern and literal or its peripheral printing opacity of printing in front by back lighting.Such pattern and literal are made by being printed on synthetic resin board or the synthetic resin formed product.
, when being printed on synthetic resin board (below, abbreviate plate as), can use a plurality of goods of large-area plate print production, but when printing synthetic resin formed product (below, abbreviate the moulding product as), produce various problems.
That is, when printed products, the making complexity of the anchor clamps of fixed-type product and valency height, owing to moulding product inhomogeneous can not get high-quality goods, its yield is low.
In addition, compare, need about 2 times operating personnel with the printing of plate.
And then, when polychrome making sheet, in removing the washing operation of dust, breakage of moulding product or ledge occur and come off.
In addition,,, quality is reduced, become the reason that yield reduces owing to become the influence of sleeve clamp also to produce small bending even the moulding product are smooth.
And then, when the moulding product are single-curved surface or many curved surfaces, except the special mode of printing of so-called filling printing, print and to carry out, but the time by this filling printing, when carrying out back lighting for the instrument board of automobile or employed moulding product such as idle call operation board or audio and video products, existing pin hole appears on the pattern of projection and literal, other part (unregistered land is many) produces as the light leak of babysbreath, the problem appearance that original purpose is difficult to realize.
In addition, when on the moulding product, printing, except being printed on above-mentioned moulding product, also has following mode.
First kind is to be called to transmit treatment system (going into mould) simultaneously, is to make manifolding paper tinsel position make the formation system of molding procedure and manifolding drawing integrated process in injecting molding die.This mode only makes the ink film that is printed on the film make carbon copies on the moulding product when moulding, so can not hide weld bond or inlet mark that the moulding product produce, has the problem of cosmetic damage.
Second kind is to be called plate transfer system (heat manifolding), is to use thermoprinting equipment will be printed on printing (pattern) heat manifolding on the film in the mode of moulding product.At this moment, exist the problem that the moulding product must be the planes.
The present inventor is willing to disclose following synthetic resin formed product on clear 63-129693 number (No. the 2127383rd, patent) the spy in order to address the above problem.
That is, but with the printing ink rete of the above individual layer of thickness 4 μ or with having the synthetic resin formed product of welding on the surface of the synthetic resin board that print, thickness 0.1～2.0mm of the printing ink rete more than two layers more than thickness 8 μ or the inside in conjunction with the back lighting of heterogeneous superficial layer or the inside layer.
In addition, about its method for making, be on the synthetic resin board of thickness 0.1～2.0mm, printing ink rete or the above printing ink rete that uses more than two layers of thickness 8 μ that use has the above individual layer of thickness 4 μ print, after being processed into the shape that can be seated in the mould, carry out loading in abutting connection with ground, but molten resin is expelled to behind the matched moulds synthetic resin formed product of the back lighting that obtains having heterogeneous superficial layer or the inside layer in this mould then with mould inner surface.
By such synthetic resin formed product or method for making, the thick printing surface that also can easily keep the printing ink thickness in the side of moulding product, but can high production rate, low defect rate, be manufactured on the moulding product of the back lighting of the thick printing surface of paying the printing ink rete easily in surface with single-curved surface or many curved surface forming product or the inside at low cost, and then can obtain having the moulding product of the beautiful appearance that does not have bonding wire or inlet mark.
Goal of the invention
; in recent years; at the instrument board of automobile or the panel of idle call operation board or audio and video products etc. is the moulding product that for example use the black non transparent resin mostly, when whole injection moulding opaque resin of synthetic resin board, and the problem that generation can not back lighting.
The present invention be exactly Given this situation carry out, even its purpose is also can provide the synthetic resin formed product with good back lighting when synthetic resin formed product is made of opaque or translucent synthetic resin.Technical scheme
In order to achieve the above object, the synthetic resin formed product of claim 1 of the present invention, but it is characterized in that with the printing ink rete of the above individual layer of thickness 4 μ or with having the synthetic resin formed product of welding on the surface of the synthetic resin board that print, thickness 0.1～2.0mm of the printing ink rete more than two layers more than thickness 8 μ or the inside in conjunction with the back lighting of heterogeneous superficial layer or the inside layer, this synthetic resin formed product is opaque or translucent, can carry out back lighting.
The synthetic resin formed product of claim 2 of the present invention is characterized in that, the regulation position by the above-mentioned opaque or translucent synthetic resin formed product in claim 1 forms light inlet window and carries out back lighting.
The synthetic resin formed product of claim 3 of the present invention, the regulation position that it is characterized in that the above-mentioned opaque or translucent synthetic resin formed product in claim 1 forms light inlet window, hide the light inlet window of above-mentioned synthetic resin formed product by the synthetic resin board that engages with the surface or the inside welding of this synthetic resin formed product, pattern and the literal to the light transmission that is printed on this synthetic resin board can carry out back lighting simultaneously.
The synthetic resin formed product of claim 4 of the present invention, it is characterized in that hiding by halves by the above-mentioned synthetic resin board in 3 light inlet window (a light part sees through) of above-mentioned synthetic resin formed product, being printed on the pattern of this synthetic resin formed product and literal becomes and carries out back lighting light tightly.
The manufacture method of the synthetic resin formed product of claim 5 of the present invention, it is characterized in that on the synthetic resin board of thickness 0.1～2.0mm, printing ink rete or the above printing ink rete that uses more than two layers of thickness 8 μ that use has the above individual layer of thickness 4 μ print, after being processed into the shape that can be seated in the mould, carry out loading in abutting connection with ground with mould inner surface, but behind the matched moulds molten resin is expelled to the manufacture method of the synthetic resin formed product of the back lighting that obtains having heterogeneous superficial layer or the inside layer in this mould then, in this molten resin, can use opaque or translucent, according to the transparency of this resin, light inlet window is set at above-mentioned synthetic resin formed product regulation position.
The manufacture method of the synthetic resin formed product of claim 6 of the present invention when it is characterized in that above-mentioned molten resin in claim 5 is translucent, is not provided with light inlet window at above-mentioned synthetic resin formed product regulation position.
The manufacture method of the synthetic resin formed product of claim 7 of the present invention is characterized in that the Punching Technology of the enterprising professional etiquette setting of above-mentioned molten resin plate in claim 5 and 6 shape.
Below, synthetic resin formed product of the present invention and manufacture method thereof are described.
The thickness of synthetic resin board used in the present invention must be more than the 0.1mm, below the 2.0mm.
When the thickness of synthetic resin board was thinner than 0.1mm, intensity difference when being loaded in the mould was because the structure of mould often misplaces with die face.In addition, because the temperature of molten resin makes its partial melting, its shape can not keep.
When the thickness of synthetic resin board is thicker than 2.0mm, be no problem in being loaded into mould, but onboard after the printing, when being processed into the shape that is loaded into mould, be restricted when for example using die-cut type.Owing to process,, be unfavorable as industrial production so productivity ratio significantly reduces with cut-outs such as garden saws.
In addition, when die face has curved surface, for the plate thicker, even the injection moulding molten resin can not paste die face, so can not get desirable moulding product than 2.0mm.
The present invention's one big feature is that the curvature portion at the moulding product with curved surface can print, and sees that from then on using the above plate of 2mm to depart from the invention is intended to.
When printing above-mentioned synthetic resin board with screen printing mode, the ink film thickness that uses with individual layer must be more than the 4 μ m.This thickness is the thickness behind the dry printing ink in printing back.
In order to thicken the thickness of ink film, preferably use screen printing mode.With other mode of printing, one-step print can only obtain the following thin ink film of 1 μ.If the thickness of ink film is less than 4 μ, will produce pin hole can not back lighting.
When printing forms background color (occasion that does not have pattern or literal) with black, must carry out two layers overlapping printing, it is necessary that the printing ink rete is made more than 8 μ.Because compare with pattern or literal, pin hole appears in substrate part that just area is big easily, and this is the cause that back lighting causes light leak easily.
For with above-mentioned printing synthetic resin board be loaded in the mold for forming, be processed into the peristome shape of mould.
When plate is thin, cut off with scissors or cutting machine (shearing), disconnected during thickness of slab with the garden sawing, but it can not be boosted productivity.Therefore, must make die-cut being installed on the press and be processed into the regulation shape by die-cut cut-out with mould.Perforate on the moulding product makes die cutting die, to be die-cut into the hole with its same size, shape.The die-cut size of printed panel is according to the requirement of moulding product and difference.
When printed panel was fitted to the side of moulding product, just given size was more die-cut than mould peristome the earth, if when cutting cubic moulding product, cut four jiaos, and the part bending machining that forwards the side then to makes a kind of shape of box.
When moulding product surface and printed panel face are measure-alike, printed panel can be contrasted Mould Machining portion and carry out die-cut.
When above-mentioned two kinds of situations, printed panel is seated on the mould without any problem.Also identical when on the moulding product, forming the hole.At this moment, the hole that is formed on printed panel makes the size identical with mould.
Want when the surperficial periphery of moulding product exposes the moulding resin face, to reduce processing printed plate with the size of wanting to expose.Load printed panel this moment in mould, die surface center and printed panel center are kept coincideing, and is connected with vacuum generator and carries out vacuum suction owing to minute aperture is set in mould.
By above with printed panel be seated in the mould, matched moulds, injecting molten resin, moulding.At this moment, the path (inlet) that in mould, imports molten resin preferably with the printed panel out of plumb.If vertical, because the temperature and pressure of molten resin makes printed panel break easily.
Description of drawings
Fig. 1 is the oblique view of the used for automobile air conditioning operation board of synthetic resin formed product concrete example of the present invention.
Fig. 2 is the oblique view with used for automobile air conditioning operation board separation costs body disc of the present invention and synthetic resin board.
Fig. 3 is an oblique view of seeing used for automobile air conditioning operation board of the present invention and this body disc (not containing synthetic resin board) from inner face.
Fig. 4 is the rearview of this body disc (not containing synthetic resin board) of used for automobile air conditioning operation board of the present invention.
Fig. 5 is the rearview that engages the state of synthetic resin board on this body disc of expression used for automobile air conditioning operation board of the present invention.
Fig. 6 is the A-A direction sectional drawing of Fig. 1.
Fig. 7 is the mould of expression moulding synthetic resin formed product of the present invention, has represented to be equivalent to the part sectional drawing of moulding situation at position of 2 the dotted line B of Fig. 6.
The explanation of symbol
1 ... idle call operation board (synthetic resin formed product)
2 ... the hole
3 ... pattern and literal
4 ... the dish body
5 ... synthetic resin board
7 ... the reinforcement framework
8 ... light inlet window
10 ... mould
11 ... molten resin
Embodiment
Below, as above-mentioned synthetic resin formed product of the present invention, the idle call operation board of automobile as object lesson, is described for its manufacture method.
In order on used for automobile air conditioning operation board 1 shown in Figure 1, to be installed into sector-style to the Switch of, adjustment etc. (not shown go out), a plurality of holes 2,2 of formation in dish ...In addition, from each hole 2,2 ... the interior end form forwards outstanding L shaped edge 2a.
In addition, in each hole 2,2 ... printing for the pattern and the literal 3 of each button class of pilot operationp, by carrying out back lighting, can improve dark visualitys such as night for this pattern and literal 3.
This idle call operation board 1 is to constitute by the dish body 4 of synthetic resin formed product with the synthetic resin board 5 of the surperficial welding of this dish body 4 as shown in Figure 2, is printed with the shielding part beyond above-mentioned pattern and literal 3 and these patterns and the literal 3 on this synthetic resin board 5.
This coils body 4, as the curved surface that makes slight curvature around Fig. 6 (A-A of Fig. 1 is to sectional drawing) each hole 2 that is shown in towards the hole 2 inclinations oblique.Therefore, as shown in Figure 2, with the inner face of synthetic resin board 5 of the surperficial welding of dish body 4 on, each hole 2,2 of respective disc body 4 ... corresponding position reaches and forms hole 2,2 in shape ... as shown in Figure 6, the curved surface of suitable operation board body 4 forms synthetic resin board 5 by extrusion process.
As shown in Figure 1, this synthetic resin board 5 used thickness 0.1mm～2.0mm's, by forming, expose the periphery that coils body 4 than the little size of operation board body 4 whole surface sizes.
When on the idle call operation board 1 of above-mentioned formation, carrying out back lighting, the light that the rear is come is with the position beyond pattern on the position of directive the place ahead printing opacity and the literal 3, must apply with shield light, but in the present embodiment, because dish body 4 is by black,, do not cover above-mentioned light so do not need to apply promptly with the formation of opaque molten resin, and then do not need coating device, can reduce cost.
, with opaque molten resin formation dish body 4 such as black the time, need the part of back lighting light-permeable.Therefore, in the present embodiment, as shown in Figure 5, by each hole 2,2 at operation board body 4 ... around form the light inlet window 8,8 of arcuation as shown in Figure 4 at the position corresponding with the formation position of the pattern of synthetic resin board 5 and literal 3 ..., so that carry out back lighting.
When being black, not needing black as the nameplate color of background color and the operation (coating etc.) of color of resin blending, thereby reduced cost as the molten resin that coils body 4.
And then, when forming operation board body 4, do not need to design the light leak when covering back lighting by opaque molten resins such as black.
Not opaque completely but during translucent molten resin, above-mentioned light inlet window can be set yet, but, must on dish body 4, print using in order to regulate the light quantity of back lighting as molten resin.In the present invention, according to the transparency of molten resin, can omit 1 time～printing for several times.
In addition, in above-mentioned synthetic resin board 5, when the printing by light transmission forms pattern and literal 3,, use black printing its periphery identical with coiling body 4 in order to see these patterns and literal 3 clearly.
This printing, the light leak when eliminating back lighting carries out two ply printings of screen printing mode on the inner face of synthetic resin board 5 or surface even its two sides, the printing ink rete is made more than 8 μ, to prevent the generation of pin hole.
For the synthetic resin board 5 with above-mentioned regulation shape of having printed is loaded in the mold for forming shown in Figure 7 10, make mould 10 according to the surface of synthetic resin board 5 and the whole shape of dish body 4, be processed into the regulation shape by die-cut cut-out, and with the synthetic resin board 5 of Punching Technology and the surface adjacency in the mould 10.
Then, as shown in Figure 7, behind the closed die 10, with nozzle 13 molten resin 11 of black is imported to sprue 14 from the injection moulding that is arranged on this mould 10, by inlet 15 molten resin 11 is expelled in the mould 10, will coils body 4 weldings on the inner face of synthetic resin board 5.
The invention effect
Because the present invention has the formation of above-mentioned explanation, so have following excellent results.
(1) simplification of technology
Technology of the present invention is that the synthetic resin board that will print is loaded in the mold for forming, will But molten resin is expelled to the extremely simple and easy technology of the products formed that obtains back lighting in the mould. Have The feature that also keeps easily the printing surface of ink film bed thickness in the side of products formed, when moulding, Mould to plate loads easily.
(2) can make the flexography product of back lighting
Surface or inner face at the products formed with single-curved surface or many curved surfaces give the heat-bodied oil ink film easily The printing surface of layer can make back lighting.
(3) high production rate
With directly when printing relatively has the productivity ratio of several times on products formed.
(4) low defect rate
With directly when printing relatively has extremely low defect rate on products formed.
(5) low cost
With on each products formed directly when printing relatively, can print simultaneously a plurality of, thereby fall Low-cost.
(6) beauty of outward appearance
Can't see in the direct printing of products formed or from the film that prints ink film is duplicated at products formed Method in common weld bond and inlet mark, have the outward appearance of good beauty.
And then, in the present invention, in the regulation of opaque or translucent synthetic resin formed product The position forms light inlet window, and then, by welding on the surface of this products formed or the synthetic tree of inner face The fat plate hides the light inlet window of products formed, simultaneously, and for the light transmission that is printed on the synthetic resin board But pattern and literal back lighting consist of, so even can obtain opaque or semi-transparent But the products formed of the structure of bright also back lighting.
In addition, synthetic resin board not exclusively hides the light inlet window of products formed (that is, light transmission rate is not Foot 100%) time, but makes back lighting by opaque pattern and literal are set, also can Make the structure with pattern and literal epirelief.
In this structure, when forming products formed by opaque molten resin, not need to for Light when hiding back lighting and applying does not need coating device, can reduce cost.
In addition, when the molten resin of shaping products formed uses black, do not need to carry out black is done For the nameplate color of background color and the operation (coating etc.) of color of resin blending, can reduce cost.
And then, when forming products formed by opaque molten resins such as black, do not need design Light leak when covering back lighting.
And then, when using opaque resin as the molten resin of products formed, can use regenerated material Material reduces cost.
Claims (7)
1. synthetic resin formed product, but it is with the printing ink rete of the above individual layer of thickness 4 μ or with having the synthetic resin formed product of welding in conjunction with the back lighting of heterogeneous superficial layer or the inside layer on the surface of the synthetic resin board that print, thickness 0.1～2.0mm of the printing ink rete more than two layers more than thickness 8 μ or the inside, it is characterized in that this synthetic resin formed product is opaque or translucent, can carry out back lighting.
2. synthetic resin formed product according to claim 1 is characterized in that carrying out back lighting by forming light inlet window at above-mentioned regulation position opaque or translucent synthetic resin formed product.
3. synthetic resin formed product according to claim 1, it is characterized in that forming light inlet window at above-mentioned regulation position opaque or translucent synthetic resin formed product, the synthetic resin board that surface by this synthetic resin formed product or the inside welding engage hides the light inlet window of above-mentioned synthetic resin formed product, and pattern and the literal to the light transmission that is printed on this synthetic resin board can carry out back lighting simultaneously.
4. synthetic resin formed product according to claim 1, it is characterized in that hiding by halves by the above-mentioned synthetic resin board in claim 3 light inlet window (light a part see through) of above-mentioned synthetic resin formed product, being printed on the pattern of this synthetic resin formed product and literal becomes and carries out back lighting light tightly.
5. the manufacture method of synthetic resin formed product, be on the synthetic resin board of thickness 0.1～2.0mm, printing ink rete or the above printing ink rete that uses more than two layers of thickness 8 μ that use has the above individual layer of thickness 4 μ print, after being processed into the shape that can be seated in the mould, carry out loading in abutting connection with ground with mould inner surface, behind the matched moulds molten resin is expelled in this mould then, but obtain having the manufacture method of synthetic resin formed product of the back lighting of heterogeneous superficial layer or the inside layer, it is characterized in that in this molten resin, can using opaque or translucent, according to the transparency of this resin, light inlet window is set at above-mentioned synthetic resin formed product regulation position.
6. according to the manufacture method of the synthetic resin formed product of claim 5, when it is characterized in that above-mentioned molten resin is translucent, light inlet window is not set at above-mentioned synthetic resin formed product regulation position.
7. according to the manufacture method of claim 5 or 6 described synthetic resin formed products, it is characterized in that Punching Technology at the enterprising professional etiquette setting of above-mentioned molten resin plate shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP379319/2000 | 2000-12-13 | ||
| JP2000379319A JP3740558B2 (en) | 2000-12-13 | 2000-12-13 | Synthetic resin molded product and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1357441A true CN1357441A (en) | 2002-07-10 |
| CN1217776C CN1217776C (en) | 2005-09-07 |
Family
ID=18847714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01134698 Expired - Lifetime CN1217776C (en) | 2000-12-13 | 2001-11-13 | Synthetic resin molded article and its making process |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3740558B2 (en) |
| CN (1) | CN1217776C (en) |
| HK (1) | HK1045825B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100360300C (en) * | 2003-08-29 | 2008-01-09 | 株式会社堺谷 | Shaping processing product of synthetic resin board and its processing method |
| CN100427287C (en) * | 2004-02-12 | 2008-10-22 | 株式会社堺谷 | Synthetic resin forming product and producing method thereof |
| CN102853334A (en) * | 2012-08-01 | 2013-01-02 | 杭州广安汽车电器有限公司 | Backlight indicator used by controller and provided with correction film and manufacture method thereof |
| CN103448329A (en) * | 2012-05-31 | 2013-12-18 | 珠海格力电器股份有限公司 | Multilayer structure decoration and air conditioner room unit |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4742341B2 (en) * | 2005-11-07 | 2011-08-10 | 株式会社サカイヤ | Manufacturing method of ring-integrated display panel |
| DE102006053043A1 (en) * | 2006-11-10 | 2008-05-15 | Leopold Kostal Gmbh & Co. Kg | Operating unit for a motor vehicle |
| JP5249731B2 (en) * | 2008-12-01 | 2013-07-31 | 株式会社サカイヤ | Synthetic resin molded parts with changing design surfaces |
| JP6976917B2 (en) * | 2018-09-25 | 2021-12-08 | ダイハツ工業株式会社 | Resin molding member |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63256984A (en) * | 1987-04-15 | 1988-10-24 | サカエ理研工業株式会社 | Light transmission display body and molding thereof |
| JPH01299016A (en) * | 1988-05-26 | 1989-12-01 | Sakaiya Meihan Kk | Synthetic resin molded product and its manufacture |
| JP2969190B2 (en) * | 1992-03-25 | 1999-11-02 | サカイヤ銘版株式会社 | Synthetic resin molded product and method for producing the same |
| JPH0997026A (en) * | 1995-09-29 | 1997-04-08 | Nissha Printing Co Ltd | Display panel and its production |
-
2000
- 2000-12-13 JP JP2000379319A patent/JP3740558B2/en not_active Expired - Lifetime
-
2001
- 2001-11-13 CN CN 01134698 patent/CN1217776C/en not_active Expired - Lifetime
-
2002
- 2002-10-03 HK HK02107278.6A patent/HK1045825B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100360300C (en) * | 2003-08-29 | 2008-01-09 | 株式会社堺谷 | Shaping processing product of synthetic resin board and its processing method |
| CN100427287C (en) * | 2004-02-12 | 2008-10-22 | 株式会社堺谷 | Synthetic resin forming product and producing method thereof |
| CN103448329A (en) * | 2012-05-31 | 2013-12-18 | 珠海格力电器股份有限公司 | Multilayer structure decoration and air conditioner room unit |
| CN103448329B (en) * | 2012-05-31 | 2015-12-16 | 珠海格力电器股份有限公司 | Multilayer structure decoration and air conditioner room unit |
| CN102853334A (en) * | 2012-08-01 | 2013-01-02 | 杭州广安汽车电器有限公司 | Backlight indicator used by controller and provided with correction film and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1045825B (en) | 2006-01-06 |
| JP2002178362A (en) | 2002-06-26 |
| HK1045825A1 (en) | 2002-12-13 |
| CN1217776C (en) | 2005-09-07 |
| JP3740558B2 (en) | 2006-02-01 |
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Owner name: CO., LTD. GU Free format text: FORMER NAME OR ADDRESS: SAKAIDANI MINGBAN CO., LTD. |
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Address after: Saitama Prefecture, Japan Patentee after: Sakaidani Akita KK Address before: Saitama Prefecture, Japan Patentee before: Sakaidani Mingban Co., Ltd. |
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Granted publication date: 20050907 |