CN1351396A - Design and manufacture of low-inductance bus - Google Patents
Design and manufacture of low-inductance bus Download PDFInfo
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- CN1351396A CN1351396A CN 00126647 CN00126647A CN1351396A CN 1351396 A CN1351396 A CN 1351396A CN 00126647 CN00126647 CN 00126647 CN 00126647 A CN00126647 A CN 00126647A CN 1351396 A CN1351396 A CN 1351396A
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Abstract
A low-inductance multi-layer bus bar for the reverse converter is composed of conducting copper rod with positioning function, external insulating layer, positive copper bars, intermediate insulating layer, negative copper bars and external insulating layer, a features that insulating block is inserted between conducitng copper rod and bus bar, the adhesive semisolidified sheet is between adjacent layers, and the tracking structure for increasing tracking distance is attached to external insulating layer. It is made up through blanking, drilling, milling, punching, bending, rivetting-welding, cleaning, electroplating, stacking, and hot pressing.
Description
The present invention relates to a kind of design and manufacture method of low-inductance bus, belong to the manufacture method class of inverter auxiliary.
In, in the engineering design of big capacity IGBT inverter, the bus of rationally arranging, reduce distributed inductance and exempt from for protection IGBT element that punctured by transient overvoltage extremely important.Therefore, seek to have become one of key technology of IGBT inverter main circuit design less than the structural design and the manufacture method of 100nH low-inductance bus.Existing various low-inductance bus (Busbar) also has the following disadvantages though can satisfy the basic demand of IGBT converter main circuit structural design:
1, therefore some low-inductance bus only can satisfy the use of low pressure occasion because structural design is too simple and crude, but when operating voltage is higher than 1500VDC between busbar, are difficult to then ensure that inverter can long-time reliably working.
Though 2, class low-inductance bus compact and reasonable in design, profile is also more attractive in appearance, but the method for making these low-inductance bus is more complicated often, not only need special processing mold, and raise to close when using at high pressure and can guarantee on the IGBT element that for guaranteeing that it is installed to C, E two interpolars have sufficiently long creepage distance, often have to big change is done in the design of low-inductance bus, even reduce the basic principle of the structural design of low-inductance bus: make both shapes of positive and negative busbar and area differ bigger.Thereby cause the distributed inductance of low-inductance bus to increase, but therefore increase the difficulty of main circuit design.
Purpose of the present invention: aim to provide a kind of new low-inductance bus project organization and manufacture method, overcome the above-mentioned defective that existing low-inductance bus exists, compact conformation not only, appearance looks elegant and easy to make can satisfy the requirement of different operating voltage power supply field simultaneously again.
The foregoing invention purpose realizes by following technical proposals:
This low-inductance bus is made up of positive copper bar (2), negative copper bar (3), conduction copper column (5) and intermediate insulating layer (1) and outer insulation (4), it is characterized in that:
The multilayer stack that the outer insulation (4) that A, described this busbar will be shelved in regular turn by the conduction copper column that plays the role of positioning (5), positive copper bar (2), intermediate insulating layer (1), negative copper bar (3), outer insulation (4) and prepreg (7) form through stacked and hot pressing.
Setting up insulation chock (6) between B, described conduction copper column (5) and the positive and negative busbar; At every adjacent prepreg (7) that has been provided with bonding effect between two-layer.
Be positioned at the C of IGBT on the described outer insulation (4), the plate body in interval, E the two poles of the earth is provided with the recess or the creepage structure of convex that can increase creepage distance.
Described creepage structure is to be located at outer insulation (4) to go up the little groove (8) that mills quarter on C, the interval plate body in E the two poles of the earth, and the quantity of this little groove is advisable with 2～5, and its single groove width is less than 2mm.
Described creepage structure is to be located at outer insulation (4) to go up a creepage division board of convex (9) of setting up on C, the interval plate body in E the two poles of the earth; And can mill thereon and carve little groove (8).
The concrete manufacture method of this busbar is as follows:
1, blanking, promptly according to technique scheme, electrolysis copper coin or the aluminium sheet selecting to be suitable for come positive and negative busbar material down, come intermediate insulating layer and outer layer insulation layered material down with epoxy plate FR4; With the material semi-solid preparation sheet stock that has viscosity;
2, according to design above-mentioned each material that is used for each layer position is bored, mills, dashes and Bending Processing, both on each layer position, got out special hole, on outer insulation, mill and carve the creepage structure that increases creepage distance for conduction copper column location or riveted joint; On positive and negative busbar, go out the space of setting up the insulation chock;
3, rivet welding is about to conduction copper column and carries out the rivet welding connection with the corresponding positive and negative busbar that matches;
4, clean plating, promptly above-mentioned each layer position member is cleaned plating respectively;
5, contraposition lamination, order on promptly according to complying with down is with outer insulation, layer of prepreg, negative copper bar and insulation chock, layer of prepreg, intermediate insulating layer, layer of prepreg, positive copper bar and insulate chock, layer of prepreg, the stacked respectively coordination stack that is of outer insulation;
6, carry out hot-forming processing, promptly under 176 ℃ temperature, finish hot-press solidifying and handle;
7, the check cleaning becomes final products.
According to this inverter low-inductance bus of above-mentioned design and manufacture method making, not only simple and compact for structure, attractive in appearance, and also production technology is also very simple and clear, need not design special process mould and anchor clamps; Simultaneously can also highly effective increase C, the creepage distance of E two interpolars, not only be suitable for the operating on low voltage environment, also be very suitable for the above operating voltage environment of 1500VDC.
Below provide and implement three embodiment of the present invention, and further set forth the present invention in conjunction with the embodiments.
Accompanying drawing 1 is a kind of busbar structure when being applicable to low-pressure state;
Accompanying drawing 2 is that the AA of Fig. 1 is to cut-away view;
Accompanying drawing 3 is for being provided with the low-inductance bus structural representation of the creepage structure of recess;
Accompanying drawing 4 be the AA of accompanying drawing 3 to cut-away view:
Accompanying drawing 5 is for being provided with the low-inductance bus structural representation of the creepage structure of convex;
Accompanying drawing 6 is that the AA of accompanying drawing 5 is to cut-away view;
Among the figure: 1. intermediate insulating layer, 2. positive copper bar, 3. negative copper bar, 4. outer insulation, 5. conduction copper column, 6. insulation chock, 7. prepreg, 8. little groove, 9. creepage division board.
Embodiment 1:
The low-inductance bus that accompanying drawing 1,2 provides, its positive and negative busbar is made by electrolysis copper coin or aluminium sheet below the 2mm, intermediate insulating layer is made up of epoxy plate FR4 below the 1.5mm or flexible substrate insulating material such as (as LPET-FR), and outer insulation is made up of the epoxy plate FR4 under the 2mm; Being connected all between low-inductance bus and the IGBT element undertaken by the conduction copper column that is riveted on the positive and negative busbar; Adjacent stacking the prepreg (7) that plays cementation between two-layer every; And the while has additional insulation chock (6) again between positive and negative busbar and conduction copper column.
Above-mentioned this low-inductance bus, owing on version, take to set up the method for insulation chock, and make full use of the characteristic that prepreg has gummosis, with abundant bonding being integral of insulation chock and the busbar that will fill, thereby the current-sharing requirement of busbar and the contradiction that creepage distance will mate have been solved effectively.
Embodiment 2 (seeing accompanying drawing 3,4) and embodiment 3 (seeing accompanying drawing 5,6)
These two embodiment are actual to be two kinds of improvement to embodiment 1, and its common purpose all is in order to increase the creepage distance between C, E the two poles of the earth.Wherein the method for embodiment 2 employings is not increase any way that adds annex, promptly mills the little groove (8) that carves some on outer insulation (4), makes creepage distance appropriateness increasing between C, E the two poles of the earth by this 2-5 little groove.
3 of embodiment are the creepage division boards (9) of setting up a projection on the outer insulation (4) in C, interval, E the two poles of the earth, upward set up the little groove (8) that mills quarter more in addition by this division board (9) or at this division board (9), make the creepage distance between C, E the two poles of the earth strengthen (creepage distance that certain this scheme increases is bigger than embodiment 2).
Just because of these two kinds of improvement of having adopted accompanying drawing 3,4 and accompanying drawing 5,6, thereby make the busbar can be under the condition that does not change the specification shape, make the creepage distance of C, E two interpolars obtain respective extension, make busbar can be applicable to that operating voltage uses greater than the 1500VDC occasion.
Low-inductance bus shown in the foregoing description 1-3, its concrete manufacture method all should be by blankings---bores, mills, dashes and Bending Processing that---the riveted joint weldering---is cleaned and electroplated this seven procedure of---contraposition lamination-is hot-forming---check cleaning and make.
The order that its lamination is placed as shown in Figure 7, carry out when hot-forming outer insulation (4) should place lamination division board (10) up and down, should put lamination every paper (12) between division board (10) and the outer insulation (4) down.Hot-forming generally can being placed on the working face that corrosion resistant plate (11) makes carried out.
Claims (5)
1, a kind of low-inductance bus is made up of positive copper bar (2), negative copper bar (3), conduction copper column (5) and intermediate insulating layer (1) and outer insulation (4), it is characterized in that:
The multilayer stack that the outer insulation (4) that A, this busbar of stating will be shelved in regular turn by conduction copper column (5), positive copper bar (2), intermediate insulating layer (1), negative copper bar (3), outer insulation (4) and prepreg (7) form through stacked and hot pressing:
Setting up insulation chock (6) between B, described conduction copper column (5) and the positive and negative busbar; At every adjacent prepreg (7) that has been provided with bonding effect between two-layer.
2, a kind of low-inductance bus according to claim 1 is characterized in that being positioned on the described outer insulation (4) that the C of IGBT, the plate body in interval, E the two poles of the earth are provided with the recess or the creepage structure of convex that can increase creepage distance.
3, according to claim 1 and 2 described a kind of low-inductance bus, it is characterized in that described creepage structure is to be located at the little groove (8) that mills quarter on outer insulation (4) C, the interval plate body in E the two poles of the earth, and the quantity of this little groove is advisable with 2～5, and its single groove width is less than 2mm.
4,, it is characterized in that described creepage structure is to be located at a creepage division board of convex (9) of setting up on outer field insulating barrier (4) C, the interval plate body in E the two poles of the earth according to claim 1 and 2 described a kind of low-inductance bus; And can mill thereon and carve little groove (8).
5, a kind of low-inductance bus according to claim 1, its manufacture method is as follows: 1, blanking, promptly according to technique scheme, electrolysis copper coin or the aluminium sheet selecting to establish usefulness come positive and negative busbar material down, come intermediate insulating layer and outer layer insulation layered material down with epoxy plate FR4; With the material semi-solid preparation sheet stock that has viscosity; 2, according to design above-mentioned each material that is used for each layer position is bored, mills, dashes and Bending Processing, both on every layer position, got out special hole, on outer insulation, mill and carve the creepage structure that increases creepage distance for conduction copper column location or riveted joint; On positive and negative busbar, go out the space of setting up the insulation chock; 3, rivet welding, be about to conduction copper column and carry out the rivet welding connection: 4, clean and electroplate with the corresponding positive and negative busbar that matches, promptly above-mentioned each layer position member is cleaned plating respectively: 5, contraposition lamination, order on promptly according to complying with down, with outer insulation, layer of prepreg, negative copper bar and insulation chock, layer of prepreg, intermediate insulating layer, layer of prepreg, positive copper bar and insulation chock, layer of prepreg, the stacked respectively coordination stack that is of outer insulation: 6, carry out hot-forming processing, promptly under 176 ℃ temperature, finish hot-press solidifying and handle; 7, the check cleaning becomes final products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00126647 CN1268048C (en) | 2000-10-26 | 2000-10-26 | Design and manufacture of low-inductance bus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00126647 CN1268048C (en) | 2000-10-26 | 2000-10-26 | Design and manufacture of low-inductance bus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1351396A true CN1351396A (en) | 2002-05-29 |
| CN1268048C CN1268048C (en) | 2006-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00126647 Expired - Fee Related CN1268048C (en) | 2000-10-26 | 2000-10-26 | Design and manufacture of low-inductance bus |
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| CN (1) | CN1268048C (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100345350C (en) * | 2004-12-08 | 2007-10-24 | 中国南车集团株洲电力机车研究所 | Three-D low-sensitive bus-bar line and manufacturing method thereof |
| CN100419920C (en) * | 2006-07-06 | 2008-09-17 | 株洲南车时代电气股份有限公司 | Insulation rubber filling type multilayer composite bus row and its processing positioning method |
| EP2266175A1 (en) * | 2008-04-15 | 2010-12-29 | Idealec | Electrical supply bar assembly and method of producing such an assembly |
| CN102122537A (en) * | 2011-01-15 | 2011-07-13 | 株洲南车时代电气股份有限公司 | Composite bus bar and assembly method thereof |
| CN102683024A (en) * | 2012-04-26 | 2012-09-19 | 北京科佳信电容器研究所 | Capacitor unit |
| CN102725931A (en) * | 2010-01-27 | 2012-10-10 | 株式会社日立制作所 | Power distribution mounting component and inverter apparatus using same |
| CN102769391A (en) * | 2011-05-02 | 2012-11-07 | 日立电线株式会社 | Bus bar module and manufacturing method thereof |
| CN103456407A (en) * | 2013-09-12 | 2013-12-18 | 株洲南车时代电气股份有限公司 | Composite busbar with heat dissipation function |
| CN104319010A (en) * | 2014-09-01 | 2015-01-28 | 浙江冠华电气有限公司 | Welding method of composite copper bar conducting layer, and composite copper bar |
| CN106133908A (en) * | 2014-10-10 | 2016-11-16 | 富士电机株式会社 | Semiconductor device and busbar |
| CN107466162A (en) * | 2017-07-19 | 2017-12-12 | 胜宏科技（惠州）股份有限公司 | A kind of efficient stack bus bar board manufacturing method |
| CN107767991A (en) * | 2017-09-22 | 2018-03-06 | 稳利达电源技术有限公司 | PET busbars and its production technology |
| EP3300086A4 (en) * | 2015-05-18 | 2019-01-02 | Suncall Corporation | Method for manufacturing layered bus bar unit |
| CN110062985A (en) * | 2016-12-19 | 2019-07-26 | Abb瑞士股份有限公司 | Method for conducting the multiphase busbar connector of electric energy and manufacturing it |
| CN110417276A (en) * | 2018-04-27 | 2019-11-05 | 株洲中车时代电气股份有限公司 | A kind of busbar for capableing of fast assembling-disassembling |
-
2000
- 2000-10-26 CN CN 00126647 patent/CN1268048C/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100345350C (en) * | 2004-12-08 | 2007-10-24 | 中国南车集团株洲电力机车研究所 | Three-D low-sensitive bus-bar line and manufacturing method thereof |
| CN100419920C (en) * | 2006-07-06 | 2008-09-17 | 株洲南车时代电气股份有限公司 | Insulation rubber filling type multilayer composite bus row and its processing positioning method |
| EP2266175A1 (en) * | 2008-04-15 | 2010-12-29 | Idealec | Electrical supply bar assembly and method of producing such an assembly |
| CN102725931B (en) * | 2010-01-27 | 2015-12-09 | 株式会社日立制作所 | The DC-to-AC converter of distribution installing component and use distribution installing component |
| CN102725931A (en) * | 2010-01-27 | 2012-10-10 | 株式会社日立制作所 | Power distribution mounting component and inverter apparatus using same |
| CN102122537A (en) * | 2011-01-15 | 2011-07-13 | 株洲南车时代电气股份有限公司 | Composite bus bar and assembly method thereof |
| CN102769391A (en) * | 2011-05-02 | 2012-11-07 | 日立电线株式会社 | Bus bar module and manufacturing method thereof |
| CN102683024A (en) * | 2012-04-26 | 2012-09-19 | 北京科佳信电容器研究所 | Capacitor unit |
| CN102683024B (en) * | 2012-04-26 | 2014-07-30 | 北京科佳信电容器研究所 | Capacitor unit |
| CN103456407A (en) * | 2013-09-12 | 2013-12-18 | 株洲南车时代电气股份有限公司 | Composite busbar with heat dissipation function |
| CN104319010A (en) * | 2014-09-01 | 2015-01-28 | 浙江冠华电气有限公司 | Welding method of composite copper bar conducting layer, and composite copper bar |
| CN104319010B (en) * | 2014-09-01 | 2016-09-14 | 浙江冠华电气有限公司 | The welding method of a kind of composite copper bar conductive layer and composite copper bar |
| CN106133908A (en) * | 2014-10-10 | 2016-11-16 | 富士电机株式会社 | Semiconductor device and busbar |
| CN106133908B (en) * | 2014-10-10 | 2018-12-25 | 富士电机株式会社 | Semiconductor device and busbar |
| EP3300086A4 (en) * | 2015-05-18 | 2019-01-02 | Suncall Corporation | Method for manufacturing layered bus bar unit |
| US10907268B2 (en) | 2015-05-18 | 2021-02-02 | Suncall Corporation | Method for producing multi-layer bus bar unit |
| CN110062985A (en) * | 2016-12-19 | 2019-07-26 | Abb瑞士股份有限公司 | Method for conducting the multiphase busbar connector of electric energy and manufacturing it |
| CN107466162A (en) * | 2017-07-19 | 2017-12-12 | 胜宏科技（惠州）股份有限公司 | A kind of efficient stack bus bar board manufacturing method |
| CN107466162B (en) * | 2017-07-19 | 2019-05-14 | 胜宏科技（惠州）股份有限公司 | A kind of stack bus bar board manufacturing method |
| CN107767991A (en) * | 2017-09-22 | 2018-03-06 | 稳利达电源技术有限公司 | PET busbars and its production technology |
| CN110417276A (en) * | 2018-04-27 | 2019-11-05 | 株洲中车时代电气股份有限公司 | A kind of busbar for capableing of fast assembling-disassembling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1268048C (en) | 2006-08-02 |
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Owner name: SOUTH ZHUZHOU ELECTRIC LOCOMOTIVE INSTITUTE CO., L Free format text: FORMER NAME OR ADDRESS: ZHUZHOU ELECTRIC LOCOMOTIVE INST., MINISTRY OF RAILWAYS |
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| CP01 | Change in the name or title of a patent holder |
Address after: Tian Xindong, Zhuzhou, Hunan Patentee after: CSR Zhuzou Electric Locomotive Research Institute Co., Ltd. Address before: Tian Xindong, Zhuzhou, Hunan Patentee before: Zhuzhou Inst. of Electric Locomotive, Ministry of Railways |
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