CN1348597A

CN1348597A - Bistable micro-switch and mehtod of manufacturing the same

Info

Publication number: CN1348597A
Application number: CN99816529A
Authority: CN
Inventors: R·舍洪·明纳斯
Original assignee: Individual
Current assignee: Individual
Priority date: 1999-03-26
Filing date: 1999-03-26
Publication date: 2002-05-08
Also published as: WO2000058980A1; KR20020018655A; EP1166298A1; BR9917232A; CA2363386A1; AU3114299A

Abstract

The present invention provides a bistable switch using a shape memory alloy, and a method for manufacturing the same. More specifically, the bistable switch includes a substrate having at least one power source; a flexible sheet having a first distal end attached to the substrate; a bridge contact formed at a second and opposite distal end of the flexible sheet; and at least one heat activated element connected to a first surface of the flexible sheet and between the second distance end and the power source. During operation, current from the power source passing through the heat activated element to indirectly bend the flexible sheet and short the signal contacts on the substrate with a sustainable force.

Description

Bistable state fine motion switch and manufacture method thereof

The present invention relates generally to a kind of sensitive switch, more particularly, relate to a kind of little processing bistable switch that uses a kind of marmem.

Initial electromechanics and solid-state sensitive switch were developed in the later stage forties 20th century.From that time, electronics industry has impacted the manufacturing and the function limit that is used for producing such switch.Particularly, current dynamo-electric sensitive switch in size, cost, function, durability, and aspect the interconnection technique of high-frequency applications, present technical deficiency.Equally, solid-state switch presents a kind of extra high disconnected state to logical state impedance ratio, and for multiple use, presents in disconnected state coupling capacitance and do not wish high logical state " contact " resistance value.Therefore, electronics industry current seeking manufacturing can be littler, more reliable, durable, function is many, and the method new and innovation of the effective switch of cost.

In the circuit purposes of various current and predictions, exist needs low-cost, the microswitch device, these switching devices are configured on conventional hybrid circuit substrate or the plate, and have the bistable state ability.In addition, be used for these devices manufacture process should with conventional solid state technology compatibility, as be used for forming conductive path, contact mat and be included in the thin film deposition and the pattern forming process of the passive electric circuit element in the sort circuit.

A kind of marmem (" SMA ") is a kind of known materials that can experience plastic deformation when heating from a kind of " distortion " shape to a kind of " memory " shape.If allow the SMA material cooled then, then it partly returns its deformed shape, and can return deformed shape fully.In other words, the SMA material varies with temperature the inverible transform of experience from austenitic state to martensitic state.

Research and development company only touches the surface of how to use this controllable shape deformable material in construction of switch.For example, conventional electric mechanical switch is used as the SMA lead revolving actuator and the SMA bending tablet is become a valve.Lead is reversed or twists around its longitudinal axis, and limit the end of lead then in case motion.The sheet actuator is mechanical coupling on one or more moveable element, thereby the temperature-induced distortion of actuator applies a power, the motion that perhaps produces mechanical organ.

The problem relevant with the configuration of similar SMA switch with manufacturing technology with these and for conventional electric mechanical switch those are similar described above.Particularly, size, reliability, durability, functional, and the purposes of the constrained prior art SMA switch of cost.

When closure, use or do not use big usually, the benzene weight or too perishable of the ordinary tap of marmem and relay, can not be used for industrial purposes or batch process.Therefore, advantageously develop a kind of switch or relay, this switch or relay can be benefited from the characteristic of marmem, and can eliminate current switching technique more than list problem, marmem can be used or do not used to these technology.

The objective of the invention is to, overcome or reduce at least one or more influence of the problems referred to above.

In one embodiment, the invention provides a kind of bistable switch.This switch comprises following element: a substrate has at least one power supply; A flexible sheet has one and is fixed to on-chip first far-end; A bridge contact, be formed on one second of flexible sheet with relative far-end; And at least one thermal actuation element, be connected on the first surface of flexible sheet and between second far-end and power supply, wherein from the electric current indirect crooked flexible sheet of power supply by the thermal actuation element, and by means of a sustainable power short circuit at on-chip signalling contact.

An alternative embodiment of the invention provides a process that is used for making the bistable switch of the substrate that is used to have a holding wire contact and a power supply.Specifically, this process comprises provides a flexible sheet; At least one thermal actuation element is connected between one first far-end and power supply of flexible sheet; First far-end in flexible sheet forms a conducting bridge contact; And second of flexible sheet is installed on the substrate with relative far-end, wherein pass through the indirect crooked flexible sheet of electric current of thermal actuation element, and short circuit is at on-chip signalling contact from power supply.

Property structure of the present invention provides a kind of simple and inexpensive method of producing bistable switch, and this switch has by means of using the standard semiconductor performance number that base unit-transistorized current solid-state approach can not obtain.This structure sensitive switch new can build the user with the innovation micro-processing method can carry the very system of high voltage, electric current and frequency signal.This becomes possible, because sensitive switch is equivalent to a midget relay conceptive.In fact, this sensitive switch is that a kind of motion is to connect or to throw off the mechanical microstructure of conductive contact.In addition, this structure and method and standard silicon are handled compatible, allow the batch process under should cost.

During in the following detailed description of reading with reference to accompanying drawing, other aspects of the present invention and advantage will become obvious, in the accompanying drawings:

Fig. 1 shows the stereogram according to a kind of bistable switch of one embodiment of the invention;

Fig. 2 shows total diagrammatic layout of the invention bistable switch of Fig. 1;

Fig. 3 A and 3B-5A and 5B show the process of a bistable switch that is used for shop drawings 1;

Fig. 6 A and 6B show a bistable switch that is used for shop drawings 1 to comprise the arm portion of a cockle;

Fig. 7 A and 7B represent that the bistable switch of Fig. 6 A of installing and activating is to show first and second switch position;

Fig. 8 shows that of bistable switch of the Fig. 1 that comprises a plurality of bridges contact can select embodiment; And

Fig. 9 A and 9B show another embodiment of invention bistable switch.

Although the present invention is suitable for the various modifications of optional form, its specific embodiment is represented by the example among the figure, and is here described in detail.Yet, should be appreciated that, here the description of specific embodiment is not planned the present invention is restricted to disclosed concrete form, but opposite, plan to cover drop on as by all improvement in the spirit and scope of the present invention of appended claims book definition, equivalent, and select example.

The present invention utilizes the character of marmem by means of micro-machined nearest progress, develops a kind of high efficiency, effectively and highly reliable sensitive switch.The use of SMA in sensitive switch increases several magnitude to the performance of switch or relay.Specifically, realize this point,, provide the remarkable merit output of per unit volume because the stress and strain of shape memory effect can both be very big.Therefore, can apply SMA as the fine motion mechanical switch of actuating mechanism the stress of hundreds of megapascal (MPa); Allow strain greater than 3 percent; Be operated in than static or PZO and require under the much lower general T TL voltage; Directly power with the electrical lead wire on the chip; And stand millions of time circulations and not tired.

Marmem stands be higher than T _ATemperature under the temperature correlation phase transformation that begins, it is characterized in that alloy is heated to above temperature T _ABe lower than T _HShi Hejin recovers the ability of any original shape, and be lower than T _ATemperature under the mechanical deformation that is applied on the alloy irrelevant.In operation, be lower than temperature T when the SMA material _ATemperature T _LWhen following, SMA has a kind of specific crystal structure, and material is a toughness thus, and can more easily be deformed into arbitrary shape.In that being heated to, discusss SMA in temperature T _ATemperature T _HThe time, changes in crystal structure is so that reset into beginning and end deformed shape just to SMA, recovers original give with shape, the beginning of performance recovery stress thus.Therefore, the transformetion range of the marmem that phase transformation occurs on it is defined as at T _HWith T _ABetween.SMA optimally is being lower than T _ATemperature under between 2 and 8% the distortion, this distortion is being heated to SMA at T _AWith T _HBetween the time can recover fully.A kind of best distortion is 4%.

These memory materials are mainly with the bulk form production of the shape of silk, rod and plate.Marmem the most conventional and that obtain easily is the alloy of Nitinol (nitinol)-a kind of nickel and titanium.Yet other SMA comprises copper zinc-aluminium or copper aluminium nickel.For little variations in temperature to 18 ℃, Nitinol can pass through its phase transformation, and applies a very large power when changing the resistance of its shape applying opposing.As previous discussion, use the ordinary tap of marmem and relay generally based on the operate of the shape of deformed shape memorial alloy, it is below the phase transformation humidity range simultaneously.Deforming alloy is heated to it changes all or part of that recovery is out of shape more than the humidity range, and necessary mechanical organ is moved in the motion of alloy.

Forward accompanying drawing now to, Fig. 1 shows a kind of thermal actuation bistable mems motivation tool switch 10 according to one embodiment of the invention.The actuator arm 12 of switch 10 is by little processing, and is fixed to one and goes up on the substrate surface 14.Substrate 14 can comprise a Silicon-On-Insulator or GaAs substrate, a printed circuit board, one such as high density aluminum oxide (Al ₂O ₃) or flat board or a kind of glass material such as the fusing silica of the ceramic material of beryllium oxide (BeO) and so on.Yet, to be familiar with this professional those of ordinary skill and to should be realized that, switch of the present invention is so restriction not, and therefore can be installed on almost any rock-steady structure so that the cantilever type bistable switch of hope to be provided.

Upper surface 14 provides control contact 16a, 16b and contact 18, ground, in the corresponding control and contact, ground that are interconnected to arm 12 reliably.In addition, last substrate surface 14 provides by conducting bridge contact 22 bridge joints of arm 12 or the signalling contact 20a and the 20b of short circuit.

Signalling contact

20a and 20b can transmit or support any electric signal, comprise for example conventional simulation or numerical data or voice signal.

Top and bottom

conductive path element

24a and 24b are connected on the arm 12 by routine techniques, and two SMA element 26a and 26b are installed between the top and contact on bottom centre's beam and ground through hole of arm 12.In one embodiment, SMA element 26a and 26b are made by the Ti-Ni alloy silk with the diameter between about 25 and 125 microns.

During operation, above invention switch provides the basic circuit structure that shows among Fig. 2.Specifically, when relay 30a closure and relay 30b when disconnecting, by the electric current in the top conductive horseshoe type path be made up of

element

16a, 24a, 26a and 18, arm 12 will move upward.On the contrary, when relay 30a disconnects and relay 30b when closed, the electric current by the bottom conductive horseshoe type path be made up of

element

16b, 24b, 26b and 18 will move downward arm 12.The power that exists much smaller than at heating SMA element the time in the power that exists during the hot cooling stage.In other words, the electric installation that will describe in detail below essential electric power from any control contact 16a or 16b through

conductive path element

24a or and 24b and SMA element 26a or 26b be delivered to ground contact element 18 respectively.For the following examples, SMA element 26a or 26b preferably have the diameter between about 25 and 125 microns, and during operation can be for there being 40 to 160 milliamperes.

Below with reference to Fig. 3 A-3B to 6A-6B, the manufacture process that is used for constructing bistable switch according to the present invention is as follows.Specifically, Fig. 3 A, 4A, 5A and 6A show the lower surface of switch 10, and Fig. 3 B, 4B, 5B and 6B show the end view of phase diagram.

Fig. 3 A and 3B show a kind of stabilizing material 50 that forms pattern photoresist layer 52 that scribbles.In this specific embodiment, stabilizing material 50 is beallons made from rolled plate, has at thickness between about 12 to 50 microns and the width between about 300 to 1,200 microns.Yet can use provides the other materials of wishing elasticity or deflectable nature and thickness.For example, can use from comprising polymer resin, plastics, wood composite material, silicon, silicones, reaching the material of selecting the group of the various alloy materials such as stainless steel alloy.

In the little course of processing of a kind of the best, a kind of conventional photoetching technique is used for defining stabilizing material 50 lip-deeply wishes pattern (pattern that is illustrated by the broken lines).Specifically, form a kind of three girder constructions of photoresist 52 definition of pattern, this structure has an afterbody 54 and stem 56, contact through hole 58a and a 58c, and two slit 60a and the 60b of

definition beam

62a, 62b and 62c.A kind of conventional lithographic technique is removed by pattern photoresist 52 unprotected stabilizing materials 50, to form three girder constructions 12 that show among Fig. 4 A.

Those skilled in the art will recognize, wish that pattern can be formed by other conventional methods.For example, if wishing that switch size is big must be enough to avoid micro-processing technology, then stabilizing material 50 can form pattern by a conventional punching press or mold process.

Secondly, as showing among Fig. 4 A and the 4B, a non-conductive insulating barrier 64 is coated on the top and lower surface of structure 12.This electrical insulators is a paralene layer preferably.Can select among the embodiment, insulating material 64 can from comprise silicon dioxide, polyimides, wet oxidation thing, and the group of silicon nitride layer select.But these candidates will provide the similar structures with similar operations characteristic.Those skilled in the art will recognize, if stabilizing material 50 is non-conducting materials, then can eliminate insulating barrier 64.

On each side of coated structure 12, deposit a kind of electric conducting material such as gold, and form pattern is wished the horseshoe type path with establishment a part.More particularly, the top surface (see figure 1) of coated structure 12 provides a L shaped conductive path 24a who is connected between control through hole 58a and the top contact mat.In addition, identical electric conducting material forms ground through hole 58c.On the relative or bottom side of structure 12, as showing among Fig. 4 A, coated structure 12 provides another to be connected in the L shaped conductive path 24b that controls between contact 68b and the bottom contact mat 58b.In addition, identical materials form control contact 68a, contact 70 and bridge contact 22.Those skilled in the art will recognize, be used for

conductive path

24a and 24b,

control contact

68a and 68b, contact 70, with control through

hole

58a and 58c, top and bottom contact mat 58b, and the electric conducting material of bridge contact 22, can be from gold, copper, Polarium, nickel, silver, aluminium, reach the group of available multiple other electric conducting materials of prior art and select.

With reference to Fig. 5 A and 5B, actuator component 26a and 26b are connected to reliably on the top and lower surface of the arm 12 between each contact mat and the ground through hole 58c.If wish, a kind of adhesive material (not shown) can be used for an actuator component 26a and 26b and be connected on respective tops and the bottom arm surface.Adhesive material can be from comprising cementing material, epoxy resin, locking chip belt (lock-on-chip tape), scolder, insert material, polyimides, reaching such as button or the group of the mechanical holder pressing from both sides and select.This connection is positioned at each actuator component 26a and 26b on the middle body of the top of intermediate beam 62B and lower surface to finish conduction horseshoe type path.The NiTi SMA that actuator component 26a and 26b preferably provide with sheet, band or filate formula.For above embodiment, SMA element 26a and 26b preferably have the diameter between about 25 and 125 microns.

As previously disclosed, SMA element 26A extends after the electric current by material reaches a pre-established phase transition temperature with 26B or contacts.For this specific embodiment, phase transition process typically will occur by one of two kinds of methods.A kind of first phase change technique reduces to activate the cumulative volume of material, and as a result of, the length of marmem reduces, contact stabilization material 12.In a kind of second phase change technique, SMA stretches before it is installed on the rock-steady structure 12 and/or afterwards and is no more than 8% percentage.When phase transformation, the length of SMA reduces, and returns its original length before 12 layers of contact stabilization materials, even more, up to 8%.According to the requirement that displacement, contact force, the quantity of stem 12a is circulated, reaches manufacture process, marmem can stretch or not stretch.

The final step of wishing process comprises cockle and above structure is installed.Do not have the cockle step, can be installed to one to above structure and wish on the substrate, have reliable little processing bistable switch of a kind of cantilever design that shows among Fig. 1 with formation.Equally, switch is the short-circuit signal contact continuously, removes non-electricity and be active in to produce necessary electric current and transformation in wishing the SMA element.Therefore, this last embossing or cockle step keep a contact position with permission activity device, even also be like this after outage.Therefore this embossing or super wrinkle provide a kind of action function of biting to arm, and this holding arms remains on a given position, unless when one of the SMA element holding arms opposite location of rebounding.

With reference to Fig. 6 A and 6B, show embossing or the cockle element 80A and the 80B of hope.Use conventional punching press or colouring method can form this effect structure of biting.More particularly, a left side and the middle body cockle of right beam 62A and 62C to form undaform and be out of shape or ungulate.For those skilled in the art, when actuator component 26a and 26b change with the terminal 12a of movement arm up or down, this cockle zone 80A and 80B will produce a vitality.Equally, even outage is connected to after the source on the switch 10, cockle zone 80A and 80B also allow bridge contact 22 keep with signalling contact 20a with the 20b contact or separate.In other words, by forming cockle 80A and 80B, in case holding arms 12 locate up or down, electric current just must by suitable SMA element with respectively downward or upward holding arms 12 bend to another position.Otherwise switch 10 is always located up or down, unless it is in fact by user movement.

Be with or without the cockle element that is formed on the first and the 3rd beam 62A and the 62C, the structure of generation all must be fixed on the substrate 14, as showing among Fig. 7 A and 7B or Fig. 1.Specifically, cantilever switch 10 is connected on the substrate surface 14 by conventional adhesive bonding method.Specifically, the scolder of printed circuit board (PCB) or head tank are used for electric power being adhered to

ground contact

16a, 16b and 18 or being fixed on the substrate surface 14 of switch 10.Therefore, when actuation element 26b is heated by bottom horseshoe type conductive path, the structure of generation will be bent downwardly so that bridge contact 22 is linked with signalling contact 20a and 20b.Equally, when actuation element 26A is heated by top horseshoe type conductive path, being connected between bridge contact 22 and signalling contact 20a and the 20b will be disconnected.

An alternative embodiment of the invention comprises auxiliary contact 22 ' be placed on the top surface of terminal 12a, so that auxiliary signal contact 20a ', the 20b ' of short circuit on a multi layer substrate.For this example that shows among Fig. 8, if top SMA element 26a by the current flow heats by top horseshoe type conductive path, then structure will move upward, with bridge contact, top 22 ' link with top signal contact 20a ', 20b '.On the other hand, if actuator component 26B by current flow heats by bottom horseshoe type

conductive path

24b and 26b, then structure will move downward, so that bridge contact 22 and signalling

contact

20a and 20b are linked.For this specific embodiment, arm 12 is cockle not.Therefore, when heating corresponding SMA 26a or 26b were with the terminal 12a that moves up or down, bridge contact 22 or 22 ' only is short-

circuit signal contact

20a, 20b or 20a ', 20b ' continuously.Yet those skilled in the art will recognize, cockle can be used for keeping arm 12 and contact 20a and 20b or 20a ' and 20b ' one or other and contact.

Fig. 9 A and 9B show another embodiment of above invention switch.In this embodiment, sheet 50 forms patterns and etching or punching press and wishes arm 12 with formation, as reference Fig. 3 B described above like that, and bridge contact 22 forms (as described above) on arm end 12a.Secondly, the middle body of actuator component 60 is linked to be the loop or is fixed on the arm 12 in a position adjacent with terminal 12a, and with bridge contact 22 electrical separation.At last, the afterbody 54 of arm 12 is fixed on the substrate surface 14, and the end 62a of

actuator component

60 and 62b extend on the horizontal relative direction adjacent with the length of arm 12, is connected with a power supply 64 adjacent with same substrate surface 14.In other words, be arranged in the past on the arm 12, moved to a position leaving switch arm 12, so that power supply 64 to be provided to provide essential circuit to activate the L shaped path of conduction and the contact (see figure 1) of SMA element.

Referring now to Fig. 9 B, during operation, supply to the electric current contact SMA 60 of SMA 60, to move downward arm 12 and signalling

contact

20a and 20b and 22 short circuits of bridge contact by source 62.As above open as described in, for the power supply 62 of outage, SMA 60 will return a position that bridge contact 22 and signalling contact 20a are separated with 20b.Those skilled in the art will recognize that another SMA (not shown) can be fixed on the arm 12 in a similar manner, but on the opposition side for SMA 60, and by an equivalent current supply supplying electric current.Equally, can cockle arm 12 forming a device as working described above with reference to Fig. 7 A and 7B, and arm 12 can form the pattern that has or do not have the multiple parallel beam.For this specific embodiment, if on arm 12, do not have beam and an additional SMA element to be fixed to the opposite side of arm 12 or, then can to use single embossing or full surface cockle around its winding.

About above embodiment, those skilled in the art will recognize that arm 12 can form pattern, to form a kind of many girder constructions that must keep any SMA of hope element that have.Equally, arm 12 can form pattern, only to form the rectangular configuration that does not have beam.For similar prompting, the thickness of SMA element 26a and 26b and quantity can increase or reduce, with the arm configuration that holds hope and its necessary power of moving when heating.In addition, the quantity of the cockle that forms on flexible arm 12 will depend on shape and the functional characteristic that generates switch.

In a word, the invention provides a kind of simple and inexpensive method of producing sensitive switch and relay.New and the innovation micro-processing method of this structure sensitive switch and relay makes the user can set up the system that can transmit very high voltage, electric current, frequency signal.In addition, this invention process is handled compatibility conceptive can being designed to standard silicon, and allows device with very reasonably cost batch process.Therefore, this invention structure provides a kind of small capacity double stable state to bite the action electric mechanical switch, and this switch can activate and activate with respect to the marmem of the unique ability of the power of any prior art switching mechanism by having to be used to push the speed.In addition, because micro-machined progress, this structure can produce to have and be similar at 500-3, the length between 000 micron, at about 200-1, width between 200 and the thickness between about 25-36 micron, this is less than any competition bistable switch on today market.Those skilled in the art will recognize that these sizes can change, to obtain being used for the hope size and the functional characteristic of invention switch.

Other the interior design alterations of scope that still enter the inventive concepts that requires here will be obvious for those skilled in the art.For example, illustrative embodiment described herein is used for heating the conductive path part of SMA element to SMA element 26a and 26b to realize identical purpose.For example, the SMA element can be connected on the conducting element of separation, and perhaps they can be connected to (for example non-electric) on complete different types of heating element.

Illustrative embodiment of the present invention has more than been described.For clarity, actual all features of implementing are not described in specification.Certainly be appreciated that in the development of any such practical embodiments, must carry out the special decision of multiple enforcement realizing developer's specific purpose, as the obedience system relevant with commerce related constraint, these constraints become with enforcement.Moreover, recognize that a kind of development effort of even now may be complicated and time-consuming, but only be a routine mission for the those skilled in the art that obtain disclosure benefit.

Claims

1. process that is used for making a kind of bistable switch comprises:

A flexible sheet is provided;

Form pattern to described, to define a kind of girder construction with a stub area and tail region and a front side and a rear side;

Form first a control contact adjacent with described flexible sheet tail region;

An actuator component is connected to the described front side of described beam;

Form a conductive path in described control contact and between with one first end of the adjacent described actuator component of the described stub area of described flexible sheet;

Form one second control contact at one second end place of the described actuator component adjacent with described flexible sheet tail region;

First far-end in described flexible sheet stub area forms a bridge contact; And

The part of described flexible sheet tail region is installed on the substrate so that the described first and second control contacts are connected on the power supply of described substrate, described bridge contact adjacent with at least one signalling contact be spaced from.

2. process according to claim 1 further comprises the described girder construction of cockle, so that described bridge contact quiescent biasing, to keep its position with respect to described at least one signalling contact.

3. process according to claim 1 wherein connects and comprises that further described actuator component first and second ends are bonded in described first and second to be controlled between contact.

4. process according to claim 1 further is included in described formation pattern step and afterwards an insulating barrier is coated on the described flexible sheet.

5. process according to claim 4, wherein said insulating barrier is selected from the group of being made up of polyimides, silicon dioxide, silicon nitride, wet oxidation thing and paralene.

6. process according to claim 1, wherein said flexible sheet from comprise polymer resin, plastics, wood composite material, silicon, silicones, stainless steel, and the group of beryllium copper select.

7. process according to claim 1 wherein forms pattern and further comprises:

A mask is applied on described; And

The described mask sheet of etching is to define described multiple parallel girder construction.

8. process according to claim 7, wherein etching further comprises the described flexible sheet of etching, to define through hole in a middle body of described control and contact, ground.

9. process according to claim 1 wherein forms pattern and comprises that further punching press or the described flexible sheet of mold pressing are to define described multiple parallel girder construction.

10. process according to claim 1 wherein connects and further comprises a kind of jointing material is deposited between described actuator component and described.

11. process according to claim 10, wherein said jointing material is selected from the group of being made up of polyimides, locking chip belt (lock-on-chip tape), cementing material, scolder, epoxy resin and mechanical attachment thing.

12. process according to claim 1, wherein said actuator material are a kind of marmems.

13. process according to claim 12, wherein said marmem from NiTi, copper zinc-aluminium, and the group formed of copper aluminium nickel select.

14. process according to claim 1, wherein said conductive path, bridge contact, and the control contact by a kind of from by gold, copper, Polarium, nickel, silver, reach the material of selecting the group that aluminium forms and make.

15. process according to claim 12, wherein said marmem are wires with diameter between about 25 to 125 microns.

16. process according to claim 1 is wherein installed a kind of cantilever beam bistable switch structure of definition.

17. process according to claim 1 further comprises:

On the described rear side of described girder construction, form the assist control contact;

One second actuation element is connected on the described rear side of described beam; And

Between described assist control contact and described second actuator, forming conductive path on the described rear side of described girder construction.

18. process according to claim 17 further comprises forming at least one through hole, this through hole is electrically connected the correspondence control contact on the opposite side of described flexible pattern segments.

19. process according to claim 1, wherein substrate further comprise from by a Silicon-On-Insulator or GaAs substrate, a printed circuit board, one such as high density aluminum oxide (Al ₂O ₃) or the group formed of the flat board of the ceramic material of beryllium oxide (BeO) and so on or a kind of glass material such as the fusing silica in a kind of structure of selecting.

20. a process that is used for making the bistable switch of the substrate that is used to have a signalling contact and a power supply comprises:

A flexible sheet is provided;

At least one thermal actuation element is connected between one first far-end and power supply of described flexible sheet;

Described first far-end in described flexible sheet forms a conducting bridge contact; And

One second of described flexible sheet is installed on the substrate with relative far-end, and wherein from the electric current of power supply by described thermal actuation element crooked described flexible sheet indirectly, and short circuit is at on-chip signalling contact.

21. process according to claim 20 wherein provides flexible sheet further to be included in the described flexible sheet that is comprised by described bridge contact and described second far-end and forms at least three parallel girders.

22. process according to claim 21 comprises that further the described flexible sheet of cockle is with one first and second distance of definition between described bridge contact and power supply.

23. process according to claim 21, further be included in adjacent with the described bridge contact that is used for being connected described at least one thermal actuation element or the described flexible sheet that is spaced laterally apart with it on form a contact mat, the central beam of described contact mat and described at least three parallel girders is adjacent.

24. a bistable switch comprises:

A substrate has at least one power supply;

A flexible sheet has one and is fixed to described on-chip first far-end;

A bridge contact, be formed on one second of described flexible sheet with relative far-end; And

At least one thermal actuation element, be connected on the first surface of described flexible sheet and between described second far-end and described power supply, wherein from the electric current of power supply by described thermal actuation element crooked described flexible sheet indirectly, and by means of a sustainable power short circuit at described on-chip described signalling contact.

25. bistable switch according to claim 24, wherein said power supply is supplied with the electric current between about 40 and 160 milliamperes.

26. bistable switch according to claim 24 further comprises the cockle at a middle section place that is positioned at described flexible sheet.

27. bistable switch according to claim 26 is even described cockle also allows to keep described sustainable power after the described power supply that wherein cuts off the power supply.

28. bistable switch according to claim 24, the thickness of wherein said flexible sheet is between about 12 and 50 microns.

29. bistable switch according to claim 24, comprise that further one is connected to one second of described flexible sheet and the apparent surface goes up and the second thermal actuation element between described second far-end and second source, wherein from the electric current of power supply by described thermal actuation element crooked described flexible sheet indirectly, and by means of a sustainable power short circuit at described on-chip described signalling contact.

30. bistable switch according to claim 24 further comprises the cockle at a middle section place that is positioned at described flexible sheet.

31. bistable switch according to claim 30 is even described cockle also allows to keep described sustainable power after the described power supply that cuts off the power supply, perhaps up to activating the described second thermal actuation element.

32. a process that is used for making a kind of bistable switch comprises:

A flexible sheet is provided;

Form at least one control contact adjacent with described one first distal portions;

Form and one second of a described bridge contact adjacent with relative distal portions;

Form adjacent and a fixed contact that be spaced laterally apart with described second distal portions;

A kind of actuator material is connected between described at least one control contact and the described retaining element; And

Described first distal portions is installed on the substrate that has a power supply and signalling contact, and wherein said bridge contact is adjacent with described signalling contact and be spaced laterally apart.