CN1344908A

CN1344908A - Microelectromechanical system for measuring angular speed

Info

Publication number: CN1344908A
Application number: CN 00137735
Authority: CN
Inventors: 林清芳
Original assignee: Individual
Current assignee: Individual
Priority date: 2000-09-15
Filing date: 2000-12-23
Publication date: 2002-04-17

Abstract

A microelectromechanical system for measuring angular rate of a carrier includes an angular rate sensor unit, microelectronic circuitry, and signal processing circuitry to obtain highly accurate, sensitive, stable angular rate measurements of the carrier under dynamic environments. Wherein, the angular rate sensor unit receives dither driver signals, capacitive pickoff excitation signals, and displacement restoring signals to output angle rate signals in response to the motion of the carrier and dither motion signals; the central circuitry receives the angle rate signals in response to the motion of the carrier and dither motion signals to output angular rate signals and digital low frequency inertial element displacement signals; a digital signal processing system analyzes digital low frequency inertial element displacement signals to feed back the dither drive signals to the angular rate sensor unit.

Description

The MEMS (micro electro mechanical system) of measured angular speed

The invention relates to a kind of MEMS (micro electro mechanical system) (Microelectromechanical System, MEMS), more definite says, be a kind of MEMS (micro electro mechanical system) of measuring the carrier angular speed (Microelectromechanical System, MEMS).System of the present invention comprises the angular rate sensor unit, microelectronic circuit, and signal Processing, so that in dynamic environment, obtain high precision, and high sensitive, stable carrier angular rate measurement.

Angular rate measurement can adopt conventional gyro to obtain.Along with the expansion in angular rate sensor market, come in the past few decades, based on various measuring principles, invented many methods of obtaining angular rate sensor, and and will invent more method.For example, traditional rotating mass gyro is based on gyro principle, and existing ring laser gyro and interference optical fiber gyro are based on the SAGNAC effect.

Traditional angular rate sensor has been widely used, however their cost, and volume and power consumption make them can not be applied to many emerging commercial uses.

The meaning of MEMS is MEMS (micro electro mechanical system) (Microelectromechanical System) or small electromechanical device.The MEMS device relates to application integrated circuit, and (IntegratedCircuit, IC) technology produces the mechanical movable structure that can control.MEMS comprises microelectronics and micromechanics notion.The example of MEMS device has the printhead of ink-jet printer, opens the accelerometer of automobile safety air bag, and microrobot.

Microelectric technique is made electronic circuit on silicon chip, be a kind of very proven technique.The technology that micromachined utilizes integrated circuit industry to grow up is made small sensor and actuator on silicon chip.Except the volume-diminished of sensor several orders of magnitude, integrated circuit can be added on the same silicon chip, produces total system on a silicon chip.This device not only makes the redesign of traditional military use product, and has produced many newly, and the commerce that can not have when not having the inertial sensor of small cheapness is used.

Developed at present various MEMS angular rate sensors and satisfied demand low-cost but reliable angular rate sensor, application is from the automobile to the consumption electronic product.Single shaft MEMS angular speed sensing is the line resonance principle, and such as tuning fork, perhaps the structural modal resonance principle encircles such as vibration.Multiaxis MEMS angular rate sensor can be based on the angle resonance principle of rotational stiffness rotor, and its rotor tension spring hangs.The intrinsic symmetry of circular design allows to realize simultaneously the diaxon angular rate measurement.

Yet, design and manufacturing high precision, high sensitive, wide dynamic range, high stability MEMS angular rate sensor remains one and is rich in challenging work.

Fundamental purpose of the present invention provides a system that is used for measured angular speed, angular speed sensing unit wherein, microelectronic circuit, with combining of signal Processing and face micromachined macromolecule silicon layer and integrated circuit (IC) technology, in order to obtain high precision under dynamic environment, high sensitive, stable angular rate measurement.

Compare with existing MEMS angular rate sensor, angular rate sensor of the present invention has some monopolizing characteristics, and it is described below:

1. subtract the not number of resonance mode with the strand bolt.

2. guarantee the linearity of resonance mode with mass distribution.

3. resonance mode lock-in circuit.

4. the stability that guarantees calibration factor is regulated in displacement.

5. temperature stabilization guarantees the stability of calibration factor and biasing.

6. guarantee low mechanical damping by appropriate vacuum degree.

7. reduce to setover and the signal detection circuit of calibration factor drift.

8. identical driving comb is used for excitation and vibration detects.

9. be used for the linearizing closed loop design of calibration factor.

Another object of the present invention provides a MEMS system that is used for measured angular speed.The present invention is achieved micronucleus IMU (coremicro IMU), and it has following special performance:

1. have course attitude reference system (Attitude Heading Reference System, ARHS) the responsive module of the core of function.

2. microminiaturization (length/width/height) and in light weight.

3. high-performance and low cost.

4. low-power consumption.

5. reliability improves greatly.

Another purpose of the present invention provides a MEMS system that is used for measured angular speed.The present invention makes micronucleus IMU (coremicro IMU) be attached to a miniature combination ground omniselector, and it has following unique function:

1. volume is little, and is in light weight, low-power consumption, low cost.

2.ARHS, odometer, combined GPS chipset and solenoid valves.

3. be used for the fused junction filter that reaches the zero-speed correction of sensing data.

4. the typical case uses: automobile, rolling stock, miniature ground vehicle, robot, unmanned ground vehicle, personal navigator, and military ground vehicle.

Another purpose of the present invention provides a MEMS system that is used for measured angular speed.The present invention is able to as aircraft inertia avionic unit micronucleus IMU (coremicro IMU), and it has following unique function:

1. rate gyro

2. vertical gyro

3. directional gyro

4.ARHS

5.IMU

Inertial navigation system (Inertial Navigation System, INS)

7. full coupling GPSMEMS IMU combined system

8. full coupling GPSIMU radar altimeter combined system

9. general carrier navigation and control enclosure.

Another purpose of the present invention provides a MEMS system that is used for measured angular speed.The present invention is able to as space MEMS IMU attitude and heading reference system and the full coupling GPSMEMS of space IMU combined system micronucleus IMU (coremicro IMU), and be used for track and determine, attitude control, carrying is pointed to, and formation flight, and it has following unique function:

1. shock resistance, vibration resistance

2. high block resistance

3. high dynamic performance

4. wide serviceability temperature scope

5. high resolving power

6. compact, low-power consumption and light weight unit

7. Rou Xing hardware and software structure

Another purpose of the present invention provides a MEMS system that is used for measured angular speed.The present invention is able to as the sea INS that embeds GPS micronucleus IMU (coremicro IMU), and it has following unique function:

1. the miniature MEMS IMUARHS that has GPS to embed

Implanted control display unit (Control Display Unit, CDU)

3. spendable differential GPS (Differential GPS)

4. Rou Xing hardware and software system architecture

5. low-cost, in light weight, high reliability

Another purpose of the present invention provides a MEMS system that is used for measured angular speed.The present invention makes micronucleus IMU (coremicro IMU) be used in miniature sensing and stabilising arrangement, and it has following special performance:

1. using miniature MEMS IMU ARHS makes platform stable.

2.MEMS IMU combines with the electricapparatus design of sensing and stabilising arrangement.

3. carrier movement, vibration and other interference are stabilized platform isolates.

4. variable sensing angle is done to follow the tracks of and is realized.

5. miniature MEMS IMU is used for the miniature fire control system of Rifle.

The typical case uses: miniature antenna sensing tracking Control, and the laser beam of optical communication system is pointed to control, and with laser guide control, vehicle is controlled and guiding in the air for the pointing of the telescope control of image pickup, target following.

The present invention can be used as the military and civilian motion measurement parts that need do the communication in the motion with phased array antenna system.Concrete application comprises the pointing control system that the moving satellite of truck and radio communication receives, and the reception of direct satellite broadcasting.The development of low-cost course attitude reference system, extremely important to these systems in the popularization of commercial application field.

Fig. 1 has shown functional structure of the present invention.

Fig. 2 has shown the structure of micromachined sensor unit.

Fig. 3 has shown that the point that variable capacitance signal detects connects design.

Fig. 4 has shown the MEMS angular rate sensor after the encapsulation.

Fig. 5 illustrates MEMS face processing and manufacturing process with cross-sectional layer.

Fig. 6 has shown the central circuit block diagram.

Fig. 7 has shown the digital processing system block diagram.

The present invention will be used to select the mode of scheme to be described with it.But this does not also mean that the present invention is limited to the scheme that is described.This means that all mutation are contained in the present invention, the equivalent that modification and god of the present invention and scope can comprise.

The invention relates to a kind of MEMS (micro electro mechanical system) (Microelectromechanical System, MEMS), more definite says, be a kind of MEMS (micro electro mechanical system) of measuring the carrier angular speed (Microelectromechanical System, MEMS).

With reference to Fig. 1, system of the present invention comprises angular speed sensor unit 10, central circuit 20, with digital information processing system 30, it is made into a chip, with combining of face micromachined macromolecule silicon layer and integrated circuit (IC) technology, in order to obtain high precision under dynamic environment, high sensitive, stable angular velocity rate is measured.The present invention measure the carrier angular speed MEMS (micro electro mechanical system) (Microelectromechanical System MEMS) comprises:

1. angular speed sensor unit 10, in order to receive vibration drive signal, electric capacity detects pumping signal and displacement restoring signal, with output corresponding to carrier movement and oscillating movement signal;

2. central circuit 20, in order to receive corresponding to carrier movement and oscillating movement signal, with output angle rate signal and low frequency inertance element displacement signal;

3. digital information processing system 30, in order to analyze digital low frequency inertance element displacement signal, to feed back vibration drive signal to angular rate sensor unit 10.

The angular rate sensor unit is a micromachined sensor unit.Say on the principle, the present invention can with utilize kinetic theory, the MEMS technology of Ge Shi (CORIOLIS) effect combines.When angular speed is applied on the object of a translation motion, promptly can be observed Coriolis effect and produce coriolis force.This operation logic and structure depend on the tuning fork of using the closed loop capacitance-sensitive.

MEMS of the present invention comes measured angular speed by detecting one because little crudy of vibration departs from the signal that its plane of oscillation produces.When little crudy of vibration is subjected to one during perpendicular to its rotary action of the plane of oscillation, under the right coriolis force effect, little crudy of vibration departs from its plane of oscillation.

With reference to Fig. 2, it has illustrated the structure of little processed sensor unit.

Little processed sensor unit 10 is made up of two opposite vibrating elementss of vibrational motion.Form a pair of difference measurement, to eliminate because the perturbed force that gravitational effect and acceleration cause.Responsive quality is hung by eight semi-girders, and it also provides elastic force for vibration simultaneously.

Two vibration sensing quality are connected together by spring, and the static material around being connected in.The vibration sensing quality is driven in two opposite directions by the static comb drive motor, to keep the internal vibration of plane, limit.Oscillating movement is in the wafer plane.When imposing angular speed for the MEMS device, the coriolis force that Coriolis effect produces causes the out-of-plane vibration of responsive quality to (it is in the fork plane) at input shaft.The motion amplitude of the up-down vibration that produces is proportional to input angle speed, is in electric capacity under the responsive quality and detects plate and detect and measure.Drive the responsive quality of comb driving and do anti-phase motion mutually.Therefore also direction is opposite to the response of coriolis force for responsive quality.

Circuit detects this vertical movement by the electric charge in the Measurement of capacitor.The amplitude of oscillating movement is depended in the sensitivity of device, vibration frequency, the quality of device, and detection method.The sensitivity of device is directly proportional with the product of angular speed with component speeds.Maximization motion amplitude and vibration frequency can improve sensitivity.

For increasing Oscillation Amplitude, element moves on the resonance frequency of supporting spring.This also makes the required energy minimum of driving element.If the vertical movement meeting of resonance frequency very high (hard spring) element reduces.Typical resonance frequency is 1000 hertz to 3000 hertz.If oscillating movement is not real linear, can in element, cause error.

Determine from the electric current that a high-frequency signal (100 KHz are to 1 megahertz) flows through by measurement by the capacitance variations that the mass motion corresponding to coriolis force causes.The size of electric capacity is at the 0.5pf order of magnitude, and the size of electric charge is at the 1ff order of magnitude in the electric capacity.In order to reach the highest sensitivity, in design of the present invention, arrange electronic circuit as much as possible near the electrode that detects of element.In MEMS of the present invention, by electronic circuit and little processed sensor unit are integrated on the chip, or place electronic circuit to such an extent that be positioned as close to sensor and reach this design.Electronic circuit on the chip can detect the motion change of the dust order of magnitude.

With reference to Fig. 2, little processed sensor unit 10 comprises:

1. two responsive quality 101, it is connected in eight anchor points 102 by cantilever spring, drives by three and produces vibration to detect coriolis force.

2. eight anchor points 102, the both sides that it is distributed in two responsive quality are connected in silica-based and support responsive quality by cantilever spring.

3. big anchor pad 103, it is connected in silica-based, and is connected in the vibration of four anchor points 102 to improve and to stablize two responsive quality by cantilever spring.

4. two grapnel pads 104, it is connected in silica-based, and is connected in the vibration of four anchor points 102 to improve and to stablize two responsive quality 101 by cantilever spring.

5. three stators 105, it is connected in silica-based, and drives two responsive quality 101 by comb driver 106.

When angular speed is applied in the angular speed input shaft of little processed sensor unit, can be responsive to the capacitance signal that changes.

With reference to Fig. 3, little processed sensor cellular construction has formed six capacitors altogether.Wherein, four capacitors are formed by two responsive quality and three stators, drive comb for vibratory drive mechanism has constructed four pairs.Two capacitors are formed by two pairs of responsive quality and sensor electrode.When on the input axis of gyro angular speed being arranged, under the effect of coriolis force, a responsive quality moves to electrode, and another responsive quality is left electrode.Therefore, these two capacitors can be used and be formed a difference measurement circuit.

There are two kinds of technology to be used for making the MEMS device at present; Little processing of body and the little processing of face.MEMS manufacture method preferred for this invention is the face micro fabrication.The typical thickness of the little machine component of face is several to ten microns.The angular rate sensor that is produced by the face processing technology has very little quality.The advantage of face processing is low-cost and is easy to electronic circuit and is integrated into sensor nearby.

In the face micro fabrication, make sensor element on the surface of silicon chip.For the little processed sensor of making face, the oxidation sacrifice layer of several micron thickness is deposited on the passivation layer of a silicon chip, therein N ⁺The ion well is disperseed in advance.Then, in basic unit, carve opening to the dispersion area by two insulators.Next step, macromolecule silicon layer of deposition is filled out opening, with N on the whole sensor zone ⁺The dispersion area is set up machinery and is electrically connected.Sensitive element then is carved into unsteady macromolecule silicon layer.Next step by further photoetching, removes the oxidation sacrifice layer under the macromolecule silicon, allows the macromolecule silicon layer be suspended in basically in the air, but the while also is connected in basic unit by anchor post or the anchorage that forms on spaced point.

The little processing of face is since a silicon sheet material.In the little processing of face, silicon chip is a basic unit, and promptly workplace thereon, deposits and a plurality of different structural sheets of photoetching and sacrificial material layer.When a typical face micro fabrication process began, at surface deposition one deck expendable material, its final step in manufacture craft can be removed fully, or at surface deposition one deck structured material, it is used to construct the functional part of MEMS.This sedimentary deposit is then covered by the template of a desired shape, and it typically is transformed by the photomechanical production process, usually the exposure of photochromics and expose the development of photoresistance to the open air.Next step is not capped subsurface material that template protects and is carved and remove, and typically is converted into specified material layer by retroaction ion etching covering template.This deposition-covering-Ke removes on the structure of a plurality of interlayers of cyclic process and the sacrifice layer and can repeat repeatedly, finishes up to the MEMS angular rate sensor.The micro-machined final step of face is below removing and expendable material releasing structure material from interlayer on every side.

The little process of the most frequently used face begins from a slice and the silicon chip identical type and the grade silicon chip that are used in the microelectronics manufacturing, makes expendable material with silicon dioxide layer, uses macromolecule silicon, a kind of deposition, the silicon of weak crystal form is as structured material.Other deposition materials, silicon nitride for example, high molecular synthetic material and Lu also are used to provide insulating material, conductive material, corrosion covers and other structured materials.All these materials are widely used in the microelectronics manufacture of standard, are easy to obtain.

Because sandwich construction, sacrificial material layer, with the corrosion of material with a kind of to the insensitive PROCESS FOR TREATMENT of crystal structure, perhaps because material itself is noncrystal, the face micro fabrication makes makes arbitrary shape, integrated MEMS structure complicated and multicomponent becomes possibility, separates the deviser who emits MEMS and goes conception and make body processing technology irrealizable device of institute and the system of using.The face micro fabrication can make the deviser of processing technology and device can freely select any the have complementary structure and the material system of expendable material.This just to making the material of device and system, geometric configuration, assembling and interconnect all hard-core freedom is that MEMS is abundant and in depth be applied to the source in so many field.

The subject matter of angular rate sensor is the motion reliably that makes responsive quality.Not resembling accelerometer is a kind of passive device, and rate sensor is a kind of active sensor.All execution actions realize by electrostatic force.This power is very faint, and the motion of responsive quality is easy to be prevented from.Dust or element cleaning is improper all can to cause problem.The making of face processing device is by isolate all moving components with sacrifical oxide.The final step of manufacture craft is the removal of these oxides.In case oxide is removed, the corrosion solvent must be removed by water fully, removes water with alcohol again.Then remove alcohol with the method for dry device.If the removing of solvent is improper, viscous then takes place, stop the motion of element, make component failure.Device also is subject to squeeze the influence of film effect.When device moved in air, the motion of element can be trapped in wherein that irremovable air stops.These devices encapsulate in a vacuum.The air remover is used to encapsulate to keep the quality of vacuum.The application of vacuum can reduce the shock resistance of device.Air damping strengthens shock resistance.

Fig. 4 has shown MEMS angular rate sensor encapsulation figure of the present invention.

With reference to Fig. 5, it is one the three little process of floor height molecule silicon face.This process has the general characteristic of the little process of face of standard: 1 macromolecule silicon is as structured material, and 2 deposition oxides (PSG) are as sacrifice layer, and silicon nitride is as the electric insulation between macromolecule silicon and the basic unit.Different with the little process of most of specific side is that it is general as far as possible that this process is designed to be, and have the ability to support on a silicon chip different designs.Because this process is not optimized to make any particular device, the thickness of structural sheet and sacrifice layer selects to be suitable for most of users, and conservatively the selective interconnection design rule is to guarantee high as far as possible output.

With reference to Fig. 6, central circuit 20 comprises an oscillating movement control circuit 21 and an angle signal loop circuit 22.

With reference to Fig. 6, an oscillating movement control circuit 21 comprises:

An impedance transformation amplifier circuit 211, be connected in angular rate sensor unit 10, in order to the impedance of oscillating movement signal from very high level, greater than 100 megohms, be converted to Low ESR, less than 100 ohm, to obtain two vibration displacement signals, it is the ac voltage signal of displacement between expression inertance element and the anchor comb;

One first amplifier and adder circuit 212, be connected in impedance transformation amplifier circuit 211, two vibration displacement signals are amplified more than ten times, to improve sensitivity, by the signal subtraction that the signal of central anchor comb and next door anchor are combed, in conjunction with two vibration displacement signals, to form the vibration displacement differential wave;

One first circuit of high pass filter 213 is connected in first amplifier and adder circuit 211, to remove residual oscillation drive signal and noise from the vibration displacement differential wave, produces the vibration displacement differential wave after filtering;

A demodulator circuit 214, be connected in electric bandpass filter circuit 213, detect pumping signal as phase reference signal to receive electric capacity from oscillator, from the first Hi-pass filter receiving filter vibration displacement differential wave, and extract the inertance element displacement signal of the interior mutually part of the vibration displacement differential wave after filtering in order to the generation known phase;

One first low-pass filter 215 is connected in demodulator circuit 214, to remove high frequency noise from inertance element displacement signal input, forms bandwidth less than 3000 hertz low frequency inertance element displacement signal;

An amplifier 216 is connected in first low-pass filter 215, in order to amplify the low frequency inertance element displacement signal after filtering;

An analog-digital converter 217 is connected in amplifier 216, is changed in order to simulating signal low frequency inertance element displacement signal, produces the digitizing low frequency inertance element displacement signal as digital sampled signal;

With reference to Fig. 6, angle rate signal loop circuit 22 comprises:

One second circuit of high pass filter 221 is connected in angular rate sensor unit 10, and in order to remove the low-frequency noise of angle rate signal, it is the voltage signal that comes from the angular rate sensor unit, so that form the angle rate signal after filtering;

A voltage amplifier circuit 222 is connected in second circuit of high pass filter 221, arrives at least 1000 millivolts degree in order to the angle rate signal that amplifies after filtering, to form the angle rate signal after amplifying;

Amplification and adder circuit 223 are connected in voltage amplifier circuit 222, in order to extract the difference of the angle rate signal after amplifying, to produce differential angle rate signal;

A detuner 224 is connected in and amplifies and adder circuit 223, in order to from differential angle rate signal with from the next signal of oscillator, calculates the amplitude of interior differential angle rate signal mutually;

A low-pass filter 225 is connected in detuner 224, in order to remove the high frequency noise of the range signal of interior differential angle rate signal mutually, to form angle rate signal output.

An integrator 226 is connected in low-pass filter, in order to the angular integral rate signal, to form no inclined to one side displacement restoring signal.

A driving amplifier 227 is connected in integrator 226, in order to amplify no inclined to one side displacement restoring signal, to form the drive signal of giving angular rate sensor unit 10.

With reference to Fig. 7, digital information processing system 30 comprises:

A discrete fast Fourier transformation (Fast Fourier Transform, FFT) module 301, receive digitized low frequency inertance element displacement signal from the analog-digital converter of oscillating movement control circuit 21, to form input inertance element displacement signal amplitude versus frequency characte data.

Frequency and amplitude data storage array element 302, reception amplitude and frequency spectrum data are to form an amplitude and frequency spectrum data battle array.

A maximal value detects logic module 303, and processing amplitude and frequency spectrum data battle array have the frequency of amplitude peak to select those in the local frequency spectrum from processing amplitude and frequency spectrum data battle array.

A Q value is analyzed and selection logic module 304, carries out the analysis of Q value when the frequency of selecting, and selects frequency and amplitude by the ratio of calculating amplitude and area.The scope of reference area is got between peaked positive and negative 1/2nd each maximum frequency point.

A phaselocked loop 305 as a very narrow bandpass filter, to repel the noise of institute's selected frequency, reaches the vibration drive signal that produces the selection frequency.

A digital analog converter 306 is handled selected amplitude, has the vibration drive signal of correct amplitude with formation.

An amplifier 307, for the angular rate sensor unit produces and the amplification vibration drive signal, it is based on the vibration drive signal with correct frequency and amplitude.

Claims

1. a MEMS (micro electro mechanical system) of measuring the carrier angular speed comprises:

(1) one angular speed sensor unit, in order to receive vibration drive signal, electric capacity detects pumping signal and displacement restoring signal, with the signal of output corresponding to described carrier movement and oscillating movement;

(2) one central circuit, described in order to receive corresponding to described motion of described carrier and described oscillating movement signal, with output angle rate signal and low frequency inertance element displacement signal;

(3) one digital information processing systems in order to analyze described digital low frequency inertance element displacement signal, arrive described angular rate sensor unit with the feedback vibration drive signal.

2. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 1, wherein said angular rate sensor unit further comprises:

A. two responsive quality, it is connected in eight anchor points by cantilever spring, drives by three and produces vibration to detect coriolis force;

B. eight anchor points, the both sides that it is distributed in described two responsive quality are connected in silica-based and support described two responsive quality by described cantilever spring;

C. big anchor pad, it is connected in described silica-based, and is connected in described four anchor points by described cantilever spring, with the described vibration that improves and stablize described two responsive quality;

D. two grapnel pads, it is connected in described silica-based, and is connected in described four anchor points by described cantilever spring, with the vibration that improves and stablize described two responsive quality;

E. three stators, it is connected in described silica-based, and by described two the responsive quality of described comb driver drives.

3. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 1, wherein said central circuit comprise an oscillating movement control circuit and an angle signal loop circuit.

4. as claimed in claim 2 one measures the MEMS (micro electro mechanical system) of carrier angular speed, and wherein said central circuit comprises an oscillating movement control circuit and an angle signal loop circuit.

5. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 3, wherein said oscillating movement control circuit comprises:

One impedance transformation amplifier circuit, be connected in described angular rate sensor unit, in order to the impedance of described oscillating movement signal from very high level, greater than 100 megohms, be converted to Low ESR, less than 100 ohm, to obtain two vibration displacement signals, it is the ac voltage signal of described displacement between described inertance element of expression and the described anchor comb;

One first amplifier and adder circuit, be connected in described impedance transformation amplifier circuit, described two vibration displacement signals are amplified more than ten times, to improve described sensitivity, by the signal subtraction that the signal of central anchor comb and next door anchor are combed, in conjunction with described two vibration displacement signals, to form the vibration displacement differential wave;

One first circuit of high pass filter is connected in described first amplifier and adder circuit, to remove residual vibration signal and noise from described vibration displacement differential wave, produces the vibration displacement differential wave after filtering;

One demodulator circuit, be connected in described circuit of high pass filter, detect pumping signal as phase reference signal to receive described electric capacity from oscillator, receive described wave filter vibration displacement differential wave from described first Hi-pass filter, and extract vibration displacement differential wave after the described filtration described mutually in part, in order to produce the inertance element displacement signal of known phase;

One first low-pass filter connects described demodulator circuit, to remove high frequency noise from the input of described inertance element displacement signal, forms bandwidth less than 3000 hertz low frequency inertance element displacement signal;

One amplifier is connected in described first low-pass filter, in order to amplify the low frequency inertance element displacement signal after the described filtration;

One analog-digital converter is connected in described amplifier, in order to described simulating signal low frequency inertance element displacement signal is changed, produces the digitizing low frequency inertance element displacement signal as digital sampled signal.

6. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 4, wherein said oscillating movement control circuit comprises:

One first circuit of high pass filter is connected in described first amplifier and adder circuit, to remove residual oscillation drive signal and noise from described vibration displacement differential wave, produces the vibration displacement differential wave after filtering;

One amplifier is connected in described first low-pass filter, in order to amplify the low frequency inertance element displacement signal after institute's art is filtered;

One analog-digital converter is connected in described amplifier, in order to described simulating signal low frequency inertance element displacement signal is changed, produces the digitizing low frequency inertance element displacement signal as digital sampled signal;

7. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 5, wherein said angle rate signal loop circuit comprises:

One second circuit of high pass filter is connected in described angular rate sensor unit, and in order to remove the low-frequency noise of described angle rate signal, it is the voltage signal that comes from described angular rate sensor unit, so that form the angle rate signal after filtering;

One voltage amplifier circuit is connected in described second circuit of high pass filter, in order to amplify angle rate signal after the described filtration at least 1000 millivolts degree, to form the angle rate signal after amplifying;

One amplifies and adder circuit, is connected in described voltage amplifier circuit, in order to extract the described difference of the described angle rate signal after amplifying, to produce differential angle rate signal;

One detuner is connected in described amplification and adder circuit, in order to from described differential angle rate signal and the described reference signal of coming from described oscillator, extracts the described described amplitude of interior differential angle rate signal mutually;

One low-pass filter is connected in described detuner, in order to remove the described described high frequency noise of the range signal of interior differential angle rate signal mutually, to form angle rate signal output.

One integrator is connected in described low-pass filter, in order to the described angle rate signal of integration, to form no inclined to one side displacement restoring signal.

One driving amplifier connects the integrator that is set forth in, in order to amplify described no inclined to one side displacement restoring signal, to form the drive signal of giving described angular rate sensor unit.

8. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 6, wherein said angle rate signal loop circuit comprises:

One low-pass filter is connected in described detuner, in order to remove the described described high frequency noise of the range signal of interior differential angle rate signal mutually, to form angle rate signal output;

One integrator is connected in described low-pass filter, in order to the described angle rate signal of integration, to form no inclined to one side displacement restoring signal;

One driving amplifier connects described integrator, in order to amplify described no inclined to one side displacement restoring signal, to form the drive signal of giving described angular rate sensor unit.

9. the MEMS (micro electro mechanical system) of described measurement carrier angular speed as claimed in claim 4, wherein said angle rate signal loop circuit comprises:

One detuner is connected in described amplification and adder circuit, in order to from described differential angle rate signal with from the described reference signal of the described device that shakes, extract described mutually in the described amplitude of differential angle rate signal;

10. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 3, wherein said angle rate signal loop circuit comprises:

11. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 5, wherein said digital information processing system comprises:

One discrete fast Fourier transformation (Fast Fourier Transform, FFT) module, receive described digitized low frequency inertance element displacement signal from the described analog-digital converter of described oscillating movement control circuit, to form the described amplitude versus frequency characte data of described input inertance element displacement signal;

One frequency and amplitude data storage array element receive described amplitude and frequency spectrum data, to form an amplitude and frequency spectrum data battle array;

One maximal value detects logic module, handles described amplitude and frequency spectrum data battle array, to select those to have the frequency of described amplitude peak described in described amplitude and the frequency spectrum data battle array the local wavelength coverage from handling;

Logic module is analyzed and selected to one Q value, carries out the analysis of Q value when the described frequency of selecting, and by calculating the ratio selection frequency and the amplitude of described amplitude and area, the scope of reference area is got between peaked positive and negative two minutes one each maximum frequency point;

One phaselocked loop as a very narrow bandpass filter, to repel the noise of described institute selected frequency, reaches the vibration drive signal that produces described selection frequency;

One digital analog converter is handled described selected amplitude, has the vibration drive signal of correct amplitude with formation;

One amplifier is that described angular rate sensor produces and amplifies vibration drive signal, and it is based on the described vibration drive signal with described institute's selected frequency and correct amplitude.

12. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 6, wherein said digital information processing system comprises:

Logic module is analyzed and selected to one Q value, carries out the analysis of Q value when the described frequency of selecting, and by calculating the ratio selection frequency and the amplitude of described amplitude and area, the scope of reference area is got between peaked positive and negative 1/2nd each maximum frequency point;

One amplifier is that described angular rate sensor unit produces and amplifies vibration drive signal, and it is based on the described vibration drive signal with described institute's selected frequency and correct amplitude.

13. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 7, wherein said digital information processing system comprises:

One maximal value detects logic module, handles described amplitude and frequency spectrum data battle array, to select those to have the frequency of described amplitude peak described in described amplitude and the frequency spectrum battle array the local wavelength coverage from handling;

Logic module is analyzed and selected to one Q value, carries out the analysis of Q value when the described frequency of selecting, and by calculating the ratio selection frequency and the amplitude of described amplitude and area, the scope of reference area is between each maximum frequency point the most peaked positive and negative 1/2nd;

14. the MEMS (micro electro mechanical system) of measurement carrier angular speed as claimed in claim 8, wherein said digital information processing system comprises:

Logic module is analyzed and selected to one Q value, carries out the analysis of Q value when the described frequency of selecting, and selects frequency and amplitude by the ratio that calculates described amplitude and area, and the model commentaries on classics of reference area is enclosed each maximum frequency point is got between peaked positive and negative 1/2nd;