CN1337296A - Non-corrosive solder for soldering stainless iron and aluminium - Google Patents
Non-corrosive solder for soldering stainless iron and aluminium Download PDFInfo
- Publication number
- CN1337296A CN1337296A CN 01127835 CN01127835A CN1337296A CN 1337296 A CN1337296 A CN 1337296A CN 01127835 CN01127835 CN 01127835 CN 01127835 A CN01127835 A CN 01127835A CN 1337296 A CN1337296 A CN 1337296A
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- aluminium
- fluoride
- stainless iron
- brazing flux
- eutectic
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Abstract
The present invention relates to a brazing flux for brazing metal, its composition includes (wt%) KAlF4+K3AlF6 cocrystal body 95.0-97.5, zinc fluoride 1.5-4.0, copper fluoride 0.2-0.5, tin fluoride 0.6-1.5 and cadmium fluoride 0.1-0.5. Said brazing flux is used for brazing stainless iron-aluminium.
Description
Technical field
The present invention relates to a kind of solder bonding metal brazing flux, particularly a kind of different metal solder without corrosive brazing flux.
Background technology
Gong Ying stainless steel-aluminium soldering in the market all is ptfe aluminum potassium+potassium hexafluoroaluminate (KAlF with brazing flux
4+K
3AlF
6) eutectic, it is successful being used for stainless steel-aluminium composite brazing, the soldering qualification rate is greater than 99.9%.But this brazing flux is unsuitable for the welding of stainless iron-aluminium.To use potassium fluoroaluminate eutectic brazing flux, silicon-aluminium eutectic solder to be example, the hot strength of the stainless iron-aluminium of its welding is lower.The soldering qualification rate is very low, has only about 60%, can not be used for the suitability for industrialized production of the sector.
Summary of the invention
The purpose of this invention is to provide a kind of non-corrosive solder for soldering stainless iron and aluminium.
Stainless iron-aluminium soldering of the present invention in weight percent, comprises following component with brazing flux: ptfe aluminum potassium+potassium hexafluoroaluminate (KAlF
4+K
3AlF
6) eutectic 95.0~97.5, zinc fluoride 1.5~4.0, copper fluoride 0.2~0.5, tin fluoride 0.6~1.5.
Also comprise cadmium fluoride 0.1~0.5.
By mixing, ball milling to 200 purpose powder promptly can be made into stainless iron-aluminium soldering brazing flux of the present invention with above component.During welding, these add element and are cemented out and form alloy by aluminium, iron.This displacement, alloying process " liquefaction " surface of welding work pieces, improved the bond strength of solder and workpiece.
According to the GB11363-89 detection method, recording and drawing Shen intensity with the limit of potassium fluoroaluminate eutectic welding stainless iron-aluminium is 25N/mm
2Be up to 48N/mm with stainless iron of the present invention-aluminium pricker with the ultimate tensile strength that brazing flux without corrosion welds stainless iron-aluminium
2
Under the same process condition, use is with a kind of solder silicon-aluminium eutectic thing, use potassium fluoroaluminate eutectic brazing flux and non-corrosive solder for soldering stainless iron and aluminium weld diameter of the present invention to do contrast (the soldering sample number is 350) as stainless iron-aluminium-stainless steel tableware of 200mm, by weld strength and composite bed stability experiment, find that product percent of pass differs greatly.Use potassium fluoroaluminate eutectic brazing flux, product percent of pass is about 60%, uses stainless iron-aluminium soldering brazing flux of the present invention, and product percent of pass is greater than 99%.
Embodiment one
Percentage is got potassium fluoroaluminate eutectic 95.0%, zinc fluoride 3.00%, copper fluoride 0.5%, tin fluoride 1.5% by weight, mixes the back and is milled to 200 orders at the ball mill endosphere.Recording the limit, to draw Shen intensity be 29N/mm
2
Embodiment two
With embodiment one.Get potassium fluoroaluminate eutectic 95.0%, zinc fluoride 4.0%, copper fluoride 0.2%, tin fluoride 0.8%.Recording ultimate tensile strength is 32N/mm
2
Embodiment three
With embodiment one.Get potassium fluoroaluminate eutectic 97.5%, zinc fluoride 1.2%, copper fluoride 0.4%, tin fluoride 0.6%, cadmium fluoride 0.3%.Recording the limit, to draw Shen intensity be 48N/mm
2
Claims (2)
1. stainless iron-aluminium soldering brazing flux is characterized in that in weight percent, comprises ptfe aluminum potassium+potassium hexafluoroaluminate (KAlF
4+K
3AlF
6) eutectic 95.0~97.5, zinc fluoride 1.5~4.0, copper fluoride 0.2~0.5, tin fluoride 0.6~1.5.
2. stainless iron-aluminium soldering brazing flux according to claim 1 is characterized in that also comprising cadmium fluoride 0.1~0.5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011278358A CN1141200C (en) | 2001-09-10 | 2001-09-10 | Non-corrosive solder for soldering stainless iron and aluminium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011278358A CN1141200C (en) | 2001-09-10 | 2001-09-10 | Non-corrosive solder for soldering stainless iron and aluminium |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1337296A true CN1337296A (en) | 2002-02-27 |
CN1141200C CN1141200C (en) | 2004-03-10 |
Family
ID=4667745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011278358A Expired - Fee Related CN1141200C (en) | 2001-09-10 | 2001-09-10 | Non-corrosive solder for soldering stainless iron and aluminium |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1141200C (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1297368C (en) * | 2004-12-29 | 2007-01-31 | 广州有色金属研究院 | Non-corrosive solder for stainless iron and aluminium high efficiency induction pressure blaze welding |
CN100457374C (en) * | 2003-06-25 | 2009-02-04 | 贝洱两合公司 | Fluxing agent for soldering metal components |
CN100457347C (en) * | 2003-04-08 | 2009-02-04 | 住友轻金属工业株式会社 | Brazing method for aluminium alloy material containing Mg |
CN100462187C (en) * | 2005-06-03 | 2009-02-18 | 厦门灿坤实业股份有限公司 | Hard soldering powder for aluminium soldering in air furnace |
CN100463764C (en) * | 2006-01-19 | 2009-02-25 | 李昕 | Not corrosive soldering flux in use for high frequency induced pressure braze welding |
CN100496868C (en) * | 2007-09-21 | 2009-06-10 | 江苏科技大学 | Novel non-corrosion fluoride solder and preparation method |
CN103603002A (en) * | 2013-11-14 | 2014-02-26 | 北京航空航天大学 | Surface film removing agent capable of realizing zero-defect direct-current positive polarity welding of 6XXX-series aluminum alloy |
-
2001
- 2001-09-10 CN CNB011278358A patent/CN1141200C/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100457347C (en) * | 2003-04-08 | 2009-02-04 | 住友轻金属工业株式会社 | Brazing method for aluminium alloy material containing Mg |
CN100457374C (en) * | 2003-06-25 | 2009-02-04 | 贝洱两合公司 | Fluxing agent for soldering metal components |
CN1297368C (en) * | 2004-12-29 | 2007-01-31 | 广州有色金属研究院 | Non-corrosive solder for stainless iron and aluminium high efficiency induction pressure blaze welding |
CN100462187C (en) * | 2005-06-03 | 2009-02-18 | 厦门灿坤实业股份有限公司 | Hard soldering powder for aluminium soldering in air furnace |
CN100463764C (en) * | 2006-01-19 | 2009-02-25 | 李昕 | Not corrosive soldering flux in use for high frequency induced pressure braze welding |
CN100496868C (en) * | 2007-09-21 | 2009-06-10 | 江苏科技大学 | Novel non-corrosion fluoride solder and preparation method |
CN103603002A (en) * | 2013-11-14 | 2014-02-26 | 北京航空航天大学 | Surface film removing agent capable of realizing zero-defect direct-current positive polarity welding of 6XXX-series aluminum alloy |
Also Published As
Publication number | Publication date |
---|---|
CN1141200C (en) | 2004-03-10 |
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C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040310 Termination date: 20100910 |