CN1330376A

CN1330376A - Microswitch

Info

Publication number: CN1330376A
Application number: CN 01123287
Authority: CN
Inventors: 上野展明; 中田大之
Original assignee: Omron Corp
Current assignee: Omron Corp
Priority date: 2000-05-31
Filing date: 2001-05-31
Publication date: 2002-01-09
Anticipated expiration: 2021-05-31
Also published as: HK1041980A1; CN1218337C

Abstract

To reduce man hour of wiring and connection and aim at space saving in a micro switch to which a diode is connected.Into concave parts 14, 15 formed in a common terminal2 and terminal fittings 8, a lead terminal 13a of the diode 13 is press-fitted, and by putting a notch or crushing in the vicinity of concave parts 14, 15 and by calking, the diode 13 is made to be built in a micro switch 1.

Description

Microswitch

Technical field

The present invention relates to snap-type ground and carry out the microswitch that contact switches.

Background technology

, in order to prevent to vibrate noise that causes etc., often diode is connected on the microswitch, this diode is to be welded on the circuit substrate with soft soldering method all the time, is connected with lead between microswitch and the circuit substrate that diode is installed.

In this prior art example, need diode be welded on the circuit substrate with soft soldering method, and between microswitch and circuit substrate, must make a circulation to connect up, therefore with long lead, exist wiring and to be connected required number in man-hour many, and the difficult point that increases of wiring space.

Summary of the invention

The present invention is conceived to these difficult points and develops, purpose be for the wiring that reduces the microswitch that is connected with diode be connected required number in man-hour, and save the space.

In order to achieve the above object, of the present invention being constructed as follows.

That is, microswitch of the present invention, interior dress diode simultaneously, is pressed into the terminal of described diode on the circuit terminal of this microswitch and couples together in the formed recess.

Here, so-called circuit terminal also comprises the part of the circuit end that becomes the terminal of microswitch inside part etc. except the common terminal of microswitch, Chang Kaiduan or normally closed terminal.And recess is so long as cave in to become diode terminal to be pressed into and get final product, and grooving shape or other shape also can cave in.

According to the present invention, owing to will be loaded on microswitch in the diode, so, needn't resemble and with soft soldering method diode is welded on the circuit substrate the prior art example, simultaneously, not need circuitous wiring, and, because the terminal of diode is pressed into and is connected in the recess that forms on the circuit terminal of microswitch, so, being connected of diode and microswitch can be finished simply.

In the preferred embodiment of the present invention, near the described circuit terminal the described recess, form otch, described recess is adjacent to along the terminal distortion of described diode.

According to the present invention, this recess is close to along the terminal shape distortion that is pressed in the recess, promptly carry out ca(u)lk, so, can guarantee the reliability that connects.

In other preferred embodiment of the present invention, near the described circuit terminal the described recess of conquassation makes described recess be adjacent to along the terminal distortion of described diode.

According to the present invention, make recess be out of shape and be close to along being pressed into the terminal shape in this recess, promptly carry out ca(u)lk, so, can guarantee the reliability that connects.

Description of drawings

Figure 1A, Figure 1B, Fig. 1 C are the figure of expression microswitch outward appearance of the present invention;

Fig. 2 A, Fig. 2 B are the vertical section front elevation of microswitch of expression Figure 1A, Figure 1B, Fig. 1 C and the figure of terminal part;

Fig. 3 A, Fig. 3 B are the figure of the A details partly of expression Figure 1A, Figure 1B, Fig. 1 C;

Fig. 4 is the figure of the ca(u)lk processing after the expression diode is pressed into;

Fig. 5 is the figure of the ca(u)lk processing of other embodiment of expression the present invention;

Fig. 6 is the figure that describes the ca(u)lk processing of Fig. 5 in detail.

The specific embodiment

Describe embodiments of the invention in detail below by accompanying drawing.

Figure 1A, Figure 1B, Fig. 1 C are the figure of the microswitch outward appearance of expression one embodiment of the invention, Figure 1A is plane; Figure 1B is front view; Fig. 1 C is side view, and Fig. 2 A, Fig. 2 B are that it is vertical disconnected The side view of face front view and terminal part thereof, Fig. 3 A, Fig. 3 B are the A of presentation graphs 2A, Fig. 2 B The figure of the details of part.

This microswitch 1 is the closed type both-end that common terminal 2 and normally closed terminal 3 are dashed forward and established from the shell side Sub-switch, each

terminal

2,3 make the connector type microswitch of connector (connector) shape.

This microswitch 1 comprises main body cover 5 that quick action type switching mechanism 4 is housed and chimericly is connected in this Resinous lid 6 on the main body cover 5 is located at shell 5, action button above 6 by pressing operation 7, switch the contact of described switching mechanism 4 and make its action. The below of action button 7 is provided with installing hole 21, be used for this microswitch 1 is installed in the regulation position.

Described switching mechanism 4 is shown in Fig. 2 A, Fig. 2 B, by being equipped on the described main body cover 5 But but above-mentioned

terminal

2 and 3, common terminal part 8, contact switch with moving plate 9, make this moving plate about in the of 9 QA flexural spring sheet 10 consists of, but the base end part of described moving plate 9 through V-arrangement buckling groove 11 and Fastening is supported on the fastening piece 8a that is located on the terminal part 8, the cardinal extremity warp of described flexural spring sheet 10 V-arrangement buckling groove 12 fastens on another fastening piece 8b that is supported on the 3rd fixed terminal 8, and is simultaneously, curved But the free end of bent spring leaf 10 fastens and is supported on the free end side position of described moving plate 9.

But described action button 7 easy on and off connect slidably and are installed on shell 5 top, so that from But the top contacts and acts on the pars intermedia of described moving plate 9.

The microswitch of prior art, although its common terminal 2 and terminal part 8 form, But, the microswitch of this embodiment, in diode 13 is housed, with the noise that prevents from causing because of vibration, As following, consist of and just this diode 13 can be contained in common terminal 2 and as the terminal of circuit terminal Between the part 8.

That is, common terminal 2 and terminal part 8 near about central authorities of the length direction of main body cover 5, Relatively respectively crooked downwards, two lead terminal 13a of diode 13 are pressed into respectively and remain on this Among bend 2a, the 8c, simultaneously, also be formed with respectively the

recess

14,15 that is electrically connected usefulness, recessed at this In the

section

14,15, be formed with respectively the tapered guide surface for the lead terminal 13a of guiding diode 13 14a, recess 14,15 make roughly Y word groove shape.

Like this, in

recess

14,15, owing to be formed with tapered guide surface 14a, so, diode 13 Lead terminal 13a successfully be pressed into along spigot surface 14a, thereby can automatically be pressed into.

And, as shown in profile Fig. 3 B that the hatching X-X ' from Fig. 3 A sees, outside the main body In the shell 5, be formed with the limiter that is pressed into the position 16 that limits lead terminal 13a, so that be pressed into two utmost points Managed 13 o'clock, the glass tube part of having enclosed the element of diode 13 can not contact main body cover 5 and breakage.

And, among this embodiment, for improve the recess 14 that is pressed into common terminal 2 and terminal part 8, The contact reliability of 15 diode 13, be pressed into the lead terminal 13a of diode 13 after, such as Fig. 4 institute Show, near the

recess

14,15 of common terminal 2 and terminal part 8, with the sharp special tool of front end Tool 17 forms otch 18, makes recess 14, the 15 shape distortion along the lead terminal 13a of diode 13 Be close to, thereby improve ca(u)lk intensity. Like this, even vibrated and impact, also can guarantee on electric Really be communicated with.

Microswitch 1 with above-mentioned structure shown in Fig. 2 A, Fig. 2 B, is not subjected in action button 7 Under the normality of External Force Acting, but the elastic restoring force of flexural spring sheet 10 with the free end side of moving plate 9 to Top pushing, make its displacement, but make travelling contact 9a and normally closed terminal 3 above the free end of moving plate 9 Normally closed contact 3a contact and maintain, make common terminal 2 and normally closed terminal 3 become conducting state. So After, action button 7 is carried out push operation, but with the pars intermedia bending displacement downwards of moving plate 9 to establishing When quantitatively above, but the elastic restoring force of flexural spring sheet 10 pushes, makes its position downwards with moving plate 9 Move, the instant reversal back contact disconnects. In addition, in case remove being pressed into of action button 7, but moving plate 9 The pars intermedia involution is risen, so but the elastic restoring force of flexural spring sheet 10 with moving plate 9 push upward, Make its displacement, return to original state after the counter-rotating.

The microswitch 1 that has said structure by following operation manufacturing.

At first, but moving plate 9 and flexural spring sheet 10 are installed on the terminal part 8, and the main body of packing into In the shell 5, then, common terminal 2 is packed into behind the main body cover 5, diode 13 is pressed into and protects Be held between common terminal 2 and the terminal part 8, use as described above specific purpose tool 17 ca(u)lks, will be normal Closed end 3 is packed into behind the main body cover 5, and update button 7 will cover the 6 chimeric main body covers 5 that are connected to Finish after upper.

In addition, other embodiment of the present invention, as shown in Figure 5, also can be by the more blunt ca(u)lk worker of front end Tool 19 near the

recess

14,15 of common terminal 2 and terminal part 8, forms crushed portion 20, makes Recess 14,15 is close to along the shape distortion of the lead terminal 13a of diode 13, to improve ca(u)lk intensity.

Illustrate in greater detail as followsly, as shown in Figure 6, caulking tool 19 is close to from inserting diode The recess 14 of

terminal

13a, 15 is the position of 0.2mm to 0.3mm, towards with

recess

14,15 The direction that the groove direction is identical is pressed caulking tool 19. Then, terminal part 8 clogs recess 14,15 also Distortion is fixed diode terminal 13a.

Here, if the position that caulking tool is close to is more much bigger than 0.3mm apart from

recess

14,15 distance, Then whole terminal part 8 is because of the big large deformation of pressing of caulking tool. And if the position that caulking tool is close to, When also near than 0.2mm apart from

recess

14,15 distance, then be subjected to pressing 8 distortion of rear terminal part, plug Live recess 14,15 o'clock thickness deficiency, diode terminal 13a can not fix well.

In order to prevent this two kinds of unfavorable conditions, the position that caulking tool is close to is very important.

In above-described embodiment, although be for the microswitch that only has the closed type fixed terminal,, Also can be applicable to three terminal microswitches with closed type fixed terminal and open type fixed terminal.

And, in above-described embodiment, although be microswitch be used to the terminal with connector shape, But the present invention is also applicable to the microswitch of the lead terminal with solder.

According to the invention described above, the terminal of diode is pressed into forms on the circuit terminal of microswitch In the recess, because diode is loaded in the microswitch, so, needn't resemble and use soft pricker the prior art Soldering method with welding diode on circuit substrate, to lead make a circulation the wiring, with microswitch with the electricity Base board couples together, and can reduce wiring and be connected required number in man-hour, also can save the space simultaneously.

And, by near fixed terminal, forming otch or carrying out conquassation, improve ca(u)lk intensity, So, also can be guaranteed the reliability that connects even vibrate with being connected.

Claims

1. a microswitch is characterized in that, in diode is housed, and the terminal of described diode is pressed into and is connected in the recess that forms on the circuit terminal of this microswitch.

2. microswitch as claimed in claim 1 is characterized in that, is formed with otch near the described circuit terminal the described recess, and described recess is adjacent to along the terminal distortion of described diode.

3. microswitch as claimed in claim 1 is characterized in that, with near the described circuit terminal conquassation the described recess, the terminal distortion of described recess along described diode is adjacent to.

4. microswitch as claimed in claim 3 is characterized in that, will be apart from the position conquassation of the described recess 0.2mm to 0.3mm of described circuit terminal.

5. the manufacture method of the microswitch of dress diode in a kind comprises the steps:

The terminal of diode is pressed in the recess on the circuit terminal of microswitch;

On near the described circuit terminal the described recess, form otch, described recess is adjacent to along the terminal distortion of described diode.

6. the manufacture method of the microswitch of dress diode in a kind comprises the steps:

Near the described recess of conquassation described circuit terminal makes described recess be adjacent to along the terminal distortion of described diode.

7. the manufacture method of the microswitch of dress diode in as claimed in claim 6, it is characterized in that: the step of the described circuit terminal of conquassation, be with caulking tool by the distance position of described recess 0.2mm to 0.3mm on and push, block described recess after the described circuit terminal distortion, fix the described diode terminal of inserting in the described recess like this.