CN1327935A - Upper buffer for package of electronic products - Google Patents
Upper buffer for package of electronic products Download PDFInfo
- Publication number
- CN1327935A CN1327935A CN 01123928 CN01123928A CN1327935A CN 1327935 A CN1327935 A CN 1327935A CN 01123928 CN01123928 CN 01123928 CN 01123928 A CN01123928 A CN 01123928A CN 1327935 A CN1327935 A CN 1327935A
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- CN
- China
- Prior art keywords
- package
- power lead
- electronic product
- electronic products
- rest area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Buffer Packaging (AREA)
Abstract
A top buffer for the package of electronic products features that on its different sides there are different recesses for recepting the accessories of said electronic products, such as remote controller, power cord, plug, etc. and some of the recesses are communicated to each other for arranging the power card connected to electronic product. Its advantages are simple structure and protection to accessories.
Description
(1) technical field:
The present invention relates to a kind of upper buffer for package of electronic products, particularly relate to a upper buffer that is formed with electronic product annex and power lead placement space.
(2) background technology
When electronic product is put into packing box or packing chest, conduct to electronic product, need on electronic product, insert amortizing packaging material for preventing exterior bump.
Fig. 1 is the decomposition texture scheme drawing of electronic product package buffer material in the prior art, and outward appearance and panel 3 that shell 2 and panel 3 have formed electronic product (as A/C) are provided with a protection barrier 3 '; For providing power supply to electronic product 1, power lead 4 is drawn by a side of shell 2, and is provided with the plug 5 that is used to connect external power supply at the afterbody of power lead 4.Electronic product 1 being put into before the packing box (not shown) packs, place bottom padded coaming 7 and top padded coaming 11 respectively on the bottom and the top of electronic product 1; Bottom padded coaming 7 surrounds the bottom surface and the lower edge of electronic product 1, and around being wrapped to form a upwards open placement space 8, through hole 9 and the through hole 9 ' that runs through placement space 8 then formed on its bottom by sidewall 10 in its inside; Top padded coaming 11 surrounds the top and top edge of electronic product 1 and open downwards placement space 12 of portion's formation within it, is formed with through hole 13 above the top padded coaming 11.
When utilizing bottom padded coaming 7 and top padded coaming 11 to constitute the amortizing packaging material of electronic product 1, at first electronic product 1 is inserted in the placement space 8 of bottom padded coaming 7, and then the upper end of electronic product 1 inserted the placement space 12 of top padded coaming 11, promptly place top padded coaming 11.Certainly, this operation generally should be carried out under the state that bottom padded coaming 7 is placed in the packing box, but also can be according to the size of electronic product 1 and other situations and at the outer setting padded coaming 7,11 of packing box.
Above-mentioned amortizing packaging material remains in some technical matterss, need solve.At first; except that electronic product 1 itself; in packing box, also need to put into annexes such as remote controller, specification sheets; segregative parts such as protection barrier 3 ' generally also are to separate to be placed in the packing box; these annexes are positioned over above the electronic product 1 in the through hole 13 of top padded coaming 11 usually, are easy to during carrying move around in packing box.In addition, power lead 4 generally is not to separate separately, but extend out and insert in the packing box from electronic product 1, particularly, when power lead 4 from the side of electronic product 1 or back when extending out, just in time be in the outside of the electronic product 1 that is equivalent to sidewall 10 upper ends and the inner face position of packing box, also be easy in the handling process in above-mentioned space, move around, thereby the metal terminal that power lead 4 plugs 5 are drawn sustains damage, and perhaps causes the damage of packing box or shell 2 because of metal terminal.
(3) summary of the invention:
Purpose of the present invention promptly is the improvement suitable in addition to the structure of upper buffer for package of electronic products, puts into electronic product annex and the power lead and the plug of packing box with firm placement.
To achieve these goals, the present invention's side on the buffer body of top padded coaming is recessed to form the power lead rest area and the plug non-breathing zone that is used to place power-line plug and have hold down groove that is used to place power lead, is formed for the electronic product power lead is directed to the link slot of power lead rest area on buffer body with the side; On buffer body, be recessed to form the annex rest area that is used to place the electronic product annex.
Based on above structure, upper buffer for package of electronic products of the present invention can make electronic product annex and the power lead of putting into packing box be able to more firmly place, thereby can avoid in the handling process damage to plug, packing box or electronic product outward appearance.
Be described in further detail below in conjunction with the technical characterictic of specific embodiment upper buffer for package of electronic products of the present invention.
(4) description of drawings:
Fig. 1 is the decomposition texture scheme drawing of electronic product package buffer material in the prior art;
Fig. 2 is the structural representation of upper buffer for package of electronic products of the present invention;
Fig. 3 is the birds-eye view of upper buffer for package of electronic products of the present invention.
Fig. 4 is to be the enlarged diagram at position shown in Figure 3.
(5) specific embodiment:
Referring to figs. 2 and 3 shown in; padded coamings such as the top padded coaming 30 usefulness foamed plastic among the present invention are made; the gabarit of its buffer body 31 is and the upper end gabarit of surrounding electronic product 50 corresponding with the inner face of packing box on form; the form of the placement space 32 that its bottom surface forms is corresponding with the upper end of electronic product 50; placement space 32 runs through whole buffer body 31 from top to bottom and forms through-hole section 33; thereby make placement space 32 upwards open, then can place objects such as protection barrier and service instructions in the through-hole section 33.
Sides are formed with recess and are used to place the annex rest area 35 of annex such as remote controller 40 above the buffer body 31; Be provided with power lead rest area 36 in another example, the power lead of the inside is the winding shape and places; One side of power lead rest area 36 is provided with recess and is used to place the plug non-breathing zone 37 of plug 54 and is connected with power lead rest area 36 by hold down groove 38; Hold down groove 38 will be from plug non-breathing zone 37 extended extension areas 38 ' with from the extended extension area 38 of power lead rest area by bonding pad 38c " couple together formation; extension area 38 ', 38 " parallel to each other and stagger in opposite directions, and bonding pad 38c connects extension area 38 ', 38 to side surface direction "; thereby make the bonding pad 38c and extension area 38 ', 38 of hold down groove 38 " the orthogonal intersection, as shown in Figure 4.
In addition, be provided with a link slot 39 in power lead rest area 36 1 sides, this link slot 39 extends downwards through the side above buffer body 31, and the power lead 52 that electronic product 50 1 sides are drawn can cause power lead rest area 36 through link slot 39, and unlikely and packing box inner face interacts.
When above-mentioned padded coaming 30 was placed on electronic product 50 upper ends, through-hole section 33 formed a complete space by the top of the edge of buffer body 31 and electronic product 50, can place objects such as protection barrier and service instructions in this space.In annex rest area 35, can place remote controller 40; And in power lead rest area 36, can place power lead 52, in plug non-breathing zone 37, can place plug 54, and power lead 52 is successively by extension area 38 ", bonding pad 38c and extension area 38 ' and be folded fixing.In addition, the power lead 52 of electronic product 50 1 sides is introduced and is fixed in the power lead rest area 52, can guarantee that power lead 52 can not fill between packing box the inside and the buffer body 31 by link slot 39.
Claims (4)
1, a kind of upper buffer for package of electronic products, the upper end that its buffer body below is formed with placement space and inserts electronic product; Feature of the present invention is the power lead rest area and the plug non-breathing zone with hold down groove that a side is formed with depression above the described buffer body.
2, upper buffer for package of electronic products according to claim 1 is characterized in that opposite side is provided with an annex rest area above the described buffer body.
3,, it is characterized in that being provided with link slot with the side above the described buffer body and being communicated with the power lead rest area according to claim 1 or the described upper buffer for package of electronic products of claim 2.
4,, it is characterized in that the extension area that described hold down groove extends by staggering in opposite directions from power lead rest area and plug non-breathing zone forms with the bonding pad that is connected two extension areas according to claim 1 or the described upper buffer for package of electronic products of claim 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01123928 CN1120791C (en) | 2001-08-06 | 2001-08-06 | Upper buffer for package of electronic products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01123928 CN1120791C (en) | 2001-08-06 | 2001-08-06 | Upper buffer for package of electronic products |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1327935A true CN1327935A (en) | 2001-12-26 |
CN1120791C CN1120791C (en) | 2003-09-10 |
Family
ID=4665369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01123928 Expired - Fee Related CN1120791C (en) | 2001-08-06 | 2001-08-06 | Upper buffer for package of electronic products |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1120791C (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102627173A (en) * | 2011-08-23 | 2012-08-08 | 景智电子股份有限公司 | Buffer piece and packaging combination |
CN112110057A (en) * | 2020-09-16 | 2020-12-22 | 广东海洋大学 | Small household appliance storage device convenient for protecting and arranging cables |
CN112124792A (en) * | 2020-10-15 | 2020-12-25 | 珠海格力电器股份有限公司 | Air conditioner packaging structure and window type air conditioner assembly |
CN113830432A (en) * | 2020-06-08 | 2021-12-24 | 广东美的制冷设备有限公司 | Household appliance with packaging structure |
CN114506577A (en) * | 2022-02-24 | 2022-05-17 | 苏州浪潮智能科技有限公司 | Semi-open type liquid cooling server node packaging structure |
-
2001
- 2001-08-06 CN CN 01123928 patent/CN1120791C/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102627173A (en) * | 2011-08-23 | 2012-08-08 | 景智电子股份有限公司 | Buffer piece and packaging combination |
CN113830432A (en) * | 2020-06-08 | 2021-12-24 | 广东美的制冷设备有限公司 | Household appliance with packaging structure |
CN112110057A (en) * | 2020-09-16 | 2020-12-22 | 广东海洋大学 | Small household appliance storage device convenient for protecting and arranging cables |
CN112110057B (en) * | 2020-09-16 | 2022-01-07 | 广东海洋大学 | Small household appliance storage device convenient for protecting and arranging cables |
CN112124792A (en) * | 2020-10-15 | 2020-12-25 | 珠海格力电器股份有限公司 | Air conditioner packaging structure and window type air conditioner assembly |
CN114506577A (en) * | 2022-02-24 | 2022-05-17 | 苏州浪潮智能科技有限公司 | Semi-open type liquid cooling server node packaging structure |
Also Published As
Publication number | Publication date |
---|---|
CN1120791C (en) | 2003-09-10 |
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C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |