CN1323287C - Flexible plate wave differential pressure type micro flow transducer and fabricating method thereof - Google Patents
Flexible plate wave differential pressure type micro flow transducer and fabricating method thereof Download PDFInfo
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- CN1323287C CN1323287C CNB2004100112179A CN200410011217A CN1323287C CN 1323287 C CN1323287 C CN 1323287C CN B2004100112179 A CNB2004100112179 A CN B2004100112179A CN 200410011217 A CN200410011217 A CN 200410011217A CN 1323287 C CN1323287 C CN 1323287C
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Abstract
The present invention relates to a sensor for measuring micro flow and a making method, which comprises an inlet 1, an outlet 11, an upper cover 2, a micro cavity 3, a micro cavity 9, a main body 4, a wire 5, a wire 8, a support stand 6, a signal processing module 7 and a micro pipeline 20. Oxygenation, gumming, photolithography, silicon dioxide removal, striping and etching are carried out on the upper cover so as to obtain two through holes; the oxidation of the A surface and the B surface of the main body, the gumming of the A surface, the photolithography, the silicon dioxide removal and primary corrosion are carried out on the main body so as to obtain two etch pits; the making of an electricity conducting ground layer, an energizing layer and four interdigital transducers on the B surface and secondary etching are carried out on the B surface so as to obtain two pits and two films; the primary etching or the secondary etching is carried out on the B surface can obtain thin channels. A flexible flat wave is used for increasing sensitivity, and the inner stress of the films is used for measuring the size of dynamic ranges, and increasing the dynamic ranges. Two force sensors are used for solving the problems of backpressure influence and temperature compensation. A non heating method is used for realizing biologic compatibility. Response speed can be increased because the stress can fast response. The present invention has the advantages of no moving part, low processing difficulty, high yield, far distance of the two force sensors, no interference and high measuring accuracy.
Description
Technical field:
The invention belongs to the MEMS (micro electro mechanical system) field, relate to the sensor of micro-flow measurement.
Background technology:
The micrometeor sensing is one of key problem of quantitatively output of present various microfluid system (protein analysis, genetic test, little biochemistry detection, pharmaceutical discharge).The detection technique of tiny flow quantity is not only the key factor of these microfluid system actual motion performances of decision, also is one of precondition of relevant microfluid problem in science (as the flow characteristics of microtubule inner fluid, viscosity resistance etc.) research.A kind of tiny flow quantity sensing technology with high sensitivity, great dynamic range can make microfluid system have accurate more the analysis and quantitation capabilities, expand its range of application, simultaneously, also can make the research of associated problem in science more deep, make the result have higher confidence level.
Under the flourish drive of various microfluid systems, corresponding method of testing of carrying out many micrometeors is concluded by test philosophy both at home and abroad, can be divided into two classes: non-hot flow type micro-flow measurement technology and hot flow type micro-flow measurement technology.
Non-hot flow type micrometeor technology comprises the differential flow sensor of pressure drag, the differential flow sensor of electric capacity, drag flow sensor, lifting power flow sensor etc., their basic functional principle all is by measuring microstrain the force value or the velocity amplitude of some point in the fluid field to be converted into electric signal, reaches the purpose that detects flow.Differential flow sensor of pressure drag and the differential flow sensor of electric capacity are that the microtubule two ends can be because the pressure difference value that the pressure loss of pipe interior and porch produce be calculated the value that obtains pipeline inner fluid flow when recording fluid and flow by strain: the value that when the drag flow sensor utilizes test fluid flow to flow vertical barrier (such as a little column) in the passage is produced drag also can record flow value; And opposite with the test drag, lifting power flow sensor also can calculate the size of flow by the lifting power of the test suffered fluid of wings identical with flow direction.More than these several detection methods all be that change transitions with flow becomes film or the isostructural deformation of small semi-girder, measure by piezoresistive effect or capacitance variations switching electrical signals again.
Though non-hot flow type microflow sensor does not need detected fluid is heated, has good bio-compatibility, but because this type of sensor adopts the strain sensitive detection mode, and the scope of its strain is little, and this has just determined that the dynamic range of this type of sensor is little; Because the sensitivity that pressure resistance type and condenser type strain are measured is not high, this has also limited the sensitivity of sensor again; In addition, this type of sensor microstructure technology relative complex; And because the elastic modulus of material and resistance value and temperature are closely related, so the overwhelming majority needs temperature compensation.
Hot flow type micro-flow measurement technology comprises hot line (or hot film) flow sensor, calorie type flow sensor etc., its groundwork principle is: the fluid that flows through microtubule can be taken away the heat on the well heater that places pipe side wall, constant its temperature variation of testing of heating power by well heater in the controlling plumbing fixtures, or for keeping the constant variation change heating power of heter temperature with flow, all can extrapolate the flow value of fluid, or with well heater and hygrosensor be placed in pipeline upstream and downstream and extrapolate the flow value of fluid by measuring between the two the temperature difference.
Manufacture craft is simple relatively though this type of sensor has, the ripe advantage of temperature checking method, but different with the macrofluid system is, the laminar flow characteristics of fluid is fairly obvious in the microtubule, the calorie spread principal mode is with diffusion in the microtubule, the convection current role is very faint, the poor temperature uniformity that this makes fluid has increased the randomness of temperature detection, is unfavorable for the raising of transducer sensitivity; Secondly because the microflow sensor heating can have influence on the biologically active of measured fluid, so this has not only influenced the bio-compatibility of this type of sensor, also limited the maximum heating temperature of detected fluid, even do not allow heating, thereby limited the measurement dynamic range of microflow sensor: once more, because hot flow type micro-flow measurement technology is by the temperature survey flow, so all need temperature compensation; At last, because the heat balance of fluid needs the time, so the response speed of sensor is slower.
Summary of the invention:
Not high and need the bio-compatibility of temperature compensation, hot flow type microflow sensor bad and response speed is slower, non-hot flow type microflow sensor microstructure technology relative complex, fluid back pressure be to the problems such as influence of sensor test precision in order to solve background technology medium sensitivity, dynamic range, the objective of the invention is to provide a kind of based on tonometric differential microflow sensor of flexible flat plate wave and preparation method thereof.
The differential microflow sensor of flexible flat plate wave of the present invention comprises: inlet, loam cake, microcavity body one, main body, lead one, support, signal processing module, lead two, microcavity body two, microchannel, outlet.Entrance and exit is aimed at through hole one and through hole two respectively, entrance and exit is individually fixed in covers; Around the loam cake with main body around secured in alignment form microcavity body one, microcavity body two respectively and be communicated with the microchannel of microcavity body one, microcavity body two; The main body secured in alignment is drawn signal in signal processing module from lead one and lead two on support, signal processing module is fixed on the support, between signal processing module and the main body space is arranged.
Loam cake comprises: through hole one and through hole two, preparation has through hole one and through hole two on the loam cake body.Through hole one and through hole two two port shape separately adopt shapes such as circle or rectangle, and when the shape of port adopted circle, through hole one and through hole two adopted circular port or truncated cone-shaped holes; When the shape of port adopted rectangle, through hole one and through hole two adopted taper type hole or rectangular opening.
The A face of main body comprises: film one, pit one, fine raceway groove, film two and pit two, fine raceway groove is centrosymmetric and its center overlaps with the center of main body, pit one and pit two are symmetrically distributed in the main body with the center, in the bottom of pit one and pit two film one and film two are arranged, the sidewall around pit one and the pit two is formed one with film one and film two respectively.
The B face of main body comprises: conductive formation, excitation layer, interdigital transducer one, interdigital transducer two, interdigital transducer three, interdigital transducer four, the one side of conductive formation closely is fixed on the B face of main body, and the another side of conductive formation and the one side of excitation layer are closely fixing; On the another side of excitation layer, closely be fixed with interdigital transducer one, interdigital transducer two, interdigital transducer three, interdigital transducer four.
Both are parallel and be symmetrically distributed on the another side of excitation layer for interdigital transducer one and interdigital transducer four, and both are parallel and be symmetrically distributed on the another side of excitation layer for interdigital transducer two and interdigital transducer three.
The shape of the xsect of microchannel adopts triangle or isosceles trapezoid or rectangular shape.
The global shape of microchannel adopts the rectilinear form or the shape of crawling.
Through Theoretical Calculation, Q is the volume that flows through the fluid of microchannel in the unit interval, and its expression formula is:
Wherein:
c＝-2Δp。
In the following formula: ρ is the density of fluid; ζ
jThe local losses coefficient is a dimensionless number, ζ
jNumerical values recited mainly by the geometric configuration and the size decision of microchannel, also is subjected to the influence of fluid flow characteristics simultaneously, therefore also is the function of pipe stream Reynolds number; N is the change of shape of fluid process when flowing through sensor of the present invention and the number of times of bending; S is that the cross-sectional area c of microchannel is a constant, and its concrete numerical value is relevant with cross sectional shape; μ is the viscosity of fluid; L is the length of microchannel; D
hHydraulic diameter for microchannel; Δ p is the pressure differential at microchannel two ends.
The principle of work of the differential microflow sensor of flexible flat plate wave of the present invention:
The present invention comprises two flexible flat plate wave force transducers.Form first flexible flat plate wave force transducer by interdigital transducer one, interdigital transducer two, film two and conductive formation and excitation layer of being positioned in the middle of their; Form second flexible flat plate wave force transducer by interdigital transducer three, interdigital transducer four, film and conductive formation and excitation layer of being positioned in the middle of their.
When flow sensor of the present invention was worked: signal processing module sent the alternating voltage signal and drives interdigital transducer one, interdigital transducer three, make interdigital transducer one, interdigital transducer three is with voltage difference between the conductive formation and periodically exchanges variation, exchanging the voltage that changes makes excitation layer produce periodically stretching vibration, thereby on excitation layer, formed flexible flat plate wave, the fluctuation of flexible flat plate wave is propagated on film one and film two, when fluctuation signal propagates on interdigital transducer two and the interdigital transducer four respectively, in interdigital transducer two and interdigital transducer four, form electric signal and give signal processing module with electric signal and carry out signal Processing and obtain film one and film two internal stresss.Because film one is relevant with the pressure of fluid in microcavity body one, the microcavity body two with the internal stress in the film two, we can measure hydrodynamic pressure in microcavity body one and the microcavity body two respectively by first flexible flat plate wave force transducer and second flexible flat plate wave force transducer like this.
When flow sensor is worked, all be full of fluid in microcavity body one, microcavity body two and the microchannel, fluid enters microcavity body one by inlet, flows to another microcavity body two through microchannel, flows out flow sensor of the present invention by outlet.Because the fluid toughness, so when through microchannel, fluid must be subjected to the viscosity resistance from the microchannel sidewall; The characteristic of the size of viscosity resistance and the physical dimension of microchannel, fluid itself and the relative flowing velocity of fluid and microchannel are relevant, so under the influence of viscosity resistance, when the present invention works, between microcavity body one and microcavity body two, have certain pressure differential to come drive fluid to flow smoothly.So the present invention obtains pressure differential by the pressure of measuring fluid in microcavity body one and the microcavity body two with two flexible flat plate wave force transducers respectively, and then obtain the flowing velocity of fluid in microchannel, finally obtain fluid at a time between the flow of section, realize the micro-flow measurement of fluid.
Advantage of the present invention: the flexible flat plate wave of utilization of the present invention is a kind of mechanical wave, it only thickness than the little film of its wavelength on propagation and have multiple propagation mode.Because the asymmetric mode of zeroth order (is A
0Mould) velocity of propagation of flexible flat plate wave in liquid is less than the velocity of propagation of sound wave in liquid, A
0The decay of mould flexible flat plate wave in liquid is very little, and A
0The mould flexible flat plate wave is fainter in the propagation of gas, so A
0The mould flexible flat plate wave is suitable for the measurement about fluid behaviour; Again because flexible flat plate wave, particularly its A
0Mould is extremely responsive to internal stress and the film quality of propagating film; So, utilize A
0The mould flexible flat plate wave is used to the measurement of fluid behaviour as the flexible flat plate wave force transducer of sensing media.In the flexible flat plate wave force transducer, upload sowing time as flexible flat plate wave at film, when causing its internal stress to change owing to the variation of film pressure at both sides difference, the wave characteristic of the flexible flat plate wave on the film also can change (skew etc. will take place as resonant frequency), then the variation that can calculate the film internal stress by the variation of measuring the flexible flat plate wave wave characteristic.Because the skew of adopting the frequency measurement mode of high sensitivity, high dynamic range to measure resonant frequency is so flexible flat plate wave force transducer of the present invention has very high sensitivity and dynamic range.
1. to adopt flexible flat plate wave be to survey media in the present invention, utilizes its high sensitivity to solve the low problem of sensitivity of the flow sensor in the background technology; 2. the present invention adopts the mode of MEASUREMENTS OF THIN internal stress to obtain the pressure of fluid, utilizes the film planted agent force measurement dynamic range advantage of (can reach 40-50dB) greatly, makes sensor of the present invention have big dynamic range; 3. the present invention adopts the detection method of the dull and stereotyped wave power sensor of double-flexibility, has not only overcome the influence of fluid back pressure to the sensor test precision, and has realized good temperature compensation, eliminates the error that temperature variation produces measurement result effectively; 4. the present invention adopts non-heated type detection method, has avoided heating to the bioactive influence of detected fluid, has realized good bio-compatibility; 5. the present invention adopts the metering system of film internal stress, utilizes the fast advantage of response speed of STRESS VARIATION, has improved the response speed of sensor; 6. the present invention adopts flexible flat plate wave to survey, and does not have moving component, has reduced the difficulty of processing of micrometeor sensing unit itself, has realized the raising of yield rate; 7. because two groups of interdigital transducers that the present invention adopts are separated by far away, and since between film one and the film two thickness of main body big more many and surpass the wavelength of fluctuation than the thickness of film, make flexible flat plate wave on main body, not propagate, there is not the phase mutual interference between two groups of interdigital transducers, so do not disturb between two flexible flat plate wave force transducers, therefore improved the accuracy of micro-flow measurement of the present invention.
Description of drawings:
Fig. 1 is a structural representation of the present invention;
Fig. 2 is loam cake 2 structural representations of the present invention:
Fig. 3 is the structural representation of the A face of main body 4 of the present invention:
Fig. 4 is the structural representation of the B face of main body 4 of the present invention:
Fig. 5 is the structural representation of microchannel of the present invention 10 fine raceway groove 16 during for rectilinear form;
Fig. 6 Fig. 7 is the structural representation of microchannel of the present invention 10 fine raceway groove 16 during for serpentine shaped.
Embodiment:
Differential microflow sensor of flexible flat plate wave of the present invention such as accompanying drawing 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, shown in Figure 7 comprise: inlet 1, loam cake 2, microcavity body 1, main body 4, lead 1, support 6, signal processing module 7, lead 28, microcavity body 29, microchannel 10, outlet 11.
Common thin sebific duct is adopted in inlet 1 and outlet 11, aims at bonding agents such as 502 glue or high performance structures AB glue closely to be fixed on the loam cake 2; In addition, when the flow sensor of the present invention and the external microfluidic system integration, the material of inlet 1 and outlet 11 adopts silicon or dimethyl silicone polymer materials such as (PDMS).
As shown in Figure 2: loam cake 2 adopts silicon chip or hard materials such as glass or organic glass, through hole 1 and through hole 2 13 symmetry or asymmetric being distributed on the loam cake 2.
When loam cake 2 adopted silicon chip, the shape of through hole 1 and through hole 2 13 ports adopted shapes such as circle or rectangle:
(1) when the port shape of through hole 1 and through hole 2 13 adopts circle: through hole 1 and through hole 2 13 can adopt circular port or truncated cone-shaped hole;
(2) when the port shape of through hole 1 and through hole 2 13 adopts rectangle: through hole 1 and through hole 2 13 adopt taper type hole or rectangular opening; Its both ends of the surface constitute the taper type hole by two different sizes and the similar rectangle of shape when adopting taper type; Its both ends of the surface are identical shaped by two when adopting rectangular opening constitutes rectangular opening with rectangle size.
When the base substrate of loam cake 2 was selected silicon for use, preparation method's step of loam cake of the present invention was:
A. at first the loam cake base substrate is carried out oxidation, on the loam cake base substrate, form silicon dioxide layer;
B. on the loam cake base substrate, form the photoresist layer of being with figure to carrying out gluing, photoetching on the loam cake base substrate that silicon dioxide layer is arranged among the step a;
C. the loam cake base substrate that band figure photoresist layer is arranged among the step b is not covered the silicon dioxide layer of protection by photoresist with the hydrofluorite corrosion and remove photoresist the silicon dioxide layer of formation band figure on the loam cake base substrate;
D. to utilizing inductively coupled plasma etching (ICP) to obtain the through hole 1 and the through hole 2 13 of circular cylindrical shape or rectangle column among the step c, then finish the making of loam cake 2; Or utilize wet corrosion technique making through hole 1 and through hole 2 13 to obtain taper type hole or truncated cone-shaped hole, then finish the making of loam cake 2;
When the material of loam cake 2 adopted glass or organic glass, preparation method's step of loam cake of the present invention was: the loam cake base substrate can be made obtaining circular cylindrical shape through hole 1 and through hole 2 13 by the mode of machinings such as boring.
The A face structure of main body 4 comprises as shown in Figure 3: main body 4, film 1, pit 1, fine raceway groove 16, film 2 17, pit 2 18.The blank of material of main body 4 adopts silicon chip, and the crystal orientation of silicon chip is (100).
The manufacturing process of main body 4 is:
E. at first the A face of main body base substrate and the oxidation of B face are formed silicon dioxide layer;
F. to the silicon dioxide layer on the A face of main body base substrate among the step e carry out gluing, photoetching forms on main body base substrate A face;
G. the main body base substrate A face of band photoresist layer among the step f is not covered the silicon dioxide layer of protection by photoresist with hydrofluorite corrosion and remove photoresist, the silicon dioxide layer that forms the band figure on main body base substrate A face is (in this corrosion process, attention can not allow hydrofluorite damage the silicon dioxide layer of main body base substrate B face), removing photoresist obtains main body base substrate A face the main body base substrate of silicon dioxide layer as mask is arranged;
H. the main body base substrate that mask is arranged in the step g is carried out the main body base substrate that strong base solution (as potassium hydroxide solution or NaOH etc.) the wet etching first time obtains having two etch pits, little 15 μ m of the depth ratio pit 1 of etch pit and the degree of depth of pit 2 18 or 50 μ m or 60 μ m or 70 μ m or 80 μ m or 90 μ m or 100 μ m or 150 μ m, the degree of depth of etch pit can be controlled by the time of wet etching; When the xsect of microchannel 10 adopts when triangular shaped, then the wet etching first time that the main body base substrate that mask is arranged in the step g is carried out strong base solution obtains fine raceway groove 16;
I. to the sputter of B face or the evaporation conductive formation 19 of the main body base substrate that has etch pit among the step h, conductive formation 19 is layer of metal, and conductive formation 19 is generally aluminium, gold, copper etc.;
J. to step I sputter excitation layer 20 on the conductive formation 19 of main body base substrate B face, excitation layer 20 is a piezoelectric ceramics, is generally aluminium nitride (AlN), lead titanate-zirconate (PZT), zinc paste (ZnO) etc.,
K. to step j sputter or evaporated metal layer on excitation layer 20, be generally aluminium, gold, copper etc., gluing, photoetching, corroding metal layer obtain interdigital transducer 1, interdigital transducer 2 22, interdigital transducer 3 23, interdigital transducer 4 24 on metal level then; Or to step j stripping technology (Liftoff), i.e. gluing, photoetching on excitation layer 20, sputter or evaporated metal layer again, removing photoresist at last to peel off stays the metal level that still sticks on the excitation layer 20 and obtains interdigital transducer 1, interdigital transducer 2 22, interdigital transducer 3 23, interdigital transducer 4 24; Attention: the B face of the main body base substrate of etch pit cleans clean, otherwise that conductive formation 19, excitation layer 20 and interdigital transducer 1, interdigital transducer 2 22, interdigital transducer 3 23, interdigital transducer 4 24 adhere to is insecure, causes the sensor cisco unity malfunction;
When the xsect of microchannel 10 adopts isosceles-trapezium-shaped, step j is carried out the main body base substrate that silicon dioxide that gluing, photoetching, hydrofluorite corrosion do not covered by photoresist obtains having etch pit and silicon dioxide mask at the A of main body base substrate face;
L. the main body base substrate that has interdigital transducer 1, interdigital transducer 2 22, interdigital transducer 3 23, interdigital transducer 4 24 among the step k is put into strong base solution and carry out the wet etching second time, make the thickness of film 1 and film 2 18 reach required value (3 μ m or 5 μ m or 10 μ m or 15 or 20 μ m or 25 μ m), wherein the thickness of film 1 and film 2 18 was controlled by the time of wet etching, obtained main body 4 at last.When the xsect of microchannel 10 adopts isosceles-trapezium-shaped, step k is carried out second time wet etching obtain fine raceway groove 16; Attention: the main body base substrate that has interdigital transducer 1, interdigital transducer 2 22, interdigital transducer 3 23, interdigital transducer 4 24 is being carried out the second time during wet etching; must protect in good condition the figure of main body base substrate B face, guarantee that B face structure can be by alkali corrosion.Its two, lead 1, lead 28 and guide the lead of signal processing module into by conductive formation 19 should be insulated from each other;
The bonding of loam cake 2 and main body 4:
(1) when adopting silicon chip, two kinds of bonding schemes are arranged then:
The first: directly loam cake 2 and main body 4 are bonded together by Si-Si bonding process.
It two is: make its surface that layer of silicon dioxide be arranged by the oxidation of silicon high temperature oxidation process again the loam cake 2 that makes earlier, realize the bonding of loam cake 2 and main body 4 again by anode linkage technology.
(2) when loam cake 2 employing glass, then by anode linkage technology bonding loam cake 2 and main body 4.
(3) when loam cake 2 employing organic glass, then loam cake 2 and 4 two parts of main body are sticked together with bonding agents such as 502 glue or high performance structures AB glue.Practical attention does not allow adhesive flow on microcavity body 1, microcavity body 29 and microchannel 10 when bonding, to avoid obstruction, stops fluid to flow, make sensor not work.
The A face of main body 4 forms microcavity body 1, microcavity body 29 and microchannel 10 with after loam cake 2 is aimed at tight bonding.The shape of the xsect of microchannel 10 adopts shapes such as rectangle, triangle, isosceles trapezoid.
Bonding between loam cake 2 and the main body 4 must be quite closely and certain intensity be arranged, with guarantee loam cake 2 and main body 4 around without any the slit and when certain fluid internal pressure can not arranged in microcavity body 1, microcavity body 29 and microchannel 10 fluid flow out from bonding face.After main body 4 and loam cake 2 bondings are finished, draw two groups of leads from interdigital transducer 1 and interdigital transducer 2 22, interdigital transducer 3 23 with the electrode of the both sides up and down of interdigital transducer 4 24 bodies respectively, the other end of these two groups of leads inserts signal processing module 7; In addition, conductive formation 9 has an earth lead to guide signal processing module 7 into, has so just formed lead 1 (comprising four leads and an earth lead of drawing from interdigital transducer 1 and interdigital transducer 2 22) and lead 28 (comprising four leads of drawing from interdigital transducer 3 23 and interdigital transducer 4 24); B with main body 4 is fixedly clamped on support 6 in the face of standard then.Signal processing module 7 is aimed at and is fixedly clamped in the bottom of support 6 grooves.Signal processing module 7 is made by oneself as required.0.1cm or 1cm or 3cm or 5cm or 10cm or 15cm or 20cm can be selected in space between the B face of signal processing module 7 and main body 4.
The global shape of microchannel adopt as shown in Figure 5 rectilinear form or as shown in Fig. 6, Fig. 7 etc. the shape of crawling.
Claims (5)
1, the differential microflow sensor of flexible flat plate wave comprises; Inlet (1), lead one (5), support (6), signal processing module (7), lead two (8) and outlet (11), from lead one (5) and lead two (8), be drawn out in the signal processing module (7), signal processing module (7) is fixed on the support (6), it is characterized in that also comprising; Loam cake (2), microcavity body one (3), main body (4), microcavity body two (9) and microchannel (10), inlet (1) and outlet (11) are aimed at through hole one (12) and through hole two (13) on the loam cake (2) respectively, and inlet (1) and outlet (11) are individually fixed on the one side of loam cake (2); Loam cake (2) aligns all around with main body (4), the fixing microchannel (10) that forms microcavity body one (3), microcavity body two (9) respectively and be communicated with microcavity body one (3), microcavity body two (9) of the A face of the another side of loam cake (2) and main body (4); The B face of main body (4) is fixed on the support (6), between signal processing module (7) and the main body (4) space is arranged.
2, the differential microflow sensor of flexible flat plate wave according to claim 1 is characterized in that: loam cake (2) comprising: through hole one (12) and through hole two (13), and preparation has through hole one (12) and through hole two (13) on loam cake (2) body; Through hole one (12) and through hole two (13) two port shape separately adopt circle or rectangular shape, and when the shape of port adopted circle, through hole one (12) and through hole two (13) adopted circular port or truncated cone-shaped holes; When the shape of port adopted rectangle, through hole one (12) and through hole two (13) adopted taper type hole or rectangular opening.
3, the differential microflow sensor of flexible flat plate wave according to claim 1, it is characterized in that: the A face of main body (4) comprising: film one (14), pit one (15), fine raceway groove (16), film two (17) and pit two (18), fine raceway groove (16) is centrosymmetric and is distributed on the main body (4), and the center of fine raceway groove (16) overlaps with the center of main body (4), on the body of main body (4), be symmetrically distributed with pit one (15) and pit two (18), in the bottom of pit one (15) and pit two (18) film one (14) and film two (17) are arranged, pit one (15) and pit two (18) sidewall are all around formed one with film one (14) and film two (17) respectively.
4, the differential microflow sensor of flexible flat plate wave according to claim 1, it is characterized in that: the B face of main body (4) comprising: conductive formation (19), excitation layer (20), interdigital transducer one (21), interdigital transducer two (22), interdigital transducer three (23), interdigital transducer four (24), the one side of conductive formation (19) closely is fixed on the B face of main body (4), and the another side of conductive formation (19) closely is fixed on the one side of excitation layer (20); Tight fixation fork finger transducer one (21), interdigital transducer two (22), interdigital transducer three (23), interdigital transducer four (24) on the another side of excitation layer (20), both are parallel and be symmetrically distributed on the another side of excitation layer (20) for interdigital transducer one (21) and interdigital transducer four (24), and both are parallel and be symmetrically distributed on the another side of excitation layer (20) for interdigital transducer two (22) and interdigital transducer three (23).
5, the differential microflow sensor of flexible flat plate wave according to claim 1 is characterized in that: the shape of microchannel (10) xsect adopts triangle or isosceles-trapezium-shaped; The global shape of microchannel (10) adopts rectilinear form or serpentine shaped; The fluid volume Q that flows through microchannel (10) in unit interval is:
In the formula: ρ is the density of fluid; ζ
jThe local losses coefficient is a dimensionless number, ζ
jNumerical values recited by the geometric configuration and the size decision of microchannel, is the function of pipe stream Reynolds number mainly; N is the change of shape of fluid process when flowing through sensor and the number of times of bending; S is the cross-sectional area of microchannel; C is a constant, and its concrete numerical value is relevant with cross sectional shape; μ is the viscosity of fluid; L is the length of microchannel; D
hHydraulic diameter for microchannel; Δ p is the pressure differential at microchannel two ends.
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| US10739170B2 (en) * | 2017-08-04 | 2020-08-11 | Encite Llc | Micro flow measurement devices and devices with movable features |
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| CN108775979A (en) * | 2018-05-10 | 2018-11-09 | 西安建筑科技大学 | A kind of high sensitivity pliable pressure sensor and preparation method thereof |
| CN110502049B (en) * | 2019-08-30 | 2021-05-07 | 北京北方华创微电子装备有限公司 | Chuck temperature control method, chuck temperature control system and semiconductor equipment |
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| CN2086406U (en) * | 1991-03-26 | 1991-10-09 | 中国科学院山西煤炭化学研究所 | Miniature adjusting capillary tube flowmeter |
| CN2095404U (en) * | 1991-05-08 | 1992-02-05 | 陈秀兰 | Small volume flowmeter |
| JP2000337986A (en) * | 1999-05-28 | 2000-12-08 | Nagano Keiki Co Ltd | Capacitive pressure detecting element and its manufacture |
| US20020077759A1 (en) * | 2000-11-06 | 2002-06-20 | Adam Cohen | Microflow based differential pressure sensor |
| CN2752730Y (en) * | 2004-11-10 | 2006-01-18 | 中国科学院长春光学精密机械与物理研究所 | Flexible flat-plate wave differential type micro-flow sensor |
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