CN1318011A - Compsite wire with noble metal cladding - Google Patents

Compsite wire with noble metal cladding Download PDF

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Publication number
CN1318011A
CN1318011A CN 99810940 CN99810940A CN1318011A CN 1318011 A CN1318011 A CN 1318011A CN 99810940 CN99810940 CN 99810940 CN 99810940 A CN99810940 A CN 99810940A CN 1318011 A CN1318011 A CN 1318011A
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CN
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Prior art keywords
metal
composite
wire
core
gold
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CN 99810940
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Chinese (zh)
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CN1187189C (en )
Inventor
J·M·佐伊恩蒂恩斯
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库利克及索发投资有限公司
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/04Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
    • B21C37/042Manufacture of coated wire or bars
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    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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Abstract

本发明公开了一种复合金属线,其特征在于:一个贵金属环形部分焊接到包含导电非贵金属的金属线芯部上。 The present invention discloses a composite metal wire, characterized in that: a noble metal portion welded to the annular core portion comprising a conductive metal wire non-noble metals. 本发明还公开了一种制造复合金属线的方法和一种具有至少一个与复合金属线相连的导线的半导体封装组件。 The present invention also discloses a method of manufacturing a composite metal wire and a semiconductor package having at least one conductor connected to the composite metal wire.

Description

包覆有贵金属的复合金属线 Coated with a noble metal composite wire

技术领域 FIELD

本发明涉及一种导电的复合贵金属线,其中,非贵金属芯部由贵金属环形部分所包覆。 The present invention relates to an electrically conductive composite noble metal wire, wherein the non-noble metal coated with a noble metal core annular portion. 具体的是,本发明涉及一种由非贵金属芯部材料和贵金属复合挤压而成的复合金属线。 Specifically, the present invention relates to an extrusion of a non-noble metal and a noble metal core material made of a composite metal composite wire. 本发明还涉及一种制造复合金属线的方法,该复合金属线的芯部包含非贵金属,并通过非贵金属芯部材料与贵金属的复合挤压而包覆有贵金属环形部分。 The present invention further relates to a method of manufacturing a composite metal wire, the core wire portion of the composite comprises a non-noble metal, and the noble metal coated non-noble annular portion by a composite material core and the noble metal extrusion.

未来的连接金属线需要以约20微米直径的金属线在大约5000微米的跨距上满足大约50微米间距的要求。 Future metal wires need to be connected to the metal wires of a diameter of about 20 microns to about 50 microns meet pitch in the span of about 5000 microns. 连接金属线的弯曲和倾斜会影响这种结构。 Connecting a metal line curve and inclination can affect this structure. 一条金属线相对于另一条金属线的偏移量应限制在大约30微米范围内。 Metal line offset with respect to the other metal lines should be limited to about 30 microns. 使相邻金属线之间产生短路的相对变形应小于0.005%,而且这是一种弹性变形。 The relative deformation of the shorting between adjacent metal lines should be less than 0.005%, and this is an elastic deformation. 4N金合金比纯铜具有较高的弹性模量,但铜基连接金属线合金并没有满足未来这种对足够弹性模量的需求。 4N gold alloy having a high elastic modulus than pure copper, but the copper-based alloy and the metal wire is connected not sufficient to meet future demands for such elastic modulus.

在弹性模量、电阻率、密度和成本方面,铜是一种理想的连接金属线。 Elastic modulus, resistivity, density and cost, copper is a metal line over the connection. 但是,氧化影响和较高的连接成本妨碍了铜成为一种通用的连接金属线材料。 However, Oxidation and high connection cost prevents copper into a common connecting metal wire material.

US5097100公开了一种镀有贵金属的铜金属线。 US5097100 discloses a copper wire plated with a noble metal. 直径约为44-56微米的拉制铜金属线电镀有金,其表面可经冷拉来硬化其镀金层。 Diameter of about 44-56 microns drawn copper wires plated with gold, the surface may be cold drawn to harden its gold plating layer.

但是,却不可能在合理的价格范围内均匀地电镀具有足够纯度的镀金层。 However, it is impossible to uniformly electroplated gold plating layer having a sufficient purity within a reasonable price range. US5097100所公开的技术不能使金充分地镀覆在铜制芯部。 US5097100 disclosed techniques do not adequately the gold plating in the copper core. 该发明所公开的其它的金属镀覆技术包括无电敷镀、汽相淀积、溅镀、浸镀等,也存在同样的问题。 Other of the disclosed invention, the metal plating techniques including electroless plating, vapor deposition, sputtering, dip coating, etc., there is the same problem. 另外,这些技术都不能将4N金合金连接金属线包皮包覆在铜金属线芯部。 Further, none of these techniques can 4N gold alloy wire connection metal sheath coated Cu metal wire core.

US5097100公开了铜和金可共同进行拉制,但并没有给出怎样来制得微米尺寸的金属线,更不用说给出一个实际生产的例子了。 US5097100 discloses a copper and gold can be drawn together, but not given to how the metal wire obtained micron size prepared, let alone give an example of the actual production. 因此,仍然需要提供一种复合包金铜金属线以合理的价格来满足半导体工业未来的性能要求。 Accordingly, there remains a need to provide a gold-copper composite metal wire packages at a reasonable price to meet future performance requirements of the semiconductor industry.

因此,根据本发明的一个方面,复合金属线的特征在于:贵金属环形部分焊接到包含导电非贵金属的金属线芯部上。 Thus, according to one aspect of the present invention is characterized in that the composite metal wire: the annular noble metal portion welded to the metallic core portion comprising a conductive non-noble metals.

铜是一种优选的非贵金属,最好,金属线芯部主要由铜构成。 Copper is a preferred non-noble metals, preferably, the metal core portion is mainly made of copper. 贵金属优选为金,最好,金的纯度大于90%。 Noble metal preferably gold, preferably, greater than 90% purity gold. 纯度优选大于99%,更好是大于99.99%。 Preferably greater than 99% purity, more preferably greater than 99.99%. 最好,金是一种金合金,其中,对金进行掺杂,以使金/铜复合材料在拉制时可较好地变形并使复合金属线具有良好的连接性能,例如,金掺杂有小于30ppm的钙、小于20ppm的铍和小于50ppm的其它元素。 Preferably, gold is a gold alloy, wherein the gold doping, to the gold / copper composite material is preferably a composite metal and deformed when drawn wire having a good connection property, e.g., gold-doped It is less than 30ppm calcium, beryllium and less than 20ppm 50ppm less than the other elements. 特别优选的金合金是4N金。 Particularly preferred is a gold alloy of gold 4N.

本发明提供一种生产复合金属线的方法,其中,首先将非贵金属的金属线包敷贵金属,然后将其拉制成微米尺寸,而不是在微米尺寸金属线上形成贵金属层。 The present invention provides a method of producing a composite metal wire, wherein the first non-metal wire clad with precious noble metal plating, and then drawn to micron size, instead of forming a noble metal layer on micron sized metal wire. 因此,根据本发明的另一个方面,提供一种制造微米尺寸复合金属线的方法,该复合金属线主要由包含非贵金属的导电金属线芯部和附着在芯部上的贵金属环形部分构成,其中,所述方法包括:提供直径大约为0.5-5mm的第一复合金属线,其中,第一复合金属线的特征是:贵金属环形部分焊接到包含导电非贵金属的金属线芯部上;以及将第一复合金属线拉拔成直径约为15-75微米的第二复合金属线,第二复合金属线芯部所占横截面面积的比例基本上与第一复合金属线的芯部比例相同。 Thus, according to another aspect of the invention, there is provided a method of manufacturing a micron-size metal composite wire, the composite wire is mainly composed of noble metal portion on the annular core portion comprises a non-noble conductive metal wire core and attachment portion, wherein , the method comprising: providing a first diameter of about 0.5-5mm composite metal wire, wherein the metal compound wherein the first line is: noble metal is welded to the annular portion comprises a non-noble conductive metal wire core portion; and the second a composite metal wire drawn to a diameter of the second metal composite wire of about 15-75 microns, the proportion of the cross-sectional area of ​​the second composite metallic core portion of the core portion is substantially the same ratio of the first metal composite wire.

第一复合金属线由复合棒材拉制而成,复合棒材通过具有与贵金属环形部分焊接在一起的非贵金属芯部材料的贵金属坯料复合挤压而成。 The first composite wire drawn metal bar made from a composite, the composite rod blank by a noble metal composite material having a non-noble metal core annular portion of the welding together of the noble metal extruded. 直径为20微米的复合金属线由毫米尺寸的复合金属线拉制而成,毫米尺寸的复合金属线由复合圆柱体棒材形成,复合圆柱体棒材则由复合坯料挤压而成,在从坯料变到棒材再变到金属线的过程中,复合体芯部与贵金属层的相对横截面面积保持不变。 20 micron diameter metal composite wire drawn from a composite of a metal wire made of millimeter dimensions, millimeter-sized composite wire formed from a composite metal cylinder rods, the cylinder rod by a composite extruded composite billet, from the blank is changed to changed to the metal wire rod and then process, the composite core cross-sectional area portion opposite to the noble metal layer remains unchanged. 这就可直接将标称直径为20微米的复合金属线芯部比例控制到一个迄今闻所未闻的程度。 This can be directly mixed metal wire nominal diameter of 20 microns core ratio is controlled to a degree heretofore unheard of. 因此,根据本发明的又一个方面,提供一种通过本发明方法生产的具有微米尺寸直径的复合金属线。 Thus, according to a further aspect of the present invention, there is provided a composite metal wire having a diameter of micron size produced by the process of the present invention.

换句话说,对于所需要的芯部比例,例如直径为20微米的复合金属线,可通过具有相同的芯部材料相对比例的复合坯料来进行生产。 In other words, the proportion of the core desired, for example a complex metal wire having a diameter of 20 microns, can be produced by having the same relative proportions core composite billet. 通过生产一种具有复合金属线成品所需芯部材料比例的坯料,就可制造出具有所需芯部材料比例的微米尺寸复合金属线。 By producing a composite metal wire material ratio desired finished blank having a core, can be manufactured having micron size of the composite metal wire a desired ratio of the core material.

本发明的复合金属线具有半导体封装组件所需的弹性模量、强度和导电性,且具有价格优势。 Metal composite wire of the present invention has a modulus of elasticity desired semiconductor package, strength and conductivity, and has a price advantage. 因此,根据本发明的另一个方面,提供一种半导体封装组件,其具有至少一个与本发明第二复合金属线相连的导线。 Thus, according to another aspect of the invention, there is provided a semiconductor package assembly, having at least one lead connected to the second line of the present invention is a composite metal. 直径为25微米的复合金属线在不破坏贵金属外层连续性的情况下进行楔入连接,为了避免非贵金属芯部的氧化,这是必须的。 Diameter of 25 microns composite metal wire without destroying the continuity of the outer layer is a noble metal wedge connection, in order to avoid non-noble metal oxide core, which is a must.

本发明的复合金属线可用于其它需要使用细小连接金属线的场合。 Metal composite wire according to the present invention may be used in other connector applications require the use of fine metal wire. 这种应用包括但不限于用于珠宝和阴极保护或者用于恶劣环境的金属线或金属缆线。 Such applications include, but are not limited to cathodic protection or for jewelery and metal wire or a metal cable harsh environment. 本发明上述的和其它的目的、特征和优点可通过结合附图对本发明优选实施例所进行的描述中清楚地看出。 The above and other objects, features and advantages of the present invention may be described with the preferred embodiments of the present invention carried out in conjunction with the accompanying drawings is apparent.

连接通过加热加压而成,通常是通过焊接。 Connected by heating and pressing together, usually by welding. 所施加的热量和压力根据所用的非贵金属或金属合金芯部材料和贵金属或金属合金环形部分材料而定,冶金领域的普通技术人员可在进行适当试验的情况下很容易地进行确定。 Heat and pressure applied in accordance with the non-noble metal or metal alloy core material and a noble metal or metal alloy material may be annular portion, easily be determined in the case of ordinary skill in the field of metallurgy of the appropriate test may be performed. 例如,对于铜或铜合金芯部和金或金合金环形部分,所采用的温度约大于200℃,压力约大于50kg/mm2。 For example, for copper or copper alloy core and gold or gold alloy annular portion, the temperature employed is greater than about 200 ℃, a pressure of greater than about 50kg / mm2.

金属线由通过图2所示的复合坯料20挤压而成的复合棒材拉制而成。 A composite metal wire rod drawn from extruded through the composite blank 220 shown in FIG. 例如,含铜的芯部金属圆柱体22包覆在套筒状的金中或形成中间层24的包覆层中。 For example, the metal core 22 coated copper cylindrical sleeve-like coating layer is formed of gold or the intermediate layer 24. 将形成的组件放置于带有端盖28和30的铜制挤压套26中,对所形成的坯料20进行焊接、抽空和密封处理。 The assembly formed with the end cap 28 and placed in a copper sleeve 30 of the extrusion 26, the blank 20 is formed welded, evacuated and sealed. 将坯料预热到大约200-700℃,最好是大约400-500℃,并在单位面积力约为50-200kg/mm2、最好约为100-150kg/mm2的情况下进行直接挤压来形成直径适合于拉制金属线的挤压复合圆柱棒材。 Case of direct extrusion billet is preheated to about 200-700 ℃, preferably about 400-500 ℃, and the force per unit area of ​​approximately 50-200kg / mm2, preferably about 100-150kg / mm2 of drawn with a diameter adapted to cylindrical metal wire extruded composite rod.

挤压棒材经切头、清理并通过普通简单模进行拉拔而制成直径约为0.5-5mm、最好小于约3mm的复合金属线。 Extruded bars via the cutting head, and by conventional cleaning by drawing a simple die having a diameter of about 0.5 to 5 mm and, preferably less than about 3mm is a composite metal wire. 最好通过腐蚀的方法去掉由挤压套形成的外表层,从而制成一卷带有铜芯的包金复合金属线,通过标准接合线工艺将其进一步拉制成直径小于100微米,最好是约15-75微米。 The method is preferably removed by etching the outer surface of the collar is formed, thereby producing a composite roll covered with gold metal wire with a copper core, which is further drawn to a diameter of less than 100 microns by standard joining line process, preferably is approximately 15-75 microns. 芯部横截面面积比相对原先的复合坯料未发生变化,因此,金属线产品的芯部比例是由坯料结构决定的。 Core cross-sectional area than the opposite did not change the original composite billet, and therefore, the ratio of the core metal wire product is determined by the configuration of the blank.

坯料的直径最好是25-100mm,这样进行挤压就较为经济。 Best blank diameter of 25-100mm, so squeezing it more economical. 芯部、贵金属层和外表层的相对尺寸与坯料的尺寸成比例,也就是,通过选定尺寸来获得制造复合金属线所需的芯部比例。 Core, proportional to the size and relative sizes of the noble metal layer and the outer skin blank, i.e., to obtain the desired ratio of the core wire by producing a composite metal selected size. 挤压套大约占整个坯料横截面的10-20%。 The collar approximately 10-20% of the entire cross section of the billet. 套内由非贵金属芯部和中间贵金属层所限定的圆柱体的芯部横截面面积比大约为25-95%,最好大约是50-90%。 Cylindrical sleeve of a non-noble metal core and the intermediate core portion of the noble metal layer defined cross-sectional area ratio of about 25-95%, preferably about 50-90%.

挤压压缩比(坯料横截面面积除以挤压棒材的横截面面积)最好约为10-100,更好是约为15-50。 Pressing the compression ratio (cross-sectional area of ​​the billet divided by the cross-sectional area of ​​the extruded bar) preferably about 10-100, preferably about 15-50. 由坯料挤压而成的圆柱形棒材的直径大约为2-25mm。 Pressing the blank formed by the cylindrical rod of a diameter of about 2-25mm. 圆柱形棒材最好挤压成直径约为4-20mm。 Cylindrical rod is preferably extruded to a diameter of about 4-20mm. 棒材与其挤压坯料具有相同的芯部比例。 Its rod extrusion billet has the same ratio of the core portion.

为满足将来半导体工业的模量要求,非贵金属12或由坯料20的芯部圆柱体22制成的金属线10最好其弹性模量大于约95Gpa。 To meet the modulus requirements of the semiconductor industry in the future, or a non-noble metal core 12 of the blank 20 of cylindrical body 22 made of a metal wire 10 is preferably an elastic modulus greater than about 95 GPa. 适当的芯部材料包括金属铜、镍和类似金属及其合金。 A suitable core materials include copper, nickel and the like metals and their alloys. 芯部材料最好是具有高导电率和高拉延性的金属或金属合金。 The core material is preferably a metal or metal alloy having high electrical conductivity and high tensile ductility. 因此,芯部材料最好是铜或铜合金,它们还具有明显的价格优势。 Thus, the core material is preferably copper or a copper alloy, they have a significant price advantage.

楔形接合的芯部材料最好是无氧高纯铜(OFHC)。 Wedge bonding the core material is preferably a high oxygen-free copper (OFHC). 对于球形接合,芯部材料的熔点最好不超过环形部分金属熔点5℃。 For ball bonding, the melting point of the core material is preferably not more than the melting point of the metal annular portion 5 ℃. 对于金或金合金环形部分,芯部材料最好是具有该熔点的铜合金。 For gold or gold alloy annular portion, the core material is preferably a copper alloy having the melting point. 更为有利的是,铜合金比纯铜的抗氧化性要高。 More advantageously, the copper alloy is higher than the oxidation resistance of pure copper. 最好,包金的铜芯复合金属线的电阻率大约为1.70-2.00μOhm-cm,弹性模量大约为95-120Gpa,复合密度大约为9.0-15.0g/cc。 Preferably, the resistivity of the gold-metal composite copper core wire is about 1.70-2.00μOhm-cm, elastic modulus about 95-120Gpa, the composite density of about 9.0-15.0g / cc. 每种特性都超过了4N金线。 Each feature more than 4N gold.

如上所述,构成连接于非贵金属芯部12的环形部分14的贵金属最好是纯度至少为90%的金,纯度优选至少为99%,更优选为至少99.99%。 As described above, the non-noble metal constituting the core is connected to the annular portion 12 of the noble metal portion 14 is preferably a purity of at least 90% gold, preferably a purity of at least 99%, more preferably at least 99.99%. 金最好是一种掺杂合金,以使复合材料可较好地变形并使复合金属线具有良好的连接性能。 Preferably a doped gold alloy composite material to be deformed and is preferably a composite metal wire having good connection performance. 金合金最好掺杂有小于30ppm的钙、小于20ppm的铍和小于50ppm的其它元素。 A gold alloy is preferably less than 30ppm is doped with calcium, beryllium, less than 20ppm and 50ppm less than the other elements. 金合金最好是包含小于10ppm的钙和小于10ppm的铍。 It is preferably a gold alloy containing less than 10ppm calcium and beryllium to less than 10ppm. 特别优选的金合金是4N金,最好是标称含有7.5ppm的铍、6.5ppm的钙和小于30ppm其它元素的4N金。 Particularly preferred is 4N gold gold alloy, containing nominally preferably of beryllium 7.5ppm, 6.5ppm calcium and less than 30ppm gold 4N other elements.

本发明的复合金属线通过普通的技术与半导体封装组件的导线相连。 Composite metal wire is connected by a wire according to the present invention, ordinary skill and a semiconductor package. 图3示出了半导体封装组件40,其中,导线42a、42b、42c等通过楔入接头44a、44b、44c等与金属线10a、10b、10c等相连。 Figure 3 shows a semiconductor package 40, wherein the wires 42a, 42b, 42c, etc. are connected by wedging linker 44a, 44b, 44c, etc. and metal lines 10a, 10b, 10c and the like. 金属线10b的局部剖视图示出了由环形部分14b所包围的芯部12b。 The metal wire 10b is a partial cross-sectional view illustrating the core portion 12b by the annular portion 14b surrounded.

本发明提供了一种比标准4N金合金连接金属线具有较高弹性模量、较高强度和较高导电率的复合连接金属线。 The present invention provides a compound having a higher elastic modulus, higher strength and higher electrical conductivity than the bonding wires connected to the standard 4N gold alloy metal wire. 复合连接金属线的贵金属含量名义上是普通金属线的一半,因此,复合金属线比等尺寸的4N金合金金属线便宜,而且复合金属线还保持了标准4N金合金的连接特性。 Precious metal content of the composite metal wire is connected to nominally half the normal metal wire, therefore, the metal wire size 4N gold alloy composite metal wire other than the cheaper, but also a composite metal wire to maintain the characteristics of the standard connector 4N gold alloy.

下面非限制性的例子可展示出本发明的某些特定方面。 The following non-limiting examples demonstrate certain aspects of the invention. 除非特别指出,所有的的比例和百分比都是重量百分比,所有的温度都是摄氏温度。 Unless otherwise indicated, all proportions and percentages are by weight and all temperatures are in degrees Celsius. 工业适用性由本发明方法制成的复合金属线可用于半导体封装组件。 INDUSTRIAL APPLICABILITY The composite metal wire made by the process of the present invention can be used in the semiconductor package. 例子将800gAW-14(American Fine Wire,Ltd.,Willow Grove,Pa.),含小于10ppm的Ca和Be以及小于20ppm的In和小于20ppm的Ge的4N金合金浇铸到直径为28mm的模中。 Examples of the 800gAW-14 (American Fine Wire, Ltd., Willow Grove, Pa.), Containing less than 10ppm Ca and Be and In is less than 20ppm and 20ppm 4N gold alloy of Ge less than the diameter of the casting mold of 28mm. 浇铸过程是普通的分批浇铸,其包括在石墨坩埚中熔化合金并将熔融物浇铸到圆筒形的石墨模中。 Batch casting process is a common casting, which comprises melting and molten alloy was cast into a cylindrical graphite mold in a graphite crucible.

对成品金锭进行钻孔,形成内径(ID)为18mm的中心孔,并将其外径(OD)加工到25mm。 Drilling the finished ingots, forming the inner diameter (ID) of the central bore of 18mm and an outer diameter (OD) which is machined to 25mm. 对成品管进行加工,使其长度为76mm。 Processing of finished tubes have a length of 76mm. 将OFHC级铜圆柱体加工成外径为18mm、长度为76mm的圆柱体。 The OFHC grade copper cylinder is processed into an outer diameter of 18mm, length of 76mm cylinder. 将铜圆柱体以小于1.0mm的误差装入金合金管中。 The copper cylinder was charged with an error of less than 1.0mm gold alloy tube.

0FHC铜套的内径为25mm、外径为28mm、长度约为85mm。 0FHC copper sleeve inner diameter is 25mm, an outer diameter of 28mm, a length of about 85mm. 对坯料端盖进行加工以使其可装到铜套的端部。 Machining the blank so as to cover the end portion may be attached to a copper sleeve.

然后,对坯料端盖进行电子束焊接来密封坯料。 Then, the blank for electron beam welding the end cap to seal the blank. 将坯料在450℃下预热1小时。 The blank preheated at 450 ℃ 1 hour. 将预热的坯料放置到也预热到450℃的50吨挤压机中。 The preheated blank is also placed into the extruder preheated to 50 tons of 450 deg.] C. 将坯料在48吨的标称工作挤压力下挤压到6.4mm的直径。 Extruding the billet to a diameter of 6.4mm at 48 tonnes nominal operating pressing force.

用研磨片对挤压物进行清理,并用水进行冲洗。 It was extruded with a cleaning abrasive sheet, and rinsed with water. 切去坯料的头尾,并取得试样。 Cut off the head and tail of the blank and obtain the sample. 通过普通的简单模拉制将所得的棒材拉制成1mm直径。 Common simple drawing die by the resultant drawn into 1mm diameter rod. 将成品金属线放置到50%硝酸溶液中,通过化学的方法将挤压套产生的铜皮除去。 The finished metal wire placed in 50% nitric acid solution, the copper by chemical generation of the extruded sleeve is removed. 腐蚀过的金属线用水进行冲洗,然后再用酒精进行冲洗。 The etched metal lines rinsed with water, followed by alcohol rinsing.

再将金属线在王水(1份硝酸、3份盐酸和4份水)中酸洗大约10秒钟,以除去金属线表面上的金铜混合物。 Then pickling the metal wire for about 10 seconds in aqua regia (nitric acid 1 part, 3 parts of hydrochloric acid and 4 parts of water) to remove a mixture of gold and copper on the surface of the metal wire. 利用8-12%的标准压模工艺在标准多模拔丝机上并采用含油的水乳胶润滑剂将成品金属线拉拔到标称直径为25微米。 8-12% of a stamper using a standard process on a standard multimode wire drawing machine using oil-water emulsion and the finished metal wire drawing lubricant to a nominal diameter of 25 microns. 金属线的拉延性是很好的,拉延长度超过5千米都不会断裂。 Drawability of the metal wire is good, tensile length exceeds 5 km will not be broken.

测量复合金属线的延伸率和破坏-载荷性能。 Measuring the elongation of a composite metal wire and destruction - load performance. 如图5所示,在延伸率高于2%的情况下,直径为24.8微米的复合金属线比AW-14金合金的破坏载荷大约高20%(在大多数情况下,连接金属线的延伸率都大于2%),在延伸率为4%时,其破坏载荷大约为14g。 5, in the case where the elongation rate of 2%, the composite metal wire having a diameter of 24.8 microns damage than gold alloy AW-14 a load of approximately 20% (in most cases, the metal line connected to the extension ratio greater than 2%), at an elongation of 4%, which is the failure load of about 14g. 沿金属线的轴线铜制芯部是非常均匀的。 Copper core portion along the axis of the metal wire is very uniform. 在金属线最终直径为24.8微米时,铜制芯部的横截面的标准偏差仅有0.26%。 When the metal wire having a diameter of 24.8 microns finally, the standard deviation of the cross section of the copper core only 0.26%.

退火后,复合金属线的弹性模量约为108Gpa,比AW-14约高26%。 After annealing, the elastic modulus of approximately composite metal wire is 108Gpa, 26% higher than about AW-14. 复合金属线的电阻率是2.0微欧姆·厘米,比AW-14大约低12%。 The resistivity of the composite metal wire is 2.0 micro-ohm-cm, lower than the AW-14 about 12%. 复合金属线的测量电阻率与时间和温度的关系曲线表明在温度小于或等于200℃、时间高达500小时内电阻率增加很小。 Measuring the resistance of the composite metal wire versus the time and temperature indicates a temperature equal to or less than 200 ℃, the time up to 500 hours within a small increase in resistivity.

在24.8微米的复合金属线上开始的楔入连接试验显示出较高的连接强度。 Test wedge composite metal connection line starting 24.8 microns showed high connection strength. 图4示出了楔入连接复合金属线的半导体封装组件横截面的SEM显微图。 FIG 4 shows a SEM micrograph of a composite semiconductor package assembly of wedge wire connected to the metal cross section. 楔形接头内的金皮保持连续。 Gympie remains continuous in the dovetail.

本发明提供了一种适宜于用作连接金属线的高强度、柔性复合金属线,其具有一个包在均匀的贵金属环形部分内并与其相连的非贵金属芯部。 The present invention provides a metal line connected to a high strength flexible composite for use as a suitable metal wire, having a non-noble metal package core portion and connected thereto in a uniform annular noble metal portion. 通过采用铜或铜合金作为芯部材料,复合金属线就具有优选的弹性模量、强度和导电性,并且大大降低了成本。 By using copper or copper alloy as a core material, preferably a composite having a metal line on the elastic modulus, strength and conductivity, and greatly reduce the cost.

上述的例子和对优选实施例的描述仅仅是示意性的,而不是限制性的,本发明的保护范围由权利要求书进行限定。 Examples of the above-described embodiments and description of the preferred embodiments are merely illustrative, and not restrictive, the scope of the invention be defined by the claims. 在不脱离本发明权利要求书所限定的范围内,可作出多种变型和组合。 In the present invention as claimed without departing from the scope defined by the claims, various modifications may be made and combinations thereof. 不应当认为这些变型背离了本发明的宗旨和范围,而应当认为它们都包含在本发明的权利要求书中。 Such variations are not to be considered a departure from the spirit and scope of the present invention, but rather that they are included in the present invention as claimed in the claims.

Claims (27)

  1. 1. 1. 一种复合金属线,其特征在于:一个贵金属环形部分焊接到包含导电非贵金属的金属线芯部上。 A composite metal wire, characterized in that: a noble metal portion welded to the annular core portion comprising a conductive metal wire non-noble metals.
  2. 2. 2. 根据权利要求1所述的复合金属线,其特征在于:所述芯部金属是铜。 The composite metal wire according to claim 1, characterized in that: said core metal is copper.
  3. 3. 3. 根据权利要求1所述的复合金属线,其特征在于:它是通过对将所述贵金属焊接在所述芯部金属上而构成的复合挤压型材进行拉制而成的。 Metal composite wire according to claim 1, characterized in that: it is obtained by coextrusion of the profile of the noble metal is welded to the core metal is drawn from constituted of.
  4. 4. 4. 根据权利要求1所述的复合金属线,其特征在于:芯部占整个横截面面积的比例大约是25-95%。 Metal composite wire according to claim 1, characterized in that: the proportion of the total core cross-sectional area is about 25-95%.
  5. 5. 5. 根据权利要求1所述的复合金属线,其特征在于:其直径大约为15-75微米。 Metal composite wire according to claim 1, wherein: a diameter of about 15-75 microns.
  6. 6. 6. 根据权利要求1所述的复合金属线,其特征在于:所述贵金属环形部分包括金。 The composite metal wire according to claim 1, characterized in that: said annular portion of the noble metal comprises gold.
  7. 7. 7. 根据权利要求6所述的复合金属线,其特征在于:所述贵金属是含金至少99%的金合金。 Metal composite wire according to claim 6, wherein: the noble metal is at least 99% of the gold and gold alloy.
  8. 8. 8. 根据权利要求7所述的复合金属线,其特征在于:所述金合金包括掺杂有小于30ppm的钙、小于20ppm的铍和小于50ppm的其它元素的金。 Metal composite wire according to claim 7, wherein: said metal alloy comprises less than 30ppm is doped with calcium, beryllium, gold is less than 20ppm and 50ppm less than the other elements.
  9. 9. 9. 根据权利要求8所述的复合金属线,其特征在于:所述金合金包括小于10ppm的铍和小于10ppm的钙。 Metal composite wire according to claim 8, wherein: said metal alloy comprises less than 10ppm calcium and beryllium to less than 10ppm.
  10. 10. 10. 根据权利要求7所述的复合金属线,其特征在于:所述芯部金属和所述金合金的熔融温度在5℃以内。 Metal composite wire according to claim 7, wherein: the melting temperature of the core metal and the gold alloy is within 5 ℃.
  11. 11. 11. 根据权利要求1所述的复合金属线,其特征在于:所述金属线的弹性模量约大于95Gpa。 Metal composite wire according to claim 1, wherein: the elastic modulus of the metal wire is greater than about 95 GPa.
  12. 12. 12. 一种制造微米尺寸复合金属线的方法,该复合金属线主要由包含非贵金属的导电金属线芯部和附着在芯部上的贵金属环形部分构成,其特征在于,所述方法包括以下步骤:(A)提供直径大约为0.5-5mm的第一复合金属线,其中,第一复合金属线主要由焊接到包含非贵金属的金属线芯部上的贵金属环形部分构成;以及(B)将第一复合金属线拉拔成直径约为15-75微米的第二复合金属线,其中,第二复合金属线芯部所占横截面面积的比例基本上与第一复合金属线的芯部比例相同。 A method of manufacturing a micron-size metal composite wire, the composite wire is mainly composed of noble metal portion on the annular core portion comprises a non-noble conductive metal wire core and attachment portion, characterized in that the method comprises the steps of :( a) providing a first diameter of approximately 0.5-5mm composite metal wire, wherein the first composite mainly composed of metal wire welded to the annular portion comprises a noble metal of non-noble metal constituting the core portion; and (B) a first composite a second metal wire drawing a composite wire diameter of about 15-75 microns, wherein the second composite metallic core occupies a cross-section substantially the same as the ratio of the sectional area ratio of the first portion of the composite metal core wire.
  13. 13. 13. 根据权利要求12所述的方法,其特征在于:所述芯部金属是铜。 The method of claim 12, wherein: said core metal is copper.
  14. 14. 14. 根据权利要求13所述的方法,其特征在于:所述贵金属包括金。 The method according to claim 13, wherein: said noble metal comprises gold.
  15. 15. 15. 根据权利要求14所述的方法,其特征在于:所述贵金属是含金至少99%的金合金。 The method according to claim 14, wherein: the noble metal is at least 99% of the gold and gold alloy.
  16. 16. 16. 根据权利要求15所述的方法,其特征在于:所述金合金包括掺杂有小于30ppm的钙、小于20ppm的铍和小于50ppm的其它元素的金。 The method according to claim 15, wherein: said metal alloy comprises less than 30ppm is doped with calcium, beryllium, gold is less than 20ppm and 50ppm less than the other elements.
  17. 17. 17. 根据权利要求16所述的方法,其特征在于:所述金合金包括掺杂有小于10ppm的铍和小于10ppm的钙的金。 The method according to claim 16, wherein: said gold alloy including beryllium doped with less than 10ppm and 10ppm calcium less than gold.
  18. 18. 18. 根据权利要求14所述的方法,其特征在于:所述芯部金属和所述金合金的熔融温度在5℃以内。 The method according to claim 14, wherein: the melting temperature of the core metal and the gold alloy is within 5 ℃.
  19. 19. 19. 根据权利要求12所述的方法,其特征在于:所述第一复合金属线的芯部占整个横截面面积的比例约为25-95%。 The method according to claim 12, wherein: the core portion of the first composite metal wire the total cross-sectional area ratio of about 25-95%.
  20. 20. 20. 根据权利要求12所述的方法,其特征在于:第一复合金属线由复合棒材拉制而成,其中复合棒材主要由包含所述非贵金属的芯部、所述贵金属中间层和外部金属层构成,然后除去掉所述外部金属层,其中,由所述棒材的芯部和中间层限定的圆柱体芯部比例基本上与所述第一和第二复合金属线的芯部比例相同。 The method according to claim 12, wherein: a first metal wire drawn composite rods made from composite, wherein the composite rods containing the non-noble metal mainly composed of a core portion, said intermediate layer and an outer noble metal layer is formed, and then remove the other outer metal layer, wherein the ratio of the cylindrical portion of the core rod by the core and the intermediate layer is substantially the same ratio defined by the first and second composite metallic core wire .
  21. 21. twenty one. 根据权利要求20所述的方法,其特征在于:所述棒材通过用力挤压复合坯料而成,其中,所述复合坯料主要由所述非贵金属芯部、所述贵金属中间层和与所述棒材外部金属层相对应的外部金属层构成,由所述坯料的芯部和中间层限定的圆柱体芯部比例基本上与所述棒材的芯部比例和所述第一、第二复合金属线的芯部比例相同。 The method according to claim 20, wherein: said rod is made by pressing hard composite billet, wherein the composite billet mainly by the non-precious metal core, the intermediate layer and the noble metal bar outer metal layer corresponding to the outer metal layer, the ratio of the cylinder core by a core portion of the blank and the intermediate layer substantially defined by the ratio of the core portion of the rod and the first, second composite the same proportion of the metal core wire.
  22. 22. twenty two. 根据权利要求21所述的方法,其特征在于:在挤压之前,将所述坯料预热到大约200-700℃。 The method according to claim 21, wherein: prior to extrusion, the billet is preheated to about 200-700 ℃.
  23. 23. twenty three. 根据权利要求21所述的方法,其特征在于:所述坯料以大约50-200kg/mm2的力进行挤压。 The method according to claim 21, wherein: said blank with a force of approximately 50-200kg / mm2 is pressed.
  24. 24. twenty four. 一种具有微米尺寸直径的复合金属线,其特征在于:其由权利要求12所述的方法制成。 A composite metal wire having a diameter of micron sized, characterized in that: it is made by the method of claim 12.
  25. 25. 25. 一种半导体封装组件,其特征在于:至少一个导线与权利要求1所述的复合金属线相连。 A semiconductor package assembly, comprising: at least one composite metal wire and wire according to claim 1 is connected.
  26. 26. 26. 根据权利要求25所述的半导体封装组件,其特征在于:所述导线楔入连接到所述复合金属线中。 The semiconductor package according to claim 25, wherein: said wedge wire connected to the composite metal wires.
  27. 27. 27. 根据权利要求26所述的半导体封装组件,其特征在于:所述复合金属线的芯部主要由铜构成。 The semiconductor package assembly according to claim 26, wherein: the core of the composite metal wire mainly made of copper.
CN 99810940 1998-09-16 1999-09-16 Compsite wire with noble metal cladding CN1187189C (en)

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US6610930B1 (en) * 1998-09-16 2003-08-26 Kulicke & Soffa Investments, Inc. Composite noble metal wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102226991A (en) * 2011-06-12 2011-10-26 徐云管 Copper palladium alloy monocrystal bonding wire and manufacturing method thereof
CN102226991B (en) 2011-06-12 2012-11-28 徐云管 Copper palladium alloy monocrystal bonding wire and manufacturing method thereof
CN107041160A (en) * 2015-02-26 2017-08-11 日铁住金新材料股份有限公司 Bonding wire for semiconductor devices
US10032741B2 (en) 2015-02-26 2018-07-24 Nippon Micrometal Corporation Bonding wire for semiconductor device

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JP2002524887A (en) 2002-08-06 application
EP1115565A1 (en) 2001-07-18 application
US6610930B1 (en) 2003-08-26 grant
WO2000015429A9 (en) 2001-07-12 application
CN1187189C (en) 2005-02-02 grant
WO2000015429A8 (en) 2000-06-08 application
US20040065468A1 (en) 2004-04-08 application
WO2000015429A1 (en) 2000-03-23 application

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