CN1317352C - Binder used for preparing clay-like brazing filler - Google Patents
Binder used for preparing clay-like brazing filler Download PDFInfo
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- CN1317352C CN1317352C CNB2005100360900A CN200510036090A CN1317352C CN 1317352 C CN1317352 C CN 1317352C CN B2005100360900 A CNB2005100360900 A CN B2005100360900A CN 200510036090 A CN200510036090 A CN 200510036090A CN 1317352 C CN1317352 C CN 1317352C
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- binding agent
- solder
- clay
- brazing filler
- adhesive
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Abstract
The present invention discloses an adhesive for preparing clay-like solder. The present invention is characterized in that the adhesive has the components with the weight mixture ratios of 1-20% of C10-30 alkyl group methacrylate crosslinking copolymers, 1-10% of glycerol and 70 to 98% of other solvents, wherein the other solvent is formed by that at least one of deionized water, butyldiglycol, diethylene glycol monoethyl ether, 1, 2-propylene glycol and 2, 4-hexylene glycol is prepared. Clay-like solder made from the adhesive of the present invention has the advantages of good performance, environmental protection and convenient manufacture and use; the clay-like solder can be rolled into adhesive tape solder with required width and thickness, can also be directly daubed on a place to be soldered or coated, and can still be used on metallic surfaces to form various technological patterns; then, vacuum coating or sintering technology is used for forming different artwork, and the use function of the solder is greatly widened; the clay-like solder (self fluxing alloys) can be used in vacuum soldering and vacuum fusion sintering technology to form soldering surfaces or coatings with good and stable quality and clean surfaces.
Description
Technical field
The present invention relates to a kind of binding agent that solder is used of making, relate in particular to a kind of making and have the polymer agent of plastic solder, can be mixed and made into clay-like brazing filler respectively with nickel-based solder powder, cobalt-based solder powder, manganese based solder powder, copper base solder powder, the vacuum brazing, repairing and the pricker that are used for complicated metal construction are coated with; This binding agent also can mix with various self-melting alloy, is used for vacuum sintering (or gas shiled clinkering) technology, makes various wear-and corrosion-resistant coatings.
Background technology
At present, the form of solder generally has sheet, thread and Powdered three kinds of forms.Various Ni-based, the cobalt-based that is used for that high temperature brazing uses, manganese base and copper base solder also are useful on the various self-melting alloy that vacuum sintering (or gas shiled clinkering) technology is used, and be generally all more crisp, often with the pulverulence supply.During use, use, usually these powdered alloys (120 orders~800 orders) and various binding agents are mixed and made into paste or adhesive tape shape, Here it is our usually said paste solder (or soldering paste) and adhesive tape solder for convenient.The general soldering paste that uses of the spot welding of small area and seam weldering; And the general adhesive tape solder that adopts of large-area soldering and repairing.
Publication number is that the Chinese patent of CN1580170A discloses a kind of binding agent that the adhesive tape solder is used of making.This binding agent does not meet environmental requirement owing to adopt trichloromethane, ethylene dichloride etc. that the organic solvent of irritating smell is arranged, and in addition, the fabrication cycle of this binding agent is longer, and flow process is also more loaded down with trivial details.
Make various wear-and corrosion-resistant coatings at workpiece surface, often adopt vacuum sintering (or gas shiled clinkering) technology.Various self-fluxing alloyed powders need to spread upon workpiece surface with after binding agent mixes.The making method of this binding agent is a certain proportion of rosin is dissolved in the turpentine and makes.This binding agent has two problems: 1. rosin thermal degradation in vacuum or gas shiled environment is not thorough, and postwelding leaves a spot of residual, and this residue can influence clinkering (or pricker is coated with) effect.2. rosin decomposes volatile matter in condensation process, and the meeting absorption is around the furnace wall, and this bring difficulty can for the cleaning of furnace wall.
In addition, for the soldering of some complex partses, particularly when some surfaces of complex shape are made the wear-and corrosion-resistant coating, use soldering paste and adhesive tape solder all not quite convenient.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of binding agent that clay-like brazing filler is used of making, the excellent property of this binding agent, environmental protection, making and easy to use.
The technical scheme that the present invention solves the problems of the technologies described above is, adopt a kind of binding agent that clay-like brazing filler is used of making, the component of this binding agent and weight proportion thereof are: C10-30 alkyl acrylate cross-linking copolymer 1~20%, glycerine 1~10%, other solvent 70~98%.
The preferred weight proportioning of this each component of binding agent is: C10-30 alkyl acrylate cross-linking copolymer 5~12%, glycerine 3~8%, other solvent 80~92%.
Described other solvent is by deionized water, diethylene glycol monobutyl ether, Diethylene Glycol monohexyl ether, 1,2-propylene glycol, 2, at least a formulated in the 4-hexylene glycol.
Below be two embodiment of binding agent of the present invention:
Embodiment one: C10-30 alkyl acrylate cross-linking copolymer 10%, glycerine 5%, diethylene glycol monobutyl ether 85%.This binding agent belongs to the slow curing type.
Embodiment two: C10-30 alkyl acrylate cross-linking copolymer 11%, glycerine 6%, deionized water 83%.This binding agent belongs to quick-dry type.
Compare with prior art, binding agent excellent property, the function that making clay-like brazing filler of the present invention is used is more, manufacture craft is easier, simultaneously compliance with environmental protection requirements; This binding agent and various solder powder or self-fluxing alloyed powder mix, just can form the extremely strong clay-like brazing filler of plasticity-, both can be rolled into the adhesive tape solder of required width and thickness, can directly spread upon to be brazed again or pricker is coated with the place, this is when adopting vacuum sintering technology to make the surfaces of complex shape coating, and is very convenient.In addition, use this clay-like brazing filler to form various art pattern CADs in the metallic surface, as calligraphy, drawing etc., adopt the vacuum pricker to be coated with then or clinkering technology forms various artwork, this has widened the functions of use of solder greatly; In vacuum brazing and vacuum sintering technology, use this clay-like brazing filler (self-fluxing alloy) can form the face of weld or the coating of superior in quality, stable and surface clean.
Embodiment
The present invention is further illustrated below in conjunction with embodiment.
The binding agent that making clay-like brazing filler of the present invention is used adopts the main body of C10-30 alkyl acrylate cross-linking copolymer as binding agent, the product of the product that this C10-30 alkyl acrylate cross-linking copolymer can select Noveon U.S.A company to produce Carbopol 1342, Carbopol EDT 2020 by name, Carbopol Ultrez 10, Carbopol Ultrez 21 etc.; Solvent adopts glycerine, also has " other solvent " in addition: deionized water, diethylene glycol monobutyl ether, Diethylene Glycol monohexyl ether, 1,2-propylene glycol, 2,4-hexylene glycol etc.These solvents in " other solvent " may be used alone, can also be used in combination.
C10-30 alkyl acrylate cross-linking copolymer expands to be dissolved in and forms a kind of special paste viscous gel, binding agent promptly of the present invention in the above-mentioned solvent.This binding agent of heating under vacuum or gas shiled condition; C10-30 alkyl acrylate cross-linking copolymer in the binding agent can resolve into gas fully and stay any residue hardly, thereby binding agent of the present invention is specially adapted to vacuum brazing (pricker is coated with) and vacuum sintering technology.
C10-30 alkyl acrylate cross-linking copolymer shared weight percent in binding agent is 1~20%.When content less than 1% the time, can not form effective gel, when content greater than 20% the time, then because of too dense thick can't the mixing of gel with metal-powder.The optimum content of C10-30 alkyl acrylate cross-linking copolymer in binding agent is 5~12%.
Glycerine shared weight percent in binding agent is 1~10%, and optimized percentage is 3~8%.
" other solvent " shared weight percent in the binding agent is 70~98%, and preferred percent is 80~92%.Be elected to when using deionized water to be " other solvent ", can be mixed with the rapid-drying properties binding agent; When selecting diethylene glycol monobutyl ether, Diethylene Glycol monohexyl ether, 1 for use, when 2-propylene glycol, 2, one or more in the 4-hexylene glycol are " other solvent ", can be mixed with the binding agent of different evaporation rates.
Use binding agent of the present invention to mix, can be made into clay-like brazing filler (self-fluxing alloy) with various solder powders of-120 order to 800 purposes or self-fluxing alloyed powder.Wherein metal-powder accounts for 85~95%, and binding agent accounts for 5~15% (weight percents).
Below be binding agent of the present invention and use this tackiness agent to be mixed with two embodiment of clay-like brazing filler:
Embodiment one
The mixing in glass beaker with 5g glycerine and 85g diethylene glycol monobutyl ether, then 10g C10-30 alkyl acrylate cross-linking copolymer Carbopol 1342 powder are sprinkled upon above-mentioned solution surface, after copolymer powder is moistening, slowly stir said mixture again, up to forming the gel binding agent.
Take by weighing the 900g nickel-based solder, mix with above-mentioned 100g binding agent, slowly stirring and twisting are even, can form the argillaceous nickel-based solder.This argillaceous nickel-based solder belongs to slow curing, in close not busy container, can keep more than 1 year.
Embodiment two
The mixing in glass beaker with 6g glycerine and 83g deionized water, 11g C10-30 alkyl acrylate cross-linking copolymer Carbopol Ultrez 10 powder are sprinkled upon above-mentioned solution surface, after treating that copolymer powder is moistening, slowly stir said mixture again, up to forming the gel binding agent.
Take by weighing the 900g self-fluxing alloyed powder, mix with above-mentioned 100g binding agent, slowly stirring and twisting are even, can form the argillaceous self-fluxing alloy.This argillaceous self-fluxing alloy belongs to quick-dry type, can be applied in various surfaces of complex shape easily, and this uses in vacuum sintering technology will be very easy.
Claims (5)
1, a kind ofly makes the binding agent that clay-like brazing filler is used, it is characterized in that the component of this binding agent and weight proportion thereof are: C10-30 alkyl acrylate cross-linking copolymer 1~20%, glycerine 1~10%, other solvent 70~98%.
2,, the binding agent used of making clay-like brazing filler according to claim 1, it is characterized in that the preferred weight proportioning of this each component of binding agent is: C10-30 alkyl acrylate cross-linking copolymer 5~12%, glycerine 3~8%, other solvent 80~92%.
3, the binding agent used of making clay-like brazing filler according to claim 1 and 2, it is characterized in that, described other solvent is by deionized water, diethylene glycol monobutyl ether, Diethylene Glycol monohexyl ether, 1,2-propylene glycol, 2, at least a formulated in the 4-hexylene glycol.
4, the binding agent used of making clay-like brazing filler according to claim 3 is characterized in that each component of this binding agent and weight proportion thereof are: C10-30 alkyl acrylate cross-linking copolymer 10%, glycerine 5%, diethylene glycol monobutyl ether 85%.
5, the binding agent used of making clay-like brazing filler according to claim 3 is characterized in that each component of this binding agent and weight proportion thereof are: C10-30 alkyl acrylate cross-linking copolymer 11%, glycerine 6%, deionized water 83%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100360900A CN1317352C (en) | 2005-07-18 | 2005-07-18 | Binder used for preparing clay-like brazing filler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100360900A CN1317352C (en) | 2005-07-18 | 2005-07-18 | Binder used for preparing clay-like brazing filler |
Publications (2)
Publication Number | Publication Date |
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CN1757692A CN1757692A (en) | 2006-04-12 |
CN1317352C true CN1317352C (en) | 2007-05-23 |
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CNB2005100360900A Expired - Fee Related CN1317352C (en) | 2005-07-18 | 2005-07-18 | Binder used for preparing clay-like brazing filler |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US7632570B2 (en) * | 2006-09-20 | 2009-12-15 | Ppg Industries Ohio, Inc. | Aqueous resinous binders |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000079496A (en) * | 1998-09-03 | 2000-03-21 | Furukawa Electric Co Ltd:The | Binder resin used in paste for brazing aluminum material, paste for brazing aluminum material and aluminum material |
US6053396A (en) * | 1996-11-08 | 2000-04-25 | Toyo Riken Corporation | Scale formation-inhibitory agents used in welding treatments and method for inhibiting formation of a scale in a welding treatment of metal parts |
JP2005028400A (en) * | 2003-07-11 | 2005-02-03 | Mitsubishi Alum Co Ltd | Brazing binder and heat exchanger member |
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2005
- 2005-07-18 CN CNB2005100360900A patent/CN1317352C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6053396A (en) * | 1996-11-08 | 2000-04-25 | Toyo Riken Corporation | Scale formation-inhibitory agents used in welding treatments and method for inhibiting formation of a scale in a welding treatment of metal parts |
JP2000079496A (en) * | 1998-09-03 | 2000-03-21 | Furukawa Electric Co Ltd:The | Binder resin used in paste for brazing aluminum material, paste for brazing aluminum material and aluminum material |
JP2005028400A (en) * | 2003-07-11 | 2005-02-03 | Mitsubishi Alum Co Ltd | Brazing binder and heat exchanger member |
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