CN1297136A - Optical method and instrument for testing pins of integrated circuit - Google Patents
Optical method and instrument for testing pins of integrated circuit Download PDFInfo
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- CN1297136A CN1297136A CN 00121569 CN00121569A CN1297136A CN 1297136 A CN1297136 A CN 1297136A CN 00121569 CN00121569 CN 00121569 CN 00121569 A CN00121569 A CN 00121569A CN 1297136 A CN1297136 A CN 1297136A
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- integrated circuit
- stitch
- spectroscope
- laser
- source device
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Abstract
A 3D-space optical method and instrument for detecting the pins of integrated circuit (IC) features that the autocontrolled shifter, laser source, splitter, laser spot detector, and position sensing system are used to take the image of IC carrier and its pins and process it, so judging the failure of IC pins, their bending points and height.
Description
The present invention relates to a kind of method and detecting instrument that detects quality, inflection point and the height of integrated circuit stitch with optical principle.
Flourish along with integrated circuit (IC) industry, the QC operation of integrated circuit (IC) also day show important, and for high-quality integrated circuit component is provided, detection how to carry out integrated circuit component in large quantities and has apace become an important problem.
Detected the integrated circuit stitch in the past good not, when inflection point and height etc., utilizes projection arrangement and the image of gained is done visual processing and realize, but this kind processing mode usefulness is very low, inapplicable for the production in enormous quantitiesization of integrated circuit component.
The purpose of this invention is to provide a kind of detection speed fast solid space optical profile type integrated circuit stitch detection method and detecting instrument.
For reaching above-mentioned purpose, the present invention adopts following detection method:
The present invention utilizes automatic control mobile device and optical alignment sensing apparatus and optical pick-up apparatus, take and handle the pedestal of detected integrated circuit and the image of stitch, and judge the integrated circuit stitch good not, inflection point and height, it can increase substantially integrated circuit stitch detection efficiency by the computer software of robotization optical detection apparatus and judgement usefulness.
Realize that the used instrument of the inventive method includes automatic control mobile device, laser source device, laser spot detector, spectroscope, lens combination and location sensing Reconnaissance system, laser source device and laser spot detector are located at respectively on the X-axis and Y-axis of automatic control mobile device, on the light path of laser source device, spectroscope is set, lens combination and location sensing Reconnaissance system is set in a side.
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is that the system of the first embodiment of the present invention constitutes vertical view.
Fig. 2 is the system shown in Figure 1 fundamental diagram.
Fig. 3 is that the system of the second embodiment of the present invention constitutes vertical view.
Fig. 4 is the fundamental diagram of system shown in Figure 3.
Fig. 5 is another variation synoptic diagram of system shown in Figure 3.
Fig. 6 is the fundamental diagram of the system of the third embodiment of the present invention.
Fig. 7 is system works flow process figure of the present invention.
1 ', 80 be integrated circuit, 11 ', 81 for the integrated circuit stitch, 2 ' for spectroscope, 3 ', 20 for laser source device, 4 ', 30 for laser spot detector, 5 ', 40 for lens combination, 6 ', 50 for location sensing Reconnaissance system, 7 ' for fine motion refraction scanner, 71 ' for eyeglass, 10 for composite prism optical splitter, 90 be two prisms, 8 ' is to control mobile device automatically, and 10 ' is spectroscope.
As Fig. 1, shown in Figure 2, the first embodiment of the present invention is can do on the automatic control mobile device 8 ' that directions X and Y direction move one, laser source device 3 ' and laser spot detector 4 ' are set respectively on X-axis and Y-axis, and on the laser optical path of laser source device 3 ', spectroscope 2 ' is set, and lens combination 5 ' and location sensing Reconnaissance system 6 ' are set in a side, it detects integrated circuit 1 ' by lens combination 5 ' and location sensing Reconnaissance system 6 ', simultaneously with laser source device 3 ' through spectroscope 2 ' to integrated circuit stitch 11 ' projecting laser, take the situation of integrated circuit stitch 11 ' again with laser spot detector 4 ', analyze its situation by computer software again, and the height of judgement integrated circuit stitch and good.
Though said method can be judged integrated circuit stitch 11 ' and have or not the overview of bending and height, but it is to perform an analysis with respect to pick-up unit that the height of its stitch is judged, if integrated circuit is placed not at ordinary times, then may make stitch produce error and judge by accident with respect to the relative position relation between integrated circuit pedestal and stitch and pick-up unit, in order just accurately to judge the height situation of integrated circuit stitch, provide one second embodiment below with respect to the integrated circuit pedestal.
As Fig. 3, Fig. 4 and shown in Figure 5, be the second embodiment of the present invention, be to do on the automatic control mobile device 60 that directions X and Y direction move one, laser source device 20 is set on X-axis, and two groups of lens combination 40 and two groups location sensing Reconnaissance systems 50 are set on Y direction, these two groups location sensing Reconnaissance systems are detected the height of integrated circuit 80 pedestals and stitch 81 respectively, and laser source device 20 is by to composite prism spectroscope 10 (as shown in Figure 4) or two prisms 90 and spectroscope 10 (shown in Figure 5) projecting laser, and produce reflection respectively and take in images by laser spot detector 30 at integrated circuit 80 pedestals and stitch 81, the relative height that so can correctly compare pedestal and stitch 81 is made more accurate stitch height and is judged.This detection is to advise one by one by driving on X and the Y direction and detect being contained in each integrated circuit on the storing tray 70, and the application of matching computer software again can form the large batch of integrated circuit detection system of high speed.
But above-mentioned first, second embodiment only can do the judgement of single luminous point or two luminous points, and its restriction is arranged on judging efficiency, can not do the scanning of wire or planar luminous point and judge.
As shown in Figure 6, be the third embodiment of the present invention, its detection system includes a location sensing system, is made of lens combination 5 ' and location sensing Reconnaissance system 6 ', and a mobile device is that detection system is moved to the detection position; One laser source device 3 ' is used for the projecting laser light beam; One spectroscope 2 ' is used for handling the projecting direction and the projection amount of laser; One fine motion refraction scanner 7 ' which is provided with one by the eyeglass 71 ' that step motor drove, and can do the fine motion at the bottom of the set angle, and laser beam is done the fine motion projection of multiple spot; One laser spot detector 4 ' is taken in the fine motion projection situation of aforementioned multiple spot; By aforementioned system integrated circuit 1 ' pedestal and stitch 11 ' are done wire even planar scanning, its scanning back is painted to the stitch image with software, the different different height of color representative, because of pedestal and stitch 11 ' are taken in simultaneously, therefore, can detect stitch good not, inflection point and with respect to the height of the stitch 11 ' of pedestal, can do multiple detection, its effect is better.
Above-mentioned three treatment schemees of implementing exemplary system, as shown in Figure 7, startup power supply at first, then laser sensor (laser source device) is made zero, then the laser spot detector is made zero, then will locate the sensing Reconnaissance system makes zero, follow the testing integrated circuit components position, then take in the locating area inverted image, then judge whether coincidence detection of inverted image zone, as do not meet and then adjust spectroscope, as meet then and take in integrated circuit component by the laser spot detector through spectroscope, then judge stitch position and stitch quality, as for defective products then terminator promptly finish, as then laser beam being projeced into the integrated circuit stitch, then judge the height of stitch, as then detection system is moved to the not detection limit of integrated circuit for non-defective unit for non-defective unit, as the program that then ends for defective products, when each side has been surveyed, the end of a period program, and carry out the detection of next integrated circuit.
Wherein the judgement of the detection of integrated circuit stitch quality and stitch height can separate or carry out simultaneously.
Claims (5)
1. solid space optical profile type integrated circuit stitch detection method, it is the height by the lens combination on the X-axis of being located at automatic control mobile device and location sensing Reconnaissance system detecting integrated circuit pedestal and stitch thereof, and be arranged on spectroscope that the laser source device on the X-axis of automatic control mobile device is provided with on its light path to integrated circuit stitch projecting laser, integrated circuit pedestal and stitch produce reflection respectively and the situation of taking the integrated circuit stitch by the laser spot detector of being located on the Y-axis, by the computer software analysis, judge the good of integrated circuit stitch again, inflection point and height situation.
2. realize the used detecting instrument of the described method of claim 1, it is characterized in that: it includes automatic control mobile device, laser source device, laser spot detector, spectroscope, lens combination and location sensing Reconnaissance system, wherein, laser source device and laser spot detector are located at respectively on the X-axis and Y-axis of automatic control mobile device, on the light path of laser source device, spectroscope is set, lens combination and location sensing Reconnaissance system is set in a side.
3. according to the described detecting instrument of claim 2, it is characterized in that: said lens combination and location sensing Reconnaissance system are two groups.
4. according to the described detecting instrument of claim 2, it is characterized in that: said spectroscope is composite prism spectroscope or two prisms and spectroscope.
5. according to the described detecting instrument of claim 2, it is characterized in that: fine motion refraction scanner is set on the laser projections path between said laser source device and the spectroscope, which is provided with one by eyeglass that step motor drove, do the fine motion of set angle, and laser beam is done the fine motion projection of multiple spot.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00121569 CN1114089C (en) | 2000-08-14 | 2000-08-14 | Optical method and instrument for testing pins of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00121569 CN1114089C (en) | 2000-08-14 | 2000-08-14 | Optical method and instrument for testing pins of integrated circuit |
Publications (2)
Publication Number | Publication Date |
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CN1297136A true CN1297136A (en) | 2001-05-30 |
CN1114089C CN1114089C (en) | 2003-07-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 00121569 Expired - Fee Related CN1114089C (en) | 2000-08-14 | 2000-08-14 | Optical method and instrument for testing pins of integrated circuit |
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CN (1) | CN1114089C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854063A (en) * | 2011-06-30 | 2013-01-02 | 苏州品翔电通有限公司 | Anti-bending test device |
CN108982513A (en) * | 2018-07-11 | 2018-12-11 | 天津工业大学 | A kind of high-precision three-dimensional connector stitch defect inspection method based on line laser structured light |
-
2000
- 2000-08-14 CN CN 00121569 patent/CN1114089C/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854063A (en) * | 2011-06-30 | 2013-01-02 | 苏州品翔电通有限公司 | Anti-bending test device |
CN102854063B (en) * | 2011-06-30 | 2015-04-15 | 苏州品翔电通有限公司 | Anti-bending test device |
CN108982513A (en) * | 2018-07-11 | 2018-12-11 | 天津工业大学 | A kind of high-precision three-dimensional connector stitch defect inspection method based on line laser structured light |
CN108982513B (en) * | 2018-07-11 | 2021-05-07 | 天津工业大学 | High-precision three-dimensional connector pin defect detection method based on line laser scanning |
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Publication number | Publication date |
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CN1114089C (en) | 2003-07-09 |
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