CN1290887C - Wear-resisting phenolic resin without dirt-water discharge and preparation method thereof - Google Patents
Wear-resisting phenolic resin without dirt-water discharge and preparation method thereof Download PDFInfo
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- CN1290887C CN1290887C CN 200410025829 CN200410025829A CN1290887C CN 1290887 C CN1290887 C CN 1290887C CN 200410025829 CN200410025829 CN 200410025829 CN 200410025829 A CN200410025829 A CN 200410025829A CN 1290887 C CN1290887 C CN 1290887C
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Abstract
The present invention relates to a preparation method of wear-resistance phenolic resin, particularly to a phenolic resin preparation method without sewage discharge. The present invention is characterized in that phenol, solid paraformaldehyde, polyamide and catalysts are used as raw materials to prepare the phenolic resin through copolycondensation. The wear-resistance phenolic resin without sewage discharge has the characteristics: (1) the vacuum pumping is not needed and the preparation process does not have sewage discharge; (2) the solid content is between 75% and 85%, and the solidification is rapid at a forming temperature; (3) the resin polyamide with high wear resistance is adopted, so the compatibility is increased and the boundary strength is high so that the wear resistance of the wear-resistance phenolic resin is good. When pulley standard components prepared by the wear-resistance phenolic resin without sewage discharge are adopted, the wear-resisting property of the pulleys of service aircrafts achieves requirements of Russian standards OCT100628-73 and OCT100629-73. The phenolic resin without sewage discharge can be used for preparing molding materials, adhesive, foamed plastic, coating, composite material components, honeycomb plastic, insulation materials, ion exchange resin, etc.
Description
Affiliated technical field: the present invention relates to wear-resisting resol of a kind of without sewage discharge and preparation method thereof, mainly adopting phenol, solid polyformaldehyde, polymeric amide is raw material, prepares by copolycondensation.
Background technology: at present,, need to adopt resol in a lot of fields.It can be used for making moulding compound, stratified plastics, porous plastics, cellularpiston, various matrix material, tackiness agent, coating, ion exchange resin etc.Phenoplast are cheap, raw material is easy to get, and over-all properties is better.
But domestic and international conventional novolak resin all adopts aqueous solution formaldehyde, needs the vacuum hydro-extraction discharging behind the synthetic production resin, contains free phenol, aldehyde, alcohol in the water, and the sewage pollution rivers and lakes of discharging destroy environment and ecology; And phenoplast are crisp, and its use is restricted.
Summary of the invention: for avoiding the defective of conventional art, the present invention proposes wear-resisting resol of a kind of without sewage discharge and preparation method thereof, major advantage is not vacuumize without sewage discharge in the preparation process; The solids content height.The resol that makes of the aqua-solution method of Shi Yonging now, solids content are generally between 45~55%, and the solids content of without sewage discharge resol is between 75~85%, and its resin content height solidifies under mold temperature fast, and preparation technology is easier; Polyamide resin itself is a high abrasion resin, by the copolycondensation modified phenolic resins, makes the polyamide resin methylolation.Methylolation makes between polyamide resin and the resol can graft copolymerization, and consistency increases, and the biphase interface is fuzzy, the boundary strength height.Such microtexture more helps the toughness reinforcing of resol, makes its wear resistance good.
The invention is characterized in: material component is phenol 100 mass parts, solid polyformaldehyde 40~45 mass parts, polymeric amide 10~20 mass parts, catalyzer 2~6 mass parts.
Catalyzer is a hydrated barta.
The preparation method of above-mentioned resol is characterized in that: make by following steps:
A: at device agitator is arranged, with the phenol heating and melting, Heating temperature is about 50 ~ 60 ℃ in the reactor of reflux exchanger, and carries out in stirring;
B: add catalyzer, polyamide resin, solid polyformaldehyde, be warming up to 80~90 ℃ with speed with 1~5 ℃/min;
C: under above-mentioned temperature of reaction, react, obtain yellow to beige transparent glue.
Reaction obtains yellow to the gelation time control of beige transparent glue with reactant, and the gelation time of control reactant is 80~120s on 50 ± 1 ℃ set plate.
The characteristics of the resol of the present invention's development are need not vacuumize without sewage discharge in (1) preparation process; (2) solids content height, the resol that makes of the aqua-solution method of Shi Yonging now, solids content is generally between 45~55%, and the solids content of without sewage discharge resol is between 75~85%, its resin content height, solidify fast under mold temperature, preparation technology is easier, is suitable for scale operation; (3) polyamide resin itself is a high abrasion resin, and by the copolycondensation modified phenolic resins, methylolation makes between polyamide resin and the resol can graft copolymerization, and consistency increases, and the biphase interface is fuzzy, the boundary strength height.Such microtexture more helps the toughness reinforcing of resol, makes its wear resistance good.Adopt the pulley standardized component of the wear-resisting resol preparation of without sewage discharge, make the wear resisting property of military aircraft pulley reach Russia standard OCT
100628-73, OCT
1The requirement of 00629-73 is for phenoplast, the matrix material of development high comprehensive performance have been created prerequisite.
Description of drawings:
Fig. 1: embodiment synoptic diagram
Fig. 2: the wear-resisting resol of without sewage discharge (curing) fracture SEM photo
Embodiment:
Now 1 couple of the present invention is further described in conjunction with the accompanying drawings:
Umber among the embodiment 1:(embodiment is weight part)
1, at device agitator is arranged, add 50 parts of phenol in the reactor of reflux exchanger, make phenol heating and fusion under agitation.
2, in aforesaid liquid, add 2 parts of catalyzer, 8 parts of polyamide resins, 20 parts of solid polyformaldehydes, be warming up to 80~90 ℃ with the speed of 1~5 ℃/min;
3, reacted 2.5 hours under above-mentioned temperature of reaction, recording gelation time on 50 ± 1 ℃ set plate is 80~110s,, obtain yellow to beige transparent glue.
Embodiment 2:
1, at device agitator is arranged, add 50 parts of phenol in the reactor of reflux exchanger, make phenol heating and fusion under agitation.
2, in aforesaid liquid, add 3 parts of catalyzer, 9 parts of polyamide resins, 22 parts of solid polyformaldehydes, be warming up to 80~90 ℃ with the speed of 1~5 ℃/min;
3, reacted 2.9 hours under above-mentioned temperature of reaction, recording gelation time on 50 ± 1 ℃ set plate is 80~120s,, obtain yellow to beige transparent glue.
Prepared resol solids content is 75~85%, the infrared spectra comparison of this resin and aqua-solution method resol can be found out, the structural similitude of without sewage discharge resol and aqua-solution method resol, just without sewage discharge resol is not at 1050cm
-1The charateristic avsorption band of dimethylene ehter bond appears in the place.Fig. 2 is the wear-resisting resol of without sewage discharge (curing) fracture SEM photo.
Claims (4)
1, the wear-resisting resol of a kind of without sewage discharge is characterized in that: material component is phenol 100 mass parts, solid polyformaldehyde 40~45 mass parts, polymeric amide 10~20 mass parts, catalyzer 2~6 mass parts.
2, the wear-resisting resol of without sewage discharge according to claim 1 is characterized in that: catalyzer is a hydrated barta.
3, a kind of preparation method who realizes the described without sewage discharge resol of claim 1 is characterized in that:
A: at device agitator is arranged, with the phenol heating and melting, Heating temperature is about 50 ~ 60 ℃ in the reactor of reflux exchanger, and carries out in stirring;
B: add catalyzer, polyamide resin, solid polyformaldehyde, be warming up to 80~90 ℃ with speed with 1~5 ℃/min;
C: under above-mentioned temperature of reaction, react, obtain yellow to beige transparent glue.
4, preparation method according to claim 3 is characterized in that: reaction obtains yellow to the gelation time control of beige transparent glue with reactant, and the gelation time of control reactant is 80~120s on 50 ± 1 ℃ set plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200410025829 CN1290887C (en) | 2004-01-16 | 2004-01-16 | Wear-resisting phenolic resin without dirt-water discharge and preparation method thereof |
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CN 200410025829 CN1290887C (en) | 2004-01-16 | 2004-01-16 | Wear-resisting phenolic resin without dirt-water discharge and preparation method thereof |
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CN1640904A CN1640904A (en) | 2005-07-20 |
CN1290887C true CN1290887C (en) | 2006-12-20 |
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CN 200410025829 Expired - Fee Related CN1290887C (en) | 2004-01-16 | 2004-01-16 | Wear-resisting phenolic resin without dirt-water discharge and preparation method thereof |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104641293B (en) * | 2012-09-18 | 2019-04-19 | 旭化成株式会社 | Photosensitive polymer combination |
CN105348461A (en) * | 2015-12-29 | 2016-02-24 | 珠海市斗门福联造型材料实业有限公司 | Special high-strength modified phenolic resin adhesive for precoated sand and preparation method of special high-strength modified phenolic resin adhesive |
CN111471149A (en) * | 2020-05-19 | 2020-07-31 | 安徽凯沃科技有限公司 | Silicon modified phenolic resin and preparation method thereof |
CN111471150A (en) * | 2020-05-22 | 2020-07-31 | 安徽凯沃科技有限公司 | Modified phenolic resin and preparation method thereof |
CN115505083A (en) * | 2022-10-09 | 2022-12-23 | 南通百川新材料有限公司 | Nylon modified phenolic resin and preparation method thereof |
CN115785360B (en) * | 2023-02-02 | 2023-05-16 | 山东诚汇新材料有限公司 | Low-abrasion phenolic resin with high strength and high toughness and synthesis process thereof |
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