CN1290205C - Light-emitting diode evenly emitting light around - Google Patents
Light-emitting diode evenly emitting light around Download PDFInfo
- Publication number
- CN1290205C CN1290205C CNB031137229A CN03113722A CN1290205C CN 1290205 C CN1290205 C CN 1290205C CN B031137229 A CNB031137229 A CN B031137229A CN 03113722 A CN03113722 A CN 03113722A CN 1290205 C CN1290205 C CN 1290205C
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- CN
- China
- Prior art keywords
- light
- emitting diode
- cladding
- concave
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to a light emitting diode evenly emitting light around, which comprises a light emitting diode wafer, a transparent coating body and a wiring foot and is characterized in that the top of the coating body is an invaginated concave body. Due to the fact that the present invention uses the structure that the top of the coating body is set up for the invaginated concave body, and the optical diffusion characteristic of the invaginated concave body is skillfully utilized, which makes light rays sent by the light emitting diode wafer evenly transmitted from the circumference of the coating body after refracted by multiple surfaces of the invaginated concave body, the circumference of the invaginated concave body can emit the light. Moreover, the coating body has the advantages of simple structure, simple manufacture, low production cost and good decorative effect. Simultaneously, in order to further enhance the decorative effect, the coating body can be set up for colored bodies with different colors. The present invention can emit the light around, has the advantages of simple structure, easy manufacture, low production cost and good decorative effect and can be widely applied to the field of various novel decorative lamps.
Description
Technical field
The present invention relates to a kind of light-emitting diode, particularly a kind of to around luminous uniform light-emitting diode.
Background technology
Along with the continuous development and the peculiar low-voltage driving of light-emitting diode itself of light-emitting diode chip for backlight unit technology, do not generate heat, be difficult for advantages such as fragmentation, make it in various novel modulator Application for Field more and more widely, especially the application in various decorative lamps is more remarkable.Yet general its top of present known light-emitting diode is cambered outwards circular-arc cladding, the effect of optically focused is arranged because of the circular-arc cladding of evagination, therefore the light that is sent all is positive front end emission type, the light visual angle is little, and light undue concentration in the front end active zone, dazzling sensation is arranged, and the outer light intensity of active zone die-offs, the user from around the light seen very weak, influence its result of use. these shortcomings for a change, the someone adopts the method for the shape change of cladding, as is designed to the evagination brilliant, the evagination polygonal or around the cladding design concavo-convex point etc. is arranged, though these structures are because of interception of rays, also can see some light around it, but because its cladding end shape is always male type, therefore most light still in the past end-fire go out, light all around still a little less than, result of use is relatively poor.The patent No. is that the Chinese patent of ZL98248959 also disclosed a kind of light-emitting diode; the method of little bead is added in employing in cladding; when emission light when running into little bead because of the relation of refract light and the effect of many little beades; a part of light is emitted around diode; but because the proportion of little bead is different with the proportion of the epoxy resin of cladding; add man-hour little bead usually can skewness; cause the phenomenon of luminance nonuniformity; and manufacturing procedure is loaded down with trivial details, therefore also is difficult to be accepted by manufacturer and consumer.
Summary of the invention
The objective of the invention is problem at above-mentioned existence, provide a kind of to around luminous evenly, good decorating effect, and light-emitting diode simple in structure, that making is simple and easy, production cost is low.
Technical scheme of the present invention is achieved in that
A kind of to around luminous light-emitting diode, comprise light-emitting diode chip for backlight unit, transparent cladding, leg, be characterized in that described transparent cladding top is the sinking concave body of cone angle between 100 °～160 °.
The shape of the shape of described cladding and top concave volume thereof can design arbitrarily as required, cladding is a cylindrical tube as described, its concave volume can be made as taper concave volume or semicircle concave volume, and when concave volume is the taper concave volume, for making it to luminous more even all around, the optimized angle of the cone angle of above-mentioned sinking concave body is between 130 °～140 °.
For strengthening its decorative effect, described cladding is a colored body.
The present invention is owing to adopt the cladding top to be set to sinking concave body or the semicircle concave volume structure of cone angle between 100 °～160 °, utilized the optics diffusion property of sinking concave body dexterously, the light that light-emitting diode chip for backlight unit is sent reflects and evenly emitting around cladding through the multiaspect of sinking concave body, thereby make the present invention luminous evenly all around, and it is simple in structure, make simple and easy, production cost is low, good decorating effect, the light that has solved existing light-emitting diode effectively is that positive front end emission or most of end-fire in the past go out, all around light a little less than, problems such as result of use difference.Be further to strengthen its decorative effect simultaneously, described cladding can be made as colored body.The present invention to around luminous evenly, good decorating effect, and simple in structure, making is simple and easy, production cost is low, can be widely used in the various novel decorative lamps field.
The present invention is described in further detail below in conjunction with accompanying drawing;
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a vertical view of the present invention;
Fig. 3 is an A-A cutaway view of the present invention;
Fig. 4 is a user mode optical principle schematic diagram of the present invention;
Fig. 5 is that the present invention is a structural representation blue, white luminous pipe.
Embodiment
As Fig. 1 and shown in Figure 3, the present invention includes light-emitting diode chip for backlight unit 1, leg 3, transparent cladding, for making leg 3 be difficult for from transparent cladding, deviating from, electrode suppor 31 is made on the top of described leg 3, wherein said cladding is made for adopting epoxide resin material, for the light that light-emitting diode chip for backlight unit 1 is sent is concentrated forward more, an above-mentioned electrode suppor 31 be provided with can ccontaining light-emitting diode chip for backlight unit 1 recess 311, the upper end of above-mentioned electrode suppor 31 links to each other with light-emitting diode chip for backlight unit 1 in another electrode suppor 31 recess 311 with a lead, as shown in Figure 4, for making it can satisfy user's needs, can be to luminous all around, and it is luminous even, strengthen decorative effect, described cladding top is made as the sinking concave body of cone angle between 100 °～160 °, because it has utilized the optics diffusion property of sinking concave body dexterously, thereby when sinking concave body is arrived in the light direct projection that above-mentioned light-emitting diode chip for backlight unit 1 is sent, described sinking concave body can carry out the multiaspect refraction to light, light is evenly emitted around cladding 2, thereby make it luminous evenly all around, and light intensity is sufficient and not dazzling, the light effects uniqueness, ornamental strong.Described cladding can be difform body simultaneously, as can be the semicircle shape body; Also can be cylindric body 2.For making it easy to use, the cylindric body 2 of general employing, and the shape of described body 2 top concave volumes can design arbitrarily as required, and concave volume can be made as taper concave volume 21 as described, and described taper concave volume 21 can be coniform concave volume or the imitative polygon pyramid concave volume that bores shape; Described concave volume also can be made as semicircle concave volume.As shown in Figure 3, when described concave volume is taper concave volume 21, for better guaranteeing its result of use, its cone angle can not too greatly can not be too little, because too big or too little then light-emitting diode chip for backlight unit 1 direct projection of cone angle goes out light intensity deficiency around it to the then most end-fire in the past of the light on the concave volume 21, influence its result of use, learn that according to optical principle the cone angle of above-mentioned concave volume 21 is more suitable when being 100 °～160 °, wherein its cone angle best results in the time of 130 °～140 °.Be further to strengthen its decorative effect, described cladding 2 can be made the colored body of various different colours according to user's needs, and the light that the color of described cladding 2 and light-emitting diode chip for backlight unit 1 are sent is homochromy.As shown in Figure 3, for the user need be other colour light emitting pipe that removes blue or white the time, described light-emitting diode structure schematic diagram; As shown in Figure 5, for the user need be blue or white luminous pipe the time, described light-emitting diode structure schematic diagram.
Claims (10)
1, a kind of to around luminous uniform light-emitting diode, comprise light-emitting diode chip for backlight unit (1), leg (3), transparent cladding, it is characterized in that described transparent cladding top is the sinking concave body of cone angle between 100 °～160 °.
2, light-emitting diode according to claim 1 it is characterized in that described transparent cladding is cylindrical tube (2), and the concave volume at described body (2) top is taper concave volume (21).
3, light-emitting diode according to claim 2 is characterized in that the concave volume at described body (2) top is coniform concave volume.
4, light-emitting diode according to claim 2 is characterized in that the concave volume at described body (2) top is the imitative polygon pyramid concave volume that bores shape.
5, light-emitting diode according to claim 1, the cone angle that it is characterized in that above-mentioned sinking concave body is between 130 °～140 °.
6, light-emitting diode according to claim 1 is characterized in that described cladding is a colored body, and the light that the color of described cladding and light-emitting diode chip for backlight unit (1) are sent is homochromy.
7, light-emitting diode according to claim 1 is characterized in that described leg (3) top makes electrode suppor (31), wherein an electrode suppor (31) be provided with can ccontaining light-emitting diode chip for backlight unit (1) recess (311).
8, a kind of to around luminous uniform light-emitting diode, comprise light-emitting diode chip for backlight unit (1), leg (3), transparent cladding, it is characterized in that described transparent cladding is cylindrical tube (2), and described body (2) top is semicircle concave volume.
9, light-emitting diode according to claim 8 is characterized in that described cladding is a colored body, and the light that the color of described cladding and light-emitting diode chip for backlight unit (1) are sent is homochromy.
10, light-emitting diode according to claim 8 is characterized in that described leg (3) top makes electrode suppor (31), wherein an electrode suppor (31) be provided with can ccontaining light-emitting diode chip for backlight unit (1) recess (311).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031137229A CN1290205C (en) | 2003-01-30 | 2003-01-30 | Light-emitting diode evenly emitting light around |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031137229A CN1290205C (en) | 2003-01-30 | 2003-01-30 | Light-emitting diode evenly emitting light around |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1445868A CN1445868A (en) | 2003-10-01 |
| CN1290205C true CN1290205C (en) | 2006-12-13 |
Family
ID=27814738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031137229A Expired - Fee Related CN1290205C (en) | 2003-01-30 | 2003-01-30 | Light-emitting diode evenly emitting light around |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1290205C (en) |
-
2003
- 2003-01-30 CN CNB031137229A patent/CN1290205C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1445868A (en) | 2003-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Changzhou Star Sea Electronics Co., Ltd. Assignor: Xu Peixin Contract fulfillment period: 2006.12.28 to 2012.12.27 contract change Contract record no.: 2008320000897 Denomination of invention: Light-emitting diode evenly emitting light around Granted publication date: 20061213 License type: Exclusive license Record date: 20081013 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2006.12.28 TO 2012.12.27; CHANGE OF CONTRACT Name of requester: CHANGZHOU XINGHAI ELECTRONICS CO., LTD. Effective date: 20081013 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061213 Termination date: 20150130 |
|
| EXPY | Termination of patent right or utility model |