CN1289129A - Platable end paste for chip inductor - Google Patents
Platable end paste for chip inductor Download PDFInfo
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- CN1289129A CN1289129A CN 00117535 CN00117535A CN1289129A CN 1289129 A CN1289129 A CN 1289129A CN 00117535 CN00117535 CN 00117535 CN 00117535 A CN00117535 A CN 00117535A CN 1289129 A CN1289129 A CN 1289129A
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Abstract
The present invention relates to a platable end sluury for sheet inducer, and is characterized by that it is formed from organic carrier, glass powder, leveling agent, antisettling agent, flake silver powder and bead silver powder. Said invention possesses good matching propenty of slurry material and sheet slurry body, possesses good thixotropy and fluidity, and is uniform and fine, the sheet inducer made up by using said invented slurry material does not produce sagging and crack, has no pin-hole, and bubble, its appearance after fired is bright and beautiful, its structure is compact and conductivity is good.
Description
The present invention relates to a kind of Platable end paste for chip inductor.
Development along with miniaturization, slimming, lightweight and the surface mounting technology (SMT) of electronic product, chip component is also and then advanced by leaps and bounds, the ratio that whole world chip component use amount accounts for the chip type electronic component increases year by year, accounted for 21% market in 1985, reach 40% to nineteen ninety, and still increasing substantially, now reaching about 80%.Chip inductor is as one of three big chip components, and development is same swift and violent.But the import chip inductor costs an arm and a leg with the platable end paste material, and has thixotropy and mobile less-than-ideal problem.
Purpose of the present invention is exactly at above-mentioned the deficiencies in the prior art part, provide the matching performance of a kind of slurry and sheet sense slurry good, have good thixotropy, flowability, and it is evenly fine and smooth, the chip inductor made from this slurry not sagging, do not ftracture, free of pinholes, no bubble, burn till back outward appearance light, compact structure, the Platable end paste for chip inductor that electric conductivity is good.
The object of the present invention is achieved like this: a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition.Its percentage by weight is: organic carrier 15-25%, glass dust 3-8%, levelling agent 1-5%, antisettling agent 1-5%, flake silver powder 20-40%, spherical silver powder 40-60%.Described glass dust comprises ZnO45-60%, SiO
210-20%, B
2O
310-20%, PbO
2-10%, other oxide Co
2O
3Or MnO
2Or NiO1-5% forms.Described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent 50-70%, cosolvent 5-10%, cellulose derivative 10-20%, dispersant 0.5-2%, plasticizer 0.1-5%, anti-sag agent 0.5-2%, defoamer 0.5-5%, rosin 5-10%.Described organic carrier main solvent is a terpinol, and cosolvent is a butane etc., and cellulose derivative is a methylcellulose, and dispersant is the sulfonic acid class, and plasticizer is that dibutyl phthalate, defoamer are 3,5, and the 5-trimethyl is alcohol.A kind of preparation method of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth.
Purpose of the present invention also can be achieved like this: a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition.Its percentage by weight is: organic carrier 15-25%, glass dust 3-8%, levelling agent 1-5%, antisettling agent 1-5%, flake silver powder 20-40%, spherical silver powder 40-60%.Described glass dust comprises ZnO45-60%, SiO
210-20%, B
2O
310-20%, PbO2-10%, other oxide Co
2O
3Or MnO
2Or NiO1-5% forms.Described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent 50-70%, cosolvent 5-10%, cellulose derivative 10-20%, dispersant 0.5-2%, plasticizer 0.1-5%, anti-sag agent 0.5-2%, defoamer 0.5-5%, rosin 5-10%.Described organic carrier main solvent is a terpinol, and cosolvent is a butane etc., and the fiber rope derivative is an ethyl cellulose, and dispersant is that polyvinyl alcohol, plasticizer are that dibutyl phthalate, defoamer are 3,5, the 5-trimethyl hexanol.A kind of preparation method of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth.
The drawing of accompanying drawing is described as follows:
Fig. 1 is a process chart of the present invention,
Fig. 2 is sintering curve figure of the present invention,
Fig. 3 is that complete silver-colored platable end paste of the present invention is coated on when surface state diagram of sheet sense porcelain body,
Fig. 4 is the dried model that adheres to of the present invention,
Fig. 5 is the termination state diagram behind the sintering of the present invention,
Fig. 6 is R of the present invention
1Thermal analysis curve,
Fig. 7 is R of the present invention
3Thermal analysis curve,
Fig. 8 is R of the present invention
4Thermal analysis curve,
Fig. 9 is R of the present invention
1And R
2Thermal analysis curve,
Figure 10 is a process chart of the present invention,
Table 1 is R of the present invention
1: R
2The resin comparison diagram,
Table 2 is tests of the present invention,
Table 3 is tests of the present invention,
Table 4 is ball of the present invention, sheet test,
Table 5 is that the present invention compares with the data of external similar slurry.
The present invention is described in further detail below in conjunction with accompanying drawing, table and embodiment:
Selection and prescription to the organic carrier in the Platable end paste for chip inductor, silver powder, inorganic binder have proposed requirement.The typical process flow of its production technology is seen Fig. 1, and operation and technological parameter thereof in this production technology are as follows:
End-blocking: 230 ℃ ± 20 ℃ of baking temperatures (10min)
Burn till: burn 870 ± 20 ℃ of high temperature section 10～15min duration 40～80min of temperature
Electroplate: acid electroplating plating Ni PH3～50～60 ℃ of 40～80min of 4 temperature
Plating Sn-Pb PH2～18～25 ℃ of 40～80min of 3 temperature
According to technological process, technological requirement and use equipment, Platable end paste for chip inductor is required: 1, slurry has suitable surface tension, should be able to the complete wetting porcelain body, form continuous metal cladding.2, slurry should have suitable viscosity, and good flowability, thixotropy, levelability are in case good surface appearance and suitable silver thickness are hung and guaranteed to have in fluid stopping.3, organic carrier should possess suitable evaporation curve in the slurry, to adapt to the drying curve of production line.4, inorganic binder should have suitable vitrification point, to adapt to the sintering curve of production line.5, the termination is burnt till back silver layer densification, is not had cracking, flat appearance light, and between silver layer and porcelain body certain adhesive force should be arranged.6, the plating performance that tool is good is not extended bridge joint.7, do not influence the electrical property of chip inductor.
And E.I.Du Pont Company's 1183 senses platable end paste technical indicator is as follows:
Viscosity: 10～30pas (BROOKFIELD HBDV-II+, 10rpm, CP52,25 ℃)
Tenor: 72 ± 2%
Solid content: 77 ± 1%
Baking temperature: 230 ± 20 ℃ of 10min
Firing temperature: 850～890 ℃ of high temperature section 10～15min
Pulling force:＞10N
In sum, the specific requirement of the Platable end paste for chip inductor of the present invention's development is as follows:
Viscosity: 10～30pas (BROOKFIELD HBDV-II+, 10rpm, CP52,25 ℃)
Tenor: 65～75%
Solid content: 70～80%
Baking temperature: 230 ± 20 ℃ of 10min
Firing temperature: 850～890 ℃ of high temperature section 10～15min
Pulling force:＞10N
Below to the structure of slurry and the changing condition when using do one and analyze:
Fig. 3 is that complete silver-colored platable end paste is coated on the sheet sense porcelain body state in when surface.As seen from the figure, the silver slurry is made up of organic carrier, silver powder, inorganic binder, and silver powder and inorganic binder evenly are suspended in the organic carrier.
Fig. 4 is the dried model that adheres to.At this moment, most of solvent volatilizees, and silver powder and inorganic bond belong to physical absorption attached on the sheet sense porcelain body.
Fig. 5 is the termination state behind the sintering.At this moment, organic carrier burns down fully, and inorganic binder flows at intermetallic after high temperature melting, through physics and chemical action, it is enriched between silver layer and the sheet sense porcelain body and forms third phase, forms firm bonded areas after cooling, and making between silver layer and sheet sensillary base body has enough adhesive force.
According to above-mentioned analysis, formula test of the present invention also launches from organic carrier, silver powder, these three aspects of inorganic binder.
Formula test requires as follows to organic carrier:
A, organic carrier can soak into sheet sensillary base body.
B, can provide suitable viscosity.
C, can provide good rheologic behavio(u)r.
The volatilization temperature scope of d, broad is suitable for the bake out temperature curve.
The kind of resin and content will influence the viscosity of organic carrier, to the wettability of porcelain body, and to the wettability and the suspension of silver powder.For this reason, adopt R
1: R
2Two kinds of similar resins, wherein R
1Resin viscosity is low, R
2The resin viscosity height.After both ratios of test, see Table 1.
As shown in Table 1, adopt R
1: R
2Be fit to make sheet sense platable end paste at=1: 1.Simultaneously,, also require resin when sintering, can decompose fully, do not stay carbon residue, and the temperature that requires to decompose fully is lower than the inorganic bond softening temperature in the termination for improving the electric conductivity of termination electrode.For this reason, to R
1Done thermal analysis curve (as Fig. 6), the result who obtains is R
1, R
2Can decompose fully in the past at 550 ℃, meet the requirements.In order to increase the dry tenacity and the adhesive force of oven dry follower head, increased part R again
3, R
4Two kinds of resins (its thermal analysis curve such as Fig. 7,8) and plasticizer D
BBehind selected above-mentioned material, selected for use R
1And R
2The D of tool fine solubility and tool good solvent release property
EMake main solvent.In order to obtain the volatilization temperature scope of broad, added lower boiling S again
1Make second solvent, simultaneously S
1To regulating viscosity effect is arranged very also.For reducing the surface tension at carrier and metal powder grain interface, make the surface of the abundant wetting metal powder grain of organic carrier energy, be beneficial to the dispersion of metal powder, organic carrier has also added surfactant S
2The adding of antisettling agent M then can keep slurry not produce precipitation in storage, makes slurry stable in one period.In addition, also added the anti-sag agent, regulating the thixotropy of slurry, because be scattered in can become agent and can form irregular network structure in the slurry, the warm-up movement of prevention molecule segment and molecule can make the edge, termination after the coating smooth, the elimination sagging.
In sum, in the organic carrier of preparation, with R
1And R
2Two kinds of resins are main, with D
EBe main solvent, S
1Be cosolvent, add auxiliary rheological agents and other surfactant etc. simultaneously.After making above-mentioned organic carrier, it has been carried out hot analysis, result such as Fig. 9.As can be seen from Figure, it is since about 80 ℃ volatilizations.It is the fastest to volatilize in the time of 170～210 ℃, just conforms to technological requirement.To about 230 ℃, solvent volatilizees substantially.Decompose in that 300～350 ℃ of resins are also most of, decompose fully to 550 ℃ of organic carriers, do not have any residual.From the heat analysis, the organic carrier volatility range broad of being prepared, and can decompose fully, can satisfy the development requirement.
Silver powder: the quality of sheet sense platable end paste and the shape of silver powder, particle diameter, specific area, dispersiveness and powdery density have substantial connection, and can these performances of silver powder will determine obtain the end slurry of favorable dispersibility.Can obtain the favorable conductive rate, pile up fine and close metal level, and the good outward appearance of burning till.For this reason, ground silver powder has carried out a large amount of tests.At first, try out different ball silver, seen Table 2:
Secondly, sheet silver is compared, sees Table 3:
For obtaining the metal level of compact structure, ball sheet silver ratio is tested, according to result of the test, selected Q for use
2Ball silver, F
2Sheet silver, its characteristic index sees Table 4.And ball, sheet silver ratio fixed on 1: 1.
Inorganic filler, its effect mainly contains two aspects: the one, can reduce silver-colored sintering temperature; The 2nd, can increase the adhesive strength between silver layer and substrate.According to the development requirement of slurry, it has proposed following requirement to inorganic binder:
1, for adapting to the sintering curve of sheet sense, its softening point should be between 550～700 ℃.
2, also must under acid condition, electroplate after burning till because of the sheet sense, therefore require inorganic binder corrosion-resistant, acidproof.
3, help being connected of silver layer and porcelain body, make chip inductor that enough adhesive strengths be arranged.
Through after the test of many times, select ZnO-B
2O
3-PbO-SiO
2Be glass, can find out that it has softening ruckbildung to occur in the time of 580 ℃ from the thermal expansion curve.After softening, it can soak into silver powder particles and porcelain body gradually, and segment glass can be enriched in the junction of silver layer and porcelain body simultaneously, can satisfy the needs of slurry.
In sum, organic carrier, silver powder, inorganic binder have been determined.Make the combination that can reach best between organic carrier, silver powder, the inorganic binder.
The preparation technology of slurry: sheet sense platable end paste adopts three rod milling trains preparations, and it is even to have a slurry, and the efficient advantages of higher is seen Figure 10.
Pulp property: 1, through above-mentioned formula test and make the test of many times of each technology, the present invention has following advantage: A, slurry has good rheological, and processing range is wide.The inductance outward appearance of being made is good, no sag and cracking phenomena.After two skills that employing vacuumizes, eliminated the pin hole phenomenon fully.B, porcelain body, silver layer, coating are in conjunction with tight, and adhesive strength is higher.
The present invention compares with external similar slurry measured data, sees chart 5.
The present invention has compared to existing technology: 1, this end slurry can adapt to the mass production of chip inductor; 2, this end material manufacturing process is simple, steady quality, reliable, and production cost is low; 3, this end slurry performance index are located the leading position at home, reach Dupont 1183 levels, can the substituting import one slurry, realize domestic material.
Embodiment 1: a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition, its percentage by weight is: organic carrier 25%, glass dust 3%, levelling agent 1%, antisettling agent 1%, flake silver powder 20%, spherical silver powder 50%.Described glass dust comprises ZnO45%, SiO
220%, B
2O
320%, PbO10%, other oxide Co
2O
3Or MnO
2Or NiO5% forms.Described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent such as terpinol 50%, cosolvent such as butane 10%, cellulose derivative such as methylcellulose 20%, dispersant such as polyvinyl alcohol 2%, plasticizer such as dibutyl phthalate 3%, anti-sag agent 2%, defoamer are as 3,5,5-trimethyl hexanol 3%, rosin 10%.A kind of preparation method of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth get final product.
Embodiment 2: a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition, its percentage by weight is: organic carrier 15%, glass dust 3%, levelling agent 1%, antisettling agent 1%, flake silver powder 25%, spherical silver powder 55%.Described glass dust comprises ZnO60%, SiO
215%, B
2O
315%, PbO7%, other oxide Co
2O
3Or MnO
2Or NiO
3% forms.Described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent such as terpinol 60%, cosolvent such as butane 8%, cellulose derivative such as ethyl cellulose 14%, dispersant such as polyvinyl alcohol 2%, plasticizer such as dibutyl phthalate 5%, anti-sag agent 1%, defoamer are as 3,5,5-trimethyl hexanol 2%, rosin 8%.A kind of preparation method of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth get final product.
Embodiment 3: a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition, its percentage by weight is: organic carrier 20%, glass dust 6%, levelling agent 2%, antisettling agent 2%, flake silver powder 30%, spherical silver powder 40%.Described glass dust comprises ZnO55%, SiO
218%, B
2O
319%, PbO6%, other oxide Co
2O
3Or MnO
2Or NiO2% forms.Described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent such as terpinol 55%, cosolvent such as pentane 6%, cellulose derivative such as methylcellulose 19%, dispersant such as sulfonic acid class 2%, plasticizer such as dibutyl phthalate 5%, anti-sag agent 2%, defoamer are as 3,5, the 5-trimethyl is alcohol 5%, rosin 6%.A kind of preparation method of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth get final product.
Table 1
Table 2
Table 3
| Project | Q 1 | Q 2 | Q 3 |
| Particle diameter | 0.1～1μm | 0.5～ | 1～6μm |
| Particle mean size | 0.3μm | 1.2μm | 3μm |
| Specific area | 2.1m 2/g | 0.8m 2/g | 0.3m 2/g |
| Dispersed | Generally | Well | Well |
| Pattern | Subsphaeroidal | Subsphaeroidal | Subsphaeroidal |
| Impurity content | <100ppm | <100ppm | <100ppm |
| | 1. more difficult pulping, the higher back of 2. burning till of viscosity is bright fine and closely woven, but the edge is easy to crack | 1. it is good that 2. easy pulping burns till | 1. 2. the coarse 3. internal structure of outward appearance is loose for easy pulping |
| F 1 | F 2 | |
| Granularity | 1～ | 3～10μm |
| Particle mean size | 3.5μm | 6μm |
| Specific area | 1.3m 2/g | 0.6m 2/g |
| Dispersed | Well | Well |
| Pattern | Sheet | Sheet |
| Impurity content | <100ppm | <100ppm |
| | 1. easily 2. contraction burns till 3. densification of internal structure of appearance poor | 1. easily pulping 2. outward appearance better 3. internal structure is general |
Table 4
Table 5
| F 2 | Q 2 | |
| Granularity | 3～10μm | 0.5～3μm |
| Particle mean size | 6.0μm | 1.2μm |
| Specific area | 0.6m 2/g | 0.8m 2/g |
| Dispersed | Well | Well |
| Pattern | Sheet | Subsphaeroidal |
| Impurity content | <100ppm | <100ppm |
| IT-100 | ?1183 | |
| | 10～18pa．s/25℃ | ?10～30pa．s/25℃ |
| Tenor | 65～69％ | 70～74％ |
| Solid content | 73～75％ | 76～78％ |
| Average fineness | <7μm | <10μm |
| Drying condition | 230±20℃(10min) | 230±20℃(10min) |
| Sintering condition | 870±20℃(15min) | 870±20℃(15min) |
| Outward appearance | Well | Well |
| Bubble | Do not have | Do not have |
| Pin hole | Do not have | Do not have |
| Pulling force | >10N | >10N |
| Internal structure | Fine and close | Fine and close |
| Can weld, anti-weldering | Qualified | Qualified |
| Other electric property | Qualified | Qualified |
Claims (6)
1, a kind of Platable end paste for chip inductor, it comprises organic carrier, glass dust, levelling agent, antisettling agent, flake silver powder and spherical silver powder composition.
2, Platable end paste for chip inductor according to claim 1, its percentage by weight is: organic carrier 15-25%, glass dust 3-8%, levelling agent 1-5%, antisettling agent 1-5%, flake silver powder 20-40%, spherical silver powder 40-60%.
3, Platable end paste for chip inductor according to claim 1 is characterized in that described glass dust comprises ZnO45-60%, SiO
210-20%, B
2O
310-20%, PbO2-10%, other oxide Co
2O
3Or MnO
2Or NiO1-5% forms.
4, Platable end paste for chip inductor according to claim 1, it is characterized in that described organic carrier is by main solvent, cosolvent, cellulose derivative, dispersant, plasticizer, anti-sag agent, defoamer, rosin is formed, its percentage by weight is: main solvent 50-70%, cosolvent 5-10%, cellulose derivative 10-20%, dispersant 0.5-2%, plasticizer 0.1-5%, anti-sag agent 0.5-2%, defoamer 0.5-5%, rosin 5-10%.
5, Platable end paste for chip inductor according to claim 4, it is characterized in that described organic carrier main solvent is a terpinol, cosolvent is a butane etc., cellulose derivative is methyl or ethyl cellulose, dispersant is that sulfonic acid class or polyvinyl alcohol, plasticizer are that dibutyl phthalate, defoamer are 3,5, the 5-trimethyl is alcohol.
6, each method of a kind of system of Platable end paste for chip inductor, it is characterized in that it comprises the described various components of claim 1, crust → lamination → cutting → binder removal → burn till → chamfering → end-blocking → burning end → plating → test is moulded → dried by the fire to each component mixing → batching → curtain coating → one-tenth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001175351A CN1159732C (en) | 2000-10-30 | 2000-10-30 | Platable end paste for chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001175351A CN1159732C (en) | 2000-10-30 | 2000-10-30 | Platable end paste for chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1289129A true CN1289129A (en) | 2001-03-28 |
| CN1159732C CN1159732C (en) | 2004-07-28 |
Family
ID=4586896
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001175351A Expired - Fee Related CN1159732C (en) | 2000-10-30 | 2000-10-30 | Platable end paste for chip inductor |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385573C (en) * | 2003-04-21 | 2008-04-30 | 上海宝银电子材料有限公司 | Dedicated silve paste of stannum indium oxide and manufacturing method |
| CN101206957B (en) * | 2007-12-07 | 2010-04-21 | 宁波晶鑫电子材料有限公司 | Preparation of low temperature drying wafer capacitance electrode silver paste |
| CN101728002A (en) * | 2010-01-15 | 2010-06-09 | 贵阳晶华电子材料有限公司 | End-blocking slurry for flaky component |
| CN101604557B (en) * | 2008-06-11 | 2011-06-29 | 四川虹欧显示器件有限公司 | Conductive slurry and plasma display using same |
| CN102686523A (en) * | 2009-08-07 | 2012-09-19 | Lg化学株式会社 | Electrically conductive base plate and a production method for the same |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN104658634A (en) * | 2015-02-03 | 2015-05-27 | 四川银河星源科技有限公司 | Crystalline silicon solar battery back electrode silver paste and preparation method thereof |
-
2000
- 2000-10-30 CN CNB001175351A patent/CN1159732C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385573C (en) * | 2003-04-21 | 2008-04-30 | 上海宝银电子材料有限公司 | Dedicated silve paste of stannum indium oxide and manufacturing method |
| CN101206957B (en) * | 2007-12-07 | 2010-04-21 | 宁波晶鑫电子材料有限公司 | Preparation of low temperature drying wafer capacitance electrode silver paste |
| CN101604557B (en) * | 2008-06-11 | 2011-06-29 | 四川虹欧显示器件有限公司 | Conductive slurry and plasma display using same |
| CN102686523A (en) * | 2009-08-07 | 2012-09-19 | Lg化学株式会社 | Electrically conductive base plate and a production method for the same |
| CN101728002A (en) * | 2010-01-15 | 2010-06-09 | 贵阳晶华电子材料有限公司 | End-blocking slurry for flaky component |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN102842353B (en) * | 2012-08-14 | 2015-05-13 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN104658634A (en) * | 2015-02-03 | 2015-05-27 | 四川银河星源科技有限公司 | Crystalline silicon solar battery back electrode silver paste and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1159732C (en) | 2004-07-28 |
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