CN1285756C - Method for preparing wide caliber high-precision super-glossy aspheric surface - Google Patents
Method for preparing wide caliber high-precision super-glossy aspheric surface Download PDFInfo
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- CN1285756C CN1285756C CN 200310109906 CN200310109906A CN1285756C CN 1285756 C CN1285756 C CN 1285756C CN 200310109906 CN200310109906 CN 200310109906 CN 200310109906 A CN200310109906 A CN 200310109906A CN 1285756 C CN1285756 C CN 1285756C
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Abstract
The present invention relates to an aspheric surface processing technique which is to solve the problems that heavy caliber high precision super-smooth aspheric surfaces are very difficult to be processed, processing cycles are long and cost is high. Under the condition that sputtering power and the pressure of working gas are certain, firstly, the deposition rate of a target material is calibrated, and the speed of a rotary disk revolving mechanism is determined by the deposition rate according to the difference quantity of a spherical surface and an aspheric surface. Staying time T of points on a base of the spherical surface on a sputtering coating area is controlled through controlling the revolving speed at which the points on the base of the spherical surface penetrate through the sputtering target material. Films distributed according to certain space are coated on the base of the spherical surface, and the required surface shape of the aspheric surface is manufactured. The present invention solves the problems of traditional numerical control, strain disc polishing, etc., provides a method for preparing heavy caliber high precision super-smooth aspheric surfaces, which has the advantages of low surface roughness, high precision, short processing cycles and low cost, and is suitable for the processing of high precision super-smooth aspheric surfaces of big curvature radii, small offset and heavy calibers.
Description
Technical field: the invention belongs to the Optical manufacture technology field, relate to aspheric surface processing technology.
Background technology: shortening of operation wavelength improves the surface figure accuracy of optical element and the requirement of surfaceness thereupon.According to the criterion of the fair value of optical system square root of the variance, have only when total system residual accuracy requirement of ripple difference and operation wavelength linear.Because the scattering of light that causes of surfaceness and root mean square value just can be considered to the diffraction limited system less than λ/14 o'clock.Obviously, the biquadratic of the face shape wavelength of element is inversely proportional to, promptly along with the shortening of operation wavelength, the tiny flaw of optical element surface will have a strong impact on image quality.Since roentgen in 1895 found X ray, X ray optics was applied in the optical systems such as visual telescope, microscope and extreme ultraviolet projection lithography gradually.In order to improve the performance of system, need to introduce non-spherical reflector.But, because the wavelength of extreme ultraviolet (EUV), soft X-ray is very short, therefore higher to the requirement of aspheric surface figure accuracy and surfaceness, such as in the extreme ultraviolet projection lithography system, requiring aspheric surface figure accuracy is nanometer scale, and surfaceness is inferior nanometer scale.And aspheric surface processing technology such as employing at present are difficult to satisfy above-mentioned requirements.
Summary of the invention:, the objective of the invention is to solve aperture aspherical processing technologies such as traditional numerical control and strain disc polishing and bring the high and low problem of precision of surfaceness at existing the requirement height of aspheric surface figure accuracy and surfaceness, the problem of aspherical mirror machining difficulty in the above-mentioned background technology; Next solves traditional problem that the aspheric surface processing technology process-cycle is long, cost is high.For this reason, the present invention will provide the novel aspheric surface processing technology that a kind of surfaceness is low, precision is high, the process-cycle is short, cost is low.
For achieving the above object, feature of the present invention is: at first spherical substrate is placed on the sample table, utilize the velocity modulation technology to control the thickness spatial distribution then: promptly under the certain condition of sputtering power and working gas pressure, at first the sedimentation rate of target is calibrated, again according to sphere and aspheric measures of dispersion, utilize sedimentation rate to determine the speed of rotating disk revolution mechanism, revolution speed by each point process sputtering target material on the control spherical substrate, thereby each point is at the residence time in sputter coating district T on the control spherical substrate, at the thicknesses of layers that spherical substrate coats, then make required aspheric surface by the certain space distribution.
Advantage of the present invention is: the aspheric surface according to design is made corresponding film thickness monitoring scheme; And then utilize high-precision thickness spatial distribution control techniques on high precision, ultra-smooth spherical substrate, to coat required aspheric surface.Thereby solved aperture aspherical processing technologies such as traditional numerical control and strain disc polishing and brought surfaceness height, precision is low, the process-cycle is long, cost is high problem; The heavy caliber high precision ultra-smooth aspheric surface that a kind of surfaceness is low, precision is high, the process-cycle is short, cost is low preparation method is provided.Bigbore high precision ultra-smooth sphere is compared easy processing with aspheric surface of the present invention; Simultaneously, plated film is to the almost not influence of roughness of spherical substrate, and plated film can not increase surfaceness on spherical substrate; And coating process is very ripe, can high-precision control space film thickness distribution, can on spherical substrate, coat bigbore surfaceness at nanometer scale, surface figure accuracy aspheric surface in inferior nanometer scale.
Description of drawings:
Fig. 1 is the synoptic diagram of an embodiment of the present invention structure.
Fig. 2 is the speed curve diagram of stepper-motor among the present invention
Embodiment is as shown in Figure 1:
The specific embodiment of the present invention is: the major advantage of magnetron sputtering technique is that the bonding force between rete and substrate is good, and sedimentation rate and deposition ion energy are easy to control, and sedimentation rate is stable.Compare with coating techniques such as electron beam evaporation, ion beam sputterings, the control accuracy and the repeatability precision of magnetron sputtering are higher, and its film thickness monitoring precision is in inferior nanometer scale, and repeatability precision is less than 1 .Therefore, utilize this technology can coat surfaceness at nanometer scale, surface figure accuracy aspheric surface in inferior nanometer scale.
The magnetron sputtering plating chamber of adopting is made up of rectangle magnetic control source 1, target 2, rotating disk 3, sample table 4, sample table free-wheeling system 5 and rotating disk revolution mechanism 6.Rectangle magnetic control source 1 adopts two groups of magnetic control sources to be separated by 180 ° respectively; Target 2 can be selected different targets for use according to the different needs that is coated with sample; Rotating disk 3 and sample table 4 adopt metallic substance to make; Sample table free-wheeling system 5 adopts the direct-current machine rotation system; Rotating disk revolution mechanism 6 adopts the stepper-motor rotation system.
Sample of the present invention adopts spherical substrate.Spherical substrate is placed on the sample table 4, and rotating disk 3 drive spherical substrate are through different coating film area, and revolution drive sample table 4 revolution by control rotating disk 3 make sample table 4 inswept targets 2, utilize the alternating sputtering plated film of two kinds of targets of revolution realization of rotating disk.In an embodiment of the present invention, needing the bore of preparation is φ 300 aspheric surfaces, and it is that symmetry is parabolic, and sputtering power is chosen as 200W, and working gas pressure is chosen as 4 * 10
-2Pa, target 2 may be selected to be Mo and Si material, make corresponding film thickness monitoring scheme according to aspheric surface: at first the sedimentation rate that is coated with material is calibrated, the sedimentation rate that draws Mo and Si is respectively: 1.43 /sec and 1.65 /sec.Again according to sphere and aspheric measures of dispersion, utilize sedimentation rate to determine velocity curve such as the Fig. 2 of stepper-motor in the rotating disk revolution mechanism 6, represent the central position of spherical substrate the zero point of its X-coordinate, other each points on the X-coordinate represent to depart from the amount at spherical substrate center; Its ordinate zou is represented the normalized velocity of rotating disk revolution, carries out normalization method with the speed at spherical substrate center.With above-mentioned stepper motor speed adjustment curve input plated film Controlling System, utilize computer-controlled stepper motor by the velocity modulation curvilinear motion, and then on the control spherical substrate each point through the revolution speed of sputtering target material, promptly control the time T that each point stops in the sputter coating district on the spherical substrate, on spherical substrate, obtain at last then making required aspheric surface by paraboloidal spatial distribution thicknesses of layers.
Claims (1)
1, heavy caliber high precision ultra-smooth aspheric surface preparation method, it is characterized in that step is as follows: under the certain condition of sputtering power and working gas pressure, at first the sedimentation rate of target is calibrated, again according to sphere and aspheric measures of dispersion, utilize sedimentation rate to determine the speed of rotating disk revolution mechanism, revolution speed by each point process sputtering target material on the control spherical substrate, thereby each point is at the residence time in sputter coating district T on the control spherical substrate, at the thicknesses of layers that spherical substrate coats, then make required aspheric surface by the certain space distribution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310109906 CN1285756C (en) | 2003-10-08 | 2003-10-08 | Method for preparing wide caliber high-precision super-glossy aspheric surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310109906 CN1285756C (en) | 2003-10-08 | 2003-10-08 | Method for preparing wide caliber high-precision super-glossy aspheric surface |
Publications (2)
| Publication Number | Publication Date |
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| CN1542161A CN1542161A (en) | 2004-11-03 |
| CN1285756C true CN1285756C (en) | 2006-11-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200310109906 Expired - Fee Related CN1285756C (en) | 2003-10-08 | 2003-10-08 | Method for preparing wide caliber high-precision super-glossy aspheric surface |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560384B (en) * | 2012-02-23 | 2013-12-11 | 成都精密光学工程研究中心 | Method for depositing nano dot matrix on surface of substrate |
| CN102776484B (en) * | 2012-06-27 | 2014-03-26 | 中国科学院光电技术研究所 | Design method of baffle for controlling distribution of film thickness of planar optical element in film coating planetary system |
| CN107052913B (en) * | 2017-05-31 | 2018-10-30 | 西安工业大学 | RB-SiC optical element polishing process processing methods |
| CN108468029B (en) * | 2018-02-12 | 2020-01-21 | 中国科学院国家天文台南京天文光学技术研究所 | Magnetron sputtering scanning method for silicon carbide optical mirror surface modification and surface shape lifting |
| CN114606468B (en) * | 2022-03-11 | 2023-03-31 | 业成科技（成都）有限公司 | Non-spherical film sputtering system |
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