CN1281104C - Printing circuit layout method, printing circuit board and electronic device - Google Patents
Printing circuit layout method, printing circuit board and electronic device Download PDFInfo
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- CN1281104C CN1281104C CN 200410057224 CN200410057224A CN1281104C CN 1281104 C CN1281104 C CN 1281104C CN 200410057224 CN200410057224 CN 200410057224 CN 200410057224 A CN200410057224 A CN 200410057224A CN 1281104 C CN1281104 C CN 1281104C
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Abstract
The present invention relates to a layout method for a printed circuit, a printed circuit board and an electronic device for reducing noise interference, which is mainly characterized in that a common element which is easy to radiate noise and an element which is easily disturbed by radiation are respectively arranged on two surface circuit layers of the printed circuit board directly or indirectly, and the two elements separately belong to different corresponding positions; earthing plane regions are respectively formed on a region position corresponding to one surface circuit layer provided with the element which is easily disturbed by radiation, on other at least two inner circuit layer of the printed circuit board and on the other surface circuit layer; the pressed earthing plane regions of each circuit layer are conducted by a plurality of blind holes so that each earthing plane region is connected with an earthing plane region above or below the earthing plane region, and the effect of earthing area increase is achieved. Therefore, the design is capable of effectively reducing signal interference caused by radiation from other elements for the element which is easily disturbed by radiation.
Description
Technical field
The present invention is relevant for a kind of printed circuit layout method and printed circuit board (PCB) that reduces noise jamming, outstanding assignment is closed and is arranged in the electronic installation, in order to mutual noise jamming between the element that reduces this electronic installation inside, with usefulness that promotes its electronic installation and the effect that receives signal.
Background technology
Present individual portable electronic device product is more and more universal on the market, individual accompanied electronic product miscellaneous, as personal digital assistant device, stock finance machine, digital camera, palmtop computer and intelligent mobile phone etc., in function and moulding, make every effort to invariably break through with perfect, obtaining consumer's favor, and promote the growth of achievement.
Wherein (Printed circuit board PCB) almost can appear in the middle of each electronic equipment printed circuit board (PCB), and except fixing various electronic components, the mutual electric current that the major function of PCB provides each item of the higher authorities connects.And along with electronic equipment becomes increasingly complex, the part that needs is more and more, and PCB the higher authorities' circuit and part are also more and more intensive.Therefore, in order to increase the area that can connect up, this PCB adopts a kind of multi-layer sheet (Multi-Layer Boards) structure at present mostly, and wherein multi-layer sheet uses several pieces double sided boards, and cements (pressing) after putting a layer insulating between every laminate.Which floor independently wiring layer is the number of plies of plank just represented, and the number of plies all is an even number usually, and comprises outermost two-layer.All there is wiring on the two sides of this circuit board.But to use the lead on two sides, must between the two sides, have suitable circuit to connect." bridge " between sort circuit is called guide hole (via).Guide hole is on PCB, is full of or the duck eye of coated with metal, and it can be connected with the lead on two sides.But in the middle of multi-layer sheet, if only want to connect the some of them circuit, guide hole may be wasted the circuit space of some other layers so.Buried via hole (Buried vias) and blind hole (Blind vias) technology can be avoided this problem, because which floor they only penetrate wherein.Blind hole is which floor inner PCB is connected with surperficial PCB, must not penetrate whole plank.Buried via hole then only connects inner PCB, so only can't see from the surface.In addition, the processing procedure of this printed circuit board (PCB) is made " substrate " beginning by glass epoxy resin (Glass Epoxy) or similar material, and it belongs to known technology, therefore, is not described further at this.
Moreover, in recent years since, follow the high speed of the high performance operating frequency of product, make unwanted radiation activity increase, and cause EMI (anti-electronic jamming) to enter harsh state.Again, follow popularizing of these electronic products, the EMI countermeasure of electronic product etc. is then more and more harsh.Though electronic product vigorous growth at present, but this electronic product in the use at present, so do not need in the radiation increase, electromagnetic environment can worsen more, and social concern such as the operating system of the problem that must cause causing usefulness to reduce as producing the phase mutual interference between the electronic component in: the electronic equipment, its picture displayed confusion, aircraft is uncontrollable; The research staff that some companies of manufacturer are wherein arranged is in order to consider miniaturization, slimming, the demand of light-weighted market that meets electronic product, and the area that can connect up with increase except the use multi-layer sheet on the PCB, on the layout of its PCB, also may electronic component be laid in the same one side of PCB with thickness that reduces whole PCB and the inner space that reduces its shared electronic product as far as possible; Or be on the layout of PCB, and reckon without the attribute that electronic component is relative to each other and he is laid in the same zone, therefore, cause element (for example: antenna or signal amplifier etc.) responsive to some and that be interfered easily can receive the interference of some not clear radiation signals and cause the situation of interpretation mistake or usefulness variation to take place; Yet the noise jamming that some are arranged but comes from some element on the PCB, make the element in this electronic installation that the problem that interferes with each other often be arranged, for this reason, noise limit then must be strengthened on the point of scope of activity, applicable object product etc., each company of manufacturer is then for passing through so restriction, via design, simulation and prediction technology etc., to scheme the lifting of product E MC performance; And EMC is with the electromagnetic environment of EMI (output noise side) and anti-interference (receiving the noise side) and save as purpose.
Summary of the invention
Main purpose of the present invention, be to provide a kind of printed circuit layout method and printed circuit board (PCB) that reduces noise jamming, be equipped with in electronic installation, with radiated noise interference mutually between the element that reduces this electronic installation inside, and effectively promote the usefulness of its electronic installation and the effect of reception signal.
For reaching above-mentioned purpose, the present invention discloses a kind of printed circuit layout method that reduces noise jamming, be implemented on a printed circuit board (PCB), this printed circuit board (PCB) combination has a plurality of circuit layers, comprise: have the internal circuit layer of one deck at least between the first surface circuit layer on upper and lower surface, second surface circuit layer and the two surface circuit layers, wherein this method comprises:
First surface circuit layer in this printed circuit board (PCB) is formed with a ground plane district and the element signal layout district of at least one;
The ground plane zone position of corresponding this first surface circuit layer, the internal circuit floor of one deck at least in its below of this first surface circuit layer is formed with a ground plane district equally;
To have between the ground plane district of the ground plane district of internal circuit floor of one deck at least in ground plane district and this first surface circuit layer with a plurality of blind hole conductings, be connected in the ground plane district of the internal circuit floor of one deck at least with its below with ground plane district with this first surface circuit layer;
The position, ground plane district of corresponding this first surface circuit layer is formed with at least one element signal layout district in the second surface circuit layer of this printed circuit board (PCB).
For reaching above-mentioned purpose, the present invention discloses a kind of low noise printed circuit board (PCB), and it comprises at least:
The first surface circuit layer is positioned at the wherein surface of this printed circuit board (PCB), includes a ground plane district and the element signal layout district of at least one;
The second surface circuit layer is positioned at another surface of this printed circuit board (PCB), includes the element signal layout district of at least one, one of them element signal layout district, and its position is arranged on the region, ground plane district of corresponding this first surface circuit layer; And
The internal circuit layer of at least one, the ground plane zone position of corresponding this first surface circuit layer of internal circuit floor that wherein is positioned at one deck at least of its below of this first surface circuit layer is provided with the ground plane district equally, and with the ground plane district of this first surface circuit layer and its below at least between the ground plane district of the internal circuit floor of one deck with a plurality of blind hole conductings, so that this is connected with the ground plane district of first surface circuit layer in ground plane district of the internal circuit floor of one deck at least.
For reaching above-mentioned purpose, wherein with above-mentioned printed circuit board (PCB), be equipped with electronic installation in, to disclose a kind of electronic installation of tool low noise interference characteristic, comprise at least:
One memory is in order to store data;
One communication module group is in order to receive or to send signal;
One microprocessor is controlled the operation of aforementioned every unit; And
One printed circuit board (PCB) comprises first surface circuit layer, the second surface circuit layer on upper and lower surface; And two have the internal circuit layer of one deck at least between the surface circuit layer; Wherein:
This first surface circuit layer includes a ground plane district and the element signal layout district of at least one; And elements such as the memory of this easy radiated noise and microprocessor are arranged at the element signal layout district of this first surface circuit layer;
This second surface circuit layer includes at least one element signal layout district, one of them element signal layout district, and its position is arranged on the zone of the position, ground plane district of corresponding this first surface circuit layer; And this is subject to the communication module group of radiated interference, then is arranged on above-mentioned element signal layout district; And
The internal circuit layer of at least one, at least one the ground plane zone position of corresponding this first surface circuit layer of internal circuit floor that wherein is positioned at its below of this first surface circuit layer is provided with the ground plane district equally, and the ground plane district of this first surface circuit layer and its below at least between the ground plane district of the internal circuit floor of one deck with a plurality of blind hole conductings, so that this is connected with the ground plane district of first surface circuit layer in ground plane district of the internal circuit floor of one deck at least.
Description of drawings
Fig. 1 is the schematic flow sheet of printed circuit layout method of the present invention.
Fig. 2 is the three-dimensional exploded view of the preferred embodiment of printed circuit board (PCB) of the present invention.
Fig. 3 is the combination section of the preferred embodiment of printed circuit board (PCB) of the present invention.
Fig. 4 is the internal structure calcspar of electronic installation preferred embodiment of the present invention.
Fig. 5 is the internal structure calcspar of another embodiment of electronic installation of the present invention.
Fig. 6 is the internal structure calcspar of the another embodiment of electronic installation of the present invention.
Fig. 7 is the three-dimensional exploded view of another embodiment of printed circuit board (PCB) of the present invention.
Fig. 8 is the three-dimensional exploded view of the another embodiment of printed circuit board (PCB) of the present invention.
The figure number explanation
11,12,13,14.. implementing procedure 2.... printed circuit board (PCB)
21,24...... surface circuit layer 22,23.. internal circuit layer
211,221,231.. ground plane district 212,241.. element signal layout district
232....... insulation layer 25..... blind hole
26........ the element of easy radiated noise
27........ be subject to the element of radiated interference
3........ electronic installation 31..... memory
32........ microprocessor 33..... communication module group
34........ antenna 35..... amplifying circuit
36........ display
Embodiment
See also Fig. 1, Fig. 2 and shown in Figure 3, be respectively the schematic flow sheet of printed circuit layout method of the present invention preferred embodiment, and utilize an exploded perspective and the combination generalized section of the printed circuit board (PCB) 2 that this method obtains.As shown in the figure, these printed circuit board (PCB) 2 combinations have four layers of circuit layer in the present embodiment, and cement (pressing) after putting a layer insulating between each circuit layer into, comprise: the two internal circuit layers 22,23 that the first surface circuit layer 21 on upper and lower surface, second surface circuit layer 24 and two surface circuit layers are 21,24, so the number of plies of not lifted with present embodiment is exceeded.
The implementing procedure of this method is at first as described in the step 11, first surface circuit layer 21 prior to this printed circuit board (PCB) 2 is formed with an element signal layout district 212 and a ground plane district 211, wherein these element signal layout district 212 electronic components are fixed in this zone by surface adhering technology (SMT) or alternate manner, and usually by literal and symbol to indicate the position of each element on printed circuit board (PCB) 2; For another example shown in the step 12, and the ground plane zone position 211 of corresponding this first surface circuit layer 21, be formed with a ground plane district 221 in the internal circuit floor 22 of these first surface circuit layer 21 its below one decks; For another example shown in the step 13, again with between the ground plane district 211 of the first surface circuit layer 21 of the ground plane district 221 of internal circuit floor 22 and its last layer with a plurality of blind hole 25 conductings, be connected with the ground plane district 221 of the internal circuit floor 22 of its below with ground plane district 211 first surface circuit layer 21; At last shown in step 14,221 positions, ground plane district of corresponding this first surface circuit layer 21 are formed with an element signal layout district 241 in the second surface circuit layer 24 of this printed circuit board (PCB) 2.Wherein the sequence of steps of foregoing circuit layout method is not limited to above-mentioned execution mode, and the also visual circuit layout of quantity in element signal layout district 212,241 and be a plurality of zones.
See also Fig. 2, shown in Figure 3, comply with the low noise printed circuit board (PCB) 2 that above-mentioned printed circuit layout method is made, it comprises: the first surface circuit layer 21 on upper and lower surface, second surface circuit layer 24, and the two-layer internal circuit layer 22,23 between the two surface circuit layers 21; Wherein be positioned at the first surface circuit layer 21 on a wherein surface of this printed circuit board (PCB) 2, include a ground plane district 211 and an element signal layout district 212, and this element signal layout district 212, in order to easily element 26 installations of radiated noise to be provided; And 211 positions, ground plane district that are positioned at internal circuit floor 22 corresponding this first surface circuit layer 21 of these first surface circuit layer 21 its belows are provided with ground plane district 221 equally, and the ground plane district 211 of this first surface circuit layer 21 with its below the ground plane district 221 of internal circuit floor 22 between with a plurality of blind hole 25 conductings, be connected with the ground plane district 211 of first surface circuit layer 21 with ground plane district 221, and increase its contact area this internal circuit floor 22; And be positioned at another surperficial second surface circuit layer 24 of this printed circuit board (PCB) 2, include an element signal layout district 241, its position is arranged on 211 regions, ground plane district of corresponding this first surface circuit layer 21 up and down, and this component placement district 241 installs and uses in order to the element 27 that is subject to radiated interference to be provided.
See through above-mentioned printed circuit board (PCB) 2 topology layouts, the element 26 of general easily radiated noise and the element 27 that is subject to radiated interference directly or indirectly can be arranged on two surface circuit layers 21,24 of this printed circuit board (PCB) 2 respectively and belong to different correspondence positions, add the ground plane district 221 of the internal circuit floor 22 of the ground plane district 211 that sees through first surface circuit layer 21 and below thereof, and the noise that general element gave off can be directed to ground connection, with the radiation signal interference of effective reduction electronic product inside.
See also Fig. 2, Fig. 3 and shown in Figure 4, wherein with above-mentioned printed circuit board (PCB) 2, be equipped with electronic installation 3 in, in order to mutual noise jamming between the element that reduces these electronic installation 3 inside, with usefulness that promotes its electronic installation 3 and the effect that receives signal, wherein this electronic installation 3 can be a personal digital aid (PDA) (Personal Digital Assistant, PDA), devices such as mobile phone, stock beeper, it comprises at least: a plurality of easily first electronic components of radiated noises; One is subject to second electronic component of radiated interference; And one in order to installing the printed circuit board (PCB) of said elements, to comprise a first surface circuit layer and second surface circuit layers that lay respectively at two opposite surfaces, and at least one internal circuit layer that is positioned at this first and second surface circuit interlayer; In present embodiment, these a plurality of first electronic components are meant a memory 31 in order to store data, reach one in order to control element microprocessor operating 32, this second electronic component then refer to one in order to the communication module group 33 of extraneous transmitting signals, wherein elements such as microprocessor 32 in this electronic installation 3 and memory 31 are processing at a high speed using or operating, read or be read data, and belong to the element of high performance and high speed operating frequency, therefore, be easy to generate unwanted radiated noise, and caused EMI (anti-electronic jamming) to enter harsh state.So, at other is subject to the element (for example: responsive and in order to transmit the communication module group 33 of message with the external world) of radiated interference on the printed circuit board (PCB) 2, and, and cause causing interpretation mistake, the problem of usefulness reduction or the shortcoming of its display frame confusion as producing the phase mutual interference between the electronic component in this electronic installation 3 easily because of being subjected to the easy noise jamming that element gave off of radiated noise such as microprocessor 32, memory 31 in this electronic installation 3.
Therefore, the present invention is the element 26 with easy radiated noise, is arranged at the wherein element signal layout district 212 of the first surface circuit layer 21 of one side of this printed circuit board (PCB) 2 as elements such as memory 31 and microprocessors 32; And this is subject to the element 27 of radiated interference, as: communication module group 33, then be arranged on the element signal layout district 241 of the second surface circuit layer 24 of these printed circuit board (PCB) 2 another opposed surface, wherein this element signal layout district 241 that is subject to element 27 places of radiated interference is the element signal layout district 241 of the second surface circuit layer 24 of 211 positions, ground plane district that are arranged on corresponding this first surface circuit layer 21, therefore, make the element 26 of this easy radiated noise and be subject to the element 27 of radiated interference except that adhering to separately the both sides (surface) of this printed circuit board (PCB) 2, adhere to different corresponding positions simultaneously separately, can reduce the problem of phase mutual interference between the element in this electronic installation 3 effectively in this printed circuit board (PCB) 2 both sides opposed surface; Moreover, and the ground plane district 211 that can see through this first surface circuit layer 21 with its below the ground plane district 221 of internal circuit floor 22 between be connected formed contact area, and the noise that the general easily element 26 of radiated noise is given off can be directed to ground connection via this ground plane district 211,221, to reduce the problem that electronic installation 3 internal noises disturb effectively.
See also shown in Figure 5, it is for another embodiment of electronic installation 3 of the present invention, wherein this electronic installation 3 comprises: one in order to the memory that stores data 31, one in order to the microprocessor operating 32, of the communication module group 33 of extraneous transmitting signals, aforementioned each element of a control in order to the printed circuit board (PCB) 2 of said elements to be installed, and the display 36 in order to the display operation state, wherein this display can be connected to the first surface circuit layer 21 of printed circuit board (PCB) 2 indirectly by signal control winding displacement (figure does not show); Because this display 36 is when showing dynamic picture image, also must high speed read and the scanning data to demonstrate the picture effect of dynamic image, therefore, also can give off the interference of noise signal equally, and have influence on some other comparatively sensitive element, yet formed contact area between the ground plane district 211 that the present invention can see through first surface circuit layer 21 and the ground plane district 221 of the internal circuit floor 22 of its below one deck is to intercept effectively and the noise signal interference of 36 radiation of this display of ground connection.
See also shown in Figure 6, it is for another embodiment of electronic installation 3 of the present invention, wherein this electronic installation comprises: one in order to the memory 31 that stores data, in order to the communication module group 33 of extraneous transmitting signals, antenna 34, a microprocessor operating 32 in order to the amplifying circuit 35 of handling signal, aforementioned each element of a control, in order to the printed circuit board (PCB) 2 of said elements to be installed, and the display 36 in order to the display operation state, wherein this highly sensitive communication module group 33, antenna 34, and amplifying circuit 35 generally belong to the element that is subject to radiated interference.
See also another embodiment of printed circuit board (PCB) of the present invention shown in Figure 7, the main difference of embodiment of itself and Fig. 2 is, the ground plane district 211 of corresponding these first surface circuit layer 21 belows, can be in this first surface circuit layer 21 its belows the not only internal circuit layer 22 of one deck, 23 are formed with ground plane district 221 equally, 231, and with each internal circuit floor 22 of ground plane district 211 with its below of first surface circuit layer 21,23 ground plane district 221, between 231 with a plurality of blind hole 25 conductings, with the not only internal circuit floor 22 of one deck of the ground plane district 211 of the first surface circuit layer 21 that will be superimposed and its below, 23 ground plane district 221,231 connect, the mode of wherein utilizing blind hole 25 conductings is to connect more internal circuit layer 22,23 ground plane district 221,231, and the contact area that increases will be along with internal circuit layer 22,23 the number of plies and strengthening, therefore, the noise that its element gives off will be via ground plane district 211,221,231 and ground connection, the effect of its ground connection and obstruct noise jamming is also relatively strengthened, and the reduction that can try one's best by The noise.
See also the another embodiment of printed circuit board (PCB) of the present invention shown in Figure 8, the present invention can corresponding printed circuit board (PCB) 2 first surface circuit layer 21 and 211,221 positions, ground plane district of internal circuit floor 22, internal circuit layer 23 in the below of above-mentioned internal circuit layer 22 is provided with insulation layer 232, can be in order to intercept the noise that element gives off on the first surface circuit layer 21, be subjected to noise jamming with the element that prevents second surface circuit layer 24, wherein this insulation layer 232 is one the circuit layer zone of circuit layout not to be arranged.
Claims (6)
1, a kind of printed circuit layout method that reduces noise jamming, it is characterized in that, be implemented on a printed circuit board (PCB), this printed circuit board (PCB) combination has a plurality of circuit layers, comprise: have the internal circuit layer of one deck between first surface circuit layer, second surface circuit layer and the two surface circuit layers on upper and lower two opposite surfaces at least, wherein this method comprises:
First surface circuit layer in this printed circuit board (PCB) forms a ground plane district;
The ground plane zone position of corresponding this first surface circuit layer is in the same ground plane district that forms of this internal circuit floor of its below of this first surface circuit layer;
Be connected conducting between the ground plane district with the ground plane district of this internal circuit floor and this first surface circuit layer;
Form at least one element signal layout district in the second surface circuit layer of this printed circuit board (PCB), and the formation position in one of them element signal layout district, the position, ground plane district of corresponding this first surface circuit layer.
2, the printed circuit layout method of reduction noise jamming as claimed in claim 1 is characterized in that, also comprises:
Form the element signal layout district of at least one in the first surface circuit layer of this printed circuit board (PCB).
3, a kind of low noise printed circuit board (PCB) is characterized in that, comprises:
The first surface circuit layer is positioned at the wherein surface of this printed circuit board (PCB), includes a ground plane district;
The second surface circuit layer, be positioned at another surface of this printed circuit board (PCB), the second surface circuit layer comprises the element signal layout district of at least one, the position in one of them element signal layout district is arranged on the region, ground plane district of corresponding this first surface circuit layer, and this element signal layout district is in order to install the element that is subject to radiated interference; And
The internal circuit layer of at least one, between this first and second surface circuit layer, the ground plane zone position of corresponding this first surface circuit layer of internal circuit floor that wherein is positioned at one deck at least of this first surface circuit layer below is provided with a ground plane district equally, and the ground plane district of this first surface circuit layer with its below this is connected conducting between ground plane district of the internal circuit floor of one deck at least.
4, low noise printed circuit board (PCB) as claimed in claim 3 is characterized in that, the first surface circuit layer also comprises:
The element signal layout district of at least one is in order to install the easily element of radiated noise.
5, a kind of electronic installation of tool low noise interference characteristic is characterized in that, comprises:
One memory is in order to store data;
One communication module group, in order to extraneous transmitting signals;
One microprocessor, the operation of aforementioned each element of control; And
One printed circuit board (PCB) comprises upper and lower two opposite surperficial first surface circuit layer, second surface circuit layers; And two have the internal circuit layer of one deck at least between the surface circuit layer;
This first surface circuit layer includes a ground plane district and the element signal layout district of at least one; And this memory and microprocessor are arranged at the element signal layout district of this first surface circuit layer;
This second surface circuit layer includes at least one element signal layout district, one of them element signal layout district, and its position is arranged on the zone of the position, ground plane district of corresponding this first surface circuit layer; And this communication module group is arranged on above-mentioned element signal layout district; And
This at least one internal circuit layer, at least one the ground plane zone position of corresponding this first surface circuit layer of internal circuit floor that wherein is positioned at its below of this first surface circuit layer is provided with the ground plane district equally, and the ground plane district of this first surface circuit layer with its below be connected conducting between the ground plane district of the internal circuit floor of one deck at least.
6, a kind of electronic installation of tool low noise interference characteristic is characterized in that, comprises:
First electronic component of one easy radiated noise;
One is subject to second electronic component of radiated interference; And
One printed circuit board (PCB) comprises the first surface circuit layer and the second surface circuit layer that lay respectively at upper and lower two opposite surfaces, and at least one internal circuit layer that is positioned at this first and second surface circuit interlayer,
This first surface circuit layer comprises a ground plane district and at least one element signal layout district, and this first electronic component is arranged at the element signal layout district of this first surface circuit layer;
This second surface circuit layer comprises at least one element signal layout district, this element signal layout district is arranged on the region, ground plane district of corresponding this first surface circuit layer, and this second electronic component is arranged on the element signal layout district of this second surface circuit layer; And
The ground plane zone position of corresponding this first surface circuit layer of this internal circuit floor is provided with a ground plane district equally, and is connected conducting between the ground plane district of the ground plane district of this first surface circuit layer and this internal circuit floor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410057224 CN1281104C (en) | 2004-08-23 | 2004-08-23 | Printing circuit layout method, printing circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410057224 CN1281104C (en) | 2004-08-23 | 2004-08-23 | Printing circuit layout method, printing circuit board and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1589090A CN1589090A (en) | 2005-03-02 |
| CN1281104C true CN1281104C (en) | 2006-10-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410057224 Expired - Fee Related CN1281104C (en) | 2004-08-23 | 2004-08-23 | Printing circuit layout method, printing circuit board and electronic device |
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| CN (1) | CN1281104C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100367644C (en) * | 2005-04-07 | 2008-02-06 | 杭州华三通信技术有限公司 | Electronic circuit with separated earthing |
| CN100424514C (en) * | 2005-08-09 | 2008-10-08 | 陈文祺 | Semiconductor test plate structure for preventing noise interference |
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2004
- 2004-08-23 CN CN 200410057224 patent/CN1281104C/en not_active Expired - Fee Related
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| CN1589090A (en) | 2005-03-02 |
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