CN1280955A - Gas-phase synthesis process of superfine silicon nitride powder - Google Patents

Gas-phase synthesis process of superfine silicon nitride powder Download PDF

Info

Publication number
CN1280955A
CN1280955A CN 99109605 CN99109605A CN1280955A CN 1280955 A CN1280955 A CN 1280955A CN 99109605 CN99109605 CN 99109605 CN 99109605 A CN99109605 A CN 99109605A CN 1280955 A CN1280955 A CN 1280955A
Authority
CN
China
Prior art keywords
gas
phase synthesis
synthesis process
reactor
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 99109605
Other languages
Chinese (zh)
Other versions
CN1142089C (en
Inventor
刘庆昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNB991096053A priority Critical patent/CN1142089C/en
Publication of CN1280955A publication Critical patent/CN1280955A/en
Application granted granted Critical
Publication of CN1142089C publication Critical patent/CN1142089C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

A gas-phase synthesis process of superfine silicon nitride powder uses SiC14 and ammonia in ratio of 1:(1.5-1.9) as base materials and features that the gas-phase synthesis takes place in a sealed reactor with DC plasma arc as heat source. The resultant of reaction is quenched in settling procedure to directly become super fine powder. In the reactor by means of controlling the output power of plasma generator and the ratio of N2 and H2 to stabilize the ionic arc and keeping reaction temp. at 1000-1500 deg.C, the superfine powder is heated to remove impurities of chlorides to obtain high-purity nm-class Si3N4 powder.

Description

Gas-phase synthesis process of superfine silicon nitride powder
The invention belongs to a kind of gas-phase synthesis process of inorganic chemical industry nitride, specifically to the improvement of nitride micro mist manufacture craft.
Silicon nitride (Si 3N 4) ultra-fine micropowder is the desirable base-material of high-temperature structural ceramics, matrix material, heat exchange material and superhard cutter.Occupying consequence with its technical feature that can not be substituted in field of new, is the basic industry of developing high-tech industry, thereby is subjected to the generally attention of countries in the world.At present, the method for production high purity, superfine silicon nitride powder can be divided into three kinds theoretically: one is a hot reducing method, by SiO 2Mix to place with excessive carbon dust and fill N 2Be heated to 1400 ℃ in the environment, reduction SiO 2Generate Si 3N 4At SiO 2-C-N 2One critical temperature (1450 ℃) is arranged under the hybird environment.If temperature control is unstable, can produce SiC is not Si 3N 4So, need add small amount of Fe aborning 2O 3The disinthibite generation of SiC utilizes hydrochloric acid to remove ferruginous compound again after the reaction.This method often contains a spot of SiO 2Or the impurity of other form, its high purity is greatly affected.Two, silicon powder nitride method: with the silica flour of the following granularity of 10 μ m at N 2In be heated to 1200 ℃-1450 ℃, the directly synthetic Si that obtains 3N 4Agglomerate grinds the Si that obtains about 1 μ m through pulverizing 3N 4Powder.The processing method of this mechanical type refinement fundamentally can't guarantee the refinement and the consistence of its micro mist, and the hard aggregation phenomenon is inevitable, and it is higher directly to use the cost cost of silica flour, and quality-guarantee is unstable, produces in enormous quantities to have suitable difficulty.It three is gas phase synthesis methods: with gaseous state SiCl 4And NH 3Under 1350 ℃-1450 ℃, synthesize amorphous Si 3N 4Transform into Si through aftertreatment again 3N 4, but wherein closing contains the Cl ionic impurity more, uses the induced with laser method at present and comes investment of production equipment too big, and the cost height is unsuitable for suitability for industrialized production.Use the low excessively economic scale that can not form of other heat-source energy utilization ratio instead.Object height is pure though it is produced, and high refinement is far superior to other method, only does systems simulation under laboratory scale in practice and fails to realize the industrial experiment of mass-producing.
The objective of the invention is to find out a Si who is applicable to suitability for industrialized production 3N 4Novel process, make it not only can guarantee high thin, high-purity technical requirements, and want facility investment little, processing ease, with low cost, be easy to make Si 3N 4Product have the rational ratio of performance to price and start its application market.
The starting point of the present invention is the improvement to gas phase synthesis method technology, and its key point is that choosing plasma body in the gas phase synthesis technique is thermal source, gas phase is synthesized in the reactor that is provided with plasma arc of sealing finish.Concrete technical process is to be based upon on the theoretical basis of plasma chemical industry, and the major technology target is to guarantee Si under the high purity 3N 4Specific surface area.Use the advantage of gas phase synthesis method exactly to be to utilize the gas phase synthesising reacting speed fast and evenly, if controlled temperature and reaction times just can obtain the building-up process of high quality and less energy-consumption exactly.Under the common energy, can't realize, though synthetic can the realization under the laser, but uncontrollable cost, have only the plasma arc of utilization just might realize the temperature precise control for thermal source, rate of heating is fast, special process environments such as reaction zone internal and external temperature gradient is big, to be subjected to the big restraining effect of reaction zone internal and external temperature gradient difference obvious for the synthetics grain growth when realizing that resultant velocity is fast, and thermosteresis is little.Thereby to select plasma arc to be that the thermal reactor of thermal source does be key of the present invention.The synthetic phase feed is injected in the thermal reactor exactly, controlled well proper technical conditions, promptly the building-up reactions of dozens of minutes in the technical process at ordinary times even several hours can be finished in second in some thousandths of, finish synthetic Si 3N 4Automatically breaking away from the ion arc by the guiding of the air-flow in gravity and the reactor is the thermal reaction area freedom of entry sedimentation quenching refinement at center.Follow-up gas-phase reaction material constantly replenishes into reaction zone, the or else disconnected introducing of resultant negative area quenching is collected, thereby form the technological process that a serialization is produced, the equipment that this technology adopted can design with reference to the direct current-arc plasma thermal reactor, this equipment is by applicant's formal application national patent, application number: 99205853.8, name is called: plasma method is produced the reactor of ultra-fine micropowder, the related master operation of this technology all can be finished in this equipment, and concrete technical process and control condition are as follows:
A, nitrogenizing reaction device environment: keep forming negative pressure in the reactor, negative pressure value is the 50-110cm water column, mainly is to form negative pressure, nitrogen environment, gets rid of the foreign gas of reactor, carries out environmental preparation for purifying reaction, guarantees synthetics purity.
The evaporation of b, liquid raw material and quantitatively transmission: with liquid silicon tetrachloride and NH 3By weight 1: 1.5-1.9, insert respectively in the vaporizer, be converted into gaseous state and inject synchronously in the plasma reactor, because NH by weight the throughput ratio that transforms 3Boiling point lower, can finish under the normal temperature gasification thereby NH 3Need not special evaporator unit, SiCl 4Boiling point be higher than liquefied ammonia for guaranteeing SiCl 4Can the temperature in the vaporizer must be transferred to 110 ℃-135 ℃ to set flow steady input reactor, pressure is 0.4MPa-0.5MPa.
C, to finish silicon nitride under design temperature synthetic: the setting of temperature is one of key of this Technology with adjusting, Si 3N 4Synthesis temperature between 1000 ℃-1500 ℃, often kind and the purity according to raw material has bigger difference, when using liquid Si Cl 4Synthesis temperature is higher during raw material, can be on the low side when using chlorosilane, add in the raw material effective ingredient and change and can directly influence synthesis temperature, this often batch materials must test next strictly determined parameter by pre-production after entering factory.The conciliation of temperature and setting can be obtained by the variation of following processing parameter: regulate the output rating of plasma arc generator, and fit adjustment stabilising arc gas N 2And H 2Drainage flow ratio in the input reactor.N 2And H 2The input flow rate ratio is: 1: between the 2.8-3.5.
D, the resultant quenching refinement after synthetic: directly formation is solid-state through quenching for the synthetic resultant down of gas phase, not only can reduce energy expenditure, and prevent to generate the increase of article grain, the fine structure of formation superfineization.For effectively resultant being introduced settling pocket, can make part N 2Gas is introduced from reactor head and is formed the trend that the local malleation of reactor upper container impels logistics formation to move down, and finishes the purpose that drainage enters the quenching settling vessel smoothly with combining from resedimentation of resultant.In order to guarantee the technological effect of quenching, utilize the forced water cooling circulation in the sedimentation wall outside sandwich, make and form the ideal thermograde in the settling vessel, this gradient serves as with reference to 1/4th seconds temperature of every free setting 0.8-1.2 standard(thermodynamic)scale that should descend with the free setting process.Quenching processing through this gradient can make resultant reach nano level fine structure, and is very good.For guaranteeing normal technical process, the N that introduces from the top 2Airshed should the 20-60 liter/minute between.The bottom-up liter of water coolant is squeezed into high pressure, and water pressure is as the criterion with the thermograde that can realize processing requirement and suitably regulates.
E, cloth bag collect, and the cloth bag collection device is located at below the settling vessel, the Si that will cooling descends 3N 4Collect.
F, heating aftertreatment: owing to contain intermediate product impurity NH in the resultant 4Cl or hydrogenchloride place 380-450 ℃ of vacuum drying oven internal heating with collecting good trickle powder, at N 2Kept under the atmosphere 2-3 hour, and can effectively chloride impurity be separated and remove the NH of discharge 4Cl can recycle becomes subsidiary products.
How to realize for further specifying process characteristic of the present invention and goal of the invention thereof, and provide following
Embodiment:
Embodiment 1:
Reactor negative pressure 60cm water column, plasma power 55KW, SiCl 4Flow 240g/min, NH 3Flow 152g/min, H 2196 liters/min of flow, N 210 liters/min of flow.
Embodiment 2:
Reactor negative pressure 80cm water column, plasma generator power 70KW, SiCl 4Flow 292g/min, NH 3Flow 198g/min, H 2280 liters/min of flow, N 290 liters/min of flow.
Embodiment 3:
Reactor negative pressure 100em water column, plasma generator power 85KW, SiCl 4Flow 360g/min, NH 3Flow 230g/min, H 2Flow 1/min, N 2Flow 1001/min.
The Si that produces according to above technology 3N 4Purity can be greater than 96%, contents of free si<0.3%, and total oxygen content<1.5%, mean particle size 50-100nm, specific surface area is greater than 30m 2/ g, and the overall cost cost has had tangible commercial value.And facility investment is little, and technology is simple, and is easy to operate, energy low consumption, and the breakthrough on the special technical indicator lays a solid foundation for nano-grade silicon nitride enters the practical stage.

Claims (7)

1, gas-phase synthesis process of superfine silicon nitride powder, taking silicon tetrachloride and liquefied ammonia in the technology is basic raw material, it is synthetic to finish gas phase at the encloses container internal heating, obtains high purity Si through thermal treatment again 3N 4Crystalline flour.It is characterized in that this synthesis procedure is to finish in the sealed reactor that is thermal source with the plasma arc, concrete technical process is as follows:
A, nitrogenizing reaction device environment, keeping the reactor negative pressure is the 50-110cm water column,
The evaporation of b, liquid raw material and quantitatively transmission are with liquid NH 3With silicon tetrachloride by weight 1: 1.5-1.9, insert in the vaporizer respectively.Be converted into gaseous state and inject plasma reactor synchronously by weight the throughput ratio that transforms,
C, to finish silicon nitride under design temperature synthetic, and setting synthesis temperature is between 1000 ℃-1500 ℃,
D, the refinement of resultant quenching: resultant of reaction is introduced the quenching settling vessel, and the envrionment temperature gradient is 0.5-1.2 standard(thermodynamic)scale of every free setting temperature decline in 1/4th seconds in the settling vessel,
E, cloth bag are collected,
F, heating aftertreatment, are kept and were removed the muriate of temperature in product in 2-3 hour to 300-450 ℃ at the vacuum drying oven internal heating.
2, according to the said gas-phase synthesis process of claim 1, it is characterized in that liquid Si Cl 4Gasification condition be 110 ℃-135 ℃, pressure keeps 0.4MPa-0.5MPa.
3,, it is characterized in that synthetic Si according to the said gas-phase synthesis process of claim 1 3N 4The time the temperature adjustment by means of the power and the stabilising arc gas N of plasma arc generator output 2, H 2The flow proportional of input reactor is finished.
4, according to the said gas-phase synthesis process of claim 3, it is characterized in that N 2: H 2The input flow rate ratio is 1: 2.8-1: 3.5.
5, according to the said gas-phase synthesis process of claim 1, it is characterized in that N by the reactor head drainage 2Resultant is introduced the quenching settling vessel.
6, according to the said gas-phase synthesis process of claim 5, it is characterized in that from the N of top drainage 2Flow control the 20-60 liter/minute.
7,, it is characterized in that the thermograde in the settling vessel realizes by means of from bottom to top cycle of higher pressure water-cooled in double sandwich sedimentation wall according to the said gas-phase synthesis process of claim 1.
CNB991096053A 1999-06-30 1999-06-30 Gas-phase synthesis process of superfine silicon nitride powder Expired - Fee Related CN1142089C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB991096053A CN1142089C (en) 1999-06-30 1999-06-30 Gas-phase synthesis process of superfine silicon nitride powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB991096053A CN1142089C (en) 1999-06-30 1999-06-30 Gas-phase synthesis process of superfine silicon nitride powder

Publications (2)

Publication Number Publication Date
CN1280955A true CN1280955A (en) 2001-01-24
CN1142089C CN1142089C (en) 2004-03-17

Family

ID=5274013

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB991096053A Expired - Fee Related CN1142089C (en) 1999-06-30 1999-06-30 Gas-phase synthesis process of superfine silicon nitride powder

Country Status (1)

Country Link
CN (1) CN1142089C (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100441501C (en) * 2002-09-09 2008-12-10 张芬红 System for preparing nanometer silicon nitride powder
CN1946476B (en) * 2004-02-28 2010-05-12 库尔尼亚·维拉 Fine particle powder production
CN101734632B (en) * 2009-12-10 2011-10-05 四川德诚金谷硅材料有限公司 Production method of nano silicon nitride powders
CN102491291A (en) * 2011-12-14 2012-06-13 合肥摩凯新材料科技有限公司 Method for preparing high-purity silicon nitride micro-nano powder
CN102502536A (en) * 2011-11-03 2012-06-20 合肥摩凯新材料科技有限公司 Preparation method of high-purity silicon nitride powder
CN105712305A (en) * 2014-12-02 2016-06-29 沈阳鑫劲粉体工程有限责任公司 New silicon nitride powder synthesis method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100441501C (en) * 2002-09-09 2008-12-10 张芬红 System for preparing nanometer silicon nitride powder
CN1946476B (en) * 2004-02-28 2010-05-12 库尔尼亚·维拉 Fine particle powder production
CN101734632B (en) * 2009-12-10 2011-10-05 四川德诚金谷硅材料有限公司 Production method of nano silicon nitride powders
CN102502536A (en) * 2011-11-03 2012-06-20 合肥摩凯新材料科技有限公司 Preparation method of high-purity silicon nitride powder
CN102502536B (en) * 2011-11-03 2013-03-20 合肥摩凯新材料科技有限公司 Preparation method of high-purity silicon nitride powder
CN102491291A (en) * 2011-12-14 2012-06-13 合肥摩凯新材料科技有限公司 Method for preparing high-purity silicon nitride micro-nano powder
CN105712305A (en) * 2014-12-02 2016-06-29 沈阳鑫劲粉体工程有限责任公司 New silicon nitride powder synthesis method

Also Published As

Publication number Publication date
CN1142089C (en) 2004-03-17

Similar Documents

Publication Publication Date Title
US6932954B2 (en) Method for producing silicon
US4084024A (en) Process for the production of silicon of high purity
JPS6228083B2 (en)
CA1228220A (en) Process for the production of silicon
CN102686514A (en) Method for manufacturing polysilicon and method for manufacturing silicon tetrachloride
JP4038110B2 (en) Method for producing silicon
US4318942A (en) Process for producing polycrystalline silicon
CN110272283A (en) A kind of production method of silicon nitride powder
US4986971A (en) Method for production of trichloromonosilane
CN1142089C (en) Gas-phase synthesis process of superfine silicon nitride powder
JP2006298740A (en) Method for manufacturing silicon
JP3839539B2 (en) Crystalline disordered layered boron nitride powder and method for producing the same
CN106565246A (en) Aluminum nitride/yttrium nitride composite powder preparation method
CN104891499B (en) Technological method for preparing polysilicon by silane method
CN1133584C (en) Gas phase synthesis process of superfine titanium carbide powder
CN201372207Y (en) Novel trichlorosilane synthesis reactor
CN1339416A (en) Gas phase synthesis process of super fine carbon-nitrogen-silicon composite material
JPH02279513A (en) Production of high-purity polycrystal silicon
CN1272243C (en) Gasifying synthetic tungsten carbide nanometer microcrystalline and preparing process thereof
CN111204771B (en) Preparation method of high-purity spherical nano silicon dioxide with onion structure
JPH082907A (en) Powdery silicon nitride
CN109485432A (en) A kind of high-purity α-Si3N4The preparation method of nano-powder
JP2002234719A (en) Apparatus for producing silicon material and method therefor
KR20110127097A (en) Hybrid tcs-siemens process equipped with 'turbo charger' fbr. method of saving electricity and equipment cost from tcs-siemens process polysilicon plants of capacity over 10,000 mt/yr
CN218709227U (en) System for coproduction of trichlorosilane

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040317